CN108950628A - A kind of self assembly diamond fretsaw cutting material and preparation method thereof - Google Patents
A kind of self assembly diamond fretsaw cutting material and preparation method thereof Download PDFInfo
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- CN108950628A CN108950628A CN201810713299.3A CN201810713299A CN108950628A CN 108950628 A CN108950628 A CN 108950628A CN 201810713299 A CN201810713299 A CN 201810713299A CN 108950628 A CN108950628 A CN 108950628A
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- mixed solution
- steel wire
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/36—Pretreatment of metallic surfaces to be electroplated of iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of self assembly diamond fretsaw cutting materials and preparation method thereof, cutting material is formed by stacking gradually the absorption solidification layer, nickel coating and the diadust that are coated on outside steel wire bus, in the bottom part insertion absorption solidification layer of diamond particles in the diadust, and the substrate of diamond particles is wrapped up by nickel coating.Absorption solidification layer in self assembly diamond fretsaw cutting material of the present invention and preparation method thereof, which is uniformly infiltrated, has good adsorptivity to diadust in steel wire surface, so that the upper sand amount and upper sand stability of unit area steel wire surface greatly improved；Diamond particles are arranged closely in steel wire surface, and arrangement is close uniform, reduces agglomeration in sand Ni-Speed, collapse the occurrence of crisp when can effectively reduce hard brittle material cutting；Without processing of putting the first edge on a knife or a pair of scissors, steel wire surface diamond particles height of protrusion is uniform, and sword rate is high out, and diamond wire line footpath is small and uniform.
Description
Technical field
The invention belongs to diamond fretsaw production field, more particularly, to a kind of self assembly diamond fretsaw cutting material and
Preparation method.
Background technique
Diamond fretsaw is one of the important means of most promising hard and brittle material cutting technology, and especially valuable is hard crisp
Crystalline material, such as crystalline silicon, sapphire, optical glass.Initial inside and outside round cutting technique is difficult to ensure the straight line of sawing
Degree, and joint-cutting is wider, cannot achieve curvilinear cut；Abrasive material adds perpendicular to workpiece surface in free abrasive wire saw cutting process
Working hour is easy to produce slight crack, damages to silicon wafer intensity, and scroll saw service life is short, and working environment is poor.Diamond fretsaw skill
Art is with line footpath is small, good processing accuracy, slice thickness is uniform, surface quality is good, surface precision is high, cutting efficiency and lumber recovery are high
The advantages that, comprehensive performance is prominent, while diamond abrasive grain is small to matrix abrasion, can greatly improve the durability and use of slice
Service life.
Diamond fretsaw in the prior art generally uses electric plating method to deposit one layer of metal on the metal filament (generally
Nickel and nickel cobalt (alloy)), and a kind of linear tool made of superhard material made of consolidating material and diamond abrasive in metal.The coat of metal is knot
Mixture, diadust are used for cutting processing.It is needed before use by opening using the diamond fretsaw that this technique is prepared
It just can be used after sword processing and diadust be easy to fall off, complex treatment process.
Summary of the invention
In view of this, the present invention is directed to propose a kind of self assembly diamond fretsaw cutting material and preparation method thereof, the system
Preparation Method is the upper sand line method to maintain a long-term stability, improve diamond wire unit area on diamond particle quantity and
Even property, improves the height of protrusion and sword rate out of diamond abrasive grain, and then improves diamond fretsaw to the cutting efficiency of hard brittle material.
In order to achieve the above objectives, the technical scheme of the present invention is realized as follows:
A kind of self assembly diamond fretsaw cutting material, by stack gradually the absorption solidification layer being coated on outside steel wire bus,
Nickel coating and diadust form, and the bottom part of the diamond particles in the diadust is embedded in absorption solidification layer
In, and the substrate of diamond particles is wrapped up by nickel coating.
Further, the diameter of the steel wire bus is 40-150 μm, and absorption solidification layer 0 and is less than with a thickness of being greater than
0.4 μm, nickel coating with a thickness of 2-12 μm, the partial size of diadust is 6-16 μm, and diamond particles therein are polyhedron.
Further, the absorption solidification layer is successively infiltrated on mixed solution A and mixing by steel wire bus is one or many
It is formed after solution B, includes electropositive absorbers and inorganic salts in the mixed solution A, wherein the concentration of electropositive absorbers is 5-
15g/L, the concentration of inorganic salts are 0.005-1mol/L；It include negative electricity adsorbent, curing agent and inorganic in the mixed solution B
Salt, wherein the concentration of negative electricity adsorbent is 5-50g/L, and the concentration of curing agent is 10-50g/L, and the concentration of inorganic salts is 0.005-
1mol/L。
It further, further include curing agent in the mixed solution A, the concentration of curing agent is 5- in the mixed solution A
50g/L。
Preferably, the electropositive absorbers include polyethyleneimine, polyvinyl pyridine, Quadrafos, polysilicate, poly- two
One or more kinds of mixture in allyl dimethyl ammonium chloride.
Preferably, the negative electricity adsorbent includes polyacrylic acid, polyacrylamide, polymethylacrylic acid, polystyrene sulphur
Acid, polyvinylpyrrolidone, polyvinyl sulfonic acid, mixture one or more kinds of in polyvinyl.
Preferably, the curing agent includes triethylene tetramine, N hydroxymethyl acrylamide, polyisocyanates, poly- carbonization two
One or more kinds of mixture in imines.
Preferably, the inorganic salts include lithium chloride, sodium chloride, potassium chloride, ammonium chloride, sodium sulphate, potassium sulfate, nitric acid
One or more kinds of mixture in sodium, potassium nitrate.
Another object of the present invention is to propose a kind of preparation method of self assembly diamond fretsaw cutting material, including such as
Lower step:
Step 1: first preparing degreasing powder solution, and pole plate or pole roller are installed in degreasing powder solution, removing steel wire bus
Positive and negative anodes circuit is formed with pole plate or pole roller in oil powder solution, circuit quantity is unlimited, removes water after the impurity on steel wire bus surface
It washes；
Step 2: electropositive absorbers and inorganic salts being mixed evenly, and are configured to mixed solution A to after being completely dissolved；
Step 3: negative electricity adsorbent, curing agent and inorganic salts being mixed evenly, and are configured to mix to after being completely dissolved
Close solution B；
Step 4: diadust being added into mixed solution B, wherein the additive amount of diadust is every liter of mixing
Solution B adds 10-25g, is sufficiently diluted, dilution is water, and dispersion, circulation impact is sufficiently stirred；
Step 5: steel wire bus of the step 1 by washing is one or many successively mixed by passing through again after mixed solution A
Solution B is closed, and by sufficiently wetting, absorption, is formed in mixed solution A and mixed solution B gradually on steel wire bus surface；
Step 6: step 5 treated diamond wire being subjected to high-temperature concretion, is by the high temperature silicon carbide of high temperature section
140℃-250℃；
Step 7: steel wire bus is by carrying out nickel plating, solidification, adverse current washing, last coiling and molding after step 6.
The purpose of high-temperature concretion, one make solvent sufficiently volatilize, secondly, make negative electricity adsorbent generate rheology, degree of cure
Diamond particle.
Further, the concentration of degreasing powder solution used in the step 1 is 100-200g/L, degreasing powder packet therein
Include sodium pyrophosphate, coconut oil diethanol amine, diethylene glycol, nonylphenol polyoxyethylene ether, organic silicon modified by polyether, triethanolamine oil
Sour soap, alkyl polyoxyethylene ether, polyoxyethylene ether alkyl phenol, fatty acid diethanolamine, linear alkylbenzene sulfonate (LAS), alkenyl sulphur
Hydrochlorate, alkyl sulfate, mixture one or more in phosphate.
It further, further include curing agent in the mixed solution A in the step 2, the high-temperature region of the high temperature section in step 6
Between temperature be 160 DEG C -250 DEG C.
Further, the time that steel wire bus passes through in mixed solution A in the step 5 is 5-20s, in mixed solution
The time passed through in B is 5-20s.
Compared with the existing technology, self assembly diamond fretsaw cutting material of the present invention and preparation method thereof have with
Lower advantage:
(1) self assembly diamond fretsaw cutting material of the present invention, one, absorption solidification layer are uniformly infiltrated in steel
Silk table has good adsorptivity in face of diadust, so that the upper sand amount of unit area steel wire surface and upper greatly improved
Sand stability；Secondly, diamond particles be arranged closely in steel wire surface, arrangement is close uniform, reduces in sand Ni-Speed
Agglomeration collapses the occurrence of crisp when can effectively reduce hard brittle material cutting；Thirdly, without put the first edge on a knife or a pair of scissors processing, steel wire surface
Diamond particles height of protrusion is uniform, and sword rate is high out, and diamond wire line footpath is small and uniform；
(2) preparation method of self assembly diamond fretsaw cutting material of the present invention, one are acted in adsorbent
Under, diamond micron particles are arranged closely in steel wire surface, and arrangement is close uniform, and whole coverage rate can reach 95% or more；Its
Two, without processing of putting the first edge on a knife or a pair of scissors, steel wire surface diamond particles height of protrusion and out sword rate are high；Thirdly using the directly upper sand of naked sand, nothing
Nickel plating sand need to be used, production cost is greatly reduced.
Detailed description of the invention
Fig. 1 is the structure chart of self assembly diamond fretsaw cutting material of the present invention；
Fig. 2 is the surface scan electron microscope of self assembly diamond fretsaw cutting material of the present invention.
Description of symbols:
1, diamond particles；2, nickel coating；3, absorption solidification layer；4, steel wire bus.
Specific embodiment
In addition to being defined, technical term used in following embodiment has universal with those skilled in the art of the invention
The identical meanings of understanding.Test reagent used in following embodiment is unless otherwise specified conventional biochemical reagent；It is described
Experimental method is unless otherwise specified conventional method.
Below with reference to examples and drawings, the present invention will be described in detail.
Embodiment 1
Configure degreasing powder solution, comprising 120g/L surfactant (trihydroxy ethylamine oleate soap, phosphate weight ratio be 3:
1 mixed liquor), metal pole roller is installed in degreasing powder solution, pole roller positive electricity, negative electricity are given.Configure mixed solution A, make it includes
The electropositive absorbers (mixed liquor that polyvinyl pyridine and polyethyleneimine volume ratio are 2:1) of 5g/L, the triethylene four of 10g/L
Amine, the inorganic salts (sodium chloride and sodium sulfate quality ratio 1:1) of 0.08mol/L；Mixed solution B is configured, bearing it includes 5g/L is made
Electro-adsorbent (mixed liquor that polyacrylic acid and polymethylacrylic acid volume ratio are 3:1), the triethylene tetramine of 10g/L,
The inorganic salts (sodium chloride and sodium sulfate quality ratio 1:1) of 0.08mol/L.10-15 μm of diadust of addition is to mixed liquor b
In, diadust content is 12g/L, is sufficiently diluted, dispersion, circulation impact is sufficiently stirred.Diameter is 80 μm of steel wire warps
It crosses after removing oil solution, after washing, by mixed solution A, by the time 15 seconds, using mixed solution B, by the time 15
Second.Into drying cabinet, drying temperature is 150 DEG C, is directly entered nickel preplating, nickel plating, solidification, adverse current washing, finally winds
Molding.
It is observed through scanning electron microscope, steel wire surface nickel plating thickness is 5 μm, steel wire surface unit length (mm) diamond
Particle par is 186, and diamond particles are averaged 7.1 μm of height of protrusion, and wire rupture power is 22.3N.After tested, diamond
The Fracture Force of saw blade cutting line goes out the apparent increase of sword rate, and no particle agglomeration phenomenon generates.
Embodiment 2
Degreasing powder solution is configured, includes the 100g/L surfactant (weight of coconut oil diethanol amine, organic silicon modified by polyether
Amount than be 1:1 mixed liquor), metal polar plate is installed in degreasing powder solution, gives pole plate positive electricity, negative electricity, it is miscellaneous to carry out steel wire surface
Matter removing.Mixed solution A is configured, is made it includes the electropositive absorbers of 4g/L (polysilicate), the triethylene tetramine of 12g/L,
The inorganic salts (lithium chloride) of 0.04mol/L；Mixed liquor b is configured, the negative electricity adsorbent (polymethylacrylic acid) it includes 4g/L is made,
The polycarbodiimide of 5g/L, the inorganic salts (ammonium chloride) of 0.1mol/L.6-12 μm of diadust of addition is to mixed solution B
In, diadust content is 15g/L, is sufficiently diluted, dispersion, circulation impact is sufficiently stirred.Diameter is 60 μm of steel wire warps
It crosses after removing oil solution, after washing, by mixed solution A, by the time 10 seconds, using mixed solution B, by the time 15
Second.Into drying cabinet, drying temperature is 160 DEG C, is directly entered nickel preplating, nickel plating, solidification, adverse current washing, finally winds
Molding.
It is observed through scanning electron microscope, steel wire surface nickel plating thickness is 4 μm, steel wire surface unit length (mm) diamond
Particle par is 166, and diamond particles are averaged 5.3 μm of height of protrusion, and wire rupture power is 17.1N.After tested, diamond
The Fracture Force of saw blade cutting line goes out the apparent increase of sword rate, and no particle agglomeration phenomenon generates.
Embodiment 3
Degreasing powder solution is configured, it is (sodium pyrophosphate, coconut oil diethanol amine, polyether-modified comprising 150g/L surfactant
Organosilicon, phosphate weight ratio be the mixed liquor of 2:1:1:1), metal polar plate is installed in degreasing powder solution, is giving pole plate just
Electricity, negative electricity, in degreasing powder solution, steel wire carries out surface impurity removing for several positive/negative plate cross arrangements.Configure mixed solution
A makes it includes the electropositive absorbers of 4g/L (diallyl dimethyl ammoniumchloride), the N hydroxymethyl acrylamide of 15g/L,
The inorganic salts of 0.05mol/L (potassium chloride: sodium carbonate mass ratio is 1:1)；Mixed liquor b is configured, makes that it includes the suctions of the negative electricity of 3g/L
Attached dose (polyvinylpyrrolidone), the polycarbodiimide of 5g/L, the inorganic salts (sodium sulphate) of 0.1mol/L.9-14 μm of addition
For diadust into mixed solution B, diadust content is 10g/L, is sufficiently diluted, dispersion is sufficiently stirred, recycled
Impact.Diameter is 75 μm of steel wires after except oil solution, washing, by mixed solution A, by the time 10 seconds, using mixed
Solution B is closed, by the time 3 seconds.Into drying cabinet, drying temperature be 250 DEG C, be directly entered nickel preplating, nickel plating, solidification,
Adverse current is washed, last coiling and molding.
It is observed through scanning electron microscope, steel wire surface nickel plating thickness is 5 μm, steel wire surface unit length (mm) diamond
Micro powder granule par is 214, and diamond particles are averaged 6.8 μm of height of protrusion, and wire rupture power is 17.9N.After tested, golden
The Fracture Force of hard rock saw blade cutting line goes out the apparent increase of sword rate, and no particle agglomeration phenomenon generates.
Embodiment 4
Configure degreasing powder solution, comprising 165g/L surfactant (coconut oil diethanol amine, neopelex,
The weight ratio of phosphate is the mixed liquor of 2:3:1), metal polar plate is installed in degreasing powder solution, gives pole plate positive electricity, negative electricity, if
In degreasing powder solution, steel wire carries out surface impurity removing for dry positive/negative plate cross arrangement.Configure mixed solution A, make it includes
The electropositive absorbers (diallyl dimethyl ammoniumchloride) of 12g/L, the inorganic salts (lithium chloride: potassium nitrate quality of 0.3mol/L
Than for 1:1)；Mixed solution B is configured, the negative electricity adsorbent (polyvinyl) it includes 35g/L, the poly- carbonization two of 20g/L are made
Imines, the inorganic salts (sodium nitrate) of 0.1mol/L.9-14 μm of diadust of addition is into mixed solution B, diadust
Content is 22g/L, is sufficiently diluted, and dispersion, circulation impact is sufficiently stirred.Diameter is 75 μm of steel wires after except oil solution,
Washing, by mixed solution A, by the time 10 seconds, using mixed solution B, by the time 12 seconds.Into drying box
Body, drying temperature are 200 DEG C, are directly entered nickel preplating, nickel plating, solidification, adverse current washing, last coiling and molding.
It is observed through scanning electron microscope, steel wire surface nickel plating thickness is 10 μm, steel wire surface unit length (mm) Buddha's warrior attendant
Stone micro powder granule par is 286, and diamond particles are averaged 7 μm of height of protrusion, and wire rupture power is 19.6N.After tested, golden
The Fracture Force of hard rock saw blade cutting line goes out the apparent increase of sword rate, and no particle agglomeration phenomenon generates.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of self assembly diamond fretsaw cutting material, it is characterised in that: the cutting material is coated on steel by stacking gradually
Absorption solidification layer, nickel coating and diadust outside screw line form, the bottom of the diamond particles in the diadust
Portion is partially submerged into absorption solidification layer, and the substrate of diamond particles is wrapped up by nickel coating.
2. self assembly diamond fretsaw cutting material according to claim 1, it is characterised in that: the steel wire bus it is straight
Diameter is 40-150 μm, absorption solidification layer with a thickness of being greater than 0 and less than 0.4 μm, nickel coating with a thickness of 2-12 μm, diamond is micro-
The partial size of powder is 6-16 μm, and diamond particles therein are polyhedron.
3. self assembly diamond fretsaw cutting material according to claim 2, it is characterised in that: the absorption solidification layer by
Steel wire bus it is one or many successively be infiltrated on mixed solution A and mixed solution B after formed, include in the mixed solution A
Electropositive absorbers and inorganic salts, wherein the concentration of electropositive absorbers is 5-15g/L, and the concentration of inorganic salts is 0.005-1mol/L；
It include negative electricity adsorbent, curing agent and inorganic salts in the mixed solution B, wherein the concentration of negative electricity adsorbent is 5-50g/L, Gu
The concentration of agent is 10-50g/L, and the concentration of inorganic salts is 0.005-1mol/L.
4. self assembly diamond fretsaw cutting material according to claim 3, it is characterised in that: in the mixed solution A
It further include curing agent, the concentration of curing agent is 5-50g/L in the mixed solution A.
5. self assembly diamond fretsaw cutting material according to claim 3, it is characterised in that: the electropositive absorbers packet
Include polyethyleneimine, polyvinyl pyridine is Quadrafos, polysilicate, one or two kinds of in diallyl dimethyl ammoniumchloride
Above mixture；Preferably, the negative electricity adsorbent includes polyacrylic acid, polyacrylamide, polymethylacrylic acid, polyphenyl second
Alkene sulfonic acid, polyvinylpyrrolidone, polyvinyl sulfonic acid, mixture one or more kinds of in polyvinyl；Preferably, institute
State inorganic salts include lithium chloride, it is sodium chloride, potassium chloride, ammonium chloride, sodium sulphate, potassium sulfate, sodium nitrate, a kind of in potassium nitrate or two
Kind or more mixture.
6. self assembly diamond fretsaw cutting material according to claim 4, it is characterised in that: the curing agent includes three
Ethylene tetramine, N hydroxymethyl acrylamide, polyisocyanates, mixture one or more kinds of in polycarbodiimide.
7. a kind of preparation method of any self assembly diamond fretsaw cutting material of claim 1-6, it is characterised in that:
Include the following steps:
Step 1: first preparing degreasing powder solution, and pole plate or pole roller are installed in degreasing powder solution, make steel wire bus in degreasing powder
Positive and negative anodes circuit is formed with pole plate or pole roller in solution, circuit quantity is unlimited, washes after removing the impurity on steel wire bus surface；
Step 2: electropositive absorbers and inorganic salts being mixed evenly, and are configured to mixed solution A to after being completely dissolved；
Step 3: negative electricity adsorbent, curing agent and inorganic salts being mixed evenly, and to after being completely dissolved are configured to mix molten
Liquid B；
Step 4: diadust being added into mixed solution B, wherein the additive amount of diadust is every liter of mixed solution B
10-25g is added, is sufficiently diluted, dilution is water, and dispersion, circulation impact is sufficiently stirred；
Step 5: steel wire bus of the step 1 by washing is one or many successively by molten by mixing again after mixed solution A
Liquid B, and by sufficiently wetting, absorption, it is formed in mixed solution A and mixed solution B gradually on steel wire bus surface；
Step 6: step 5 treated diamond wire being subjected to high-temperature concretion, the high temperature silicon carbide by high temperature section is 140
℃-250℃；
Step 7: steel wire bus is by carrying out nickel plating, solidification, adverse current washing, last coiling and molding after step 6.
8. the preparation method of self assembly diamond fretsaw cutting material according to claim 7, it is characterised in that: the step
The concentration of degreasing powder solution used in rapid 1 is 100-200g/L, and degreasing powder therein includes sodium pyrophosphate, coconut oil diethanol
Amine, nonylphenol polyoxyethylene ether, organic silicon modified by polyether, trihydroxy ethylamine oleate soap, alkyl polyoxyethylene ether, gathers diethylene glycol
Ethylene oxide ether alkyl phenol, fatty acid diethanolamine, linear alkylbenzene sulfonate (LAS), olefin sulfonate, alkyl sulfate, phosphate
In one or more mixture.
9. the preparation method of self assembly diamond fretsaw cutting material according to claim 7, it is characterised in that: the step
It further include curing agent in mixed solution A in rapid 2, the high temperature silicon carbide of the high temperature section in step 6 is 160 DEG C -250 DEG C.
10. the preparation method of self assembly diamond fretsaw cutting material according to claim 7, it is characterised in that: described
The time that steel wire bus passes through in mixed solution A in step 5 is 5-20s, and the time passed through in mixed solution B is 5-
20s。
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| CN201810713299.3A CN108950628A (en) | 2018-06-29 | 2018-06-29 | A kind of self assembly diamond fretsaw cutting material and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112793023A (en) * | 2021-01-15 | 2021-05-14 | 河南鑫宇光科技股份有限公司 | Multi-wire cutting method for machining Faraday optical rotator |
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| KR20080063227A (en) * | 2006-12-31 | 2008-07-03 | 고려대학교 산학협력단 | Method for pretreatment of subtrate using electrostatic self-assembly process with nano diamond particles and deposition method for diamond thin film using the same |
| US20110263187A1 (en) * | 2010-04-27 | 2011-10-27 | Yen-Kang Liu | Wire saw and method for fabricating the same |
| WO2012134133A2 (en) * | 2011-03-31 | 2012-10-04 | 고려대학교 산학협력단 | Nanowire having diamond deposited thereon, manufacturing method thereof, and biosensor including same |
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2018
- 2018-06-29 CN CN201810713299.3A patent/CN108950628A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20080063227A (en) * | 2006-12-31 | 2008-07-03 | 고려대학교 산학협력단 | Method for pretreatment of subtrate using electrostatic self-assembly process with nano diamond particles and deposition method for diamond thin film using the same |
| US20110263187A1 (en) * | 2010-04-27 | 2011-10-27 | Yen-Kang Liu | Wire saw and method for fabricating the same |
| WO2012134133A2 (en) * | 2011-03-31 | 2012-10-04 | 고려대학교 산학협력단 | Nanowire having diamond deposited thereon, manufacturing method thereof, and biosensor including same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112793023A (en) * | 2021-01-15 | 2021-05-14 | 河南鑫宇光科技股份有限公司 | Multi-wire cutting method for machining Faraday optical rotator |
| CN112793023B (en) * | 2021-01-15 | 2022-07-29 | 河南鑫宇光科技股份有限公司 | Multi-line cutting method for machining Faraday rotator |
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