CN108918534A - A kind of bonding defect detection device based on parital vacuum load - Google Patents

A kind of bonding defect detection device based on parital vacuum load Download PDF

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Publication number
CN108918534A
CN108918534A CN201810702638.8A CN201810702638A CN108918534A CN 108918534 A CN108918534 A CN 108918534A CN 201810702638 A CN201810702638 A CN 201810702638A CN 108918534 A CN108918534 A CN 108918534A
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CN
China
Prior art keywords
ccd camera
laser
sliding block
slide bar
bonding defect
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Pending
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CN201810702638.8A
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Chinese (zh)
Inventor
尚伟
刘洁
曹力玮
白翰学
苏泽强
高尔泰
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Tianjin Chengjian University
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Tianjin Chengjian University
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Priority to CN201810702638.8A priority Critical patent/CN108918534A/en
Publication of CN108918534A publication Critical patent/CN108918534A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination

Abstract

The invention discloses a kind of bonding defect detection devices based on parital vacuum load, including laser, sliding block, CCD camera, slide bar, shear mirror, vacuum pump, organic glass case and beam expanding lens, the laser and CCD camera pass through screw rod respectively and are mounted on sliding block, and it is fixed using nut, beam expanding lens is installed in the front end of the laser, shear mirror is installed in the front end of the CCD camera, two sliding blocks drive laser and CCD camera to slide on slide bar respectively, the sliding block can be fixed on slide bar by screw, the organic glass case is controlled to a vacuum pump by pipeline.The present invention uses parital vacuum loading method, can be realized the detection of the position to bonding defect, size and shape, and can be applied to the on-the-spot test of large-scale component.

Description

A kind of bonding defect detection device based on parital vacuum load
Technical field
The present invention relates to bonding defect detection device technology field, especially a kind of bonding based on parital vacuum load is lacked Fall into detection device.
Background technique
Composite material leans on lamination to be fabricated with technique for sticking mostly, and the inside of material and bonding plane be often during this Will appear be mingled with, unsticking, layering, affinity unsticking, weak bonding and the defects of fibrous fracture, especially the most with unsticking, lamination defect It is common, it is the most immediate cause for influencing its performance, so the non-destructive testing of composite material bonding interface defect is particularly significant.
Electric speckle-shearing pattern interferometer method is a kind of laser interferometry techniques for measuring acoplanarity displacement derivative field.It is in addition to dissipating The features such as outside many advantages of spot interferometry, it is simple that there are also optical paths, low to measurement environmental requirement, can be used for in-site measurement.Due to Speckle-shearing interferometry method is measurement displacement derivatives, and the strain loaded for defect concentrates ten while eliminating rigid body displacement automatically Divide sensitive.Based on These characteristics, electric speckle-shearing pattern interferometer method is a kind of good lossless detection method, lossless in optics at present It is played a very important role in detection technique.Electric speckle-shearing pattern interferometer method is illuminated using single beam, preposition in CCD camera Shear mirror carries out double exposure record to before object deformation and after deformation.It is to pass through that electric speckle-shearing pattern interferometer method, which obtains information, Subtract each other before deformation with deformed two images, obtains the information (as shown in Figure 1) of striped.
The principle that electric speckle-shearing pattern interferometer method carries out non-destructive testing is the zero power of adhesion region using fault location, certain Interior of articles defect is set to generate the deformation bigger than under normal circumstances on the surface under load effect, this small deformation will Shown in the form of interference fringe.Loading method is an essential ring in electronic cutting speckle nondestructive detection system Section.For different defects, used loading method is most important to non-destructive testing.Common loading method has vacuum to add Load, heat load, electromagnetic exciting load, audio load etc..Wherein vacuum load minimum affected by environment, but to large scale test specimen Detection will make large scale vacuum tank, or even can not be detected, so having certain limitation, so this patent proposes to use Parital vacuum loading method detects bonding defect.Small deformation is detected with electric speckle-shearing pattern interferometer method, If deformation is excessive, coherence can be lost, is detected so being proposed for large deformation with projection moire method.
The basic principle of projection moire method is when optical grating projection is to testee surface, due to by testee height Modulation, grating can generate deformation, contain object height information in deformed grating.Profiling object surface is measured with projection moire method, It can accomplish non-cpntact measurement.As shown in Fig. 2, being recorded grating loss to body surface with CCD due to body surface injustice And deformed grid line, then be superimposed with undeformed grid line, the contour of body surface can be obtained.
Summary of the invention
In view of the above problems, the object of the present invention is to provide a kind of bonding defect inspections based on parital vacuum load Survey device.
The technical scheme is that:A kind of bonding defect detection device based on parital vacuum load, including laser, Sliding block, CCD camera, slide bar, shear mirror, vacuum pump, organic glass case and beam expanding lens, the laser and CCD camera point It is not mounted on sliding block by screw rod, and is fixed using nut, beam expanding lens is installed in the front end of the laser, described Shear mirror is installed in the front end of CCD camera, and two sliding blocks drive laser and CCD camera to slide on slide bar respectively, The sliding block can be fixed on slide bar by screw, and the organic glass case is controlled to a vacuum pump by pipeline.
Further, sealing strip is installed at organic glass case edge.
Compared with prior art, the beneficial effects of the invention are as follows:The present invention uses parital vacuum loading method, can be realized Detection to the position of bonding defect, size and shape, and can be applied to the on-the-spot test of large-scale component.
Detailed description of the invention
Fig. 1 is the index path of electronic cutting speckle method.
Fig. 2 projection moire method optical path.
Fig. 3 schematic structural view of the invention.
The Section A-A schematic diagram of Fig. 4 Fig. 3.
Fig. 5 circular flaw bonding defect interference fringe picture.
The rectangular defect bonding defect interference fringe picture of Fig. 6.
Fig. 7 triangle defect bonding defect interference fringe picture.
The circular flaw bar graph of the undeformed projection grating of Fig. 8.
The circular flaw bar graph of the projection grating of Fig. 9 deformation.
The circular flaw bar graph of the superimposed contour of Figure 10.
In figure:1- laser, 2- sliding block, 3-CCD video camera, 4- slide bar, 5- shear mirror, 6- vacuum pump, 7- organic glass Case, 8- sealing strip, 9- beam expanding lens, 10- test specimen, 11- nut, 12- screw rod, 13- screw.
Specific embodiment
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower", The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of description of the present invention and simplification of the description, rather than instruction or dark Show that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as pair Limitation of the invention.In addition, term " first ", " second " etc. are used for description purposes only, it is not understood to indicate or imply phase To importance or implicitly indicate the quantity of indicated technical characteristic.The feature for defining " first ", " second " etc. as a result, can To explicitly or implicitly include one or more of the features.In the description of the present invention, unless otherwise indicated, " multiple " It is meant that two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition Concrete meaning in the present invention.
The present invention is further illustrated with reference to the accompanying drawings and examples.
As shown, a kind of bonding defect detection device based on parital vacuum load, including laser 1, sliding block 2, CCD Video camera 3, slide bar 4, shear mirror 5, vacuum pump 6, organic glass case 7 and beam expanding lens 9, the laser 1 and CCD camera 3 divide Not Tong Guo screw rod 11 be mounted on sliding block 2, and be fixed using nut 12, beam expanding lens be installed in the front end of the laser 1 9, shear mirror 5 is installed in the front end of the CCD camera 3, the sliding block 2 is mounted on slide bar 4 by screw 13, described in two Sliding block 2 drives laser 1 and CCD camera 3 to slide on slide bar 4 respectively, and the organic glass case 7 passes through pipeline and vacuum pump 6 connections, vacuumize organic glass case using vacuum pump, and 8 high vacuum of sealing strip is installed at 7 edge of organic glass case Degree.
Working principle:
The present invention proposes to detect bonding defect using parital vacuum loading method.If there is debonding defect, then Unsticking position can be mingled with a small amount of air, under vacuum conditions, since there are pressure differences, and defective locations surface can be made to generate from face position It moves, acoplanarity displacement can be tested with electric speckle-shearing pattern interferometer method and projection moire method, it can be real according to test result Now to the detection of the position of bonding defect, size and shape.
Deformation refers to generating on the surface at test specimen bonding defect under vacuum conditions more greatly bigger than under normal circumstances Deformation.Deformation is small, so being detected with electric speckle-shearing pattern interferometer method and projection moire method.
Under vacuum conditions, the deformation bigger than under normal circumstances is generated at test specimen bonding defect on the surface, it is this micro- Small deformation will be shown in the form of interference fringe, and different shape bonding defect interference fringe picture is as shown in Figure 5-Figure 7.It is right It is detected in small deformation with electronic cutting speckle technology, large deformation is detected with projection moire method, at this time will Laser is changed to projector.
Operating procedure:
By the organic glass case 7 equipped with sealing strip 8 as the surface of tested test block 10, by adjusting the cunning on slide bar 4 Block 2 adjusts the position of laser 1 and CCD camera 3, and acquires the speckle pattern before vacuum load.Vacuum pump 6 is opened, and is adopted Speckle pattern after collecting vacuum load.By subtracting each other to two width speckle patterns before and after vacuum load, reflection bonding defect is obtained Position, size and shape bar graph.If deformation is excessive, coherence can be lost, so being proposed for large deformation with throwing Shadow moire method is detected.The laser 1 that front end is installed to beam expanding lens 9 is needed to change projector at this time, by grating loss to examination 10 surface of part, is recorded with CCD camera 3 due to the grating figure before and after surface of test piece vacuum load, then by two width grating figures into The position of reflection bonding defect, the contour bar graph of size and shape can be obtained, as Figure 8-Figure 10 in row superposition.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.

Claims (2)

1. a kind of bonding defect detection device based on parital vacuum load, which is characterized in that taken the photograph including laser, sliding block, CCD Camera, slide bar, shear mirror, vacuum pump, organic glass case and beam expanding lens, the laser and CCD camera pass through screw rod respectively It is mounted on sliding block, and is fixed using nut, beam expanding lens is installed in the front end of the laser, in the CCD camera Front end shear mirror is installed, two sliding blocks drive laser and CCD camera to slide on slide bar respectively, and the sliding block can It is fixed on slide bar by screw, the organic glass case is controlled to a vacuum pump by pipeline.
2. a kind of bonding defect detection device based on parital vacuum load according to claim 1, which is characterized in that institute State organic glass case edge installation sealing strip.
CN201810702638.8A 2018-06-29 2018-06-29 A kind of bonding defect detection device based on parital vacuum load Pending CN108918534A (en)

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Application Number Priority Date Filing Date Title
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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000011430A1 (en) * 1998-08-01 2000-03-02 Bae Systems Plc Apparatus and method for the non-destructive testing of articles using optical metrology
CN1632543A (en) * 2004-12-22 2005-06-29 广州华工百川自控科技有限公司 Laser speckle tire non-destructive detector and non-destructive testing method utilizing the same
CN2771816Y (en) * 2005-03-23 2006-04-12 中国船舶重工集团公司第七一一研究所 Large-shearing electronic speckle interfering instrument
CN1844843A (en) * 2006-04-28 2006-10-11 上海大学 High-resolution real-time non-destructive detection system and method
CN101221133A (en) * 2008-01-25 2008-07-16 天津商业大学 Honeycomb paper plate bonding defect detecting method and detecting system
CN101699272A (en) * 2009-11-19 2010-04-28 西北工业大学 Method of nondestructive testing with digital shearing speckle interferometry and device thereof
CN102590218A (en) * 2012-01-16 2012-07-18 安徽中科智能高技术有限责任公司 Device and method for detecting micro defects on bright and clean surface of metal part based on machine vision
CN202512071U (en) * 2012-03-29 2012-10-31 上海大学 Negative air pressure cover for portable laser speckle interference nondestructive testing
CN102854190A (en) * 2012-02-14 2013-01-02 孙金立 Laser speckle flaw detection system
CN105758868A (en) * 2016-03-28 2016-07-13 成都飞机工业(集团)有限责任公司 Thermal protecting structure debonding defect detecting method and system
CN208313848U (en) * 2018-06-29 2019-01-01 天津城建大学 A kind of bonding defect detection device based on parital vacuum load

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000011430A1 (en) * 1998-08-01 2000-03-02 Bae Systems Plc Apparatus and method for the non-destructive testing of articles using optical metrology
CN1632543A (en) * 2004-12-22 2005-06-29 广州华工百川自控科技有限公司 Laser speckle tire non-destructive detector and non-destructive testing method utilizing the same
CN2771816Y (en) * 2005-03-23 2006-04-12 中国船舶重工集团公司第七一一研究所 Large-shearing electronic speckle interfering instrument
CN1844843A (en) * 2006-04-28 2006-10-11 上海大学 High-resolution real-time non-destructive detection system and method
CN101221133A (en) * 2008-01-25 2008-07-16 天津商业大学 Honeycomb paper plate bonding defect detecting method and detecting system
CN101699272A (en) * 2009-11-19 2010-04-28 西北工业大学 Method of nondestructive testing with digital shearing speckle interferometry and device thereof
CN102590218A (en) * 2012-01-16 2012-07-18 安徽中科智能高技术有限责任公司 Device and method for detecting micro defects on bright and clean surface of metal part based on machine vision
CN102854190A (en) * 2012-02-14 2013-01-02 孙金立 Laser speckle flaw detection system
CN202512071U (en) * 2012-03-29 2012-10-31 上海大学 Negative air pressure cover for portable laser speckle interference nondestructive testing
CN105758868A (en) * 2016-03-28 2016-07-13 成都飞机工业(集团)有限责任公司 Thermal protecting structure debonding defect detecting method and system
CN208313848U (en) * 2018-06-29 2019-01-01 天津城建大学 A kind of bonding defect detection device based on parital vacuum load

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
田代才等: ""电子错位照相技术及其在材料无损检测中的应用"", 《上海金属》, vol. 28, no. 2, 31 May 2006 (2006-05-31), pages 53 - 56 *

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