CN108899350A - A kind of display panel and its packaging method, OLED device - Google Patents
A kind of display panel and its packaging method, OLED device Download PDFInfo
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- CN108899350A CN108899350A CN201810775886.5A CN201810775886A CN108899350A CN 108899350 A CN108899350 A CN 108899350A CN 201810775886 A CN201810775886 A CN 201810775886A CN 108899350 A CN108899350 A CN 108899350A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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Abstract
The embodiment of the present invention provides a kind of display panel and its packaging method, OLED device, it is related to display device technology field, be able to solve existing display panel edge it is cracked after, crackle is easy to extend on inorganic buffer layer, so that the problem of water oxygen easily enters display panel inside and the OLED device in display panel is caused to damage.The display panel includes substrate, further includes：Inorganic buffering layer pattern in substrate is set；Inorganic buffering layer pattern includes multiple buffering area block, and there are the first gaps between two neighboring buffer blocks；Inorganic medium layer pattern on inorganic buffering layer pattern is set；Inorganic medium layer pattern includes multiple medium blocks, and there are the second gaps between two neighboring medium block；The first organic planarization layer on inorganic medium layer pattern is set, and the first organic planarization layer covers inorganic medium layer pattern.The present invention is used for display device.
Description
Technical field
The present invention relates to display device technology field more particularly to a kind of display panel and its packaging methods, OLED device.
Background technique
Organic electroluminescence device (Organic Light Emitting Device, OLED) is gradually to develop in recent years
The display illuminating device to get up, due to its have many advantages, such as high response, high contrast, can flexibility, be considered as possessing widely
Application prospect.But since OLED device is under the action of steam and oxygen, it may appear that the phenomenon that corrosion and damage, therefore, selection
Preferable packaged type is particularly important for OLED device.
OLED device generally is encapsulated by way of setting multilayer inorganic barrier layer and inorganic barrier layer in the prior art.
Refering to what is shown in Fig. 1, display panel includes substrate 01 and the inorganic buffer layer 02, the inorganic medium that are successively set in substrate 01
Layer 03 and organic planarization layer 04；OLED device is arranged in organic planarization layer 04.However the display panel of existing OLED device exists
In cutting technique, edge is very easy to that small crackle occurs, once and there is small crackle in display panel edge, crackle is very
It is easy to extend on inorganic buffer layer 02, so that water oxygen is easy to penetrate into inside display panel to cause OLED device
The damage of part, and then lead to the lost of life of display panel.
Summary of the invention
The embodiment of the present invention provides a kind of display panel and its packaging method, OLED device, is able to solve existing aobvious
After showing that face plate edge is cracked, crackle is easy to extend on inorganic buffer layer, so that water oxygen easily enters display panel
It is internal and the problem of cause the OLED device in display panel to damage.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that：
On the one hand, the embodiment of the present invention provides a kind of display panel, including substrate, further includes：Setting is on the substrate
Inorganic buffering layer pattern；The inorganic buffering layer pattern includes multiple buffering area block, between the two neighboring buffer blocks
There are the first gaps；Inorganic medium layer pattern on the inorganic buffering layer pattern is set；The inorganic medium layer pattern packet
Include multiple medium blocks, there are the second gaps between the two neighboring medium block；It is arranged in the inorganic medium layer pattern
On the first organic planarization layer, first organic planarization layer covers the inorganic medium layer pattern.
Optionally, the inorganic buffering layer pattern and the orthographic projection weight of the inorganic medium layer pattern on the substrate
It closes；First organic planarization layer fills first gap and second gap.
It optionally, further include that second be arranged between the inorganic buffering layer pattern and the inorganic medium layer pattern has
Machine flatness layer；Second organic planarization layer covers the inorganic buffering layer pattern and filling first gap；Described first
Organic planarization layer fills second gap.
Optionally, the orthographic projection covering of inorganic the buffering layer pattern and the inorganic medium layer pattern on the substrate
The substrate.
Optionally, the making material of the inorganic medium layer pattern is gate metal material.
Optionally, the making material phase of the making material of second organic planarization layer and first organic planarization layer
Together.
On the other hand, the embodiment of the present invention provides a kind of packaging method of display panel, and the display panel includes substrate；
The packaging method includes：Inorganic buffering layer pattern and inorganic medium layer pattern are formed on the substrate；The inorganic buffering
Layer pattern includes multiple buffering area block, and there are the first gaps between the two neighboring buffer blocks；The inorganic dielectric layer figure
Case includes multiple medium blocks, and there are the second gaps between the two neighboring medium block；It is formed and covers the inorganic medium
First organic planarization layer of layer pattern.
Optionally, described to form inorganic buffering layer pattern on the substrate and inorganic medium layer pattern specifically includes：?
Inorganic buffer layer is formed in the substrate；Inorganic dielectric layer is formed on the inorganic buffer layer；On the inorganic dielectric layer
Photoresist is coated, through overexposure, development and etching, forms the inorganic buffering layer pattern and the inorganic medium layer pattern；It goes
Except the photoresist on the inorganic medium layer pattern.
Optionally, the display panel further includes being arranged in the inorganic buffering layer pattern and the inorganic medium layer pattern
Between the second organic planarization layer；It is described to form inorganic buffering layer pattern on the substrate and inorganic medium layer pattern specifically wraps
It includes：Inorganic buffer layer is formed on the substrate；Photoresist is coated on the inorganic buffer layer, through overexposure, development and quarter
Erosion forms the inorganic buffering layer pattern；Remove the photoresist on the inorganic buffering layer pattern；It is described inorganic slow to form covering
Rush second organic planarization layer of layer pattern；Inorganic dielectric layer is formed in second organic planarization layer；Described inorganic
Photoresist is coated on dielectric layer, through overexposure, development and etching, forms the inorganic medium layer pattern；Remove inorganic Jie
Photoresist on matter layer pattern.
In another aspect, the embodiment of the present invention provides a kind of OLED device, including display panel described in any one of the above.
Display panel provided in an embodiment of the present invention and its packaging method, OLED device, the display panel include substrate,
Further include：Inorganic buffering layer pattern in substrate is set；Inorganic buffering layer pattern includes multiple buffering area block, two neighboring slow
Rush between block that there are the first gaps；Inorganic medium layer pattern on inorganic buffering layer pattern is set；Inorganic medium layer pattern
Including multiple medium blocks, there are the second gaps between two neighboring medium block；It is arranged on inorganic medium layer pattern
One organic planarization layer, the first organic planarization layer cover inorganic medium layer pattern.Compared to the prior art, lead in the embodiment of the present invention
It crosses and is set as inorganic buffering layer pattern mutually to separate the multiple buffering area block opened, so that crackle is difficult to prolong on inorganic buffer layer
It stretches, largely avoids water oxygen in this way and enter inside display panel along crackle and the OLED device in display panel is caused to damage
It is bad, improve the service life of display panel；Meanwhile after the first gap between adjacent buffer block is filled by organic layer, Ke Yiti
The toughness of high display panel entirety, and then the generation of crackle is fundamentally reduced, improve the reliability and yield of product.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the display panel structure schematic diagram that the prior art provides；
Fig. 2 is display panel structure schematic diagram one provided in an embodiment of the present invention；
Fig. 3 is display panel structure schematic diagram two provided in an embodiment of the present invention；
Fig. 4 is the packaging method flow chart one of display panel provided in an embodiment of the present invention；
Fig. 5 is the packaging method flowchart 2 of display panel provided in an embodiment of the present invention；
Fig. 6 is the packaging method flow chart 3 of display panel provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of display panel, as shown in Figures 2 and 3, including substrate 11, further include：Setting exists
Inorganic buffering layer pattern 12 in substrate 11；Inorganic buffering layer pattern 12 includes multiple buffering area block 121, two neighboring buffer area
There are the first gaps between block 121；Inorganic medium layer pattern 13 on inorganic buffering layer pattern 12 is set；Inorganic dielectric layer figure
Case 13 includes multiple medium blocks 131, and there are the second gaps between two neighboring medium block 131；It is arranged in inorganic dielectric layer
The first organic planarization layer 14 on pattern 13, the first organic planarization layer 14 cover inorganic medium layer pattern 13.
As its name suggests, inorganic buffering layer pattern 12 and inorganic medium layer pattern 13 are made of inorganic material, and first is organic
Flatness layer 14 using organic material make, the embodiment of the present invention for specific material type without limitation.In practical applications, base
Bottom 11 can be made of Kapton (Polyimide Film, PI) material, and inorganic buffering layer pattern 12 can use
The production of SiOx material, inorganic medium layer pattern 13 can be made of SiOx, SiNx or other inorganic material.
The embodiment of the present invention is big for the concrete shape of the multiple buffering area block 121 in inorganic buffering layer pattern 12, size
Small wait is not construed as limiting, and those skilled in the art can set according to the actual situation.Wherein, inorganic 12 He of buffering layer pattern
Inorganic medium layer pattern 13 may be the same or different, the embodiment of the present invention to this also without limitation.It should be noted that
Inorganic buffering layer pattern 12 and inorganic medium layer pattern 13 can prevent the extension of crackle, thus may be implemented to display surface edges of boards
The double shielding of edge.
So, compared to the prior art, by setting mutual for inorganic buffering layer pattern in the embodiment of the present invention
Separate the multiple buffering area block opened and largely avoids water oxygen in this way so that crackle is difficult to extend on inorganic buffer layer
Enter inside display panel along crackle and the OLED device in display panel is caused to damage, improves the service life of display panel；Together
When, after the first gap between adjacent buffer block is filled by organic layer, the toughness of display panel entirety, Jin Ercong can be improved
The generation for fundamentally reducing crackle, improves the reliability and yield of product.
It should be noted that inorganic buffering layer pattern 12 and inorganic medium layer pattern 13 can be respectively single layer structure,
It can be respectively multilayered structure, it is not limited in the embodiment of the present invention.
Optionally, refering to what is shown in Fig. 2, inorganic buffering layer pattern 12 and positive throwing of the inorganic medium layer pattern 13 in substrate 11
Shadow is overlapped；First organic planarization layer 14 fills the first gap and the second gap.
In such structure, inorganic buffering layer pattern 12 can pass through a patterning processes system with inorganic medium layer pattern 13
Make, specific production process is as follows：Inorganic buffer layer is formed in substrate 11 first；Then inorganic Jie is formed on inorganic buffer layer
Matter layer；Then photoresist is coated on inorganic dielectric layer, using mask plate through overexposure, development and etching, forms inorganic buffering
Layer pattern 12 and inorganic medium layer pattern 13；Then the photoresist on inorganic medium layer pattern 13 is removed；Eventually form covering nothing
First organic planarization layer 14 of machine medium layer pattern 13, the first organic planarization layer 14 fill the first gap between buffer blocks 121
The second gap between medium block 131.
Optionally, refering to what is shown in Fig. 3, the display panel further includes being arranged in inorganic buffering layer pattern 12 and inorganic medium
The second organic planarization layer 15 between layer pattern 13；Second organic planarization layer 15 covers inorganic buffering layer pattern 12 and filling the
One gap；First organic planarization layer 14 fills the second gap.
In such structure, inorganic buffering layer pattern 12 is needed with inorganic medium layer pattern 13 through secondary patterning processes system
Make, specific production process is as follows：Inorganic buffer layer is formed in substrate 11 first；Then photoetching is coated on inorganic buffer layer
Glue forms inorganic buffering layer pattern 12 through overexposure, development and etching；Then the photoetching on inorganic buffering layer pattern 12 is removed
Glue；Then the second organic planarization layer 15 of the inorganic buffering layer pattern 12 of covering is formed；Then the shape in the second organic planarization layer 15
At inorganic dielectric layer；Then photoresist is coated on inorganic dielectric layer, through overexposure, development and etching, forms inorganic dielectric layer
Pattern 13；Then the photoresist on inorganic medium layer pattern 13 is removed；Eventually form the first of covering inorganic medium layer pattern 13
Organic planarization layer 14.
It should be noted that the buffer blocks in above-mentioned patterning processes twice, in the inorganic buffering layer pattern 12 of formation
It can be aligned, can also be staggered, the embodiment of the present invention does not do this with the edge of the medium block in inorganic medium layer pattern 13
It limits.Preferably, the orthographic projection of inorganic buffering layer pattern 12 and inorganic medium layer pattern 13 in substrate 11 covers substrate 11, i.e.,
Buffer blocks in inorganic buffering layer pattern 12 are mutually staggered with the medium block in inorganic medium layer pattern 13, can be mentioned in this way
The case where overall structure stability of high display panel, the appearance and display panel inner layer structure for being further reduced crackle are broken
Occur.In production, only need to change twice etching position difference can be realized such structure.
The embodiment of the present invention for the second organic planarization layer 15 making material and setting thickness etc. without limitation.Preferably
, the making material of the second organic planarization layer 15 is identical as the making material of the first organic planarization layer 14, has in this way convenient for second
The production of the technique of machine flatness layer 15 and the first organic planarization layer 14.In practical applications, the thickness one of the second organic planarization layer 15
As be set as 1um~2um and can meet the requirements.
Since the making material that metal has preferable ductility, thus inorganic medium layer pattern 13 can be set is metal
Material is further reduced inside the appearance and extension and display panel of crackle so as to improve the resistance to stress ability of display panel
The case where layer structural break, occurs.Preferably, the making material of inorganic medium layer pattern 13 be gate metal material so that it is convenient to
Technique production.
Another embodiment of the present invention provides a kind of OLED devices, including display panel described in any one of the above.This hair
The display panel that bright embodiment provides by being set as inorganic buffering layer pattern mutually to separate the multiple buffering area block opened so that
Crackle is difficult to extend on inorganic buffer layer, largely avoids water oxygen in this way and enters inside display panel along crackle and make
At the OLED device damage in display panel, the service life of display panel is improved；Meanwhile between first between adjacent buffer block
After gap is filled by organic layer, the toughness of display panel entirety can be improved, and then fundamentally reduce the generation of crackle, improve
The reliability and yield of product.
Further embodiment of this invention provides a kind of packaging method of display panel, and the display panel includes substrate；Such as Fig. 4
Shown, the packaging method includes：
Inorganic buffering layer pattern and inorganic medium layer pattern is formed on the substrate in step 401；Inorganic buffering layer pattern includes
Multiple buffering area block, there are the first gaps between two neighboring buffer blocks；Inorganic medium layer pattern includes multiple medium blocks,
There are the second gaps between two neighboring medium block；
Step 402, the first organic planarization layer for forming covering inorganic medium layer pattern.
Further, described inorganic buffering layer pattern to be formed on the substrate and inorganic medium layer pattern specifically includes：In base
Inorganic buffer layer is formed on bottom；Inorganic dielectric layer is formed on inorganic buffer layer；Photoresist is coated on inorganic dielectric layer, is passed through
Exposure, development and etching, form inorganic buffering layer pattern and inorganic medium layer pattern；Remove the photoetching on inorganic medium layer pattern
Glue.
Further, the display panel further includes being arranged between inorganic buffering layer pattern and inorganic medium layer pattern
Second organic planarization layer；Inorganic buffering layer pattern is formed on the substrate and inorganic medium layer pattern specifically includes：The shape in substrate
At inorganic buffer layer；Photoresist is coated on inorganic buffer layer, through overexposure, development and etching, forms inorganic buffering layer pattern；
Remove the photoresist on inorganic buffering layer pattern；Form the second organic planarization layer of the inorganic buffering layer pattern of covering；Have second
Inorganic dielectric layer is formed on machine flatness layer；Photoresist is coated on inorganic dielectric layer, through overexposure, development and etching, forms nothing
Machine medium layer pattern；Remove the photoresist on inorganic medium layer pattern.
Yet another embodiment of the invention provides a kind of packaging method of display panel, as shown in Figure 2 and Figure 5, the encapsulation side
Method includes：
Inorganic buffer layer is formed on the substrate in step 501；
Step 502 forms inorganic dielectric layer on inorganic buffer layer；
Step 503 coats photoresist on inorganic dielectric layer, through overexposure, development and etching, forms inorganic buffer layer figure
Case and inorganic medium layer pattern；
Photoresist in step 504, removal inorganic medium layer pattern；
Step 505, the first organic planarization layer for forming covering inorganic medium layer pattern.
Further embodiment of this invention provides a kind of packaging method of display panel, as shown in Figure 3 and Figure 6, the encapsulation side
Method includes：
Inorganic buffer layer is formed on the substrate in step 601；
Step 602 coats photoresist on inorganic buffer layer, through overexposure, development and etching, forms inorganic buffer layer figure
Case；
Photoresist in step 603, the inorganic buffering layer pattern of removal；
Step 604, the second organic planarization layer for forming the inorganic buffering layer pattern of covering；
Step 605 forms inorganic dielectric layer in the second organic planarization layer；
Step 606 coats photoresist on inorganic dielectric layer, through overexposure, development and etching, forms inorganic dielectric layer figure
Case；
Photoresist in step 607, removal inorganic medium layer pattern；
Step 608, the first organic planarization layer for forming covering inorganic medium layer pattern.
Each step in the packaging method of above-mentioned display panel can refer to the introduction of each layer of structure in display panel,
Details are not described herein, can achieve function identical with display panel.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of protection of the claims
It is quasi-.
Claims (10)
1. a kind of display panel, including substrate, which is characterized in that further include：
Inorganic buffering layer pattern on the substrate is set；The inorganic buffering layer pattern includes multiple buffering area block, adjacent
There are the first gaps between two buffer blocks；
Inorganic medium layer pattern on the inorganic buffering layer pattern is set；The inorganic medium layer pattern includes multiple media
Block, there are the second gaps between the two neighboring medium block；
The first organic planarization layer on the inorganic medium layer pattern is set, and the first organic planarization layer covering is described inorganic
Medium layer pattern.
2. display panel according to claim 1, which is characterized in that the inorganic buffering layer pattern and the inorganic medium
The orthographic projection of layer pattern on the substrate is overlapped；
First organic planarization layer fills first gap and second gap.
3. display panel according to claim 1, which is characterized in that further include setting in the inorganic buffering layer pattern and
The second organic planarization layer between the inorganic medium layer pattern；
Second organic planarization layer covers the inorganic buffering layer pattern and filling first gap；
First organic planarization layer fills second gap.
4. display panel according to claim 3, which is characterized in that the inorganic buffering layer pattern and the inorganic medium
The orthographic projection of layer pattern on the substrate covers the substrate.
5. display panel according to claim 1, which is characterized in that the making material of the inorganic medium layer pattern is grid
Pole metal material.
6. display panel according to claim 3, which is characterized in that the making material of second organic planarization layer and institute
The making material for stating the first organic planarization layer is identical.
7. a kind of packaging method of display panel, which is characterized in that the display panel includes substrate；The packaging method packet
It includes：
Inorganic buffering layer pattern and inorganic medium layer pattern are formed on the substrate；The inorganic buffering layer pattern includes multiple
Buffer blocks, there are the first gaps between the two neighboring buffer blocks；The inorganic medium layer pattern includes multiple media
Block, there are the second gaps between the two neighboring medium block；
Form the first organic planarization layer for covering the inorganic medium layer pattern.
8. the packaging method of display panel according to claim 7, which is characterized in that described to form nothing on the substrate
Machine buffering layer pattern and inorganic medium layer pattern specifically include：
Inorganic buffer layer is formed on the substrate；
Inorganic dielectric layer is formed on the inorganic buffer layer；
Coat photoresist on the inorganic dielectric layer, through overexposure, development and etching, formed the inorganic buffering layer pattern with
The inorganic medium layer pattern；
Remove the photoresist on the inorganic medium layer pattern.
9. the packaging method of display panel according to claim 7, which is characterized in that the display panel further includes setting
The second organic planarization layer between the inorganic buffering layer pattern and the inorganic medium layer pattern；
It is described to form inorganic buffering layer pattern on the substrate and inorganic medium layer pattern specifically includes：
Inorganic buffer layer is formed on the substrate；
Photoresist is coated on the inorganic buffer layer, through overexposure, development and etching, forms the inorganic buffering layer pattern；
Remove the photoresist on the inorganic buffering layer pattern；
Form second organic planarization layer of the covering inorganic buffering layer pattern；
Inorganic dielectric layer is formed in second organic planarization layer；
Photoresist is coated on the inorganic dielectric layer, through overexposure, development and etching, forms the inorganic medium layer pattern；
Remove the photoresist on the inorganic medium layer pattern.
10. a kind of OLED device, which is characterized in that including display panel described in any one of claim 1 to 6.
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| CN201810775886.5A CN108899350A (en) | 2018-07-13 | 2018-07-13 | A kind of display panel and its packaging method, OLED device |
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| CN201810775886.5A CN108899350A (en) | 2018-07-13 | 2018-07-13 | A kind of display panel and its packaging method, OLED device |
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Application publication date: 20181127 |