CN108925038A - Inductance, circuit board and inductance measurement method - Google Patents
Inductance, circuit board and inductance measurement method Download PDFInfo
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- CN108925038A CN108925038A CN201810829333.3A CN201810829333A CN108925038A CN 108925038 A CN108925038 A CN 108925038A CN 201810829333 A CN201810829333 A CN 201810829333A CN 108925038 A CN108925038 A CN 108925038A
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- inductance
- spiral
- section
- fanout area
- line layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Inductance, circuit board and inductance measurement method.This application involves electronic technology field, a kind of inductance using the removal interference of magnetic bead principle.The inductance is located at the fanout area of circuit board, including input section, spiral section and deferent segment.The input section and the deferent segment are located in metal line layer different in fanout area, the spiral section includes first end point and the second endpoint, the first end point and second endpoint are connected to the input section and the deferent segment respectively, and at least provided with a via hole between the first end point and the input section or between second endpoint and the deferent segment.The input section, the spiral section and the deferent segment are linked as access by the via hole, the application inductance forms magnetic bead inductance using the cabling in the fanout area, clutter can be effectively removed, while simplifying the setting quantity of the element in fanout area, has saved manufacture and design cost.
Description
Technical field
This application involves electronic technology field more particularly to a kind of inductance using the removal interference of magnetic bead principle.
Background technique
In circuit design, the circuit symbol of magnetic bead is exactly inductance, i.e., magnetic bead is exactly inductance.The inductance of magnetic bead is smaller,
Easy to make, it also has the characteristics that ordinary inductor is unexistent.Such as ordinary inductor, since there are distribution capacity, so
In the case where frequency very high (especially higher hamonic wave), ordinary inductor is possible to can be by equivalent at a capacitor, thus can not
Play the role of inductance.
But just the no drawbacks described above of ordinary inductor, magnetic bead have fabulous high frequency characteristics to magnetic bead inductance, frequency very
Still with the inductance characteristic of temperature under high environment.Therefore, as described in Figure 1, one would generally be placed in circuit design in circuit
Magnetic bead even several magnetic beads inhibit the noise and spike interference on power supply line preferably to remove noise wave removing.
In the fanout area of circuit board, since winding displacement arrangement is relatively intensive, the demand to production precision is higher.Fanout area is often
It needs to be added magnetic bead to remove noise, but be individually added into magnetic bead element in the intensive position of winding displacement, increases the complexity of fanout area
Degree, is also unfavorable for the control of the fanout area accuracy of manufacture, undoubtedly increases the manufacturing cost of circuit board.
Summary of the invention
The application proposes a kind of inductance in circuit board fanout area, utilizes the clutter in magnetic bead principle removal fanout area
Interference.The application inductance includes following technical solution：
A kind of inductance, positioned at the fanout area of circuit board, the inductance includes input section, spiral section and deferent segment, described
Input section and the deferent segment are located in metal line layer different in fanout area, and the spiral section includes first end point and second end
Point, the first end point and second endpoint are connected to the input section and the deferent segment respectively, and the first end point
At least provided with a via hole between the input section or between second endpoint and the deferent segment.
Wherein, the spiral section and the input section are located in the same metal line layer of the fanout area, the second end
It is electrically connected between point and the deferent segment by the via hole.
Wherein, the first end point is located at the spiral outer ring of the spiral section.
Wherein, the spiral section includes the first spiral winding and the second spiral winding being sequentially connected electrically, the first end
Point is located at first spiral winding, and the second end point is located at second spiral winding.
Wherein, first spiral winding and second spiral winding are respectively positioned on the same metal wire of the fanout area
Layer.
Wherein, first spiral winding and second spiral winding are located at the different metal line layer of the fanout area
In.
Wherein, first spiral winding and the input section are located in the same metal line layer of the fanout area.
Wherein, second spiral winding and the deferent segment are located in the same metal line layer of the fanout area.
The application further relates to a kind of circuit board, including fanout area, is equipped with above-mentioned inductance in the fanout area.
The application further relates to a kind of measurement method of inductance, and the inductance is located at the fanout area of circuit board, the inductance packet
Input section, spiral section and the deferent segment of electrical connection are included, the input section and the deferent segment are located in the fanout area different
Metal line layer in, the line width for measuring the spiral section is W, and the wire length of the spiral section is l, and the value L of the inductance is：
L=2l [ln (2l/w)+0.5+0.2235 (w/l)] (nH).
Herein described inductance forms similar magnetic by the spiral section in the fanout area of the circuit board
The structure of pearl inductance, to effectively carried out using the high frequency characteristics of magnetic bead inductance to the metal routing in the fanout area miscellaneous
Wave filtering.Since the first end point of the spiral section and second endpoint can not be in the same metal wires of the fanout area
It is attached in layer, and then the input section and the deferent segment is set in the different metal line layer of the fanout area, and
The electrical overlap joint of the inductance is realized by the via hole.Herein described inductance realizes filtering in the fanout area
Effect, while necessity that magnetic bead element is specially set in the fanout area is eliminated, the structure of the fanout area is simplified, into
And reduce the cost of manufacture and design cost of circuit board.
Detailed description of the invention
Fig. 1 is the schematic diagram of magnetic bead inductance in the prior art；
Fig. 2 is the floor map of herein described inductance；
Fig. 3 is the schematic cross-section of Fig. 2；
Fig. 4 is the floor map of another embodiment of herein described inductance；
Fig. 5 is the schematic cross-section of Fig. 4；
Fig. 6 is the schematic diagram of herein described inductance plate another embodiment；
Fig. 7 is a kind of schematic cross-section of embodiment of Fig. 6；
Fig. 8 is the schematic cross-section of Fig. 6 another kind embodiment；
Fig. 9 is the schematic cross-section of Fig. 6 another embodiment.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiment of the application, instead of all the embodiments.Base
Embodiment in the application, those of ordinary skill in the art are obtained all without making creative work
Other embodiments shall fall in the protection scope of this application.
Please refer to inductance 100 shown in Fig. 2.Herein described inductance 100 includes input section 10, spiral section 20 and output
Section 30.The spiral section 20 includes first end point 201 and the second endpoint 202, the first end point 201 and second endpoint
202 are electrically connected with the input section 10 and the deferent segment 30 respectively.Figure it is seen that by the institute of the spiral section 20
It states first end point 201 and second endpoint 202 divides the outer ring for arranging the spiral section 20 and inner ring, the input section 10 and described
Being electrically connected for deferent segment 30 and the first end point 201 and second endpoint 202, needs as shown in figure 3, by the input section
10 and the deferent segment 30 be set in the different metal line layer of circuit board 200.The i.e. described circuit board 200 includes the first metal wire
Layer 21 and the second metal line layer 22, the input section 10 are located at first metal line layer 21, and the deferent segment 30 is located at described
Second metal line layer 22.Otherwise the input section 10 or the deferent segment 30 at least one need from the spiral section 20
The heart is pierced by, while being crossed over many times during it is pierced by with the spiral helicine spiral section 20, and the spiral section is destroyed
20 inductance characteristic.It should be understood that when to be set to the circuit board 200 different for the input section 10 and the deferent segment 30
When in metal line layer, the spiral section 20 can be located in first metal line layer 21, can also be located at second metal
In line layer 22.Even, the spiral section 20 may be located on being different from first metal line layer 21 and second metal wire
In remaining metal line layer except layer 22.As a result, between the first end point 201 and the input section 10 or the second end
At least provided with a via hole 40 between point 202 and the deferent segment 30, to by the input section 10, the spiral section 20 and institute
It states deferent segment 30 and is linked as conductive access.
It should be understood that when the spiral section 20 be located at first metal line layer 21 or second metal line layer 22 it
When in remaining outer metal line layer, 40 quantity of via hole is 2, is respectively used to connect the input section 10 and the first end point
201 and the deferent segment 30 and second endpoint 202.
Herein described inductance 100 is located in the fanout area 210 of the circuit board 200.Have in the fanout area 210 a plurality of
Fan-out line.It should be understood that the input section 10, the spiral section 20 and the deferent segment 30 are the one of same fan-out line
Part.Because the fan-out line in the fanout area 210 is more intensive, need to add signal filter element in fan-out line to guarantee
The useful signal of fan-out line transmits.In the prior art, it generallys use and adds the mode of magnetic bead inductance on fan-out line path to realize
Signal filtering.But magnetic bead inductance element is added in the intensive fanout area 210, will increase the structure of the fanout area 210
Complexity, and then improve the manufacturing cost of the circuit board 200.And herein described inductance 100, utilize the fanout area
Existing fan-out line in 210, itself can generate parasitic inductance.It only needs to come according to preset shape in the production process real
It applies, can realize the filtering function of similar magnetic bead inductance using parasitic inductance on fan-out line, greatly reduce the circuit
The element quantity required of plate 200 simplifies the structure of the circuit board 200, has saved manufacturing cost and design cost.
Further, the spiral is measured referring to fig. 2 for the measurement method of the inductance value of herein described inductance 100
The line width of section is W, and the wire length of the spiral section is l, then the equivalent magnetic bead inductance value L of herein described inductance 100 is：
L=2l [ln (2l/w)+0.5+0.2235 (w/l)] (nH).
For example, the line width measured value of circuit board X, power supply 3.3V are 0.076cm, the wire length actual measurement of the spiral section 20 is
0.427cm substitutes into above-mentioned formula it can be concluded that the inductance value of a PCB trace is：
L=2x0.427 [ln (2x0.427/0.076)+0.5+0.2235 (0.076/0.427)]=2.1nH (nanohenry)
As can be seen from the above formula that the inductance value L measurement method of herein described inductance 100, with the spiral section 20
Length l and line width W it is related.Meanwhile the helicoidal area of the inductance value L of the inductance 100 and the spiral section 20 also positive
It closes.The spiral winding area of the spiral section 20 is bigger, and corresponding inductance value L obtained is also bigger.Further, the inductance
Ratio (l of the length l of 100 inductance value L and the spiral section 20 with line width W：W and W：L) related.It should be understood that
By reasonable reverse-direction derivation, in the different embodiments of the application, by the length l of spiral section 20 described in appropriate adjustment or
Width W can obtain required inductance value, and then the parameters such as voltage for matching herein described circuit board 200, can to realize
The signal filter effect leaned on.
It should be mentioned that the spiral section 20 be preferably etc. line widths production method, just be conducive to herein described inductance
100 inductance value L is measured and calculated.In the diagram such as Fig. 2, Fig. 4, the spiral section 20 is because the reason of mapping thickness occurs not
Deng shape, only show the spiral path of the spiral section 20, do not represent the preferred forms of the application.
In the fig. 3 embodiment, the spiral section 20 is located at the same metal of the fanout area 210 with the input section 10
Line layer, i.e., in described first metal line layer 21.Meanwhile first metal line layer 21 is located at the top surface of the circuit board 200.Into
One step, for the spiral section 20, the first end point 201 is located at the outer ring position of the spiral section 20, the input section 10
It is connect with the first end point 201.And second endpoint 202 is located in the inner ring of the spiral section 20, second endpoint
Connection between 202 and the deferent segment 30 is realized by the via hole 40.Likewise, second metal line layer 22 can be with
For the bottom surface of the circuit board 200, realization is relatively easily made positioned at the metal line layer of bottom surface and top surface.
It should be mentioned that the embodiment of Fig. 2 and Fig. 3 is a kind of embodiment in this application, another embodiment is shown in
The spiral section 20 can be set to second metal line layer 22 with the deferent segment 30 by Fig. 4 and Fig. 5 simultaneously.Institute at this time
Deferent segment 30 is stated to need to connect with the first end point 201 to be just able to achieve structure, and the input section 20 is needed through the mistake
Hole 40 is connected to second endpoint 202 positioned at 20 inner ring of spiral section.
In the fanout area 210, because the arrangement of fan-out line is relatively intensive, and the spiral section 20 is in the fanout area
It needs to occupy certain area in 210.Especially when the inductance value L of 100 demand of inductance is larger, the spiral section 20 needs
The area of occupancy increases accordingly, and may arrange to the fan-out line in the fanout area 210 and cause certain limitation.Referring to Fig. 6's
Embodiment, the spiral section 20 include the first spiral winding 203 and the second spiral winding 204 being sequentially connected electrically.Described first
Endpoint 201 is located at first spiral winding 203, and second endpoint 202 is located at second spiral winding 204.Shape at this time
At two concatenated inductance, and two inductance are provided with the inductance characteristic of magnetic bead.This is arranged two in the fanout area 210
The effect of a magnetic bead is identical, and while effectively filtering clutter, the inductance 100 for reducing single helical coil shape is occupied
The excessive defect of width area.
Referring to Fig. 7, a kind of embodiment, first spiral winding 203 and second spiral winding 204 are respectively positioned on described
In the same metal line layer of fanout area 210 (Fig. 7 is first metal line layer 21).First spiral winding 203 at this time
Endpoint is the first end point 201 at outer ring, and endpoint 2031 needs and described second at the inner ring of first spiral winding 203
Endpoint 2041 connects at the outer ring of spiral winding 204.Need to be arranged one section of bridge joint sections 50 at this time, the bridge joint sections 50 and described the
One spiral winding 203 and second spiral winding 204 are located in different metal line layers.In the example of figure 7, the bridge
It connects section 50 and is located at second metal line layer 22, and the both ends of the bridge joint sections 50 pass through the first bridge joint hole 51 and the second bridge respectively
Hole 52 is connect to connect with endpoint 2031 at the inner ring of first spiral winding 203 and the outer ring of second spiral winding 204
Locate endpoint 2041 to connect.Herein described inductance 100 passes through concatenated first spiral winding 203 and described second as a result,
The element that spiral winding 204 realizes two similar magnetic bead inductance is connected effect.
Another embodiment is shown in that Fig. 8, first spiral winding 203 and second spiral winding 204 are located at the fan
Out in the different metal line floor in area 210.Further, first spiral winding 203 and the input section 10 are located on described the
In one metal line layer 21.The bridge joint sections 50 are located at except first metal line layer 21 and second metal line layer 22 at this time
Third metal line layer 23 in.The company of the bridge joint sections 50 and first spiral winding 203 and second spiral winding 204
It connects, equally passes through the connection of endpoint 2031 at the inner ring of the first bridge joint hole 51 and first spiral winding 203, Yi Jisuo
The connection that bridge joint sections 50 are stated at the outer ring of second spiral winding 204 2041 is realized.
In the embodiment in fig. 8, the third metal line layer 23 is located at first metal line layer 21 and second gold medal
Belong between line layer 22, wherein first metal line layer 21 is the top surface of the circuit board 200, the second metal wire line layer 22
For the bottom surface of the circuit board 200.In further embodiments, second metal line layer 22 can be defined as the circuit
The a certain intermediate structure layer of plate 200 sets the third metal line layer 23 to the bottom surface of the circuit board 200, equally not shadow
The scheme for ringing herein described inductance 100 is realized.
It should be mentioned that (see Fig. 9) in some other embodiment, can be set second spiral winding 204 with
The deferent segment 30 is located in second metal line layer 22, and the via hole 40 is located at the input section 10 and described at this time
Between end point 201.Correspondingly, the third metal line layer 23 can also be located at first metal line layer 21 and described second
Between metal line layer 22, or the third metal line layer 23 is set to the top surface of the circuit board 200, by first metal
Line layer 21 is set as a certain intermediate structure layer of the circuit board 200, and the technology of herein described inductance 100 equally may be implemented
Scheme.
This application involves circuit board 200, including fanout area 210.It should be understood that being equipped in the fanout area 210
Multiple fan-out lines.The phenomenon that the application can generate parasitic inductance using fan-out line sets one or more snippets in fan-out line to
The structure of the inductance 100, to play the role of efficiently using parasitic inductance to generate magnetic bead inductance.It should be understood that
Herein described circuit board 200 is using self structure and electrically special because being equipped with the inductance 100 in the fanout area 210
Point saves the necessity that magnetic bead inductance element is separately provided in the circuit board 200, simplifies institute to realize filtration effect
The structure for stating circuit board 200, has saved manufacturing cost.
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (10)
1. a kind of inductance, positioned at the fanout area of circuit board, which is characterized in that the inductance includes input section, spiral section and defeated
Section out, the input section and the deferent segment are located in metal line layer different in fanout area, and the spiral section includes first end
Point and the second endpoint, the first end point and second endpoint are connected to the input section and the deferent segment respectively, and institute
It states between first end point and the input section or between second endpoint and the deferent segment at least provided with a via hole.
2. inductance as described in claim 1, which is characterized in that the spiral section is located at the same of the fanout area with the input section
In one metal line layer, it is electrically connected between second endpoint and the deferent segment by the via hole.
3. inductance as claimed in claim 2, which is characterized in that the first end point is located at the spiral outer ring of the spiral section.
4. inductance as described in claim 1, which is characterized in that the spiral section include the first spiral winding for being sequentially connected electrically and
Second spiral winding, the first end point are located at first spiral winding, and the second end point is located at second helix
Circle.
5. inductance as claimed in claim 4, which is characterized in that first spiral winding and second spiral winding are respectively positioned on
The same metal line layer of the fanout area.
6. inductance as claimed in claim 4, which is characterized in that first spiral winding and second spiral winding are located at institute
It states in the different metal line layer of fanout area.
7. inductance as claimed in claim 6, which is characterized in that first spiral winding is located at described be fanned out to the input section
In the same metal line layer in area.
8. inductance as claimed in claim 6, which is characterized in that second spiral winding is located at described be fanned out to the deferent segment
In the same metal line layer in area.
9. a kind of circuit board, which is characterized in that including fanout area, be equipped in the fanout area such as any one of claim 1~8 institute
State inductance.
10. a kind of measurement method of inductance, which is characterized in that the inductance is located at the fanout area of circuit board, and the inductance includes
Input section, spiral section and the deferent segment of electrical connection, the input section and the deferent segment are located at different in the fanout area
In metal line layer, the line width for measuring the spiral section is W, and the wire length of the spiral section is l, and the value L of the inductance is：
L=2l [ln (2l/w)+0.5+0.2235 (w/l)] (nH).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810829333.3A CN108925038A (en) | 2018-07-25 | 2018-07-25 | Inductance, circuit board and inductance measurement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810829333.3A CN108925038A (en) | 2018-07-25 | 2018-07-25 | Inductance, circuit board and inductance measurement method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108925038A true CN108925038A (en) | 2018-11-30 |
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ID=64416852
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810829333.3A Pending CN108925038A (en) | 2018-07-25 | 2018-07-25 | Inductance, circuit board and inductance measurement method |
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| Country | Link |
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| CN (1) | CN108925038A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005077404A (en) * | 2003-09-02 | 2005-03-24 | Ind Technol Res Inst | Magnetic component for plurality of magnetic poles and its manufacturing method |
| CN201781069U (en) * | 2010-05-17 | 2011-03-30 | 瑞声精密制造科技(常州)有限公司 | Antenna device |
| CN203368934U (en) * | 2013-07-12 | 2013-12-25 | Tcl通力电子（惠州）有限公司 | PCB wiring inductor, and DC-DC circuit |
-
2018
- 2018-07-25 CN CN201810829333.3A patent/CN108925038A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005077404A (en) * | 2003-09-02 | 2005-03-24 | Ind Technol Res Inst | Magnetic component for plurality of magnetic poles and its manufacturing method |
| CN201781069U (en) * | 2010-05-17 | 2011-03-30 | 瑞声精密制造科技(常州)有限公司 | Antenna device |
| CN203368934U (en) * | 2013-07-12 | 2013-12-25 | Tcl通力电子（惠州）有限公司 | PCB wiring inductor, and DC-DC circuit |
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| CB02 | Change of applicant information |
Address after: 518132 No. 9-2 Ming Avenue, Guangming New District, Guangdong, Shenzhen Applicant after: TCL Huaxing Photoelectric Technology Co.,Ltd. Address before: 518132 No. 9-2 Ming Avenue, Guangming New District, Guangdong, Shenzhen Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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Application publication date: 20181130 |
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| RJ01 | Rejection of invention patent application after publication |