CN108896602B - Heat conduction temperature measuring device and temperature measuring method using same - Google Patents

Heat conduction temperature measuring device and temperature measuring method using same Download PDF

Info

Publication number
CN108896602B
CN108896602B CN201810946022.5A CN201810946022A CN108896602B CN 108896602 B CN108896602 B CN 108896602B CN 201810946022 A CN201810946022 A CN 201810946022A CN 108896602 B CN108896602 B CN 108896602B
Authority
CN
China
Prior art keywords
temperature
temperature measuring
heat conduction
medium
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810946022.5A
Other languages
Chinese (zh)
Other versions
CN108896602A (en
Inventor
陈永生
刘红红
林军
苏佳伟
陈彦廷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Yangpeng Technology Co ltd
Original Assignee
Changzhou Yangpeng Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changzhou Yangpeng Technology Co ltd filed Critical Changzhou Yangpeng Technology Co ltd
Priority to CN201810946022.5A priority Critical patent/CN108896602B/en
Publication of CN108896602A publication Critical patent/CN108896602A/en
Application granted granted Critical
Publication of CN108896602B publication Critical patent/CN108896602B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/02Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
    • G01N25/12Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering of critical point; of other phase change

Abstract

The invention discloses a heat conduction temperature measuring device which is used for measuring the temperature value required by deformation or reaction of a temperature measuring sample and comprises a temperature control display instrument used for measuring and displaying the temperature, a temperature measuring heat conduction medium and a heating medium used for heating the middle position of the temperature measuring heat conduction medium, wherein one end of the temperature measuring heat conduction medium is fixedly contacted with the temperature measuring sample, and the other end of the temperature measuring heat conduction medium is connected with the temperature control display instrument. The heat conduction temperature measuring device can realize the measurement of the temperature value required by the deformation or reaction of the temperature measuring sample, and has simple structure and high precision.

Description

Heat conduction temperature measuring device and temperature measuring method using same
Technical Field
The invention relates to a heat conduction temperature measuring device and a temperature measuring method using the same.
Background
At present, in industry or life, the temperature control is particularly important, the temperature is a physical quantity representing the cold and hot degrees of an object, the temperature control has close relation with human life, industrial and agricultural production and scientific research, any two objects with different cold and hot degrees are contacted, a heat exchange phenomenon is inevitably generated, heat is transferred from the object with high heated degree to the object with low heated temperature until the cold and hot degrees of the two objects are completely consistent, and temperature measurement is realized when a heat balance state is reached.
In the prior art, the method is divided into two categories, namely contact temperature measurement and non-contact temperature measurement, only according to whether a measuring body is in contact with a measured medium or not. The contact type temperature measurement is based on the heat balance principle, and the temperature measurement sensitive element must be in contact with the measured medium, so that the temperature measurement sensitive element and the measured medium are in the same heat balance state and have the same temperature, and the method is used for measuring the temperature, such as a mercury thermometer, a thermocouple thermometer and the like. The non-contact temperature measurement utilizes the thermal radiation principle of substances, and the temperature measuring element does not need to be in contact with a measured medium, but judges the temperature by receiving the radiant heat emitted by a measured object, such as an infrared thermometer, an optical fiber thermometer and the like. However, in actual life, the temperature measurement methods have certain disadvantages due to use conditions and the like, and the test work of the actual required temperature cannot be realized. The contact type temperature measurement is delayed, the non-contact type temperature measurement is easily influenced by distance, smoke dust, water vapor and the like, and the measurement of the real decomposition temperature of the heated easily-decomposed material cannot be performed when the measurement precision is inaccurate.
Disclosure of Invention
The technical problem to be solved by the invention is to overcome the defects of the prior art and provide a heat conduction temperature measuring device which can realize the measurement of the temperature value required by the deformation or reaction of a temperature measuring sample and has simple structure and high precision.
In order to solve the technical problems, the technical scheme of the invention is as follows: a heat conduction temperature measuring device for measuring
The temperature value required by the deformation or reaction of the temperature sample comprises:
the temperature control display instrument is used for measuring and displaying the temperature;
a temperature measuring heat conduction medium, one end of which is contacted with the temperature measuring sample
The other end of the temperature measuring heat conduction medium is connected with the temperature control display instrument;
and the heating medium is used for heating the middle position of the temperature measuring heat conduction medium.
Furthermore, the temperature measuring heat conduction medium is a copper bar or a copper sheet.
Furthermore, the temperature measuring heat conduction medium is an aluminum bar or an aluminum sheet.
Further, the length of the temperature measuring heat conduction medium is 25-30 cm.
The invention also provides a temperature measuring method using the heat conduction temperature measuring device, which comprises the following steps:
(1) one end of the temperature measuring heat conduction medium is contacted and fixed with the temperature measuring sample, and the other end of the temperature measuring heat conduction medium is contacted and fixed with the temperature measuring sample
Is connected with a temperature control display instrument;
(2) heating the middle position of the temperature measuring heat conduction medium by the heating medium, and observing the temperature measuring sample when
And reading the temperature value displayed by the temperature control display instrument when the surface of the temperature measurement sample is observed to deform or react, wherein the temperature value is the temperature value required by the deformation or reaction of the temperature measurement sample.
After the technical scheme is adopted, the method selects the copper bar or the aluminum bar or the copper sheet or the aluminum sheet with the length of 25 cm-30 cm
The temperature measuring device is used as a temperature measuring heat conduction medium, one end of the selected temperature measuring heat conduction medium is contacted and fixed with a temperature measuring sample, the other end of the selected temperature measuring heat conduction medium is connected with a temperature control display instrument, then the middle position of the temperature measuring heat conduction medium is selected as a temperature measuring hot spot, heating is started to carry out a test temperature measuring test of the temperature measuring sample, and when the surface of the temperature measuring sample is seen to deform or react, the temperature value displayed by the temperature control display instrument is read, wherein the temperature value is the temperature value required by the deformation or reaction of the temperature measuring sample; the invention selects excellent heat-conducting material, and has high temperature measurement effect; the invention selects equidistant positions for heating test, and the temperature measurement precision is high; the invention has simple equipment and easy implementation.
Drawings
FIG. 1 is a schematic structural diagram of a thermal conduction temperature measuring device according to the present invention.
Detailed Description
In order that the present invention may be more readily and clearly understood, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
Example one
As shown in figure 1, a heat conduction temperature measuring device is used for measuring the temperature value required by the deformation or reaction of a temperature measuring sample 1,
it includes:
a temperature control display instrument 2 for measuring and displaying temperature;
a temperature measuring heat conduction medium 3, one end of the temperature measuring heat conduction medium 3 is contacted with the temperature measuring sample 1
The other end of the temperature measuring heat conduction medium 3 is connected with the temperature control display instrument 2;
and a heating medium 4 for heating the middle position of the temperature measuring heat conduction medium 3.
The temperature measuring heat conduction medium 3 is a copper bar or sheet or an aluminum bar or sheet.
As shown in FIG. 1, the length of the temperature measuring heat conducting medium 3 is 25-30 cm.
Example two
A temperature measuring method using the thermal conduction temperature measuring device according to the first embodiment, the method comprising:
(1) one end of a temperature measurement heat conduction medium 3 is contacted and fixed with a temperature measurement sample 1, and the other end of the temperature measurement heat conduction medium 3 is connected with a temperature control display instrument 2;
(2) heating the middle position of the temperature measuring heat conduction medium 3 by the heating medium 4, and observing
When the temperature measurement sample 1 is observed to deform or react on the surface of the temperature measurement sample 1, reading a temperature value displayed by the temperature control display instrument 2, wherein the temperature value is a temperature value required by deformation or reaction of the temperature measurement sample 1.
The working principle of the invention is as follows:
the invention selects a copper bar or an aluminum bar or a copper sheet or an aluminum sheet with the length of 25 cm-30 cm as a temperature-measuring heat-conducting medium 3,
then one end of the selected temperature-measuring heat-conducting medium 3 is contacted and fixed with the temperature-measuring sample 1, the other end is connected with the temperature-controlling display instrument 2, then the middle position of the temperature-measuring heat-conducting medium 3 is selected as a temperature-measuring heated point, heating is started to carry out a test temperature-measuring test of the temperature-measuring sample 1, and when the surface of the temperature-measuring sample 1 is seen to be deformed or reacted, the temperature value displayed by the temperature-controlling display instrument 2 is read, wherein the temperature value is the temperature value required by the deformation or reaction of the temperature-measuring sample 1; the invention selects excellent heat-conducting material, and has high temperature measurement effect; the invention selects equidistant positions for heating test, and the temperature measurement precision is high; the invention has simple equipment and easy implementation.
The above embodiments are described in further detail to solve the technical problems, technical solutions and advantages of the present invention, and it should be understood that the above embodiments are only examples of the present invention and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (4)

1. A temperature measuring method of a heat conduction temperature measuring device is used for measuring the temperature required by deformation or reaction of a temperature measuring sample (1)
The value, which is characterized in that,
the heat conduction temperature measuring device includes:
a temperature control display instrument (2) for measuring and displaying temperature;
a temperature measuring heat conduction medium (3), one end of the temperature measuring heat conduction medium (3) is contacted with the temperature measuring sample (1)
The other end of the temperature measuring heat conduction medium (3) is connected with the temperature control display instrument (2);
a heating medium (4) for heating the middle position of the temperature measuring heat conduction medium (3); wherein the content of the first and second substances,
the method comprises the following steps:
(1) one end of the temperature measurement heat conduction medium (3) is contacted and fixed with the temperature measurement sample (1), and the other end of the temperature measurement heat conduction medium (3) is connected with the temperature control display instrument (2);
(2) heating the middle position of the temperature measuring heat conduction medium (3) by using the heating medium (4), and observing and measuring
When the surface of the temperature measurement sample (1) is observed to deform or react, the temperature value displayed by the temperature control display instrument (2) is read, and the temperature value is the temperature value required by the deformation or reaction of the temperature measurement sample (1).
2. The temperature measuring method of the thermally conductive temperature measuring device according to claim 1, wherein: the temperature measuring heat
The conducting medium (3) is a copper bar or a copper sheet.
3. The temperature measuring method of the thermally conductive temperature measuring device according to claim 1, wherein: the temperature measuring heat
The conducting medium (3) is an aluminum bar or an aluminum sheet.
4. The temperature measuring method of the thermally conductive temperature measuring device according to claim 1, wherein: the temperature measuring heat
The length of the conducting medium (3) is 25-30 cm.
CN201810946022.5A 2018-08-20 2018-08-20 Heat conduction temperature measuring device and temperature measuring method using same Active CN108896602B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810946022.5A CN108896602B (en) 2018-08-20 2018-08-20 Heat conduction temperature measuring device and temperature measuring method using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810946022.5A CN108896602B (en) 2018-08-20 2018-08-20 Heat conduction temperature measuring device and temperature measuring method using same

Publications (2)

Publication Number Publication Date
CN108896602A CN108896602A (en) 2018-11-27
CN108896602B true CN108896602B (en) 2021-06-18

Family

ID=64354756

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810946022.5A Active CN108896602B (en) 2018-08-20 2018-08-20 Heat conduction temperature measuring device and temperature measuring method using same

Country Status (1)

Country Link
CN (1) CN108896602B (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU957078A1 (en) * 1978-08-11 1982-09-07 Рижское Высшее Военно-Политическое Краснознаменное Училище Им.Маршала Советского Союза Бирюзова С.С. Device for measuring phase transformation temperature of heat carrier on water=receptive surfaces
JP2001183319A (en) * 1999-12-27 2001-07-06 Shimadzu Corp Thermal analyzer
CN102004117A (en) * 2009-09-01 2011-04-06 精工电子纳米科技有限公司 Thermal analysis apparatus
JP2011179897A (en) * 2010-02-26 2011-09-15 Fujitsu Ltd Image processing device and image processing program
US8092078B2 (en) * 2003-10-09 2012-01-10 University Of Southampton Measurement of melting points of multiple samples
CN205209845U (en) * 2015-12-11 2016-05-04 哈尔滨理工大学 A standard sample making devices for electrical property and hot capability test
CN106153670A (en) * 2016-09-22 2016-11-23 济南大学 A kind of linear expansion coefficient measuring instrument based on Hall effect
CN206002469U (en) * 2016-08-12 2017-03-08 泰诺风保泰(苏州)隔热材料有限公司 Section bar heat transfer property detects exhibiting device
CN106706700A (en) * 2016-11-11 2017-05-24 四川天策聚材科技有限公司 Online monitoring system and method for phase change-resistance relation of conductive polymer composite material
CN108303443A (en) * 2018-01-09 2018-07-20 中国计量大学 A kind of sheeting is towards heat conductivility steady-state method of test

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101487805A (en) * 2008-01-17 2009-07-22 联茂电子股份有限公司 Apparatus and method for measuring thermal conduction effect
CN201331502Y (en) * 2009-02-20 2009-10-21 中山大学 Differential scanning calorimeter compatible with visible function

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU957078A1 (en) * 1978-08-11 1982-09-07 Рижское Высшее Военно-Политическое Краснознаменное Училище Им.Маршала Советского Союза Бирюзова С.С. Device for measuring phase transformation temperature of heat carrier on water=receptive surfaces
JP2001183319A (en) * 1999-12-27 2001-07-06 Shimadzu Corp Thermal analyzer
US8092078B2 (en) * 2003-10-09 2012-01-10 University Of Southampton Measurement of melting points of multiple samples
CN102004117A (en) * 2009-09-01 2011-04-06 精工电子纳米科技有限公司 Thermal analysis apparatus
JP2011179897A (en) * 2010-02-26 2011-09-15 Fujitsu Ltd Image processing device and image processing program
CN205209845U (en) * 2015-12-11 2016-05-04 哈尔滨理工大学 A standard sample making devices for electrical property and hot capability test
CN206002469U (en) * 2016-08-12 2017-03-08 泰诺风保泰(苏州)隔热材料有限公司 Section bar heat transfer property detects exhibiting device
CN106153670A (en) * 2016-09-22 2016-11-23 济南大学 A kind of linear expansion coefficient measuring instrument based on Hall effect
CN106706700A (en) * 2016-11-11 2017-05-24 四川天策聚材科技有限公司 Online monitoring system and method for phase change-resistance relation of conductive polymer composite material
CN108303443A (en) * 2018-01-09 2018-07-20 中国计量大学 A kind of sheeting is towards heat conductivility steady-state method of test

Also Published As

Publication number Publication date
CN108896602A (en) 2018-11-27

Similar Documents

Publication Publication Date Title
Hammerschmidt et al. Transient hot wire (THW) method: uncertainty assessment
CN107817054B (en) Temperature measurement method of infrared imager for parts in vacuum cavity
CN103675019A (en) Method for measuring material surface emissivity by virtue of thermal infrared imager rapidly
CN203798759U (en) Glass thermophysical property tester
CN103983365B (en) Multi-measuring-head transient radiation heat flow meter and measuring method for thermal radiation heat flow density
CN111189552B (en) Methane hydrate flame temperature testing device and temperature measurement correction method
CN102778475A (en) Method for measuring solid-solid thermal contact resistance via up-and-down constant temperature parameter identification method
CN104748866A (en) Two-color thermometer and industrial camera fused temperature measurement method
CN108896602B (en) Heat conduction temperature measuring device and temperature measuring method using same
Baballe et al. A Study on the Impact and Challenges of Temperature Detection System
CN206348090U (en) A kind of bareing thermocouple dynamic response time measurement apparatus
CN2874444Y (en) Non-contact type temperature sensor temperature measurer for high pressure water resistance startor
Bao et al. Fully-distributed fiber optic sensor for strain measurement at high temperature
CN209342253U (en) A kind of temperature monitoring device
JP2002214046A (en) Non-contact temperature sensor and infrared clinical thermometer therefor
CN106679818A (en) Measuring apparatus and method of temperature distribution on smooth surface
CN107063493A (en) Double function thermometrics heat sensor
CN206339310U (en) The measurement apparatus of smooth surface Temperature Distribution
CN106370322A (en) Tungsten-rhenium thermocouple calibration system
CN218896062U (en) Insulating material coefficient of heat conductivity measuring device
CN102998333B (en) A kind of measurement mechanism of surface coefficient of heat transfer and method
CN112380698A (en) Method and device for detecting steady-state temperature of overhead conductor
CN105806502B (en) A kind of heat acquisition device
Rusby Introduction to temperature measurement.
Riou et al. Thermal study of an aluminium nitride ceramic heater for spray CVD on glass substrates by quantitative thermography

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant