CN108922865A - 一种芯片固定方法及系统 - Google Patents
一种芯片固定方法及系统 Download PDFInfo
- Publication number
- CN108922865A CN108922865A CN201811023370.1A CN201811023370A CN108922865A CN 108922865 A CN108922865 A CN 108922865A CN 201811023370 A CN201811023370 A CN 201811023370A CN 108922865 A CN108922865 A CN 108922865A
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- chip
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- 230000005540 biological transmission Effects 0.000 claims abstract description 41
- 238000012546 transfer Methods 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 16
- 238000012790 confirmation Methods 0.000 description 15
- 238000001514 detection method Methods 0.000 description 12
- 230000001960 triggered effect Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004590 computer program Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 206010052428 Wound Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 210000001367 artery Anatomy 0.000 description 1
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- 238000004891 communication Methods 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811023370.1A CN108922865A (zh) | 2018-09-03 | 2018-09-03 | 一种芯片固定方法及系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811023370.1A CN108922865A (zh) | 2018-09-03 | 2018-09-03 | 一种芯片固定方法及系统 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108922865A true CN108922865A (zh) | 2018-11-30 |
Family
ID=64406738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811023370.1A Pending CN108922865A (zh) | 2018-09-03 | 2018-09-03 | 一种芯片固定方法及系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108922865A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113382602A (zh) * | 2021-06-07 | 2021-09-10 | 上海国微思尔芯技术股份有限公司 | 一种芯片散热系统 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5117555A (en) * | 1991-01-17 | 1992-06-02 | International Business Machines Corporation | Modular system and method for populating circuit boards |
KR19990079132A (ko) * | 1998-04-01 | 1999-11-05 | 김영환 | 반도체 패키지 |
KR200346837Y1 (ko) * | 2004-01-12 | 2004-04-08 | 한동희 | 평판표시소자용 본딩시스템 |
US20070138630A1 (en) * | 2005-12-20 | 2007-06-21 | Phoenix Precision Technology Corporation | Structure of circuit board and method for fabricating same |
CN103111753A (zh) * | 2013-02-04 | 2013-05-22 | 福建省威诺数控有限公司 | 一种基于视觉的全自动晶圆划片机控制系统 |
WO2015072666A1 (ko) * | 2013-11-14 | 2015-05-21 | (주)피토 | 전자부품용 칩 정렬유닛 및 이를 갖는 전자부품용 칩 정렬장치 |
CN106340481A (zh) * | 2016-10-20 | 2017-01-18 | 上海客辉自动化设备有限公司 | 一种大型载板的移动定位机构 |
US20170263483A1 (en) * | 2014-09-17 | 2017-09-14 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
CN108015382A (zh) * | 2018-01-22 | 2018-05-11 | 成都玖信科技有限公司 | 一种多芯片共晶石墨工装及装配方法 |
CN208923077U (zh) * | 2018-09-03 | 2019-05-31 | 华丰源(成都)新能源科技有限公司 | 一种芯片固定系统 |
-
2018
- 2018-09-03 CN CN201811023370.1A patent/CN108922865A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5117555A (en) * | 1991-01-17 | 1992-06-02 | International Business Machines Corporation | Modular system and method for populating circuit boards |
KR19990079132A (ko) * | 1998-04-01 | 1999-11-05 | 김영환 | 반도체 패키지 |
KR200346837Y1 (ko) * | 2004-01-12 | 2004-04-08 | 한동희 | 평판표시소자용 본딩시스템 |
US20070138630A1 (en) * | 2005-12-20 | 2007-06-21 | Phoenix Precision Technology Corporation | Structure of circuit board and method for fabricating same |
CN103111753A (zh) * | 2013-02-04 | 2013-05-22 | 福建省威诺数控有限公司 | 一种基于视觉的全自动晶圆划片机控制系统 |
WO2015072666A1 (ko) * | 2013-11-14 | 2015-05-21 | (주)피토 | 전자부품용 칩 정렬유닛 및 이를 갖는 전자부품용 칩 정렬장치 |
US20170263483A1 (en) * | 2014-09-17 | 2017-09-14 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus and substrate processing method |
CN106340481A (zh) * | 2016-10-20 | 2017-01-18 | 上海客辉自动化设备有限公司 | 一种大型载板的移动定位机构 |
CN108015382A (zh) * | 2018-01-22 | 2018-05-11 | 成都玖信科技有限公司 | 一种多芯片共晶石墨工装及装配方法 |
CN208923077U (zh) * | 2018-09-03 | 2019-05-31 | 华丰源(成都)新能源科技有限公司 | 一种芯片固定系统 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113382602A (zh) * | 2021-06-07 | 2021-09-10 | 上海国微思尔芯技术股份有限公司 | 一种芯片散热系统 |
CN113382602B (zh) * | 2021-06-07 | 2023-07-18 | 上海思尔芯技术股份有限公司 | 一种芯片散热系统 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: No. 2002, Konggang 4th Road, Shuangliu District, Chengdu, Sichuan 610200 Applicant after: CHENGDU DONGTENG FILM SOLAR Co.,Ltd. Address before: No. 2002, Konggang 4th Road, Shuangliu District, Chengdu, Sichuan 610200 Applicant before: HUAFENGYUAN (CHENGDU) NEW ENERGY TECHNOLOGY Co.,Ltd. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20210222 Address after: 101400 No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing (cluster registration) Applicant after: Beijing Huihong Technology Co.,Ltd. Address before: No. 2002, Konggang 4th Road, Shuangliu District, Chengdu, Sichuan 610200 Applicant before: CHENGDU DONGTENG FILM SOLAR Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211008 Address after: 101400 Yanqi Street, Yanqi Economic Development Zone, Huairou District, Beijing Applicant after: Dongjun new energy Co.,Ltd. Address before: 101400 No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing (cluster registration) Applicant before: Beijing Huihong Technology Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181130 |