CN101487805A - Apparatus and method for measuring thermal conduction effect - Google Patents
Apparatus and method for measuring thermal conduction effect Download PDFInfo
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- CN101487805A CN101487805A CNA2008100012963A CN200810001296A CN101487805A CN 101487805 A CN101487805 A CN 101487805A CN A2008100012963 A CNA2008100012963 A CN A2008100012963A CN 200810001296 A CN200810001296 A CN 200810001296A CN 101487805 A CN101487805 A CN 101487805A
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Abstract
A device for measuring heat conduction effect is used for measuring the heat conduction effect of a base plate. The device at least comprises a heating plate and a surface temperature measuring meter. The base plate is arranged on the heating plate. At least a space exists between the base plate and the heating plate. The contact positions of the surface temperature measuring meter, the heating plate and the base plate are stagger to form an indirect heat conduction mode. The invention also provides a method for measuring the heat conduction effect. The invention can reduce the cost of the device and increases the accuracy of measuring heat conduction effect.
Description
Technical field
The present invention relates to a kind of apparatus and method of measuring thermal conduction effect, particularly a kind of apparatus and method of measuring the thermal conduction effect of hot interface material.
Background technology
Along with electronic equipment gets over precision, the circuit degree of integration is more and more higher, and (ThermalInterface Material, application TIM) also more and more widely for hot interface material.Yet, the optimal parameter that determines hot interface material is heat-conduction coefficient (Heat Conductivity Coefficient), as the device of lower-cost measurement thermal conduction effect how, measure the thermal conduction effect (HeatConductivity Effect) of hot interface material exactly, play important effect for hot interface material development.
When measuring the heat-conduction coefficient of hot interface material under unidimensional scale (heat-conduction coefficient is the function of the heat conducting distance of one-dimension temperature), its relational expression is as follows:
Wherein, K is a heat-conduction coefficient; Q is heat flux (Heat Flow Rate); (X2-X1)/(T2-T1) be the inverse of thermograde (Temperature Gradient), X2-X1 is the heat conducting distance of one-dimension temperature, and T2-T1 is the temperature difference of hot interface material.
Please refer to Fig. 1, this figure is the synoptic diagram of traditional measurement heat-conduction coefficient.The substrate 101 of hot interface material is provided, this substrate 101 is arranged on the thermal source 102, in order to heating this substrate 101, and surface temperature measurement meter 103 is arranged on this substrate 101, utilize and directly measure the heat-conduction coefficient that heat exchange pattern is measured this substrate 101.Wherein this thermal source 102 directly heats this substrate 101, and heating direction 104 as shown by arrows.X2-X1 is the heat conducting distance of one-dimension temperature in the above-mentioned formula, because of direct this substrate 101 of heating, makes distance shorten, and causes the amplitude of variation of measuring heat-conduction coefficient to dwindle and inaccurate.In addition, traditional hot conduction system measurement mechanism cost costliness is unfavorable for the exploitation of hot interface material.
Therefore, the inventor thinks can improve above-mentioned defective, and according to the correlation experience of being engaged in for many years in this respect, and concentrated the observation and research, and cooperate and apply the principles of science proposes reasonable in design and effectively improve the present invention of above-mentioned defective.
Summary of the invention
Therefore purpose of the present invention is exactly to propose a kind of apparatus and method of measuring thermal conduction effect, utilizes the indirect thermal conduction pattern, reaches the purpose that reduces installation cost and improve the accuracy of measuring thermal conduction effect.
According to above-mentioned purpose of the present invention, the present invention proposes a kind of device of measuring thermal conduction effect, is used to measure the thermal conduction effect of substrate, comprises at least: heating plate, this substrate are arranged on this heating plate, have a space between this substrate and this heating plate at least; And the surface temperature measurement meter, wherein the contact position of this surface temperature measurement meter, this heating plate and this substrate staggers, and forms the indirect thermal conduction pattern.
In the device of above-mentioned measurement thermal conduction effect, this substrate can be epoxy resin base plate, insulating metal substrate, aluminium base or MCPCB.
In the device of above-mentioned measurement thermal conduction effect, the heating mode that this heating plate provides can be fixed temperature pattern or stationary heat power mode.
In the device of above-mentioned measurement thermal conduction effect, the shape of this heating plate can be circle, square, rectangle or triangle.
In the device of above-mentioned measurement thermal conduction effect, air or thermal insulation material can be filled in this space.
In the device of above-mentioned measurement thermal conduction effect, this surface temperature measurement meter can be thermopair, infrared ray sensor or temperature sensor.
The present invention also provides a kind of method of measuring thermal conduction effect, is used to measure the thermal conduction effect of substrate, comprises the following steps: at least this substrate is positioned on the heating plate, start this heating plate, selected heating mode provides power of heat source to heat this substrate, and uses timer; And use the surface temperature measurement meter to be warming up to high temperature from low temperature to measure this substrate, and use the heat time heating time of this low temperature of this timer record to this high temperature, wherein the contact position of this surface temperature measurement meter, this heating plate and this substrate staggers, and forms the indirect thermal conduction pattern.
In the method for above-mentioned measurement thermal conduction effect, this substrate can be epoxy resin base plate, insulating metal substrate, aluminium base or MCPCB.
In the method for above-mentioned measurement thermal conduction effect, the shape of this heating plate can be circle, square, rectangle or triangle.
In the method for above-mentioned measurement thermal conduction effect, this surface temperature measurement meter can be thermopair, infrared ray sensor or temperature sensor.
In the method for above-mentioned measurement thermal conduction effect, this heating mode can be fixed temperature pattern or stationary heat power mode.
In the method for above-mentioned measurement thermal conduction effect, this low temperature to the scope of this high temperature can be between 40 degree Celsius approximately to 65 degree Celsius approximately.
In the method for above-mentioned measurement thermal conduction effect, can utilize following formula to decide the thermal conduction effect of this substrate:
Wherein a is the thermal conduction effect of this substrate, and the power of heat source that Q provides for this heating plate, t are the resulting multiple averaging value that should heat time heating time of this timer, Δ T is this high temperature of this measured substrate of this surface temperature measurement meter and the temperature difference of this low temperature, and C is a constant.
The present invention has following beneficial effect
(1) device of above-mentioned measurement thermal conduction effect is formed simply, and the user can buy assembling voluntarily from the market, reach the purpose that reduces installation cost.
(2) method of above-mentioned measurement thermal conduction effect has been utilized the indirect thermal conduction pattern, has reached the purpose that improves the accuracy of measuring thermal conduction effect.
In order to make narration of the present invention more detailed and complete, in the following summary of the invention, provide many different embodiment or example, can be used for understanding the application of the different characteristic in different embodiment with reference to following description and conjunction with figs..
Description of drawings
Fig. 1 is the synoptic diagram according to prior art.
Fig. 2 is the schematic representation of apparatus according to the measurement thermal conduction effect of the first embodiment of the present invention.
Fig. 3 is the schematic representation of apparatus according to the measurement thermal conduction effect of the second embodiment of the present invention.
Fig. 4 is the schematic representation of apparatus according to the measurement thermal conduction effect of the third embodiment of the present invention.
Fig. 5 is the schematic representation of apparatus according to the measurement thermal conduction effect of the fourth embodiment of the present invention.
Fig. 6 is the flow chart of steps according to the method for measurement thermal conduction effect of the present invention.
Fig. 7 is according to experimental data bar chart of the present invention.
Wherein, description of reference numerals is as follows:
[prior art]
101: substrate
102: thermal source
103: the surface temperature measurement meter
104: the heating direction
[the present invention]
201: substrate
202: heating plate
203: the surface temperature measurement meter
204: the heating direction
210: the space
301: substrate
302: heating plate
303: the surface temperature measurement meter
304: the heating direction
310: the space
401: substrate
402: heating plate
403: the surface temperature measurement meter
404: the heating direction
410: the space
501: substrate
502: heating plate
503: the surface temperature measurement meter
504: the heating direction
510: the space
600-650: the method flow step
Embodiment
Please refer to Fig. 2, this figure is the schematic representation of apparatus according to the measurement thermal conduction effect of first embodiment of the invention.The invention provides a kind of device of measuring thermal conduction effect, be used to measure the thermal conduction effect of substrate 201, comprise at least: heating plate 202, this substrate 201 are arranged on this heating plate 202, wherein have space 210 at least between this substrate 201 and this heating plate 202; And surface temperature measurement meter 203.Device disclosed in this invention, the user can reach the purpose that reduces installation cost voluntarily buying on the market and assembling voluntarily.
Wherein, this substrate 201 can be epoxy resin base plate, insulating metal substrate, aluminium base or metal core printed board (Metal-core printed circuit board, MCPCB); The shape of this heating plate 202 can be circle, square, rectangle or triangle, and the heating mode that is provided can be fixed temperature pattern or stationary heat power mode; Air or thermal insulation material can be filled in this space 210, make between this substrate 201 and this heating plate 202 unsettledly respectively, or this substrate 201 are provided support, and heat this substrate to avoid thermal source to pass through this space; This surface temperature measurement meter 203 can be thermopair, infrared ray sensor or other can measure the temperature sensor of temperature.
This surface temperature measurement meter 203, this heating plate 202 stagger with the contact position of this substrate 201, the indirect thermal conduction pattern of ecto-entad heating is provided, heating direction 204 as shown by arrows, in order to measure the thermal conduction effect of this substrate 201, increase by the heat conducting distance of one-dimension temperature, make the heat-conduction coefficient amplitude of variation of this substrate 201 increase, thereby reach the purpose of the accuracy of measuring thermal conduction effect.
Please refer to Fig. 3, this figure is the schematic representation of apparatus according to the measurement thermal conduction effect of second embodiment of the invention.Wherein, this surface temperature measurement meter 303, this heating plate 302 stagger with the contact position of this substrate 301, and the indirect thermal conduction pattern of heating from inside to outside is provided, and heating direction 304 as shown by arrows.
Please refer to Fig. 4, this figure is the schematic representation of apparatus according to the measurement thermal conduction effect of third embodiment of the invention.Wherein, this surface temperature measurement meter 403, this heating plate 402 stagger with the contact position of this substrate 401, provide by left side (heating direction 404 as shown by arrows) or by the right side indirect thermal conduction pattern of (not shown) heating to the left to the right.
Please refer to Fig. 5, this figure is the schematic representation of apparatus according to the measurement thermal conduction effect of fourth embodiment of the invention.Wherein, this surface temperature measurement meter 503, this heating plate 502 stagger with the contact position of this substrate 501, and the ecto-entad and the indirect heat conducting mode of heating simultaneously from inside to outside are provided, and heating direction 504 as shown by arrows.
Please refer to Fig. 6, this figure is the flow chart of steps according to the method for measurement thermal conduction effect of the present invention.The invention provides a kind of method 600 of measuring thermal conduction effect, be used to measure the thermal conduction effect of substrate, comprise the following steps: step 610 at least; Step 620; Step 630; Step 640; And step 650.
Execution in step 610 is positioned over this substrate on the heating plate, prepares heating.
Execution in step 620 starts heating plate, and selected heating mode provides power of heat source to heat this substrate, and uses timer.Wherein this heating mode comprises fixed temperature pattern or stationary heat power mode at least.
Execution in step 630 is used the surface temperature measurement meter, measures this substrate and changes from low temperature in time and rise to high temperature, and the contact position of this surface temperature measurement meter, this heating plate and this substrate staggers, and when temperature rose to this low temperature, this timer picked up counting.
Execution in step 640, when temperature rose to this high temperature, timer stopped timing, and used timer record to obtain the heat time heating time of this substrate from this low temperature to this high temperature.Wherein this low temperature to the scope of this high temperature can be Celsius 50 between the 100 or other temperature ranges.This high temperature need be lower than the glass transition temperature (Tg) of this substrate.When the power of heat source that is provided was fixed temperature, this fixed temperature need be higher than more than the high temperature twice of this substrate that measures.
Execution in step 650 utilizes formula to calculate the thermal conduction effect of this substrate.Wherein this formula usefulness decides the thermal conduction effect of this substrate:
Wherein a is the thermal conduction effect of this substrate, temperature when Q provides thermal source to be fixed temperature for this heating plate, its unit is absolute temperature K, t is resultant three mean values that should heat time heating time of this timer, Δ T is the high temperature of measured this substrate of this surface temperature measurement meter and the temperature difference of low temperature, with C be constant.Wherein, and the product of this temperature difference and this heat time heating time (Δ T * t), under the good more condition of thermal conduction characteristic high more at the power of heat source that is provided or this substrate, this product (Δ T * t) high more then; The thermal conduction characteristic of big more this substrate of expression of thermal conduction effect a of this substrate is poor more; Constant C and device and environment have relation.
Please refer to Fig. 7, this figure is according to experimental data bar chart of the present invention, when adopting the fixed temperature pattern of heating plate, fixed temperature is about 100, with about 7 centimeters of the circular diameter of this substrate cut, measure the heat time heating time of this substrate, for the preferred range from this low temperature to this high temperature between 40 degree Celsius are approximately spent to Celsius approximately 65, the resulting experimental data of mean value of three heat time heating times of double counting, the longitudinal axis is the time, with the second is unit, and transverse axis is the material of different substrate.Wherein the material of this substrate is respectively: e (Laird), f (NRK), g (Arlon), and commercially available epoxy resin h.Can obtaining respectively respectively according to prior art, the heat-conduction coefficient K of this basic material is respectively: e be about 3 (W/m ℃), f scope between between about 1.5 to 1.8 (W/m ℃), the scope of g between between about 1.1 to 1.2 (W/m ℃), and the scope of epoxy resin h between about 0.2 to 0.6 (W/m ℃).Therefore though learn that the heat-conduction coefficient K of material of above-mentioned this substrate is close, the apparatus and method of measurement thermal conduction effect disclosed by the invention can be told difference effectively.
Table 1 is that heat-conduction coefficient is between 0.4～0.6 (W/mK), be difficult for telling three kinds of substrate A, B, the C of thermal conduction characteristic, thermal conduction characteristic A＜B＜C wherein, utilize different heating source (fixed temperature Q) heating, in different low temperature actual measured results under the temperature range of high temperature, utilize above-mentioned formula, the thermal conduction effect a that can obtain substrate A respectively is 12.74, the thermal conduction effect a of substrate B is 11.18, and the thermal conduction effect a of substrate C is 10.97.Can learn that thermal conduction characteristic its thermal conduction effect of good material a value that heals is low more.
Table 1
The present invention utilizes the heat conducting mode of indirect measurement, the contact position of this surface temperature measurement meter, this heating plate and this substrate is staggered, thereby reached the purpose that reduces installation cost and improve the accuracy of measuring thermal conduction effect.
Though the present invention by a preferred embodiment openly as above; yet it is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing various changes and modification, so protection scope of the present invention should be as the criterion with claims.
Claims (13)
1. device of measuring thermal conduction effect is used to measure the thermal conduction effect of substrate, it is characterized in that, comprises at least:
Heating plate, this substrate are arranged on this heating plate, have a space between this substrate and this heating plate at least; And
The surface temperature measurement meter, wherein the contact position of this surface temperature measurement meter, this heating plate and this substrate staggers, and forms the indirect thermal conduction pattern.
2. the device of measurement thermal conduction effect as claimed in claim 1 is characterized in that, the material of this substrate is epoxy resin, insulating metal substrate, aluminium base or MCPCB.
3. the device of measurement thermal conduction effect as claimed in claim 1 is characterized in that, the heating mode that this heating plate provides is fixed temperature pattern or stationary heat power mode.
4. the device of measurement thermal conduction effect as claimed in claim 1 is characterized in that, being shaped as of this heating plate is circular, square, rectangle or triangle.
5. the device of measurement thermal conduction effect as claimed in claim 1 is characterized in that, air or thermal insulation material are filled in this space.
6. the device of measurement thermal conduction effect as claimed in claim 1 is characterized in that, this surface temperature measurement is counted thermopair, infrared ray sensor or temperature sensor.
7. method of measuring thermal conduction effect is used to measure the thermal conduction effect of substrate, it is characterized in that, comprises the following steps: at least
This substrate is positioned on the heating plate, starts this heating plate, selected heating mode provides power of heat source to heat this substrate, and uses timer; And
Use the surface temperature measurement meter, be warming up to high temperature in order to measure this substrate from low temperature, and use the heat time heating time of this low temperature of this timer record to this high temperature, wherein the contact position of this surface temperature measurement meter, this heating plate and this substrate staggers, and forms the indirect thermal conduction pattern.
8. the method for measurement thermal conduction effect as claimed in claim 7 is characterized in that, the material of this substrate is epoxy resin, insulating metal substrate, aluminium base or MCPCB.
9. the method for measurement thermal conduction effect as claimed in claim 7 is characterized in that, being shaped as of this heating plate is circular, square, rectangle or triangle.
10. the method for measurement thermal conduction effect as claimed in claim 7 is characterized in that, this surface temperature measurement is counted thermopair, infrared ray sensor or temperature sensor.
11. the method for measurement thermal conduction effect as claimed in claim 7 is characterized in that, this heating mode is fixed temperature pattern or stationary heat power mode.
12. the method for measurement thermal conduction effect as claimed in claim 7 is characterized in that, this low temperature to the scope of this high temperature is spent between 40 degree extremely Celsius approximately 65 Celsius approximately.
13. the method as each described measurement thermal conduction effect of claim 7 to 12 is characterized in that, utilizes following formula to decide the thermal conduction effect of this substrate: a
(Δ T * t)/(Q)+C, wherein a is the thermal conduction effect of this substrate, the power of heat source that Q provides for this heating plate, t is the resulting multiple averaging value that should heat time heating time of this timer, Δ T is this high temperature of this measured substrate of this surface temperature measurement meter and the temperature difference of this low temperature, and C is a constant.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100012963A CN101487805A (en) | 2008-01-17 | 2008-01-17 | Apparatus and method for measuring thermal conduction effect |
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008100012963A CN101487805A (en) | 2008-01-17 | 2008-01-17 | Apparatus and method for measuring thermal conduction effect |
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| CN101487805A true CN101487805A (en) | 2009-07-22 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728338A (en) * | 2013-08-12 | 2014-04-16 | 太仓派欧技术咨询服务有限公司 | Device and method for electromagnetically testing heat conduction coefficient |
| CN104374797A (en) * | 2013-08-12 | 2015-02-25 | 苏州维艾普新材料股份有限公司 | Rapid heat conductivity coefficient measuring device and method |
| CN105021650A (en) * | 2015-08-11 | 2015-11-04 | 中国兵器工业集团第五三研究所 | Device for measuring heat conduction coefficient by means of guarded hot plate method |
| CN105372288A (en) * | 2015-10-28 | 2016-03-02 | 中国农业大学 | Heat flow rate measuring instrument and measuring method |
| CN108896602A (en) * | 2018-08-20 | 2018-11-27 | 常州扬鹏科技有限公司 | Heat transfer temperature measuring equipment and the temp measuring method for applying it |
-
2008
- 2008-01-17 CN CNA2008100012963A patent/CN101487805A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103728338A (en) * | 2013-08-12 | 2014-04-16 | 太仓派欧技术咨询服务有限公司 | Device and method for electromagnetically testing heat conduction coefficient |
| CN104374797A (en) * | 2013-08-12 | 2015-02-25 | 苏州维艾普新材料股份有限公司 | Rapid heat conductivity coefficient measuring device and method |
| CN105021650A (en) * | 2015-08-11 | 2015-11-04 | 中国兵器工业集团第五三研究所 | Device for measuring heat conduction coefficient by means of guarded hot plate method |
| CN105021650B (en) * | 2015-08-11 | 2018-03-02 | 中国兵器工业集团第五三研究所 | A kind of Guarded hot plate heat conductivity measuring device |
| CN105372288A (en) * | 2015-10-28 | 2016-03-02 | 中国农业大学 | Heat flow rate measuring instrument and measuring method |
| CN105372288B (en) * | 2015-10-28 | 2018-02-13 | 中国农业大学 | A kind of rate of heat flow measuring instrument and measuring method |
| CN108896602A (en) * | 2018-08-20 | 2018-11-27 | 常州扬鹏科技有限公司 | Heat transfer temperature measuring equipment and the temp measuring method for applying it |
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Open date: 20090722 |