CN108955924A - Junction temperature and temperature rise warning device and method - Google Patents
Junction temperature and temperature rise warning device and method Download PDFInfo
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- CN108955924A CN108955924A CN201810411374.0A CN201810411374A CN108955924A CN 108955924 A CN108955924 A CN 108955924A CN 201810411374 A CN201810411374 A CN 201810411374A CN 108955924 A CN108955924 A CN 108955924A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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Abstract
This application discloses a kind of junction temperature and temperature rise warning device and methods, are related to the field ADAS, for alarming junction temperature and temperature rise.The device includes: processing chip and multiple environment temperature sensors, the processing chip include temperature sensor and Temperature Treatment module in piece；The multiple environment temperature sensor is respectively used to acquisition environment temperature；Described interior temperature sensor is used for the junction temperature of acquisition chip；The Temperature Treatment module is used to carry out junction temperature according to the environment temperature and the junction temperature and temperature rise is alarmed, and the temperature rise refers to the difference of maximum value and the junction temperature in multiple environment temperatures.The embodiment of the present application is applied to ADAS product.
Description
Technical Field
The invention relates to the field of Advanced Driver Assistance Systems (ADAS), in particular to a junction temperature and temperature rise alarm device and method.
Background
The ADAS product is more and more widely applied to automobiles, and the reliability of the ADAS product is reflected in that the junction temperature of a main chip and the temperature rise relative to the ambient temperature in the automobile directly determine whether a system of the ADAS product can normally operate or not, so that reliable guarantee is provided for the lane departure and collision alarm function.
Disclosure of Invention
Embodiments of the present application provide a junction temperature and temperature rise alarm device and method, which are used for alarming for junction temperature and temperature rise.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, there is provided a junction temperature and temperature rise warning device comprising: the temperature sensor comprises a processing chip and a plurality of environment temperature sensors, wherein the processing chip comprises an on-chip temperature sensor and a temperature processing module;
the plurality of ambient temperature sensors are used for acquiring a plurality of ambient temperatures;
the on-chip temperature sensor is used for collecting the junction temperature of the processing chip;
the temperature processing module is used for carrying out junction temperature and temperature rise alarm according to the environment temperature and the junction temperature, wherein the temperature rise refers to the difference between the maximum value in the environment temperatures and the junction temperature.
In a second aspect, there is provided a junction temperature and temperature rise alarm method, applied to the junction temperature and temperature rise alarm device of the first aspect, the method including:
collecting a plurality of ambient temperatures;
collecting the junction temperature of the processing chip;
and carrying out junction temperature and temperature rise alarm according to the environment temperature and the junction temperature, wherein the temperature rise refers to the difference between the maximum value in the environment temperatures and the junction temperature.
In a third aspect, there is provided a computer readable storage medium storing one or more programs, the one or more programs comprising instructions, which when executed by a computer, cause the computer to perform the method of the second aspect.
According to the junction temperature and temperature rise alarm device and method provided by the embodiment of the application, the ambient temperature is collected through an ambient temperature sensor, the junction temperature of the chip is collected through an on-chip temperature sensor inside a Xilinx Zynq series chip, the digital ambient temperature and the junction temperature are filtered after the temperature is subjected to analog-to-digital conversion through an Xilinx analog-to-digital converter simulated inside the Xilinx Zynq series chip, and finally the overheating alarm of the junction temperature and the temperature rise is realized through logic judgment. And the PL unit of the XilinxZynq series chip realizes the acquisition control and data processing of temperature, and releases CPU resources, so that the CPU can perform more important lane departure and collision alarm processing.
Drawings
Fig. 1 is a schematic structural diagram of a junction temperature and temperature rise alarm device provided in an embodiment of the present application;
fig. 2 is a first schematic flowchart of a junction temperature and temperature rise alarm method according to an embodiment of the present application;
fig. 3 is a schematic flowchart of a second junction temperature and temperature rise alarm method according to an embodiment of the present application;
fig. 4 is a schematic flowchart three of a junction temperature and temperature rise alarm method provided in an embodiment of the present application;
fig. 5 is a fourth schematic flowchart of a junction temperature and temperature rise alarm method according to an embodiment of the present application;
fig. 6 is a schematic flowchart of a junction temperature and temperature rise alarm method according to an embodiment of the present application.
Detailed Description
Examples 1,
Software and hardware algorithm processing is completed by taking an Xilinx Zynq series All Programmable system on a Chip (AP SOC) Chip as an example, so that a solution can be realized on a single Chip, the system architecture is simplified, and the system cost is saved. It is to be understood that the solution of the present application is not limited to be implemented by the above-mentioned chip system, and may also be implemented by using other chip systems.
The system collects the ambient temperature through an external temperature sensor (such as a thermocouple), collects the chip junction temperature through an on-chip temperature sensor inside a Xilinx Zynq series chip, carries out analog-to-digital conversion on the temperature through a Xilinx analog-to-digital converter (XADC) module simulated inside the Xilinx Zynq series chip, filters the digitized ambient temperature and the junction temperature, and finally realizes overheating alarm through logic judgment. Junction temperature as used herein refers to the operating temperature of a semiconductor chip in an electronic device.
Referring to fig. 1, the present application provides a junction temperature and temperature rise alarm device comprising a processing chip 11 and a plurality of ambient temperature sensors 12.
Wherein, the processing chip can be Xilinx Zynq series chip. The plurality of ambient temperature sensors 12 are configured to collect a plurality of ambient temperatures, which may be analog signals, and the ambient temperature sensors 12 may be thermistors. The xilinxZynq series chip 11 includes a Processing System (PS) unit 111 and a Processing Logic (PL) unit 112. The PS unit 111 embeds a high performance Central Processing Unit (CPU) of an advanced reduced instruction set processor (advanced RISC machines, ARM), embeds various hardware peripheral modules including Direct Memory Access (DMA), Serial Peripheral Interface (SPI), queuing serial peripheral interface (queued peripheral interface, pi), and the like, and can also connect with a qsmemory including Double Data Rate (DDR), FLASH memory (FLASH), electrically erasable programmable read-only memory (EEPROM), and the like, thereby satisfying the requirements of an embedded system. The PL cells 112 are programmable logic resources that can implement a variety of flexible applications for Field Programmable Gate Arrays (FPGAs). The Xilinx Zynq series chip is described by taking an independent Xilinx Zynq series chip which can comprise a plurality of devices as an example, and it can be understood that the devices can also be independent devices.
The PL cell 112 includes: an on-chip temperature sensor 1121, an XADC module 1122, a digital filtering module 1123, a temperature processing module 1124, and a temperature storage module 1125.
The in-chip temperature sensor 1121 is configured to acquire a junction temperature of a processing chip (for example, a Xilinx Zynq series chip) 11, where the junction temperature may be an analog signal. The XADC module 1122 may be configured to perform analog-to-digital conversion on the analog signal of the ambient temperature to obtain a digital signal of the ambient temperature, and may also be configured to perform analog-to-digital conversion on the analog signal of the junction temperature to obtain a digital signal of the junction temperature. The XADC module 1122 is an analog hardmac, and includes two 12-bit, 1M sampling rate ADCs, one of which may be connected to the on-chip temperature sensor 1121 for performing analog-to-digital conversion on an analog signal output from the on-chip temperature sensor 1121. The other ADC has access to up to 17 external analog input channels via which it can be connected to the ambient temperature sensor 12 for analog-to-digital conversion of the analog signal output by the ambient temperature sensor 12.
The digital filtering module 1123 may be configured to filter the digital signal of the ambient temperature and the digital signal of the junction temperature. The digital filter module 1123 initializes and starts the XADC module 1122 through a dynamic reconfiguration interface (DRP) interface of the XADC module 1122 after power-on. One ADC of the XADC module 1122 converts the analog voltage value of the on-chip temperature sensor 1121, the other ADC converts the analog voltage value of the ambient temperature sensor 12, and the converted digital signal is transmitted to the digital filtering module 1123 through the DRP interface. Because the temperature changes slowly, the digital filtering module 1123 may buffer multiple sets of the junction temperature digital signal and the ambient temperature digital signal, perform median filtering, filter out errors caused by interference, and send the two sets of data to the temperature processing module 1124 simultaneously.
The temperature processing module 1124 is configured to perform junction temperature and temperature rise alarm on the PS unit 111 according to the filtered ambient temperature and junction temperature, where the temperature rise refers to a difference between a maximum value of the multiple ambient temperatures and the junction temperature. Specifically, if the junction temperature is greater than or equal to the junction temperature threshold, the temperature processing module 1124 may generate an overheat interrupt, and send the overheat interrupt to the CPU in the PS unit 111 through the AXI _ GP interface, so as to notify the CPU to perform junction temperature and temperature rise alarm; alternatively, if the temperature rise is greater than or equal to the temperature rise threshold, the temperature processing module 1124 may generate an overheat interrupt and send the overheat interrupt to the CPU in the PS unit 111 through the AXI _ GP interface to notify the CPU to alarm for junction temperature and temperature rise. It should be noted that the CPU in the PS unit 111 may configure the junction temperature threshold and the temperature rise threshold to the temperature processing module 1124 of the PL unit 112 through the AXI _ GP interface.
The temperature storage module 1125 is used to store the ambient temperature, the junction temperature, and the temperature rise for a period of time, and the ambient temperature, the junction temperature, and the temperature rise are used to perform fault analysis, and the temperature storage module 1125 may be a storage area opened in a static random-access memory (SRAM). The CPU in the PS unit 111 can also read the data cached in the temperature storage module 1125 for analysis, and can be used for the investigation of the product reliability experiment.
According to the junction temperature and temperature rise alarm device, the ambient temperature is collected through an ambient temperature sensor, the chip junction temperature is collected through an on-chip temperature sensor inside a Xilinx Zynq series chip, after the temperature is subjected to analog-to-digital conversion through an Xilinx analog-to-digital converter inside the Xilinx Zynq series chip, the digitized ambient temperature and the junction temperature are filtered, and finally, the overheating alarm of the junction temperature and the temperature rise is achieved through logic judgment. And the PL unit of the Xilinx Zynq series chip realizes the acquisition control and data processing of temperature, and releases CPU resources, so that the CPU can perform more important lane departure and collision alarm processing.
Examples 2,
The application provides a junction temperature and temperature rise alarm method, which is applied to the junction temperature and temperature rise alarm device and shown in a reference figure 2, and the method comprises the following steps:
s101, collecting a plurality of ambient temperatures.
Specific reference is made to the function of the ambient temperature sensor 12, which is not described in detail herein.
And S102, collecting and processing the junction temperature of the chip.
Specific reference is made to the function of the on-chip temperature sensor 1121, which is not described herein again.
And S103, alarming junction temperature and temperature rise according to the ambient temperature and the junction temperature, wherein the temperature rise refers to the difference between the maximum value in the plurality of ambient temperatures and the junction temperature.
With specific reference to the functions of the temperature processing module 1124, the detailed description thereof is omitted.
Alternatively, referring to fig. 3, step S103 may include S1031 or S1042:
and S1031, if the junction temperature is larger than or equal to the junction temperature threshold value, generating overheating interruption.
S1032, if the temperature rise is larger than or equal to the temperature rise threshold value, overheat interruption is generated.
Optionally, referring to fig. 4, before step S1031, the method further includes:
and S104, receiving the configuration of the temperature change threshold and the temperature rise threshold.
With specific reference to the functions of the temperature processing module 1124, the detailed description thereof is omitted.
Optionally, referring to fig. 5, the method further includes:
and S105, storing the ambient temperature, the junction temperature and the temperature rise, wherein the ambient temperature, the junction temperature and the temperature rise are used for carrying out fault analysis.
The functions of the temperature storage module 1125 are specifically referred to and will not be described herein.
Optionally, as shown in fig. 6, before step S103, the method may further include:
and S106, performing median filtering on the digital signal of the ambient temperature and the digital signal of the junction temperature.
The functions of the digital filter module 1123 are specifically referred to, and will not be described herein again.
Since the method in the embodiment of the present application can be applied to the apparatus, the technical effect obtained by the method can also refer to the embodiment of the apparatus, and the embodiment of the present application is not described herein again.
It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus, and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the units is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
In the above embodiments, the implementation may be wholly or partially realized by software, hardware, firmware, or any combination thereof. When implemented using a software program, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. The procedures or functions described in accordance with the embodiments of the present application are all or partially generated upon loading and execution of computer program instructions on a computer. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored on a computer readable storage medium or transmitted from one computer readable storage medium to another, for example, from one website, computer, server, or data center to another website, computer, server, or data center via wire (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or can comprise one or more data storage devices, such as a server, a data center, etc., that can be integrated with the medium. The usable medium may be a magnetic medium (e.g., floppy Disk, hard Disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., Solid State Disk (SSD)), among others.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (11)
1. A junction temperature and temperature rise warning device, comprising: the temperature sensor comprises a processing chip and a plurality of environment temperature sensors, wherein the processing chip comprises an on-chip temperature sensor and a temperature processing module;
the plurality of ambient temperature sensors are used for acquiring a plurality of ambient temperatures;
the on-chip temperature sensor is used for collecting the junction temperature of the processing chip;
the temperature processing module is used for carrying out junction temperature and temperature rise alarm according to the environment temperature and the junction temperature, wherein the temperature rise refers to the difference between the maximum value in the environment temperatures and the junction temperature.
2. The apparatus of claim 1, wherein the temperature processing module is specifically configured to:
generating an overheating interrupt if the junction temperature is greater than or equal to a junction temperature threshold;
or,
generating an overheat interrupt if the temperature rise is greater than or equal to a temperature rise threshold;
wherein the over-temperature interruption is used to alarm for junction temperature and temperature rise.
3. The apparatus of claim 2, wherein the temperature processing module is further configured to receive a configuration of the junction temperature threshold and the temperature rise threshold.
4. The apparatus of claim 1, wherein the processing chip further comprises a temperature storage module, the temperature storage module is configured to store the ambient temperature, the junction temperature, and the temperature rise, and the ambient temperature, the junction temperature, and the temperature rise are configured to perform fault analysis.
5. The apparatus of claim 1, wherein the processing chip further comprises a digital filtering module, and the digital filtering module is specifically configured to perform median filtering on the digital signal of the ambient temperature and the digital signal of the junction temperature.
6. A junction temperature and temperature rise warning method applied to the junction temperature and temperature rise warning device according to any one of claims 1 to 5, the method comprising:
collecting a plurality of ambient temperatures;
collecting the junction temperature of the processing chip;
and carrying out junction temperature and temperature rise alarm according to the environment temperature and the junction temperature, wherein the temperature rise refers to the difference between the maximum value in the environment temperatures and the junction temperature.
7. The method of claim 6, wherein said alarming for junction and temperature rise based on said ambient temperature and said junction temperature comprises:
generating an overheating interrupt if the junction temperature is greater than or equal to a junction temperature threshold;
or,
generating an overheat interrupt if the temperature rise is greater than or equal to a temperature rise threshold;
wherein the over-temperature interruption is used to alarm for junction temperature and temperature rise.
8. The method of claim 7, further comprising: receiving a configuration of the junction temperature threshold and the temperature rise threshold.
9. The method of claim 6, further comprising: storing the ambient temperature, the junction temperature, and the temperature rise, the ambient temperature, the junction temperature, and the temperature rise for fault analysis.
10. The method of claim 1, further comprising:
median filtering the digital signal of the ambient temperature and the digital signal of the junction temperature.
11. A computer readable storage medium storing one or more programs, the one or more programs comprising instructions, which when executed by a computer, cause the computer to perform the method of any of claims 6-10.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810411374.0A CN108955924A (en) | 2018-05-02 | 2018-05-02 | Junction temperature and temperature rise warning device and method |
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| CN201810411374.0A CN108955924A (en) | 2018-05-02 | 2018-05-02 | Junction temperature and temperature rise warning device and method |
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Cited By (1)
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