CN108880286A - High pressure direct current valve pile structure design method based on chip and the unified optimization of system - Google Patents
High pressure direct current valve pile structure design method based on chip and the unified optimization of system Download PDFInfo
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- CN108880286A CN108880286A CN201810931928.XA CN201810931928A CN108880286A CN 108880286 A CN108880286 A CN 108880286A CN 201810931928 A CN201810931928 A CN 201810931928A CN 108880286 A CN108880286 A CN 108880286A
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- Prior art keywords
- chip
- rectifier
- high pressure
- direct current
- small
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Rectifiers (AREA)
Abstract
The invention belongs to high pressure direct current valve heap technical field of heat dissipation more particularly to a kind of high pressure direct current valve pile structure design methods based on chip and the unified optimization of system, including：Chip module is reversely connected two-by-two and forms a small-sized rectifier module, two chips share the same cooling fin, then multiple small-sized rectifier modules are connected to form big rectifier structure.The present invention is the reversed feature of upper lower arm for the structure of rectifier arm, the feature unidirectionally to radiate in conjunction with chip, under the premise of not influencing element normal work, change conventional connection type, two chips share the same cooling fin, compared with original connection type, the quantity of cooling fin saves half, simplifies component structure.
Description
Technical field
The invention belongs to high pressure direct current valve heap technical field of heat dissipation, more particularly to a kind of chip that is based on to optimize with system unification
High pressure direct current valve pile structure design method.
Background technique
With the development of D.C. high voltage transmission power grid, high pressure direct current valve heap is widely used.It is rectified below with AC/DC
(rectification adversers such as DC/AC, DC/DC, AC/AC are also such) is illustrated for device.In three-phase bridge rectification circuit, each
High pressure direct current valve heap on rectifier arm is formed by several thyristors or IGBT series aiding connection.It is with disc spring compression joint type IGBT
Example, normally when connection, all chip module series aiding connections, electrical connection meets specification.But by experiment it can be found that just
Under normal operating condition, when module passes through electric current, the main portions of fever are the chip in module, the temperature highest of chip.Chip
There are two kinds of sinking paths up and down, passes sequentially through contact chip, upper conductive sheet, disc spring, upper cover plate and upper cooling fin upwards and radiate, to
It is lower to radiate by lower contact chip, lower cover plate and cooling fin.As shown in Figure 1 and Figure 2.Fig. 1 is followed successively by from top to bottom：Upper cover plate (aluminium
Material), butterfly spring (copper product), upper conductive sheet (ag material), upper contact chip (molybdenum material), chip (silicon materials), oversheath (engineering plastic
Expect material), lower contact chip (molybdenum material).For convenience of observation, chip internal structure is proposed out of oversheath.From Fig. 2
As it can be seen that chip region is high-temperature region, both ends are low-temperature space.Distance from chip to lower contact plate is very close, nearly all
Heat is all conducted from this side.It can find that the approach to radiate upwards is longer, and radiating efficiency is lower, heat master by observation
It can substantially think unidirectionally to radiate distributing in a manner of conducting downwards.
At present in high pressure direct current valve heap, each valve block just needs to install additional a cooling fin, so each device dissipates
Heat is required to a large amount of cooling fin to meet radiating requirements, and overall setup is more complicated, but actually disc spring compression joint type IGBT
Heat dissipation substantially based on unidirectionally radiating, the heat of upper cover plate is actually mainly derived from cooling fin, cooling fin utilization efficiency
It is lower.Each valve block just needs to install additional a cooling fin, and usage amount is also larger.
Summary of the invention
In view of the above problems, the present invention proposes that a kind of high pressure direct current valve pile structure based on chip and system unification optimization is set
Meter method, including：Chip module is reversely connected two-by-two and forms a small-sized rectifier module, two chips share the same heat dissipation
Piece, then multiple small-sized rectifier modules are connected to form big rectifier structure.
The method specifically includes：
Step 1 is directed to design it needs to be determined that chip is even number, and if chip is odd number, then increase by one, formation redundancy is set
Meter；
Step 2, by taking three-phase bridge rectification circuit as an example, by 12 chip modules of three-phase two-by-two be reversely connected formation one it is small-sized whole
Flow device module；
Step 3, using small-sized rectifier module as basic unit, series connection forms big rectifier structure step by step；
Step 4, all voltage and current nargin of accounting reach requirement of system design.
Beneficial effects of the present invention：
Structure for rectifier arm is that the reversed feature of upper lower arm is not influencing member in conjunction with the feature that chip unidirectionally radiates
Under the premise of part works normally, change conventional connection type, two chips share the same cooling fin, with original connection type
It compares, the quantity of cooling fin saves half, simplifies component structure.
Detailed description of the invention
Fig. 1 is compression joint type igbt chip inside modules structure.
Temperature Distribution under Fig. 2 compression joint type igbt chip module declared working condition.
Specific embodiment
Structure for rectifier arm is that the reversed feature of upper lower arm is not influencing member in conjunction with the feature that chip unidirectionally radiates
Under the premise of part works normally, the present invention proposes a kind of high pressure direct current valve pile structure based on chip and the unified optimization of system
Design method, including：Chip module is reversely connected two-by-two and forms a small-sized rectifier module, two chips share the same heat dissipation
Piece, then multiple small-sized rectifier modules are connected to form big rectifier structure.
The method specifically includes：
Step 1 is directed to design it needs to be determined that chip is even number, and if chip is odd number, then increase by one, formation redundancy is set
Meter；
Step 2, by taking three-phase bridge rectification circuit as an example, by 12 chip modules of three-phase two-by-two be reversely connected formation one it is small-sized whole
Flow device module；
Step 3, using small-sized rectifier module as basic unit, series connection forms big rectifier structure step by step；
Step 4, all voltage and current nargin of accounting reach requirement of system design.
This embodiment is merely preferred embodiments of the present invention, but scope of protection of the present invention is not limited thereto,
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by anyone skilled in the art,
It should be covered by the protection scope of the present invention.Therefore, protection scope of the present invention should be with scope of protection of the claims
Subject to.
Claims (2)
1. a kind of high pressure direct current valve pile structure design method based on chip and the unified optimization of system, which is characterized in that including：It will
Chip module is reversely connected two-by-two forms a small-sized rectifier module, and two chips share the same cooling fin, then will be multiple small-sized
Rectifier module connects to form big rectifier structure.
2. method according to claim 1, which is characterized in that the method specifically includes：
Step 1, for design it needs to be determined that chip be even number, if chip be odd number, then increase by one, formed Redundancy Design；
Step 2, by taking three-phase bridge rectification circuit as an example, by 12 chip modules of three-phase two-by-two be reversely connected formed a small-sized rectifier
Module；
Step 3, using small-sized rectifier module as basic unit, series connection forms big rectifier structure step by step；
Step 4, all voltage and current nargin of accounting reach requirement of system design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810931928.XA CN108880286A (en) | 2018-08-16 | 2018-08-16 | High pressure direct current valve pile structure design method based on chip and the unified optimization of system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810931928.XA CN108880286A (en) | 2018-08-16 | 2018-08-16 | High pressure direct current valve pile structure design method based on chip and the unified optimization of system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108880286A true CN108880286A (en) | 2018-11-23 |
Family
ID=64318055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810931928.XA Pending CN108880286A (en) | 2018-08-16 | 2018-08-16 | High pressure direct current valve pile structure design method based on chip and the unified optimization of system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108880286A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5574312A (en) * | 1994-06-17 | 1996-11-12 | Abb Management Ag | Low-inductance power semiconductor module |
| CN101814766A (en) * | 2010-04-06 | 2010-08-25 | 中国电力科学研究院 | Power supply topology structure of electric automobile bidirectional charger |
| CN203715947U (en) * | 2013-12-19 | 2014-07-16 | 青岛毕勤易莱特电子有限公司 | Control module for washing machine |
| CN203812864U (en) * | 2014-03-24 | 2014-09-03 | 上海南泰整流器有限公司 | Heat pipe radiator thyristor rectifier module |
-
2018
- 2018-08-16 CN CN201810931928.XA patent/CN108880286A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5574312A (en) * | 1994-06-17 | 1996-11-12 | Abb Management Ag | Low-inductance power semiconductor module |
| CN101814766A (en) * | 2010-04-06 | 2010-08-25 | 中国电力科学研究院 | Power supply topology structure of electric automobile bidirectional charger |
| CN203715947U (en) * | 2013-12-19 | 2014-07-16 | 青岛毕勤易莱特电子有限公司 | Control module for washing machine |
| CN203812864U (en) * | 2014-03-24 | 2014-09-03 | 上海南泰整流器有限公司 | Heat pipe radiator thyristor rectifier module |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181123 |