CN108907574A - The positioning device and localization method of solder sphere - Google Patents
The positioning device and localization method of solder sphere Download PDFInfo
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- CN108907574A CN108907574A CN201810979021.0A CN201810979021A CN108907574A CN 108907574 A CN108907574 A CN 108907574A CN 201810979021 A CN201810979021 A CN 201810979021A CN 108907574 A CN108907574 A CN 108907574A
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- Prior art keywords
- pipe
- plane
- sphere
- solder sphere
- guide
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
Abstract
The present invention provides a kind of positioning devices of solder sphere, are related to construction field, including：Plane positioning component and altitude location component, altitude location component include the first pipe, the second pipe and third pipe.The first end of first pipe is connect with plane positioning component, and the first end of the second pipe is located inside the first pipe, and the second end of the second pipe is stretched out by the second end of the first pipe.The first end of third pipe is connect with the second end of the second pipe, and the second end of third pipe is contacted with solder sphere.The inner dimensions of first pipe are not less than the physical dimension of the second pipe, so that the second pipe can be moved along the axis of the first pipe.The present invention also provides a kind of localization method of solder sphere, the positioning device of the solder sphere or the localization method of solder sphere have good versatility.
Description
Technical field
The present invention relates to construction field more particularly to the positioning devices and localization method of a kind of solder sphere.
Background technique
Due to the various advantages of space grid structure, space grid structure is widely used in modern architecture.Space networks
Frame structure is the space net structure as made of solder sphere and welding assembly, in assembling space reticular structure, it is thus necessary to determine that weldering
The position received.
The positioning device and positioning method of existing solder sphere are mainly by being fixed on solder sphere with pre-set dimension
Interim location measure on, then adjust the position of the interim location measure, realize the positioning of solder sphere, this positioning device and
The problem of localization method generally existing poor universality.
Summary of the invention
The present invention provides a kind of positioning device of solder sphere and localization methods, for solving the poor universality of the prior art
The problem of.
First aspect of the embodiment of the present invention provides a kind of positioning device of solder sphere, including：
Plane positioning component and altitude location component, the altitude location component include the first pipe, the second pipe and third pipe；
The first end of first pipe is connect with the plane positioning component, and the first end of second pipe is located at described the
Inside one pipe, and the second end of second pipe is stretched out by the second end of first pipe；
The first end of the third pipe is connect with the second end of second pipe, the second end and the weldering of the third pipe
It receives contact；
The inner dimensions of first pipe are not less than the physical dimension of second pipe, so that second pipe can be along described
The axis of first pipe is mobile.
On the other hand the embodiment of the present invention provides a kind of localization method of solder sphere, the positioning applied to a kind of solder sphere
Device, the positioning device include：
Plane positioning component and altitude location component, the altitude location component include the first pipe, the second pipe and third pipe,
The solder sphere is contacted with the third pipe；
The localization method includes：
According to preset target position the plane positioning component is adjusted, makes the centre of sphere of the solder sphere on the support surface
Projection is overlapped with the projection of the target position on the support surface；
The relative position of first pipe and second pipe is adjusted, to adjust the entire length of the altitude location part,
It is overlapped the centre of sphere of the solder sphere with the target position.
The embodiments of the present invention due to that can manage the relative position between the second pipe by adjusting first, and then are adjusted
The entire length of whole altitude location component, therefore the positioning device of solder sphere provided in this embodiment and the localization method of solder sphere can
To adapt to the location requirement of the solder sphere of different object heights, there is good versatility.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those skilled in the art without any creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of the positioning device for the solder sphere that first embodiment of the invention provides；
Fig. 2 is the assembling schematic diagram at a visual angle of the positioning device for the solder sphere that first embodiment of the invention provides；
Fig. 3 is the assembling schematic diagram at another visual angle of the positioning device for the solder sphere that first embodiment of the invention provides；
Fig. 4 is the structural schematic diagram of the positioning device for the solder sphere that second embodiment of the invention provides；
Fig. 5 is the assembling schematic diagram at a visual angle of the positioning device for the solder sphere that second embodiment of the invention provides；
Fig. 6 is the assembling schematic diagram at another visual angle of the positioning device for the solder sphere that second embodiment of the invention provides；
Fig. 7 is the flow diagram of the localization method for the solder sphere that third embodiment of the invention provides；
Fig. 8 is the flow diagram of the localization method for the solder sphere that fourth embodiment of the invention provides.
Specific embodiment
In order to make the invention's purpose, features and advantages of the invention more obvious and easy to understand, below in conjunction with the present invention
The attached drawing that embodiment provides, is clearly and completely described technical solution provided in an embodiment of the present invention, it is clear that described
Embodiment be only a part of the embodiment of the present invention, and not all embodiments.Based on embodiment provided by the invention, this field
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of the positioning device for the solder sphere that first embodiment of the invention provides, such as
Shown in Fig. 1, which includes：
Plane positioning component 100 and altitude location component 200, altitude location component 200 are managed including the first pipe 210, second
220 and third pipe 230.
Fig. 2 and Fig. 3 are please referred to, Fig. 2 is a visual angle of the positioning device for the solder sphere that first embodiment of the invention provides
Assembling schematic diagram, Fig. 3 is that the assembly at another visual angle of the positioning device of solder sphere that first embodiment of the invention provides is shown
It is intended to, in conjunction with Fig. 1 to Fig. 3, the first end 211 of the first pipe is connect with plane positioning component 100, the first end of the second pipe 221
In the inside of the first pipe 210, and the second end 222 of the second pipe is stretched out by the second end 212 of the first pipe.
The first end 231 of third pipe is connect with the second end 222 of the second pipe, the second end 232 and solder sphere 300 of third pipe
Contact.
The inner dimensions of first pipe 210 are not less than the physical dimension of the second pipe 220, so that the second pipe 220 can be along first
The axis of pipe 210 is mobile.
Optionally, it is additionally provided with connecting element between the first pipe 210 and the second pipe 220, to fix the first pipe 210 and second
Relative position between pipe 220, for example, it is provided with magnetic stripe on the inner surface of the first pipe 210 and the outer surface of the second pipe 220,
The magnetic stripe is parallel with the axis of the first pipe 210 and the second pipe 220, and the second pipe 220 of rotation makes the first pipe 210 and the second pipe 220
On magnetic stripe mutually stagger, that is, can move freely the second pipe 220, the second pipe 220 adjusted to required position, rotation second pipe
Magnetic stripe on the inner surface of the first pipe of magnetic stripe face 210 on 220 outer surface, fixes first by the magnetic force between the magnetic stripe
Relative position between pipe 210 and the second pipe 220.
In the present embodiment, it since the relative position between the second pipe can be managed by adjusting first, and then adjusts high
The entire length of positioning component is spent, therefore the positioning device of solder sphere provided in this embodiment is adapted to different object heights
The location requirement of solder sphere has good versatility.
Fig. 4 to fig. 6 is please referred to, Fig. 4 is the structural representation of the positioning device for the solder sphere that second embodiment of the invention provides
Figure, Fig. 5 are the assembling schematic diagram at a visual angle of the positioning device for the solder sphere that second embodiment of the invention provides, and Fig. 6 is this
The assembling schematic diagram at another visual angle of the solder sphere positioning device that invention second embodiment provides, it is and preceding in conjunction with fig. 4 to fig. 6
It states unlike Fig. 1 to the positioning device of solder sphere shown in Fig. 3, in the present embodiment：
Further, as shown in figure 4, plane positioning component 100 includes：
Two guide rails 110 and guide part 120, two guide rails 110 are parallel to each other.
Guide groove 130 is provided on the face of the face of two guide rails 110, and on the length direction of guide groove 130
Axis is parallel with the axis on the length direction of guide rail 110.
Guide groove 130 forms a guide space, which is the space that guide groove 130 surrounds.
Guide part 120 is located at the inside of the guide space.
The physical dimension of guide part 120 is not more than the physical dimension of the guide space, so that guide part 120 can be along guide groove
130 length direction is mobile.
In conjunction with Fig. 4 and Fig. 6, the first end 211 of the first pipe is connect with guide part 120.
Further, in conjunction with fig. 4 to fig. 6, guide rail 110 includes the first plane 111, and the first plane 111 is with supporting surface (in figure
It is not shown) contact, guide groove 130 includes the second plane 131, and the second plane 131 is parallel with the first plane 111.
Guide part 120 includes third plane 121 and fourth plane 122, and third plane 121 is contacted with the second plane 131, the
Four planes 122 are contacted with third plane 121, and third plane 121 is parallel with fourth plane 122, the first end 211 of the first pipe with
Fourth plane 122 connects, and the axis of the first pipe 210 is vertical with fourth plane 122.
On longitudinal cross-section, the physical dimension of guide part 120 is not less than the physical dimension of the guide space, to constrain guiding
Movement of the part 120 on other directions other than moving on the length direction along guide groove 130, ensure that guide part 120 on edge
Will not be generated due to the movement of guide part 120 in the other direction when moving on the length direction of guide groove 130 perpendicular to
Displacement component on the length direction or perpendicular to the displacement component on the direction of plane where guide rail.
The longitudinal cross-section is vertical with the supporting surface, and the longitudinal cross-section is vertical with the length direction of guide groove 130.
In practical applications, supporting surface is the ground after planarizing process.
Further, in conjunction with Fig. 4 and Fig. 5, the first pipe 210 is round tube, is provided with internal screw thread on the inner surface of the first pipe 210
213。
Second pipe 220 is round tube, is provided with external screw thread 223 on the outer surface of the second pipe 220.
The axis of first pipe 210 and the second pipe 220 is overlapped, and internal screw thread 213 and external screw thread 223 match.
It should be noted that make to generate relative movement between internal screw thread 213 and external screw thread 223 by rotating the second pipe 220,
The entire length of adjustable first pipe 210 and the second pipe 220, so as to adjust the entire length of altitude location component 200, in turn
Adjust the height of solder sphere 300.Again since the screw pitch of screw thread is fixed value, solder sphere can be accurately controlled by rotating angle
The height of 300 centre of sphere, therefore the positioning of solder sphere 300 can be made more accurate.
Further, as shown in figure 4, third pipe 230 is round tube, the axis weight of the axis of third pipe 230 and the second pipe 220
It closes, and the axis of third pipe passes through the centre of sphere of solder sphere 300.
It should be noted that the axis of the first pipe 210, the second pipe 220 and third pipe 230 is overlapped, and the axis of third pipe 230
Line passes through the centre of sphere of solder sphere 300, ensure that the axis of the first pipe 210, the second pipe 220, third pipe 230 on the supporting surface
Projection is overlapped with projection of the centre of sphere of solder sphere 300 on the supporting surface, it is only necessary to by the axis location of the first pipe 210 to target
Position can guarantee that projection of the centre of sphere of solder sphere 300 on the supporting surface also is located at this at the subpoint on the supporting surface
Then target position adjusts the height of solder sphere 300 at the projection on the supporting surface by the second pipe 220 of rotation, can incite somebody to action
The centre of sphere of solder sphere 300 is positioned at the target position.When the target position is that grid structure is constructed, the ball of solder sphere 300 is needed
Position where the heart.
Simultaneously as the axis on the length direction of guide groove 130 is parallel with the axis on the length direction of guide rail 110,
And the physical dimension of guide part 120 is not less than the physical dimension of the guide space, therefore guide part 120 is along guide groove 130
When length direction is mobile, the position of the centre of sphere of solder sphere 300 will not generate the mobile component on the direction perpendicular to guide rail 110.
It is parallel to each other again due to the supporting surface, the first plane 111, the second plane 131 and third plane 121, in guide part 120 along leading
When mobile to the length direction of slot 130, the second plane is remained with third plane 121 and is contacted, it is ensured that guide part 120
Moving direction is parallel with the supporting surface always.Fourth plane 122 is parallel with third plane 121, and the axis of the first pipe 210 and
Four planes 122 are vertical, it is ensured that when guide part 120 is moved along the length direction of guide groove 130, the axis of the first pipe 210
Line is vertical with the supporting surface always, therefore can guarantee that guide part 120 when the length direction along guide groove 130 moves, welds
The position of the centre of sphere of ball 300 will not generate the mobile component on the direction perpendicular to 110 place plane of guide rail.
In conclusion in when the setting of the centre of sphere of adjustment solder sphere 300, displacement on the direction perpendicular to guide rail 110,
The displacement that is parallel on the direction of guide rail 110 and perpendicular to guide rail 110 displacement on direction in the plane it is mutually indepedent,
The displacement that can be adjusted separately on three directions is overlapped the position of the centre of sphere of solder sphere 300 with the target position, without
The position of the centre of sphere of solder sphere 300 is re-measured after the displacement on one direction of adjustment every time, and recalibrates solder sphere 300
Centre of sphere position in the other direction, therefore the positioning device of solder sphere provided in this embodiment is easy to operate.
At least one notch 233 is additionally provided on the curved surface of third pipe 230.
Optionally, there are two notches 233 for setting on the curved surface of third pipe 230, and two notches are positioned at same parallel
In in the plane of supporting surface, third pipe 230 can be made to drive the rotation of the second pipe 220 by the application torque of the two notches, from
And the entire length of altitude location component 200 is set to change, and then adjust the height of solder sphere 300.Rod piece can also be worn
Two notches are crossed, rotating handle is formed, rotate third pipe 230 by applying torque to the rotating handle, due to increasing
The arm of force, therefore can reduce power required when rotation third pipe 230.
In actual use, as shown in fig. 6, then being needed when the diameter of third pipe 230 is greater than the diameter of the second pipe 220
Third pipe 230 and the second pipe 220 are connected by connecting plate 240.The physical dimension of connecting plate 240 is not less than third pipe 230 and the
Two opposite faces of the inner dimensions of two pipes 220, connecting plate 240 are connected respectively at third pipe 230 and the second pipe 220, with even
Connect third pipe 230 and the second pipe 220.
In the present embodiment, in a first aspect, since the relative position between the second pipe can be managed by adjusting first, into
And the entire length of altitude location component is adjusted, therefore the positioning device of solder sphere provided in this embodiment is adapted to different mesh
The location requirement of the solder sphere of absolute altitude degree has good versatility.Second aspect, due to the axis on the length direction of guide groove
Line is parallel with the axis on the length direction of guide rail, and since the axis of the first pipe is perpendicular to the supporting surface, therefore welds in adjustment
When setting of the centre of sphere of ball, the displacement on the direction perpendicular to guide rail, the displacement on the direction for being parallel to guide rail and vertical
In guide rail displacement on direction in the plane it is mutually indepedent, the displacement that can be adjusted separately on three directions makes solder sphere
The position of the centre of sphere be overlapped with the target position, without re-measuring solder sphere after the displacement on one direction of adjustment every time
The centre of sphere position, and recalibrate the position of the centre of sphere of solder sphere in the other direction, therefore solder sphere provided in this embodiment
Positioning device it is easy to operate.The third aspect, since the inner surface of the first pipe is provided with internal screw thread, the outer surface setting of the second pipe
There is external screw thread, and since the screw pitch of screw thread is fixed value, the height that can accurately control the centre of sphere of solder sphere by rotating angle,
Therefore the positioning of solder sphere can be made more accurate.Fourth aspect, due to being provided at least one notch on the curved surface of third pipe,
Therefore it is convenient to the application torque of third pipe, so as to adjust the height of the centre of sphere of solder sphere, therefore can make to operate more convenient.5th side
Face, due to being connected by removably mode between guide part and guide rail, the first pipe and the second pipe, thus it is provided in this embodiment
The positioning device of solder sphere is convenient for disassembly and assembly, has good revolving.
Referring to Fig. 7, Fig. 7 is a kind of process signal of the localization method for solder sphere that third embodiment of the invention provides
Figure, this method are applied to a kind of positioning device of solder sphere, which includes：
Plane positioning component and altitude location component, the altitude location component include the first pipe, the second pipe and third pipe, are somebody's turn to do
Solder sphere is contacted with the third pipe.
As shown in fig. 7, the localization method includes：
301, plane positioning component is adjusted according to preset target position, makes the projection of the centre of sphere of solder sphere on the support surface
It is overlapped with projection of the target position on the supporting surface.
Specifically, the supporting surface is when the target position is that grid structure is constructed, to need by smooth treated ground
Position where the centre of sphere of the solder sphere.
The plane positioning component is placed on the supporting surface.
302, the relative position of the first pipe of adjustment and the second pipe makes the weldering to adjust the entire length of altitude location component
The centre of sphere received is overlapped with the target position.
Specifically, the second pipe is located at the inside of the first pipe, third pipe is connect with the second pipe, the first pipe of adjustment and the second pipe
Between relative position, the change of the entire length of altitude location part may be implemented.
It should be noted that since the entire length of altitude location component is adjustable, therefore method provided in this embodiment is applicable in
In the various target positions that solder sphere is positioned to different height, the localization method of solder sphere provided in this embodiment has good
Versatility.
Fig. 8 is please referred to, Fig. 8 is the flow diagram of the localization method for the solder sphere that fourth embodiment of the invention provides, should
Localization method is applied to a kind of positioning device of solder sphere, which includes：
Plane positioning component and altitude location component, the altitude location component include the first pipe, the second pipe and third pipe, are somebody's turn to do
Solder sphere is contacted with the third pipe.
The plane positioning component includes：Two guide rails and guide part are provided on the face of the face of two guide rails and lead
To slot.
It includes the second plane that guide rail, which includes the first plane, guide groove, and guide part includes third plane and fourth plane, this
One plane, second plane and the third plane are parallel with supporting surface.It is round tube in first pipe, and in first pipe
Internal screw thread is provided on surface.Second pipe is round tube, and external screw thread is provided on the outer surface of second pipe, and the interior spiral shell
Line matches with the external screw thread.
At least one notch is provided on the curved surface of the third pipe.
As shown in figure 8, the localization method includes：
401, target position is determined using measuring device, which includes target level axis, target vertical axis
And object height, the target level axis and the plane where the target vertical axis are parallel with supporting surface.
Specifically, the horizontal axis is vertical with the vertical axis, sky belonging to the direction of the horizontal axis and the solder sphere
Between grid structure layout determine.
Optionally, which for example can be level, theodolite or total station.
402, target level axis and target vertical axis are projected on the support surface respectively, obtain floor projection line and hung down
Deliver directly hachure.
403, two guide rails are placed on supporting surface, make the first plane and support face contact.
404, the position for adjusting two guide rails is located at floor projection line between two guide rails.
405, guide part is inserted into guide groove, makes the second plane and third plane contact, and by guide part along guide groove
Length direction it is mobile so that the intersection point of the centre of sphere of solder sphere projection on the support surface and floor projection line and vertical projecting line
It is overlapped.
Specifically, in step 404, the position of two guide rails also needs to guarantee that guide part is along guide groove in step 405
Length direction it is mobile when, the motion track of the centre of sphere of solder sphere is overlapped with floor projection line.
In practical applications, the axis of the first pipe, the second pipe and third pipe is overlapped, and the axis of third pipe passes through solder sphere
The centre of sphere, and the axis of third pipe is perpendicular to supporting surface, therefore the projected position of the centre of sphere of solder sphere on the support surface can pass through survey
The axial location of three pipe of flow control determines.
406, according to the height for the centre of sphere for measuring and being calculated solder sphere.
Specifically, a part due to solder sphere is located in third pipe, therefore the separate support of measurement third pipe can be passed through
The height of the one end in face, and by the way that welding is calculated by the internal diameter of third pipe and the radius of solder sphere according to geometrical relationship
The height of the centre of sphere of ball.
The calculation formula of the height of the centre of sphere of solder sphere is：
In formula (1), H is the height of the centre of sphere of the solder sphere, and R is the radius of the solder sphere, and r is the internal diameter of the third pipe, h
For the height of one end of the separate supporting surface of the third pipe.
407, the second pipe is calculated according to the difference between the height and object height of the centre of sphere of solder sphere to need to rotate
Target angle.
Specifically, the second pipe rotates a circle along preset direction, the Level Change amount of solder sphere is the internal screw thread or the outer spiral shell
One screw pitch of line, and since the knots modification of the height of screw thread and the angle of rotation are linear relationship, therefore can be changed by ratio
Calculation obtains the calculation formula of target angle：
In formula (2), θ is the target angle, and H ' is the object height, and H is the height of solder sphere in step 306, and d is interior spiral shell
Line or externally threaded screw pitch, since the internal screw thread and external screw thread match, therefore the internal screw thread is identical with the externally threaded screw pitch.
408, torque is applied to notch, so that third pipe is driven the second pipe rolling target angle, makes the centre of sphere and mesh of solder sphere
Cursor position is overlapped.
Optionally, there are two notch, which is located at one and is parallel to supporting surface for setting on the curved surface of third pipe
Plane on, can by rod piece pass through two notches, formed rotating handle, due to increasing the arm of force, therefore can reduce rotation
Required power when third pipe.
In the present embodiment, in a first aspect, since the relative position between the second pipe can be managed by adjusting first, into
And the entire length of altitude location component is adjusted, therefore the localization method of solder sphere provided in this embodiment is adapted to different mesh
The location requirement of the solder sphere of absolute altitude degree has good versatility.Second aspect, due to the axis on the length direction of guide groove
Line is parallel with the axis on the length direction of guide rail, and since the axis of the first pipe is perpendicular to the supporting surface, therefore welds in adjustment
When setting of the centre of sphere of ball, the displacement on the direction perpendicular to guide rail, the displacement on the direction for being parallel to guide rail and vertical
In guide rail displacement on direction in the plane it is mutually indepedent, the displacement that can be adjusted separately on three directions makes solder sphere
The position of the centre of sphere be overlapped with the target position, without re-measuring solder sphere after the displacement on one direction of adjustment every time
The centre of sphere position, and recalibrate the position of the centre of sphere of solder sphere in the other direction, therefore solder sphere provided in this embodiment
Localization method it is easy to operate.The third aspect, since the inner surface of the first pipe is provided with internal screw thread, the outer surface of the second pipe is set
It is equipped with external screw thread, and since the screw pitch of screw thread is fixed value, the height that can accurately control the centre of sphere of solder sphere by rotating angle
Degree, therefore the localization method of solder sphere provided in this embodiment can make the positioning of solder sphere more accurate.Fourth aspect, due to
At least one notch is provided on the curved surface of third pipe, thus it is convenient to the application torque of third pipe, so as to adjust the centre of sphere of solder sphere
Height, therefore the localization method of solder sphere provided in this embodiment can make to operate it is more convenient.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, there is no the portion being described in detail in some embodiment
Point, it may refer to the associated description of other embodiments.
The above are the descriptions of positioning device and localization method to solder sphere provided by the present invention, for the skill of this field
Art personnel, thought according to an embodiment of the present invention, there will be changes in the specific implementation manner and application range, to sum up,
The contents of this specification are not to be construed as limiting the invention.
Claims (10)
1. a kind of positioning device of solder sphere, which is characterized in that including：
Plane positioning component and altitude location component, the altitude location component include the first pipe, the second pipe and third pipe；
The first end of first pipe is connect with the plane positioning component, and the first end of second pipe is located at first pipe
Inside, and the second end of second pipe is stretched out by the second end of first pipe；
The first end of the third pipe is connect with the second end of second pipe, the second end and the solder sphere of the third pipe
Contact；
The inner dimensions of first pipe are not less than the physical dimension of second pipe, so that second pipe can be along described first
The axis of pipe is mobile.
2. positioning device as described in claim 1, which is characterized in that the plane positioning component includes：
Two guide rails and guide part, two guide rails are parallel to each other；
Be provided with guide groove on the face of the face of two guide rails, and the axis on the length direction of the guide groove with
Axis on the length direction of the guide rail is parallel；
The guide groove forms a guide space, and the guide space is the space that the guide groove surrounds；
The guide part is located at the inside of the guide space；
The physical dimension of the guide part is not more than the physical dimension of the guide space, so that the guide part can be led along described
It is mobile to the length direction of slot；
The first end of first pipe is connect with the guide part.
3. positioning device as claimed in claim 2, which is characterized in that the guide rail includes the first plane, first plane
With support face contact, the guide groove includes the second plane, and second plane is parallel with first plane；
The guide part includes third plane and fourth plane, the third plane and second plane contact, the third
Plane is parallel with the fourth plane, and the first end of first pipe is connect with the fourth plane, and the axis of first pipe
Line is vertical with the fourth plane；
On longitudinal cross-section, the physical dimension of the guide part is not less than the physical dimension of the guide space；
The longitudinal cross-section is vertical with the supporting surface, and the longitudinal cross-section is vertical with the length direction of the guide groove.
4. positioning device as claimed in claim 3, which is characterized in that first pipe is round tube, the interior table of first pipe
Internal screw thread is provided on face；
Second pipe is round tube, is provided with external screw thread on the outer surface of second pipe；
The axis of first pipe and second pipe is overlapped；
The internal screw thread matches with the external screw thread.
5. positioning device as claimed in claim 4, which is characterized in that the third pipe be round tube, the third pipe with it is described
The axis of second pipe is overlapped, and the axis of the third pipe passes through the centre of sphere of the solder sphere；
At least one notch is additionally provided on the curved surface of the third pipe.
6. a kind of localization method of solder sphere, which is characterized in that applied to a kind of positioning device of solder sphere, the positioning device
Including：
Plane positioning component and altitude location component, the altitude location component includes the first pipe, the second pipe and third pipe, described
Solder sphere is contacted with the third pipe；
The localization method includes：
The plane positioning component is adjusted according to preset target position, makes the projection of the centre of sphere of the solder sphere on the support surface
It is overlapped with the projection of the target position on the support surface；
The relative position for adjusting first pipe and second pipe makes institute to adjust the entire length of the altitude location part
The centre of sphere for stating solder sphere is overlapped with the target position.
7. localization method as claimed in claim 6, which is characterized in that described described flat according to the adjustment of preset target position
Face positioning component makes the projection and the throwing of the target position on the support surface of the position of the solder sphere on the support surface
Before shadow is overlapped, further include：
Determine that the target position, the target position include the target level axis, target vertical axis using measuring device
Line and object height, the target level axis are parallel with supporting surface described in the plane where the target vertical axis；
The target level axis and the target vertical axis are projected on the support surface respectively, obtain floor projection line
And vertical projecting line.
8. localization method as claimed in claim 7, which is characterized in that the plane positioning component includes：
Two guide rails and guide part are provided with guide groove on the face of the face of two guide rails；
The guide rail includes the first plane, and the guide groove includes the second plane, and the guide part includes third plane, and described the
One plane, second plane and the third plane are parallel with the supporting surface；
Then, described that the plane positioning component is adjusted according to preset target position, make the position of the solder sphere in supporting surface
On projection be overlapped with the projection of the target position on the support surface, including：
Two guide rails are placed on the supporting surface, first plane and the support face contact are made；
The position for adjusting two guide rails is located at the floor projection line between two guide rails；
The guide part is inserted into the guide groove, makes second plane and the third plane contact, and lead described
Length direction to part along the guide groove moves so that the projection of the centre of sphere of the solder sphere on the support surface with it is described
Floor projection line and the intersection point of the vertical projecting line are overlapped.
9. localization method as claimed in claim 8, which is characterized in that first pipe is round tube, the interior table of first pipe
Internal screw thread is provided on face, second pipe is round tube, is provided with external screw thread, and the interior spiral shell on the outer surface of second pipe
Line matches with the external screw thread；
The then relative position of the adjustment first pipe and second pipe, it is long with the entirety for adjusting the altitude location part
Degree, is overlapped the centre of sphere of the solder sphere with the target position, including：
Second pipe is rotated, the internal screw thread is made to relatively rotate with the external screw thread, to change first pipe and institute
The entire length for stating the second pipe is overlapped the centre of sphere of the solder sphere with the target position.
10. localization method as claimed in claim 9, which is characterized in that be provided at least one on the curved surface of the third pipe
A notch；
The then rotation second pipe, makes the internal screw thread relatively rotate with the external screw thread, to change described first
The entire length of pipe and second pipe, is overlapped the centre of sphere of the solder sphere with the target position, specifically includes：
According to the height for the centre of sphere for measuring and being calculated the solder sphere；
The second pipe needs are calculated according to the difference between the height of the centre of sphere of the solder sphere and the object height
The target angle of rotation；
Torque is applied to the notch, makes the third pipe that second pipe be driven to rotate the target angle, makes the welding
The centre of sphere of ball is overlapped with the target position.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109900259A (en) * | 2019-03-26 | 2019-06-18 | 武汉钢铁有限公司 | A kind of the measurement calibration tool and measurement scaling method of equipment installation anchor point |
| CN114800420A (en) * | 2022-01-27 | 2022-07-29 | 山东天元安装工程有限公司 | Projection positioning device of welding ball net rack rod relative to welding ball and construction method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101240565A (en) * | 2007-12-28 | 2008-08-13 | 浙江东南网架股份有限公司 | Method for positioning spatial structure sphere node and localizer |
| CN203649777U (en) * | 2013-11-25 | 2014-06-18 | 重庆工业设备安装集团有限公司 | Pipe gallery / truss assembling welding and supporting device |
| CN104110140A (en) * | 2014-06-11 | 2014-10-22 | 浙江精工钢结构集团有限公司 | Net rack node location adjusting device and location adjusting method |
| JP2015040420A (en) * | 2013-08-22 | 2015-03-02 | 大成建設株式会社 | Base plate positioning system |
| KR20150083189A (en) * | 2014-01-09 | 2015-07-17 | 에스탱크엔지니어링(주) | Jig apparatus for ball piece of ball tank |
| CN105587130A (en) * | 2014-11-14 | 2016-05-18 | 五冶集团上海有限公司 | Space latticed shell welding ball locating device and application method thereof |
| CN206625586U (en) * | 2017-01-25 | 2017-11-10 | 上海二十冶建设有限公司 | The adjustable for height support assembled for rack |
| CN107414376A (en) * | 2017-05-26 | 2017-12-01 | 浙江精工钢结构集团有限公司 | A kind of steel construction cydariform solder sphere positions adjusting method |
| CN209223452U (en) * | 2018-06-15 | 2019-08-09 | 中建钢构有限公司 | The positioning device of solder sphere |
-
2018
- 2018-08-27 CN CN201810979021.0A patent/CN108907574A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101240565A (en) * | 2007-12-28 | 2008-08-13 | 浙江东南网架股份有限公司 | Method for positioning spatial structure sphere node and localizer |
| JP2015040420A (en) * | 2013-08-22 | 2015-03-02 | 大成建設株式会社 | Base plate positioning system |
| CN203649777U (en) * | 2013-11-25 | 2014-06-18 | 重庆工业设备安装集团有限公司 | Pipe gallery / truss assembling welding and supporting device |
| KR20150083189A (en) * | 2014-01-09 | 2015-07-17 | 에스탱크엔지니어링(주) | Jig apparatus for ball piece of ball tank |
| CN104110140A (en) * | 2014-06-11 | 2014-10-22 | 浙江精工钢结构集团有限公司 | Net rack node location adjusting device and location adjusting method |
| CN105587130A (en) * | 2014-11-14 | 2016-05-18 | 五冶集团上海有限公司 | Space latticed shell welding ball locating device and application method thereof |
| CN206625586U (en) * | 2017-01-25 | 2017-11-10 | 上海二十冶建设有限公司 | The adjustable for height support assembled for rack |
| CN107414376A (en) * | 2017-05-26 | 2017-12-01 | 浙江精工钢结构集团有限公司 | A kind of steel construction cydariform solder sphere positions adjusting method |
| CN209223452U (en) * | 2018-06-15 | 2019-08-09 | 中建钢构有限公司 | The positioning device of solder sphere |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109900259A (en) * | 2019-03-26 | 2019-06-18 | 武汉钢铁有限公司 | A kind of the measurement calibration tool and measurement scaling method of equipment installation anchor point |
| CN114800420A (en) * | 2022-01-27 | 2022-07-29 | 山东天元安装工程有限公司 | Projection positioning device of welding ball net rack rod relative to welding ball and construction method |
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