CN108878343A - A kind of manufacturing method of flexible display apparatus - Google Patents
A kind of manufacturing method of flexible display apparatus Download PDFInfo
- Publication number
- CN108878343A CN108878343A CN201810697139.4A CN201810697139A CN108878343A CN 108878343 A CN108878343 A CN 108878343A CN 201810697139 A CN201810697139 A CN 201810697139A CN 108878343 A CN108878343 A CN 108878343A
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- China
- Prior art keywords
- flexible
- hole
- glass substrate
- substrate
- flexible substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 239000011521 glass Substances 0.000 claims abstract description 39
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 27
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims abstract description 20
- 239000002253 acid Substances 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims abstract description 14
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 13
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 13
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims abstract description 10
- 235000017557 sodium bicarbonate Nutrition 0.000 claims abstract description 10
- 239000011261 inert gas Substances 0.000 claims abstract description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 230000006378 damage Effects 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000035618 desquamation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a kind of manufacturing methods of flexible display apparatus, include the following steps：S1. a glass substrate is provided, the glass substrate has multiple equally distributed through-holes；S2. flexible substrate is bonded on the glass substrate；S3. display element is formed on flexible substrates；S4. air or inert gas are filled with into through-hole；S5. sodium bicarbonate solution is instilled into through-hole, then instills acid solution, generates carbon dioxide gas in the through hole to separate flexible substrate with glass substrate.In the present invention, by being first filled with air or inert gas in the through-hole of glass substrate, then sodium bicarbonate solution, acid solution are successively instilled, carbon dioxide gas is generated in the through hole by chemical reaction, uniformly, carbon dioxide gas applies active force to flexible substrate, so that generated internal stress is smaller when separating flexible substrate with glass substrate for carbon dioxide gas release, destruction will not be generated to flexible substrate, the destruction that not will cause flexible substrate causes to show bad.
Description
Technical field
The present invention relates to field of display technology, more particularly to a kind of manufacturing method of flexible display apparatus.
Background technique
Flexible display apparatus is a kind of the display device to be formed to be made based on flexible base material.Since Flexible Displays fill
Setting has the characteristics that rollable, wide viewing angle, easy to carry, therefore, in portable product, most display application field Flexible Displays
Device has broad application prospects and good market potential.
The problems such as being easy to happen fold, deformation, offset due to the flexible substrate in flexible display apparatus, is preparing display
During part, positioning, carrying, storage etc. are relatively difficult, therefore are usually first formed on the bearing substrates such as glass substrate soft
Property substrate, be formed on display element later, finally by the method for substrate desquamation, make flexible substrate and glass substrate point
It opens.In flexible display apparatus preparation process, how to separate flexible substrate with glass substrate is in flexible display technologies field
Prepare the key technology of flexible device.Then, it states during separating flexible liner bottom plate from glass substrate, sends out in realization
Bright people has found existing stripping technology, is easy to damage flexible substrate, causes product bad, separation process is complicated, unfavorable
In the production efficiency for improving flexible display apparatus.
Summary of the invention
In order to make up the defect of prior art, the present invention provides a kind of manufacturing method of flexible display apparatus.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of manufacturing method of flexible display apparatus, includes the following steps：
S1. a glass substrate is provided, the glass substrate has multiple equally distributed through-holes；
S2. flexible substrate is bonded on the glass substrate；
S3. display element is formed on flexible substrates；
S4. air or inert gas are filled with into through-hole；
S5. instill sodium bicarbonate solution into through-hole, then instill acid solution, in the through hole generate carbon dioxide gas with
Flexible substrate is separated with glass substrate.
Further, the acid solution is acetum or oxalic acid solution.
Further, the through-hole is circle, and the diameter of described hole is 5-6mm.
Further, the flexible substrate is ultra-thin glass.
Further, the display element is OLED display element；Alternatively, the display element is liquid crystal display element.
The present invention has the advantages that：
In the present invention, by being first filled with air or inert gas in the through-hole of glass substrate, sodium bicarbonate is then successively instilled
Solution, acid solution generate carbon dioxide gas by chemical reaction in the through hole, and carbon dioxide gas release is uniform, and two
Carbon oxide gas to flexible substrate apply active force, thus when separating flexible substrate with glass substrate generated internal stress compared with
It is small, flexible substrate will not be generated and be destroyed, the stripping process of flexible substrate and glass substrate is more easier, to solve flexibility
The problem of strippable substrate difficulty.Flexible display apparatus, simple process are made using this method, flexible substrate and glass substrate are easy
Separation, the destruction that not will cause flexible substrate causes to show bad.
In the present invention, after the completion of a batch flexible substrate separates, glass substrate can be recycled, save material
Material.
Specific embodiment
The present invention will now be described in detail with reference to examples, and the examples are only preferred embodiments of the present invention,
It is not limitation of the invention.
A kind of manufacturing method of flexible display apparatus, includes the following steps：
S1. a glass substrate is provided, the glass substrate has multiple equally distributed through-holes；
S2. flexible substrate is bonded on the glass substrate；
S3. display element is formed on flexible substrates；
S4. air or inert gas are filled with into through-hole；
S5. instill sodium bicarbonate solution into through-hole, then instill acid solution, in the through hole generate carbon dioxide gas with
Flexible substrate is separated with glass substrate.
Wherein, the acid solution be acetum or oxalic acid solution, but not limited to this.
It should be noted that the dosage of sodium bicarbonate solution and acid solution is not limited in the present invention specifically.Preferably, institute
Stating the ratio between amount of substance of sodium bicarbonate solution and acid solution is 1:1.
In the present invention, the flexible substrate is preferably ultra-thin glass.
In the present invention, the mode for forming through-hole is not particularly limited, such as：In glass in the way of drill bit punching
Through-hole is formed on substrate.
In the present invention, with no restrictions to the quantity of through-hole, it can be rationally designed according to the size of glass substrate.
In the present invention, the shape of through-hole is not particularly limited, as an example, can for rectangle, square, circle,
Any one or a few in triangle, cross.Preferably, the through-hole is circle, the diameter of described hole is 5-6mm.
The present invention is not particularly limited the specific arrangement mode of through-hole, as long as realizing that through-hole uniformly divides on the glass substrate
Cloth.
Due to the supporting role of glass substrate, display element is made in flexible substrate fitting together with glass substrate,
It can effectively avoid flexible substrate and occur broken, fold and deformation in display element manufacturing process.
It should be noted that being prepared in the flexible substrate of formation according to flexible display apparatus type and the difference of construction
Display element is not also identical.The display element is OLED display element；Alternatively, the display element is liquid crystal display element.
Wherein, OLED display element may include thin film transistor (TFT), anode, cathode and between anode and cathode
Organic material functional layer, wherein due to the particularity of organic material functional layer, OLED display element further includes encapsulated layer, but
It is not limited to this.With no restrictions to this present invention, and formation above structure is technique well known in the art, herein no longer
It repeats.
Liquid crystal display element includes thin film transistor (TFT), pixel electrode etc. in array substrate, and is located to box base
Chromatic filter layer on plate.Wherein, public electrode may be provided in array substrate, may also be arranged on on box substrate, colour is filtered
Photosphere may be provided on box substrate, may also be arranged in array substrate.With no restrictions to this present invention, and above structure is formed
It is technique well known in the art, details are not described herein.
It is chemically reacted in the present invention by soda acid and generates carbon dioxide gas, compared to being directly filled with carbon dioxide gas,
The air pressure that is directly filled in carbon dioxide gas be can avoid compared with macrolesion flexible substrate, and air pressure it is smaller lead to not separate ask
Topic.In the present invention, carbon dioxide gas release is uniform.
Inventor has found the dropwise addition sequence of sodium bicarbonate solution and acid solution to flexible substrate and glass substrate in practice
Separating effect have a major impact, sodium bicarbonate solution is only first added dropwise in through-holes, then acid solution is added dropwise, flexible substrate and glass
The separating effect of glass substrate is better.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (5)
1. a kind of manufacturing method of flexible display apparatus, includes the following steps：
S1. a glass substrate is provided, the glass substrate has multiple equally distributed through-holes；
S2. flexible substrate is bonded on the glass substrate；
S3. display element is formed on flexible substrates；
S4. air or inert gas are filled with into through-hole；
S5. instill sodium bicarbonate solution into through-hole, then instill acid solution, in the through hole generate carbon dioxide gas with
Flexible substrate is separated with glass substrate.
2. the manufacturing method of flexible display apparatus as described in claim 1, which is characterized in that the acid solution is acetum
Or oxalic acid solution.
3. the manufacturing method of flexible display apparatus as described in claim 1, which is characterized in that the through-hole is circle, described
The diameter of hole is 5-6mm.
4. the manufacturing method of flexible display apparatus as described in claim 1, which is characterized in that the flexible substrate is ultra-thin glass
Glass.
5. the manufacturing method of flexible display apparatus as described in claim 1, which is characterized in that the display element is aobvious for OLED
Show element；Alternatively, the display element is liquid crystal display element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697139.4A CN108878343B (en) | 2018-06-29 | 2018-06-29 | Manufacturing method of flexible display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810697139.4A CN108878343B (en) | 2018-06-29 | 2018-06-29 | Manufacturing method of flexible display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108878343A true CN108878343A (en) | 2018-11-23 |
| CN108878343B CN108878343B (en) | 2022-05-03 |
Family
ID=64297194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810697139.4A Active CN108878343B (en) | 2018-06-29 | 2018-06-29 | Manufacturing method of flexible display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108878343B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113383413A (en) * | 2019-03-29 | 2021-09-10 | Skc株式会社 | Semiconductor package glass substrate, semiconductor package substrate, and semiconductor device |
| US11469167B2 (en) | 2019-08-23 | 2022-10-11 | Absolics Inc. | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same |
| US11652039B2 (en) | 2019-03-12 | 2023-05-16 | Absolics Inc. | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same |
| US11967542B2 (en) | 2019-03-12 | 2024-04-23 | Absolics Inc. | Packaging substrate, and semiconductor device comprising same |
| US11981501B2 (en) | 2019-03-12 | 2024-05-14 | Absolics Inc. | Loading cassette for substrate including glass and substrate loading method to which same is applied |
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| KR20090040052A (en) * | 2007-10-19 | 2009-04-23 | 엘지전자 주식회사 | Method of fabricating for vertical light emitting diode |
| CN105632991A (en) * | 2016-01-07 | 2016-06-01 | 京东方科技集团股份有限公司 | Rigid substrate and manufacturing equipment and manufacturing method of flexible display substrate |
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-
2018
- 2018-06-29 CN CN201810697139.4A patent/CN108878343B/en active Active
Patent Citations (3)
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| KR20090040052A (en) * | 2007-10-19 | 2009-04-23 | 엘지전자 주식회사 | Method of fabricating for vertical light emitting diode |
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Non-Patent Citations (1)
| Title |
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| 刘清廷: "《奇妙的化学实验》", 31 October 2012 * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11652039B2 (en) | 2019-03-12 | 2023-05-16 | Absolics Inc. | Packaging substrate with core layer and cavity structure and semiconductor device comprising the same |
| US11967542B2 (en) | 2019-03-12 | 2024-04-23 | Absolics Inc. | Packaging substrate, and semiconductor device comprising same |
| US11981501B2 (en) | 2019-03-12 | 2024-05-14 | Absolics Inc. | Loading cassette for substrate including glass and substrate loading method to which same is applied |
| CN113383413A (en) * | 2019-03-29 | 2021-09-10 | Skc株式会社 | Semiconductor package glass substrate, semiconductor package substrate, and semiconductor device |
| CN113383413B (en) * | 2019-03-29 | 2022-04-08 | 爱玻索立克公司 | Semiconductor package glass substrate, semiconductor package substrate, and semiconductor device |
| US11437308B2 (en) | 2019-03-29 | 2022-09-06 | Absolics Inc. | Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus |
| US11469167B2 (en) | 2019-08-23 | 2022-10-11 | Absolics Inc. | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same |
| US11728259B2 (en) | 2019-08-23 | 2023-08-15 | Absolics Inc. | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same |
| US12027454B1 (en) | 2019-08-23 | 2024-07-02 | Absolics Inc. | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108878343B (en) | 2022-05-03 |
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