CN108914058A - A kind of precision metallic mask plate, evaporation coating device and vapor deposition processing procedure - Google Patents
A kind of precision metallic mask plate, evaporation coating device and vapor deposition processing procedure Download PDFInfo
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- CN108914058A CN108914058A CN201810949101.1A CN201810949101A CN108914058A CN 108914058 A CN108914058 A CN 108914058A CN 201810949101 A CN201810949101 A CN 201810949101A CN 108914058 A CN108914058 A CN 108914058A
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- Prior art keywords
- metallic mask
- precision metallic
- vapor deposition
- mask plate
- precision
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The present invention provides a kind of precision metallic mask plates, metal support network and at least one precision metallic mask strip including braced frame and setting on the support frame, precision metallic mask strip is located above metal support network, wherein, metal support network is an integral molding structure, at least one opening region is provided in metal support network, graphics field is provided in precision metallic mask strip, graphics field is located at the top at least one opening region and covering at least one opening region, it is deposited in processing procedure, evaporation material passes sequentially through open area and graphics field and forms default vapor deposition pattern on substrate to be deposited.Integrally formed metal support network is used in precision metallic mask plate of the invention, can support precision metallic mask strip and evaporation material is stopped to pass through from the interval between adjacent precision metallic mask strip；The shape of open area determines the shape of default vapor deposition pattern, therefore, precision metallic mask plate can be made in the special-shaped vapor deposition that shields by the way that open area is arranged.
Description
Technical field
The present invention relates to technical field of display panel more particularly to a kind of precision metallic mask plates, evaporation coating device and vapor deposition
Processing procedure.
Background technique
In recent years, Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) has self-luminous, wide
Visual angle, almost infinite high contrast, compared with low power consumption, high reaction speed the advantages that, more taken in small-medium size display field
For the trend of liquid crystal display (Liquid Crystal Display, LCD), at this stage the oled panel of small-medium size mostly according to
Rely vapor deposition processing procedure, wherein the jig in vapor deposition processing procedure for graphic definition is metallic mask, precision metallic exposure mask can be divided into
Plate (Fine Metal Mask, FMM) and universal metal mask (Common Metal Mask, CMM).FMM is used for rgb pixel
Definition is mainly used for R, G, B luminescent layer and dopant material vapor deposition, and CMM is mainly as common layer pattern definition device.
Currently, the demand of more and more separate special-shaped display devices in conventional screen shape increasingly increases.Nowadays
Special-shaped screen is mainly that LCD shields firmly, needs to cut using break bar in the fabrication process, causes its production yield lower.It is flexible
Laser cutting can be used in oled panel, and there is no many defects of break bar cutting, while flexible panel sliver passes through laser lift-off
Technology falls off, and not will cause flexible base board damage, however does not have also in existing evaporation coating technique and be suitable for being deposited setting for special-shaped screen
It is standby, main cause be not there is also special-shaped FMM exploitation to use.Therefore, it is necessary to a kind of essences of vapor deposition that can be used in abnormity screen
Close metal mask version.
Summary of the invention
In view of this, the present invention provides a kind of precision metallic mask plate, including metal branch on the support frame is arranged
Support net and precision metallic mask strip, metal support network are an integral molding structure, and can be supported precision metallic mask strip and be stopped to steam
Plating material passes through from the interval between adjacent precision metallic mask strip；The shape of open area determines default vapor deposition pattern
Shape, therefore, by be arranged open area can make precision metallic mask plate for abnormity shield vapor deposition in.
In a first aspect, the present invention provides a kind of precision metallic mask plate, including braced frame and setting are in the branch
Metal support network and at least one precision metallic mask strip on support frame frame, the precision metallic mask strip are located at the metal branch
The online side of support, wherein the metal support network is an integral molding structure, and is provided at least one opening in the metal support network
Region is provided with graphics field in the precision metallic mask strip, and the graphics field is located at least one described open area
Top and cover at least one described open area, in the vapor deposition processing procedure, evaporation material passes sequentially through the open area
Default vapor deposition pattern is formed on substrate to be deposited with the graphics field.
In the present invention, the metal support network on precision metallic mask plate is an integral molding structure, and is provided at least
One open area；Metal support network can play a supporting role to precision metallic mask strip；Meanwhile it is described during vapor deposition
Metal support network can stop evaporation material to pass through from the interval between adjacent precision metallic mask strip.During vapor deposition,
Evaporation material forms default vapor deposition pattern, the default vapor deposition pattern by open area and graphics field on substrate to be deposited
Shape determine that rgb pixel is defined by the figure of precision metallic mask strip in the default vapor deposition pattern by the shape of open area
Shape region determines.
In the present invention, the shape of the open area is set according to actual needs.Specifically, can be, but not limited to
For rectangle, round rectangle, ellipse, star, regular polygon, U-Cut design.Optionally, the open area is described wait steam
Orthographic projection on the substrate of plating is overlapped with the center of the default vapor deposition pattern, and the 50nm-300nm that extends outwardly.In the present invention
In, the setting of open area is so that the precision metallic mask plate can be used for the vapor deposition of abnormity screen.
Optionally, the periphery of the metal support network is provided with the connection strap of multiple protrusions, is arranged in the braced frame
There are the matched multiple grooves of connection strap with multiple protrusions, the connection strap setting of the protrusion is in the groove.
Further alternative, the length of the connection strap of the protrusion is 30nm-100nm, width 5nm-25nm.
In the present invention, the periphery of metal support network is provided with the connection strap of multiple protrusions, is provided in braced frame more
Width, position and the quantity of a groove, raised connection strap and groove match so that protrusion connection strap be just arranged in it is recessed
In slot, so that metal support network setting is on the support frame.
Optionally, the connection strap of the protrusion connects in the groove by welding.Specifically, can with but not
There are multiple solder joints at the edge for being limited to for the connection strap of the protrusion, in the groove by solder joint welding.
In the present invention, the position of metal support network on the support frame is lower than precision metallic mask strip on the support frame
Position, be connected in braced frame to not influence precision metallic mask strip, and support is played to precision metallic mask strip
Effect.
Optionally, further include buffer area in the precision metallic mask strip, the buffer area include the first sub- buffer area and
Second sub- buffer area, the first sub- buffer area and the second sub- buffer area are symmetrically disposed on the two sides of the graphics field,
Engraved structure is in the buffer area or etches partially structure.
Using precision metallic mask plate be deposited when, need to carry out at relatively high temperatures, thus can exist Metal Deformation and
Thermal expansion metal is easy to produce deformation, leads to the dislocation of evaporation material, and finally generates phenomena such as misplacing colour mixture.Therefore, in essence
Buffer area is set on close metal mask item, is conducive to disperse pulling force of throwing the net in high temperature deposition, reduces what the direction y when throwing the net generated
Deformation, so as to improve the deformation of precision metallic mask strip in vapor deposition processing procedure.
Further alternative, the first sub- buffer area includes the first buffer part and the second buffer part, and second son is slow
Rushing area includes third buffer part and the 4th buffer part, and first buffer part and the third buffer part are symmetrically disposed on the figure
The two sides in shape region, second buffer part and the 4th buffer part are symmetrically disposed on the two sides of the graphics field.
It is further optional, first buffer locations in second buffer part far from the graphics field one
Side.Further optional, the third buffer locations are in side of the 4th buffer part far from the graphics field.
Further optionally, second buffer part and the 4th buffer part are embedded in the connection of the adjacent protrusion
Between item.
In the present invention, the second buffer part and the 4th buffer part are between the connection strap of adjacent protrusion, not only favorably
In the deformation for improving precision metallic mask strip in vapor deposition processing procedure, the effect for further fixing precision metallic mask strip is also acted as.
Optionally, the graphics field is the reticular structure being made of multiple through-hole intervals.
In the present invention, depending on design of the spacing of the through-hole according to the substrate to be deposited, the density of the through-hole
It is identical as the pixel arrangement density designed on the substrate to be deposited.
Optionally, the section of the through-hole is trapezoid cross section.Further alternative, the acute angle in the trapezoid cross section is
30°-80°。
Further alternative, the spacing of multiple through-holes in the graphics field is equal.
Optionally, the precision metallic mask strip is made by etching, electroforming or laser ablation process.
Optionally, the graphics field includes at least one figure subregion.
In the present invention, the graphics field in the precision metallic mask strip can be several spaced figures
Shape subregion, or a figure subregion being continuously arranged.Wherein, several spaced figure subregions is each
A size can be the same or different, and be selected according to actual needs.The shape of the graphics field is not construed as limiting, specifically
Selected according to actual needs.
Optionally, bulge loop is provided on the internal perisporium of the open area, the bulge loop is far from the open area
Peripheral wall one end is pointed nose.
It is further alternative, the bulge loop with a thickness of 4.5 μm -90 μm, the ring width of the bulge loop is 0.05mm-1mm, institute
The tip angle for stating pointed nose is 30 ° -90 °.In the present invention, the thickness of bulge loop is less than the thickness of metal support network.
In the present invention, the bulge loop in the open area of metal support network, i.e. half-etched areas can avoid supporting network opening
Place is directly contacted with precision metallic mask strip, reduces supporting network opening to the scratch risk of precision metallic mask strip；Meanwhile it steaming
Evaporation material can be alleviated in plating processing procedure to the impulse force of precision metallic mask strip, preferably protect precision metallic mask strip.
Optionally, the metal support network with a thickness of 15 μm -100 μm, the precision metallic mask strip with a thickness of 8 μ
m-100μm。
Optionally, the material of the precision metallic mask plate includes invar alloy or SUS alloy.
In the present invention, the size of precision metallic mask plate is selected according to actual vapor deposition.Optionally, described
The size of precision metallic mask plate is 200mm × 200mm-1500mm × 1850mm.
Optionally, the figure on the open area in the metal support network and the precision metallic mask strip
The periphery in region is equipped with taper angle.Specifically selected according to actual needs.
Second aspect, the present invention provides a kind of evaporation coating device, including evaporation source and precision metallic mask plate, the vapor depositions
The opening in source matches setting with the precision metallic mask plate, wherein the precision metallic mask plate includes described in first aspect
Precision metallic mask plate.
The third aspect, the present invention provides a kind of vapor deposition processing procedures, including：
Substrate to be deposited is placed in evaporation coating device described in second aspect, is made described in the precision metallic mask plate
Precision metallic mask strip fits together with the substrate to be deposited；
The evaporation source is opened, the evaporation material in the evaporation source passes sequentially through the open area and the graph area
Domain forms default vapor deposition pattern on the substrate to be deposited.
Optionally, the center of orthographic projection of the open area on the substrate to be deposited and the default vapor deposition pattern
It is overlapped, and the 50nm-300nm that extends outwardly.Further alternative, extend outwardly 50nm-280nm, 50nm-200nm or 50nm-
150nm。
Beneficial effects of the present invention：
(1) a kind of precision metallic mask plate provided by the invention, including be arranged metal support network on the support frame and
Precision metallic mask strip, metal support network are integrated, can support precision metallic mask strip and stop evaporation material from
Interval between adjacent precision metallic mask strip passes through, and the setting of the open area in metal support network is so that precision metallic is covered
Film version can be used in the evaporation process of abnormity screen；
(2) the present invention provides a kind of evaporation coating devices, include precision metallic mask plate, which can be used for different
The vapor deposition of shape screen；
(3) the present invention provides a kind of vapor deposition processing procedures, can be used for the vapor deposition of abnormity screen, and operating procedure is simple, abnormity screen
Production yield it is high, be conducive to save the cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described.Specific embodiment described herein is only used to explain this
Invention, is not intended to limit the present invention.
Fig. 1 is a kind of structural schematic diagram of precision metallic mask plate provided in an embodiment of the present invention.
Fig. 2 is the A of region A in Fig. 11-A1The sectional view in face.
Fig. 3 is the B of region B in Fig. 11-B1The sectional view in face.
Fig. 4 provides a kind of structural representation of precision metallic mask strip in precision metallic mask plate for the embodiment of the present invention,
In, (a) is the structural schematic diagram of the first precision metallic mask strip in Fig. 4, and (b) is second of precision metallic mask strip in Fig. 4
Structural schematic diagram, (c) is the structural schematic diagram of the third precision metallic mask strip in Fig. 4.
Fig. 5 is a kind of vapor deposition processing procedure schematic diagram provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, being a kind of precision metallic mask plate provided by the invention, including braced frame 10 and setting in institute
State the metal support network 20 and at least one precision metallic mask strip 30 in braced frame 10, the precision metallic mask strip 30
Above the metal support network 20, wherein the metal support network 20 is an integral molding structure, in the metal support network 20
It is provided at least one opening region 21, graphics field 31, the graphics field are provided in the precision metallic mask strip 30
31 are located at the top of at least one open area 21 and cover at least one described open area 21, the vapor deposition processing procedure
In, evaporation material passes sequentially through the open area 21 and the graphics field 31 and forms default vapor deposition figure on substrate to be deposited
Case.In embodiments of the present invention, may exist one or more precision metallic mask strip 30 on precision metallic mask plate；Metal
Supporting network 20 is an integral molding structure, and can be played a supporting role to precision metallic mask strip, and make adjacent precision metallic
Interval between mask strip 30 does not have evaporation material and passes through.During vapor deposition, the shape of vapor deposition pattern is preset by open region
The shape in domain determines, to determine final screen shape, i.e., open area defines default vapor deposition pattern form.Of the invention real
Apply in mode, evaporation material pass sequentially through the open area 21 and the graphics field 31 formed on substrate to be deposited it is default
Pattern is deposited.The shape of open area 21 is set according to actual needs.Specifically, can be, but not limited to as rectangle, fillet
Rectangle, ellipse, star, regular polygon, U-Cut design.Optionally, the open area 21 is on the substrate to be deposited
Orthographic projection is overlapped with the center of the default vapor deposition pattern, and the 50nm-300nm that extends outwardly.In the present invention, open area
Setting is so that the precision metallic mask plate can be used for the vapor deposition of abnormity screen.
In embodiments of the present invention, Fig. 1 and Fig. 2 are please referred to, the periphery of the metal support network 20 is provided with multiple convex
The connection strap 22 risen, be provided in the braced frame 10 with the matched multiple grooves 11 of the connection strap 22 of the multiple protrusion,
The connection strap 22 of the protrusion is arranged in the groove 11.Optionally, the length of the connection strap 22 of the protrusion is 30nm-
100nm, width 5nm-25nm.The periphery of metal support network 20 is provided with the connection strap 22 of multiple protrusions, in braced frame 10
Multiple grooves 11 are provided with, width, position and the quantity of raised connection strap 22 and groove 11 match, so that the connection of protrusion
Item 22 is just arranged in groove 11, so that metal support network 20 is arranged in braced frame 10.
In embodiments of the present invention, referring to Fig. 2, the connection strap 22 of the protrusion is connected to institute by welding
It states in groove 11.Specifically, can be, but not limited to the edge for the connection strap 22 of the protrusion there are multiple solder joints 23, pass through institute
Solder joint 23 is stated to be welded in the groove 11.Optionally, 10 surface of braced frame is provided with solder joint 12, the precision metallic
Mask strip 30 can be welded to braced frame 10 by solder joint 12.Certainly, the braced frame 10 in the precision metallic mask plate,
Metal support network 20 and precision metallic mask strip 30 can be integrated, and save the process welded.Metal support network
20 are lower than position of the precision metallic mask strip 30 in braced frame 10 in the position in braced frame 10, to not influence precision
Metal mask item 30 is connected in braced frame 10, and is played a supporting role to precision metallic mask strip 30.
In embodiments of the present invention, described slow referring to Fig. 1, further including buffer area in the precision metallic mask strip
It rushes area and includes the first sub- buffer area 32 and the second sub- buffer area 33, the first sub- buffer area 32 and the second sub- buffer area 33
The two sides of the graphics field 31 are symmetrically disposed on, engraved structure is in the buffer area or etches partially structure.Optionally, described
One sub- buffer area 32 includes the first buffer part 321 and the second buffer part 322, and the second sub- buffer area 33 includes third buffer part
331 and the 4th buffer part 332, first buffer part 321 and the third buffer part 331 are symmetrically disposed on the graphics field
31 two sides, second buffer part 322 and the 4th buffer part 332 are symmetrically disposed on the two sides of the graphics field 31.
Further optional, first buffer part 321 is located at one of second buffer part 322 far from the graphics field 31
Side.Further optional, the third buffer part 331 is located at the 4th buffer part 332 far from the graphics field 31
Side.Further optional, second buffer part 322 and the 4th buffer part 332 are embedded in the adjacent protrusion
Between connection strap 22.When being deposited using precision metallic mask plate, need to carry out at relatively high temperatures, therefore there can be metal shape
Change and thermal expansion metal, are easy to produce deformation, lead to the dislocation of evaporation material, and finally generate phenomena such as misplacing colour mixture.Therefore,
Buffer area is set in precision metallic mask strip, is conducive to disperse pulling force of throwing the net in high temperature deposition, the direction y production when reduction is thrown the net
Raw deformation so as to improve the deformation of precision metallic mask strip in vapor deposition processing procedure, while also helping precision metallic mask strip
Fixation.
In embodiments of the present invention, referring to Fig. 3, being the B of region B1-B1The sectional view in face.The graphics field 31 is
The reticular structure constituted is spaced by multiple through-holes 311.In the present invention, the spacing of the through-hole 311 is according to the base to be deposited
Depending on the design of plate, the pixel arrangement density designed in the density of the through-hole 311 and the substrate to be deposited is identical.It is optional
, the section of the through-hole 311 is trapezoid cross section.Further alternative, the acute angle in the trapezoid cross section is 30 ° -80 °.Into
One step is optional, and the spacing of multiple through-holes 311 in the graphics field 31 is equal.Optionally, the precision metallic is covered
Film item 30 is made by etching, electroforming or laser ablation process.Optionally, the graphics field 31 includes at least one figure
Region.In the present invention, the graphics field 31 in the precision metallic mask strip 30 can be spaced for several
Figure subregion, or a figure subregion being continuously arranged.Wherein, several spaced figure subregions
Each size can be the same or different, and be selected according to actual needs.The shape of the graphics field is not construed as limiting, tool
Body is selected according to actual needs.Referring to Fig. 4, providing the structural representation of three kinds of precision metallic mask strips 30 for the present invention
Figure, wherein the graphics field 31 of (a) is made of continuous figure subregion in Fig. 4, in the graphics field in Fig. 4 in (b) and (c)
Multiple spaced figure subregions are contained, the graphics field of (b) is multiple equal-sized figure subregions in Fig. 4
What 312 intervals were formed, the graphics field of (c) is the figure subregion 313, figure subregion 314 and figure by differing in size in Fig. 4
The interval of shape subregion 315 is formed.The design of graphics field can be selected according to actual needs in precision metallic mask strip 30
It selects.
In embodiments of the present invention, Fig. 3 is please referred to.Bulge loop 211, institute are provided on the internal perisporium of the open area 21
Stating the internal perisporium one end of bulge loop far from the open area 21 is pointed nose.Optionally, the bulge loop 211 with a thickness of for 4.5 μ
M-90 μm, the ring width of the bulge loop 211 is 0.05mm-1mm, and the tip angle of the pointed nose is 30 ° -90 °.In the present invention
In, the thickness of bulge loop is less than the thickness of metal support network.In the present invention, the bulge loop in the open area of metal support network, i.e.,
Half-etched areas can avoid supporting network opening and directly contact with precision metallic mask strip, reduce supporting network opening to accurate gold
Belong to the scratch risk of mask strip；Meanwhile evaporation material can be alleviated to the impulse force of precision metallic mask strip, more in vapor deposition processing procedure
Good protection precision metallic mask strip.
In embodiments of the present invention, the metal support network 20 with a thickness of 15 μm -100 μm, the precision metallic is covered
Film item 30 with a thickness of 8 μm -100 μm.
In embodiments of the present invention, the material of the precision metallic mask plate includes invar alloy or SUS alloy.
In embodiments of the present invention, the size of precision metallic mask plate is selected according to actual vapor deposition.It can
Choosing, the size of the precision metallic mask plate is 200mm × 200mm-1500mm × 1850mm.
Metal support network in precision metallic mask plate provided by the invention is integrated, and can support precision metallic
Mask strip and evaporation material can be stopped to pass through from the interval between adjacent precision metallic mask strip, the setting of open area
So that precision metallic mask plate can be used in the evaporation process of abnormity screen.
The present invention also provides a kind of evaporation coating devices, including evaporation source and precision metallic mask plate, the evaporation source to open
Mouth matches setting with the precision metallic mask plate, wherein the precision metallic mask plate is above-mentioned precision metallic mask plate.
Referring to Fig. 5, be a kind of vapor deposition processing procedure schematic diagram provided in an embodiment of the present invention, including：
Substrate 1 to be deposited is placed in above-mentioned evaporation coating device, the accurate gold in the precision metallic mask plate 2 is made
Belong to mask strip 30 to fit together with the substrate 1 to be deposited；
The evaporation source is opened, the evaporation material in the evaporation source passes sequentially through the open area 21 and the figure
Region 31 forms default vapor deposition pattern on the substrate to be deposited.
In embodiments of the present invention, substrate 1 to be deposited be located at board carrying platform 3 and precision metallic mask plate 2 it
Between.
In embodiments of the present invention, orthographic projection of the open area 21 on the substrate 1 to be deposited with it is described pre-
If the center that pattern is deposited is overlapped, and the 50nm-300nm that extends outwardly.It is further alternative, the 50nm-280nm that extends outwardly,
50nm-200nm or 50nm-150nm.
Specifically, the vapor deposition processing procedure can be, but not limited to for by precision metallic mask plate provided by the invention be sent into for
Vapor deposition cavity in, mechanical arm decline, the braced frame of precision metallic mask plate is placed in holding for corresponding evaporated device chamber
It is on carrying platform and fixed；Substrate to be deposited is transmitted in cavity by mechanical arm, and is stably placed at board base plate carrying dress
That sets lifts on pawl；Substrate bearing device decline, is covered substrate and precision metallic to be deposited using board charge-coupled device
Template contraposition keeps vapor deposition region on open area and the substrate to be deposited on precision metallic mask plate corresponding；Due to be deposited
Substrate self gravity, the pressure that applies of platform and board magnetic sheet attract, precision metallic mask plate and substrates into intimate to be deposited
Fitting can start to carry out vapor deposition processing procedure, complete corresponding function layer and deposit in substrate surface；After processing procedure is deposited, vapor deposition is completed
Substrate slowly risen, separated with precision metallic mask plate, specify region to complete plated film on substrate, and be sent to next section of system
Journey.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of precision metallic mask plate, for processing procedure to be deposited, which is characterized in that including braced frame and be arranged in the branch
Metal support network and at least one precision metallic mask strip on support frame frame, the precision metallic mask strip are located at the metal branch
The online side of support, wherein the metal support network is an integral molding structure, and is provided at least one opening in the metal support network
Region is provided with graphics field in the precision metallic mask strip, and the graphics field is located at least one described open area
Top and cover at least one described open area, in the vapor deposition processing procedure, evaporation material passes sequentially through the open area
Default vapor deposition pattern is formed on substrate to be deposited with the graphics field.
2. precision metallic mask plate as described in claim 1, which is characterized in that the periphery of the metal support network is provided with more
The connection strap of a protrusion is provided with the matched multiple grooves of connection strap with multiple protrusions in the braced frame, described
The connection strap setting of protrusion is in the groove.
3. precision metallic mask plate as described in claim 1, which is characterized in that further include delaying in the precision metallic mask strip
Area is rushed, the buffer area includes the first sub- buffer area and the second sub- buffer area, and the first sub- buffer area and second son are slow
The two sides that area is symmetrically disposed on the graphics field are rushed, engraved structure is in the buffer area or etches partially structure.
4. precision metallic mask plate as described in claim 1, which is characterized in that the graphics field is by multiple through-hole intervals
The reticular structure of composition.
5. precision metallic mask plate as described in claim 1, which is characterized in that be provided on the internal perisporium of the open area
Bulge loop, the internal perisporium one end of the bulge loop far from the open area is pointed nose.
6. precision metallic mask plate as claimed in claim 5, which is characterized in that the bulge loop with a thickness of for 4.5 μm of -90 μ
M, the ring width of the bulge loop are 0.05mm-1mm, and the tip angle of the pointed nose is 30 ° -90 °.
7. precision metallic mask plate as described in claim 1, which is characterized in that the metal support network with a thickness of 15 μm-
100 μm, the precision metallic mask strip with a thickness of 8 μm -100 μm.
8. a kind of evaporation coating device, which is characterized in that including evaporation source and precision metallic mask plate, the opening of the evaporation source and institute
State the matching setting of precision metallic mask plate, wherein the precision metallic mask plate includes the described in any item essences of claim 1-7
Close metal mask version.
9. a kind of vapor deposition processing procedure, which is characterized in that including：
Substrate to be deposited is placed in evaporation coating device as claimed in claim 8, is made described in the precision metallic mask plate
Precision metallic mask strip fits together with the substrate to be deposited；
The evaporation source is opened, the evaporation material in the evaporation source passes sequentially through the open area and the graphics field and exists
Default vapor deposition pattern is formed on the substrate to be deposited.
10. vapor deposition processing procedure as claimed in claim 9, which is characterized in that the open area is on the substrate to be deposited
Orthographic projection is overlapped with the center of the default vapor deposition pattern, and the 50nm-300nm that extends outwardly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810949101.1A CN108914058B (en) | 2018-08-20 | 2018-08-20 | Precise metal mask, evaporation device and evaporation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810949101.1A CN108914058B (en) | 2018-08-20 | 2018-08-20 | Precise metal mask, evaporation device and evaporation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108914058A true CN108914058A (en) | 2018-11-30 |
| CN108914058B CN108914058B (en) | 2020-11-27 |
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ID=64404116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810949101.1A Active CN108914058B (en) | 2018-08-20 | 2018-08-20 | Precise metal mask, evaporation device and evaporation process |
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| Country | Link |
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| CN (1) | CN108914058B (en) |
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