CN108866588A - A kind of electroplating additive improving zinc-nickel electroplated stabilizer - Google Patents
A kind of electroplating additive improving zinc-nickel electroplated stabilizer Download PDFInfo
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- CN108866588A CN108866588A CN201810757838.3A CN201810757838A CN108866588A CN 108866588 A CN108866588 A CN 108866588A CN 201810757838 A CN201810757838 A CN 201810757838A CN 108866588 A CN108866588 A CN 108866588A
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- parts
- electroplating additive
- potassium
- nickel electroplated
- zinc
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a kind of electroplating additives for improving zinc-nickel electroplated stabilizer, including the following raw material：Pyridinium hydroxy propyl sulfobetaine, hydracrylic acid, methane sulfonic acid, ethyl vanillin, hydrogen peroxide, potassium tripolyphosphate, double chlorine sulfimides, propilolic alcohol, trimethylpyridine, Potassium dodecylbenzenesulfonate, hydroxyl sulfoacid sodium, acetoglycocoll, tri-chlorination ammonium, inorganic metal salt, inorganic non-metallic compound, deionized water.The present invention largely improves plating solution and coating performance, and will not generate and be mingled in coating, can be obviously improved coating surface bright property, guarantee the uniformity of coating；In addition, cathode efficiency and bath stability can also be maintained；Electroplating additive used in the present invention have high stability, will not decompose in the plating solution, by be repeatedly electroplated and after a long time placement be not in precipitating and discoloration phenomena such as.
Description
Technical field
The present invention relates to field of metal surface treatment technology more particularly to a kind of plating for improving zinc-nickel electroplated stabilizer to add
Add agent.
Background technique
Plating is exactly to plate the process of other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
Make the technique of the surface of metal or other materials product attachment layer of metal film prevent from corroding to play using electrolysis, mentions
The effects of high-wearing feature, electric conductivity, reflective and having improved aesthetic appearance.
It is good that attachment is deposited on machinework using electrolysis, but the metal coating that performance is different with basis material
Technology, electroplated layer is more uniform than hot dipping layer, generally all than relatively thin, differs from several microns to tens microns.It, can by plating
To obtain decoration protectiveness and various functional superficial layers on machinework, the work of abrasion and processing fault can also be repaired
Part.
Electroplated zinc nickel alloy is a kind of nearly two steel Anodic Type protective coatings risen during the last ten years.Zn-ni alloy deposits are not
Only corrosion resistance is higher than traditional 5-10 times of zinc coat, more possesses good japanning, solderability and mouldability, has excellent anti-corrosion
Property and low hydrogen brittleness, suitable plating require endurance, using such as spring, fastener and other structures part or at relatively high temperatures
Part, thus it is widely used in the industries such as automobile, aerospace, light industry, household electrical appliances.
Currently, electroplating technology is there are serious pollution problem, and electroplate liquid stability is poor in electroplating process, current efficiency is low,
It is easy to become cloudy, causes electroplated product overlay coating uniformity poor.
Summary of the invention
The present invention is in view of the deficienciess of the prior art, provide a kind of plating addition for improving zinc-nickel electroplated stabilizer
Agent, specific technical solution are as follows：
A kind of electroplating additive improving zinc-nickel electroplated stabilizer, including the following raw material according to the mass fraction：Hydroxyl third
45~70 parts of alkyl sulfonic acid pyridinium salt, 2~6 parts of hydracrylic acid, 15~25 parts of methane sulfonic acid, 0.5~1.5 part of ethyl vanillin,
15~25 parts of hydrogen peroxide, 25~40 parts of potassium tripolyphosphate, 3~8 parts of double chlorine sulfimides, 15~25 parts of propilolic alcohol, trimethyl
3~8 parts of pyridine, 5~8 parts of Potassium dodecylbenzenesulfonate, 12~25 parts of hydroxyl sulfoacid sodium, 15~25 parts of acetoglycocoll, trichlorine
Change 15~30 parts of ammonium, 20~35 parts of inorganic metal salt, 5~15 parts of inorganic non-metallic compound, 600~800 parts of deionized water.
As a further improvement of the present invention, the inorganic metal salt is strontium sulfate, potassium pyrophosphate, manganese acetate, sulfuric acid oxygen
One or more of vanadium, titanium boride.
As a further improvement of the present invention, the inorganic non-metallic compound is diboron trioxide, selenium sulfide, vulcanization
One of ammonium, selenium dioxide are a variety of.
As a further improvement of the present invention, the electroplating additive for improving zinc-nickel electroplated stabilizer, including press quality
The following raw material of number meter：50 parts of pyridinium hydroxy propyl sulfobetaine, 4 parts of hydracrylic acid, 20 parts of methane sulfonic acid, ethyl vanillin
1 part, 20 parts of hydrogen peroxide, 30 parts of potassium tripolyphosphate, 5 parts of double chlorine sulfimides, 20 parts of propilolic alcohol, 5 parts of trimethylpyridine, 12
6 parts of alkyl benzene sulphonate potassium, 18 parts of hydroxyl sulfoacid sodium, 20 parts of acetoglycocoll, 20 parts of tri-chlorination ammonium, 10 parts of strontium sulfate, sulfuric acid oxygen
15 parts of vanadium, 5 parts of selenium sulfide, 700 parts of deionized water.
Beneficial effects of the present invention：The present invention largely improves plating solution and coating performance, and of the invention adds
Add agent not generate in coating to be mingled with, coating surface bright property can be obviously improved, guarantee the uniformity of coating；In addition, also
It can maintain cathode efficiency and bath stability；Electroplating additive used in the present invention has high stability, is plating
Will not decompose in liquid, by be repeatedly electroplated and after a long time placement be not in precipitating and discoloration phenomena such as.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to embodiments, to the present invention
It is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not used to
Limit the present invention.
Embodiment 1
A kind of electroplating additive improving zinc-nickel electroplated stabilizer, including the following raw material according to the mass fraction：Hydroxyl third
45 parts of alkyl sulfonic acid pyridinium salt, 2 parts of hydracrylic acid, 15 parts of methane sulfonic acid, 0.5 part of ethyl vanillin, 15 parts of hydrogen peroxide, trimerization
25 parts of potassium phosphate, 3 parts of double chlorine sulfimides, 15 parts of propilolic alcohol, 3 parts of trimethylpyridine, 5 parts of Potassium dodecylbenzenesulfonate, hydroxyl
12 parts of sodium sulfonate, 15 parts of acetoglycocoll, 15 parts of tri-chlorination ammonium, 8 parts of strontium sulfate, 15 parts of potassium pyrophosphate, 3 parts of diboron trioxide,
7 parts of selenium sulfide, 600 parts of deionized water.
Embodiment 2
A kind of electroplating additive improving zinc-nickel electroplated stabilizer, including the following raw material according to the mass fraction：Hydroxyl third
55 parts of alkyl sulfonic acid pyridinium salt, 4 parts of hydracrylic acid, 20 parts of methane sulfonic acid, 1 part of ethyl vanillin, 20 parts of hydrogen peroxide, trimerization phosphorus
35 parts of sour potassium, 5 parts of double chlorine sulfimides, 20 parts of propilolic alcohol, 5 parts of trimethylpyridine, 7 parts of Potassium dodecylbenzenesulfonate, hydroxyl sulphur
20 parts of sour sodium, 20 parts of acetoglycocoll, 23 parts of tri-chlorination ammonium, 15 parts of potassium pyrophosphate, 15 parts of manganese acetate, 5 parts of selenium sulfide, ammonium sulfide
5 parts, 700 parts of deionized water.
Embodiment 3
A kind of electroplating additive improving zinc-nickel electroplated stabilizer, including the following raw material according to the mass fraction：Hydroxyl third
70 parts of alkyl sulfonic acid pyridinium salt, 6 parts of hydracrylic acid, 25 parts of methane sulfonic acid, 1.5 parts of ethyl vanillin, 25 parts of hydrogen peroxide, trimerization
40 parts of potassium phosphate, 8 parts of double chlorine sulfimides, 25 parts of propilolic alcohol, 8 parts of trimethylpyridine, 8 parts of Potassium dodecylbenzenesulfonate, hydroxyl
25 parts of sodium sulfonate, 25 parts of acetoglycocoll, 30 parts of tri-chlorination ammonium, 10 parts of vanadic sulfate, 10 parts of titanium boride, 10 parts of ammonium sulfide, two
5 parts of selenium oxide part, 800 parts of deionized water.
Embodiment 4
A kind of electroplating additive improving zinc-nickel electroplated stabilizer, including the following raw material according to the mass fraction：Hydroxyl third
50 parts of alkyl sulfonic acid pyridinium salt, 4 parts of hydracrylic acid, 20 parts of methane sulfonic acid, 1 part of ethyl vanillin, 20 parts of hydrogen peroxide, trimerization phosphorus
30 parts of sour potassium, 5 parts of double chlorine sulfimides, 20 parts of propilolic alcohol, 5 parts of trimethylpyridine, 6 parts of Potassium dodecylbenzenesulfonate, hydroxyl sulphur
18 parts of sour sodium, 20 parts of acetoglycocoll, 20 parts of tri-chlorination ammonium, 10 parts of strontium sulfate, 15 parts of vanadic sulfate, 5 parts of selenium sulfide, deionization
700 parts of water.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (4)
1. a kind of electroplating additive for improving zinc-nickel electroplated stabilizer, which is characterized in that including following original according to the mass fraction
Material：45~70 parts of pyridinium hydroxy propyl sulfobetaine, 2~6 parts of hydracrylic acid, 15~25 parts of methane sulfonic acid, ethyl vanillin 0.5
~1.5 parts, 15~25 parts of hydrogen peroxide, 25~40 parts of potassium tripolyphosphate, 3~8 parts of double chlorine sulfimides, propilolic alcohol 15~25
Part, 3~8 parts of trimethylpyridine, 5~8 parts of Potassium dodecylbenzenesulfonate, 12~25 parts of hydroxyl sulfoacid sodium, acetoglycocoll 15~
25 parts, 15~30 parts of tri-chlorination ammonium, 20~35 parts of inorganic metal salt, 5~15 parts of inorganic non-metallic compound, deionized water 600
~800 parts.
2. a kind of electroplating additive for improving zinc-nickel electroplated stabilizer as described in claim 1, which is characterized in that described inorganic
Metal salt is one or more of strontium sulfate, potassium pyrophosphate, manganese acetate, vanadic sulfate, titanium boride.
3. a kind of electroplating additive for improving zinc-nickel electroplated stabilizer as described in claim 1, which is characterized in that described inorganic
Nonmetallic compound is one of diboron trioxide, selenium sulfide, ammonium sulfide, selenium dioxide or a variety of.
4. a kind of electroplating additive of raising zinc-nickel electroplated stabilizer as described in claims 1 to 3, which is characterized in that described
The electroplating additive for improving zinc-nickel electroplated stabilizer, including the following raw material according to the mass fraction：Hydroxypropanesulfonic acid pyridinium
It is 50 parts of salt, 4 parts of hydracrylic acid, 20 parts of methane sulfonic acid, 1 part of ethyl vanillin, 20 parts of hydrogen peroxide, 30 parts of potassium tripolyphosphate, double
5 parts of chlorine sulfimide, 20 parts of propilolic alcohol, 5 parts of trimethylpyridine, 6 parts of Potassium dodecylbenzenesulfonate, 18 parts of hydroxyl sulfoacid sodium, second
20 parts of acyl glycine, 20 parts of tri-chlorination ammonium, 10 parts of strontium sulfate, 15 parts of vanadic sulfate, 5 parts of selenium sulfide, 700 parts of deionized water.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810757838.3A CN108866588A (en) | 2018-07-11 | 2018-07-11 | A kind of electroplating additive improving zinc-nickel electroplated stabilizer |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810757838.3A CN108866588A (en) | 2018-07-11 | 2018-07-11 | A kind of electroplating additive improving zinc-nickel electroplated stabilizer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110144610A (en) * | 2019-06-27 | 2019-08-20 | 范文学 | A kind of zinc-nickel electroplating additive and preparation method thereof |
| CN111876797A (en) * | 2020-07-08 | 2020-11-03 | 佛山亚特表面技术材料有限公司 | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6562220B2 (en) * | 1999-03-19 | 2003-05-13 | Technic, Inc. | Metal alloy sulfate electroplating baths |
| CN106086946A (en) * | 2016-08-11 | 2016-11-09 | 太仓市凯福士机械有限公司 | A kind of holding plating solution stable in properties electroplating additive |
-
2018
- 2018-07-11 CN CN201810757838.3A patent/CN108866588A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6562220B2 (en) * | 1999-03-19 | 2003-05-13 | Technic, Inc. | Metal alloy sulfate electroplating baths |
| CN106086946A (en) * | 2016-08-11 | 2016-11-09 | 太仓市凯福士机械有限公司 | A kind of holding plating solution stable in properties electroplating additive |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110144610A (en) * | 2019-06-27 | 2019-08-20 | 范文学 | A kind of zinc-nickel electroplating additive and preparation method thereof |
| CN111876797A (en) * | 2020-07-08 | 2020-11-03 | 佛山亚特表面技术材料有限公司 | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process |
| CN111876797B (en) * | 2020-07-08 | 2021-10-15 | 佛山亚特表面技术材料有限公司 | High-corrosion-resistance neutral nickel plating solution and neutral nickel priming process |
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Application publication date: 20181123 |