CN108866583A - Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof - Google Patents
Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof Download PDFInfo
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- CN108866583A CN108866583A CN201810990764.8A CN201810990764A CN108866583A CN 108866583 A CN108866583 A CN 108866583A CN 201810990764 A CN201810990764 A CN 201810990764A CN 108866583 A CN108866583 A CN 108866583A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
the invention discloses a plating solution applied to lead-free electronic component multi-element complex tinning or tin-lead alloy, a preparation method thereof and an electroplating method, wherein the electroplating solution comprises a multi-element complexing agent, tin methane sulfonate, lead methane sulfonate, a surfactant, a semi-bright additive and an antioxidant, and the pH value of the plating solution is 4-7, wherein the content of the complexing agent in the plating solution is 200-300 g/L, the content of metal tin is 10-25 g/L, the content of metal lead is 1.0-2.5 g/L, the content of the surfactant is 1-8 g/L, the content of the semi-bright additive is 0.05-0.3 g/L, the content of the antioxidant is 0.4-2 g/L, and the balance is water.
Description
Technical field
The present invention relates to field of electroplating, and in particular, to a kind of tin plating or tin-lead conjunction applied to no lead electronic component
Plating solution of gold and preparation method thereof and electro-plating method.
Background technique
No lead electronic component (capacitor, resistance, inductance) electrode mostly uses greatly three-layer metal technology, i.e. end bottom electrode
Metal is Ag, and middle layer is nickel, and external electrode metal is tin or leypewter layer.Bottom electrode be conductive silver paste it is coated,
Dry, sintering is completed, and target and external electrode are completed by plating.This class component early stage using acid stronger fluoboric acid or
Methane sulfonic acid system is tin plating or leypewter.But it is very fast due to plating speed in acidic bath, coating is more than certain thickness, that is, is greater than
When 5um, easy " climbing plating ", i.e., coating extends to the place for not applying silver paste, it is often more important that acidic bath is to no lead electronics
Element is such as using special glass encapsulation, high activity ceramics as the corrosion dissolution ten of the plate resistor of substrate and multilayer sheet type Leaded Ceramic Disc Capacitor
It is clearly demarcated aobvious, the performance of element is leveraged, causes batch that waste product is electroplated, and this kind of plating solution is to the electronics member that environmental requirement is high
Device production contaminated sites are very big.
For above situation, had investigated successively both at home and abroad close to neutral or faintly acid electrotinning or leypewter work
Skill slows down the corrosion to glass, ceramics.But due to " climbing plating " problem, yields after plating is made still to be difficult to further increase, this
Masty problem when being also the plating of such workpiece.
Formed " climbing plating " influence factor be made of drum rotation speed, plating solution when bath temperature, pH value, barrel plating, electroplating time
Deng wherein plating solution composition is crucial.Using certain complexing agent, by controlling electroplating technological parameter and plating conditions appropriate,
The generation for preventing " climbing plating ", becomes the difficult point of the prior art.
In the prior art, a kind of pair of electronic building brick carries out barrel plating or high speed rotation electric plating method and neutrality used in it
Tin plating electrolyte, patent No. CN201711057609.2, it discloses the neutrality tin plating electrolyte use including (A) stannous ion, (B) acid or
Salt, (C) complexing agent and (D) have the electroplate liquid of the diamines and pH value of polyoxy alkylidene chain between 4 and 8.Make
It can prevent electronic building brick from linking together during barrel plating with this neutrality tin plating electrolyte, to realize changing for barrel plating manufacturability
It is kind.The invention mentions control plating solution in faintly acid or neutrality, but does not mention " climbing plating " problem andsolution.One kind being used for piece
The neutral tin plating electrolyte of formula component termination electrode plating, patent No. CN201510058597.X, it discloses neutrality tin plating electrolyte pH
Value is 7.0 ± 0.5, includes in the tin plating liquid system of the neutrality：Acetic acid and sodium acetate as buffer；Lemon as complexing agent
Sour sodium；Sodium methanesulfonate and sodium sulphate as conductive salt；Morin as antioxidant；Alkyl as surfactant
More glycosides, glucose amide, alcohol ether carboxylate, Amide Ether Carboxylates, monoalkyl phosphoric acid esters, at least one in monoalky lether phosphate
Kind；Divalent tin ion.The plating solution is neutral system, does not also mention " climbing plating " problem andsolution.
Summary of the invention
In view of this, being proposed a kind of applied to no lead electricity it is an object of the invention to solve the problems of the prior art
Tin plating or leypewter plating solution of subcomponent and preparation method thereof, plating solution pH4~7 are preferable anti-using multicomponent complex
The generation for only " climbing plating ", while bath stability, long-time service are not easy muddiness, and plating solution is to human body and environmentally friendly.
In order to solve the above technical problems, the present invention is achieved by the following scheme：
A kind of tin plating or leypewter plating solution applied to no lead electronic component, the plating solution include polynary complexing agent,
Tin methane sulfonate, methane sulfonic acid lead, surfactant, half brightener, antioxidant and water, the pH of plating solution are 4~7,
In plating solution,
The content of the complexing agent is 200~300g/L；
The tin methane sulfonate is the concentrate solution of the 300g/L containing metallic tin, in plating solution the content of metallic tin be 10~
25g/L,
The methane sulfonic acid lead is the concentrate solution of the 500g/L containing metallic lead, in plating solution the content of metallic lead be 1.0~
2.5g/L；
The content of the surfactant is 1~8g/L；
The content of half brightener is 0.05~0.3g/L；
The content of the antioxidant is 0.4~2g/L；
The water is surplus.
Further, the complexing agent is selected from sulfamate, citrate, gluconate, tartrate, methyl
It is at least two kinds of in sulfonate, triethanolamine, preferably triethanolamine, gluconate, methyl sulfonate.Complexing agent is in the plating solution
Content be preferably 240~280g/L.
Further, the content of metallic tin is preferably 15~20g/L in the plating solution.
Further, the content of metallic lead is preferably 1.5~2.0g/L in the plating solution so that in coating lead quality
Score is 10% or so.
Further, the surfactant is selected from alkyl alcohol ethoxylates, alkyl phenol polyoxyethylene ether, polyoxy third
It is alkene ether, bisphenol A polyethenoxy ether, how at least two kinds of in phenol ethoxy propoxyl group addition product.It is optimizing alkyl phenol polyethenoxy ether, double
Phenol A polyoxyethylene ether.The content of the surfactant in the plating solution is preferably 3~5g/L.
Further, half brightener is in 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, imidazoles
One kind, preferably 2-mercaptobenzimidazole.The content of half brightener in the plating solution is preferably 0.1~0.2g/L.
Further, the antioxidant be selected from catechol, hydroquinone, resorcinol, morin, phenol, how
It is at least two kinds of in phenol ethyoxyl sulfonic acid, preferably morin, resorcinol.Antioxidant uses ethyl alcohol, propylene glycol, isopropanol in advance
It is then added in plating solution after equal dissolutions are complete, the concentration of antioxidant in the plating solution is preferably 0.8~1.5g/L.
The invention also discloses the preparation sides of above-mentioned tin plating or leypewter the plating solution applied to no lead electronic component
Method includes the following steps：
Water is added in a reservoir, adds complexing agent, stirs to being completely dissolved, it is molten to be successively slowly added to tin methane sulfonate
Liquid, methane sulfonic acid lead solution add surfactant, half brightener and antioxidant, are sufficiently stirred, and add pure water to connecing
Volume needed for close adjusts pH4~7 with methane sulfonic acid or sodium hydroxide, continues to add pure water constant volume, wherein antioxidant needs preparatory
With the dissolutions such as ethyl alcohol, propylene glycol, isopropanol it is complete after be then added in container.
Preferably, the methane sulfonic acid is that grade solution is electroplated in content 70% (weight ratio), to adjust plating solution
PH is maintained at 4~7.
The invention also discloses the plating sides of above-mentioned tin plating or leypewter the plating solution applied to no lead electronic component
Method includes the following steps：
(1) plating nickel：The methane sulfonic acid activation that the plating piece of silver layer is 10% through volume ratio, barrel plating sulfamic acid will be coated with
Nickel；During plating nickel, the temperature of electroplating solution is 50~60 DEG C, and optimum temperature is 55 DEG C, pH 3.8~4.5, cathode current
0.1~5A/dm of density2, the voltage of plating is 8~12V, and it is sulfur-bearing nickel cake (sulfur mass fraction 0.015 that anode used, which is electroplated,
~0.023%), drum rotation speed is 5~7 revs/min, when barrel plating is without lead ceramic component, copper material conductive bead is (or conductive
Stick) hybrid ceramic element is fitted into roller together, is electroplated using full immersed type, 3~6um of barrel nickel plating thickness.The plating of plating nickel
Solution includes the component of following content：270~330g/L of nickel sulfamic acid, 15~20g/L of nickel chloride, 30~40g/L of boric acid；
(2) plating tin or leypewter：The electronic component of nickel plating is put into tin plating or leypewter plating solution of the invention
Middle electrotinning or leypewter after having plated, rinse, drying；
During plating tin or leypewter, the temperature of electroplating solution is 15~25 DEG C, and optimum temperature is 20 DEG C, plating
Current density is 0.1~3A/dm2, it is pure tin or leypewter (leaded mass fraction is 5~10%), rolling that anode used, which is electroplated,
Cylinder revolving speed is 5~7 revs/min, when barrel plating is without lead ceramic component, by copper material conductive bead (or conductive rod) hybrid ceramic element
It is fitted into roller, is electroplated using full immersed type together.
The present invention have the advantage that compared with prior art for：The present invention will using multicomponent complex by screening
Metallic tin and lead are effectively complexed, and the pH of plating solution is maintained at 4~7, increase cathodic polarization, inhibit the growth speed of crystal grain
Degree, so that the generation for " climbing plating " when plating is prevented, the yields after substantially increasing no lead electronic component plating.
Detailed description of the invention
Fig. 1 plates the crystalline phase figure that tin-lead alloy (tin mass fraction 90%) amplifies 1000 times for no lead-in inductance.
Fig. 2 plates the crystalline phase figure that pure tin amplifies 1000 times for no lead-in inductance.
Specific embodiment
The present invention is got information about to allow those skilled in the art to be more clear, below in conjunction with attached drawing, to the present invention
It is further described.
A kind of tin plating or leypewter plating solution applied to no lead electronic component, the plating solution include polynary complexing agent,
Tin methane sulfonate, methane sulfonic acid lead, surfactant, half brightener, antioxidant, water, plating solution methane sulfonic acid or hydrogen
Sodium oxide molybdena adjusts pH to 4~7.
The complexing agent is selected from sulfamate, citrate, gluconate, tartrate, methyl sulfonate, three
At least two kinds of compositions in ethanol amine, concentration in the plating solution are 200~300g/L, and preferred concentration is 240~280g/L.
The content of metallic tin is 10~25g/L in the plating solution, and preferred concentration is 15~20g/L.Methyl sulphur used
Sour tin is the concentrate solution of the 300g/L containing metallic tin.
The content of metallic lead is 1.0~2.5g/L in the plating solution, and preferred concentration is 1.5~2.0g/L, so that coating
The mass fraction of middle lead is 10% or so.Methane sulfonic acid lead used is the concentrate solution of leaded 500g/L.
The surfactant is selected from alkyl alcohol ethoxylates, alkyl phenol polyoxyethylene ether, polyethenoxy ether, bis-phenol
A polyoxyethylene ether, how at least two kinds of compositions in phenol ethoxy propoxyl group addition product.Optimizing alkyl phenol polyethenoxy ether, polymer with bis phenol A
Ethylene oxide ether.Its concentration in the plating solution is 1~8g/L, and preferred concentration is 3~5g/L.
Half brightener is selected from one of 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, imidazoles, preferably
2-mercaptobenzimidazole.Its concentration in the plating solution is 0.05~0.3g/L, and preferred concentration is 0.1~0.2g/L.
The antioxidant be selected from catechol, hydroquinone, resorcinol, morin, phenol, how phenol ethyoxyl sulphur
It is at least two kinds of in acid, preferably morin, resorcinol.Antioxidant uses the dissolutions such as ethyl alcohol, propylene glycol, isopropanol complete in advance
After be then added in plating solution, the concentration of antioxidant in the plating solution be 0.4~2g/L, preferred concentration be 0.8~1.5g/L.
The water is surplus.
The methane sulfonic acid is that content 70% (weight ratio) is electroplated grade solution, the pH to adjust plating solution is maintained at 4~
7。
Electroplating solution preparation
Applied to no lead electronic component multicomponent complex is tin plating or the preparation method of leypewter solution, including walk as follows
Suddenly：Complexing agent is added in the pure water of volume about 50% needed for being added in a reservoir, stirs to being completely dissolved, is successively slowly added to first
Base sulfonic acid solution of tin, methane sulfonic acid lead solution add surfactant, half brightener and antioxidant, are sufficiently stirred,
Add pure water to close to required volume, adjusts pH4~7 with methane sulfonic acid or sodium hydroxide, add pure water constant volume.
Electro-plating method
One kind is tin plating applied to no lead electronic component multicomponent complex or leypewter solution, electroplating technology include as follows
Step：(1) plating nickel：The methane sulfonic acid activation that the plating piece of silver layer is 10% through volume ratio, barrel plating nickel sulfamic acid will be coated with；It applies
In Ni-Speed, the temperature of electroplating solution is 50~60 DEG C, and optimum temperature is 55 DEG C, pH 3.8~4.5, cathode-current density
0.1~5A/dm2, the voltage of plating is 8~12V, be electroplated anode used be sulfur-bearing nickel cake (sulfur mass fraction for 0.015~
0.023%), drum rotation speed is 5~7 revs/min, when barrel plating is without lead ceramic component, by copper material conductive bead (or conductive rod)
Hybrid ceramic element is fitted into roller together, is electroplated using full immersed type, 3~6um of barrel nickel plating thickness.The electroplating solution of plating nickel
Component including following content：270~330g/L of nickel sulfamic acid, 15~20g/L of nickel chloride, 30~40g/L of boric acid；
(2) plating tin or leypewter：The electronic component of nickel plating is put into tin plating or leypewter plating solution of the invention
Middle electrotinning or leypewter after having plated, rinse, drying；
During plating tin or leypewter, the temperature of electroplating solution is 15~25 DEG C, and optimum temperature is 20 DEG C, plating
Current density is 0.1~3A/dm2, it is pure tin or leypewter (leaded mass fraction is 5~10%), rolling that anode used, which is electroplated,
Cylinder revolving speed is 5~7 revs/min, when barrel plating is without lead ceramic component, by copper material conductive bead (or conductive rod) hybrid ceramic element
It is fitted into roller, is electroplated using full immersed type together.
Embodiment 1
Tin plating or leypewter of the present embodiment applied to no lead electronic component, including 20 grams of triethanolamine, glucose
80 grams of sour sodium, 100 grams of sodium methanesulfonate, 0.5 gram of alkyl phenol polyoxyethylene ether, 0.5 gram of bisphenol A polyethenoxy ether, 2- sulfydryl benzene
And 0.05 gram of imidazoles, 0.2 gram of morin, 0.2 gram of resorcinol, 33.3 milliliters of solution of tin methane sulfonate (contain 10 grams of tin ion),
2 milliliters of methane sulfonic acid lead solution (being added when tin-lead plating) (contains 1 gram of lead ion).2-mercaptobenzimidazole, morin, adjacent benzene
Diphenol is then added in electroplating solution after first being dissolved with 20 milliliters of propylene glycol.It is configured to that 1 liter of multicomponent complex is tin plating or tin above
Metal solution adjusts pH4~7 with sodium hydroxide or methane sulfonic acid.
Embodiment 2
Tin plating or leypewter of the present embodiment applied to no lead electronic component, including 20 grams of triethanolamine, glucose
100 grams of sour sodium, 120 grams of sodium methanesulfonate, 2 grams of alkyl phenol polyoxyethylene ether, 1 gram of bisphenol A polyethenoxy ether, 2- sulfydryl benzo miaow
0.1 gram of azoles, 0.2 gram of morin, 0.6 gram of resorcinol, 50 milliliters of solution of tin methane sulfonate (containing 15 grams of tin ion), methane sulfonic acid
3 milliliters of lead solution (being added when tin-lead plating) (contains 1.5 grams of lead ion).2-mercaptobenzimidazole, morin, resorcinol are first
It is then added in electroplating solution after being dissolved with 20 milliliters of propylene glycol.It is configured to that 1 liter of multicomponent complex is tin plating or leypewter above
Solution adjusts pH4~7 with sodium hydroxide or methane sulfonic acid.
Embodiment 3
Tin plating or leypewter of the present embodiment applied to no lead electronic component, including 30 grams of triethanolamine, glucose
110 grams of sour sodium, 140 grams of sodium methanesulfonate, 3 grams of alkyl phenol polyoxyethylene ether, 2 grams of bisphenol A polyethenoxy ether, 2- sulfydryl benzo thiophene
0.2 gram of azoles, 0.2 gram of morin, 1.3 grams of resorcinol, 66.6 milliliters of solution of tin methane sulfonate (containing 20 grams of tin ion), methyl sulphur
4 milliliters of lead plumbate solution (being added when tin-lead plating) (contains 2 grams of lead ion).2-mercaptobenzimidazole, morin, resorcinol are first
It is then added in electroplating solution after being dissolved with 30 milliliters of propylene glycol.It is configured to that 1 liter of multicomponent complex is tin plating or leypewter above
Solution adjusts pH4~7 with sodium hydroxide or methane sulfonic acid.
Embodiment 4
Tin plating or leypewter of the present embodiment applied to no lead electronic component, including 30 grams of triethanolamine, glucose
125 grams of sour sodium, 145 grams of sodium methanesulfonate, 5 grams of alkyl phenol polyoxyethylene ether, 3 grams of bisphenol A polyethenoxy ether, 2- sulfydryl benzo miaow
0.3 gram of azoles, 0.3 gram of morin, 1.7 grams of resorcinol, 83.3 milliliters of solution of tin methane sulfonate (containing 25 grams of tin ion), methyl sulphur
5 milliliters of lead plumbate solution (being added when tin-lead plating) (contains 2.5 grams of lead ion), 2-mercaptobenzimidazole, morin, resorcinol
It is then added in electroplating solution after first being dissolved with 30 milliliters of propylene glycol.It is configured to that 1 liter of multicomponent complex is tin plating or tin-lead is closed above
Gold solution adjusts pH4~7 with sodium hydroxide or methane sulfonic acid.
Embodiment 5
Tin plating or leypewter of the present embodiment applied to no lead electronic component, including 40 grams of triethanolamine, glucose
80 grams of sour sodium, 130 grams of sodium methanesulfonate, 2 grams of alkyl phenol polyoxyethylene ether, 1 gram of bisphenol A polyethenoxy ether, 2- sulfydryl benzo miaow
0.06 gram of azoles, 0.2 gram of morin, 0.8 gram of resorcinol, 33.3 milliliters of solution of tin methane sulfonate (containing 10 grams of tin ion), methyl
2 milliliters of sulfonic acid lead solution (being added when tin-lead plating) (contains 1 gram of lead ion).2-mercaptobenzimidazole, morin, resorcinol
It is then added in electroplating solution after first being dissolved with 20 milliliters of propylene glycol.It is configured to that 1 liter of multicomponent complex is tin plating or tin-lead is closed above
Gold solution adjusts pH4~7 with sodium hydroxide or methane sulfonic acid.
Embodiment 6
Tin plating or leypewter of the present embodiment applied to no lead electronic component, including 40 grams of triethanolamine, glucose
125 grams of sour sodium, 130 grams of sodium methanesulfonate, 3 grams of alkyl phenol polyoxyethylene ether, 1 gram of bisphenol A polyethenoxy ether, 2- sulfydryl benzo miaow
0.1 gram of azoles, 0.1 gram of morin, 0.6 gram of resorcinol, 50 milliliters of solution of tin methane sulfonate (containing 15 grams of tin ion), methane sulfonic acid
3 milliliters of lead solution (being added when tin-lead plating) (contains 1.5 grams of lead ion).2-mercaptobenzimidazole, morin, resorcinol are first
It is then added in electroplating solution after being dissolved with 20 milliliters of propylene glycol.It is configured to that 1 liter of multicomponent complex is tin plating or leypewter above
Solution adjusts pH4~7 with sodium hydroxide or methane sulfonic acid.
Barrel plating condition：
Roller：Small-sized roller, cylinder inner volume about 500ml.
Plating object：Inductance with ceramics, 60g, electrode nickel plating.
Conductive spice：The fine copper pearl of diameter about 2~2.5mm, 400g.
Current density：0.2A/dm2。
Bath temperature：20℃.
Electroplating time：120min.
Drum rotation speed：6rpm.
The inductance of different size is tin plating in example 1~6 or leypewter each 10 batches by above-mentioned condition.
Quality condition after product plating：
Every batch of full inspection appearance, it is as a result all qualified, there is no " climbing plating " phenomenon.
Every batch of inspects that 20 detecting electrodes are tin plating or tin lead layer thickness by random samples, is as a result all larger than 6um, the matter of lead in leypewter
Amount score accounts for 8%~12%, all qualification.
Every batch of inspects 20 detecting electrode coating scolding tin tests by random samples, and scolding tin is full, lacks without hole, stain, not upper tin etc.
It falls into, it is all qualified.
Every batch of inspects the crystalline phase figure of 5 1000 times of amplifications of taking pictures by random samples, and crystal phase is clear, crystallization is careful, smooth, all qualified,
See Fig. 1, Fig. 2
The above-mentioned description to embodiment is for that can understand and apply the invention convenient for those of ordinary skill in the art.It is familiar with
Those skilled in the art obviously easily can make various modifications to these embodiments, and General Principle described herein
It is applied in other embodiments without having to go through creative labor.Therefore, the present invention is not limited to embodiment here, this fields
Technical staff's announcement according to the present invention, for the improvement made of the present invention and modification all should protection scope of the present invention it
It is interior.
Claims (10)
1. a kind of tin plating or leypewter plating solution applied to no lead electronic component, which is characterized in that the plating solution includes more
First complexing agent, tin methane sulfonate, methane sulfonic acid lead, surfactant, half brightener, antioxidant and water, plating solution
PH is 4~7, in plating solution,
The content of the complexing agent is 200~300g/L；
The tin methane sulfonate is the concentrate solution of the 300g/L containing metallic tin, and the content of metallic tin is 10~25g/L in plating solution,
The methane sulfonic acid lead is the concentrate solution of the 500g/L containing metallic lead, and the content of metallic lead is 1.0~2.5g/ in plating solution
L；
The content of the surfactant is 1~8g/L；
The content of half brightener is 0.05~0.3g/L；
The content of the antioxidant is 0.4~2g/L；
The water is surplus.
2. tin plating or leypewter the plating solution according to claim 1 applied to no lead electronic component, feature exist
In, in plating solution,
The content of the complexing agent is 240~280g/L；
The content of the metallic tin is 15~20g/L；
The content of the metallic lead is 1.5~2.0g/L；
The content of the surfactant is 3~5g/L；
The content of half brightener is 0.1~0.2g/L；
The content of the antioxidant is 0.8~1.5g/L；
The water is surplus.
3. tin plating or leypewter the plating solution according to claim 1 or 2 applied to no lead electronic component, feature
It is, the complexing agent is selected from sulfamate, citrate, gluconate, tartrate, methyl sulfonate, three second
It is at least two kinds of in hydramine.
4. tin plating or leypewter the plating solution according to claim 1 or 2 applied to no lead electronic component, feature
It is, the surfactant is selected from alkyl alcohol ethoxylates, alkyl phenol polyoxyethylene ether, polyethenoxy ether, polymer with bis phenol A
It is ethylene oxide ether, how at least two kinds of in phenol ethoxy propoxyl group addition product.
5. tin plating or leypewter the plating solution according to claim 1 or 2 applied to no lead electronic component, feature
It is, half brightener is selected from one of 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, imidazoles.
6. tin plating or leypewter the plating solution according to claim 1 or 2 applied to no lead electronic component, feature
Be, the antioxidant be selected from catechol, hydroquinone, resorcinol, morin, phenol, how phenol ethyoxyl sulfonic acid
In it is at least two kinds of.
7. the preparation of tin plating or leypewter the plating solution according to claim 1 or 2 applied to no lead electronic component
Method, which is characterized in that include the following steps：
Water is added in a reservoir, complexing agent is added, stirs to being completely dissolved, is successively slowly added to solution of tin methane sulfonate, methyl
Sulfonic acid lead solution adds surfactant, half brightener and antioxidant, is sufficiently stirred, and adds pure water to needed for
Volume adjusts pH4~7 with methane sulfonic acid or sodium hydroxide, continues plus pure water constant volume, wherein antioxidant need to use in advance ethyl alcohol,
It is then added in container after the dissolutions such as propylene glycol, isopropanol are complete.
8. the preparation side of tin plating or leypewter the plating solution according to claim 7 applied to no lead electronic component
Method, which is characterized in that the methane sulfonic acid is that weight percentage is 70% plating grade solution.
9. the plating of tin plating or leypewter the plating solution according to claim 1 or 2 applied to no lead electronic component
Method, which is characterized in that include the following steps：
(1) plating nickel：The methane sulfonic acid activation that the plating piece of silver layer is 10% through volume ratio, barrel plating nickel sulfamic acid will be coated with；
During plating nickel, the temperature of electroplating solution is 50~60 DEG C, pH 3.8~4.5,0.1~5A/dm of cathode-current density2,
The voltage of plating is 8~12V, and it is 0.015~0.023% nickel cake, drum rotation speed 5 that plating anode used, which is sulfur mass fraction,
~7 revs/min, when barrel plating is without lead ceramic component, copper material conductive bead or conductive rod hybrid ceramic element are packed into rolling together
In cylinder, it is electroplated using full immersed type, 3~6um of barrel nickel plating thickness；The electroplating solution of plating nickel includes the component of following content：Ammonia
Base 270~330g/L of nickel sulphonic acid, 15~20g/L of nickel chloride, 30~40g/L of boric acid；
(2) plating tin or leypewter：The electronic component of nickel plating is put into tin plating or leypewter the plating solution and is electroplated
Tin or leypewter after having plated, rinse, drying；
During plating tin or leypewter, the temperature of electroplating solution is 15~25 DEG C, and the current density of plating is 0.1~3A/
dm2, plating anode used is pure tin or leaded mass fraction is 5~10% leypewters, and drum rotation speed is 5~7 revs/min,
When barrel plating is without lead ceramic component, copper material conductive bead or conductive rod hybrid ceramic element are fitted into roller together, using complete
Immersion plating.
10. the plating side of tin plating or leypewter the plating solution according to claim 9 applied to no lead electronic component
Method, which is characterized in that during step (2) the plating tin or leypewter, the temperature of electroplating solution is 20 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810990764.8A CN108866583B (en) | 2018-08-28 | 2018-08-28 | Tin or tin-lead alloy plating solution applied to leadless electronic component, and preparation method and plating method thereof |
Applications Claiming Priority (1)
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| CN110318076A (en) * | 2019-07-17 | 2019-10-11 | 安徽启明表面技术有限公司 | The preparation method of zinc-plating brightener |
| CN111472027A (en) * | 2020-05-09 | 2020-07-31 | 广东哈福科技有限公司 | Electrotinning additive and preparation method and use method thereof |
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| CN113862733A (en) * | 2021-11-01 | 2021-12-31 | 江苏艾森半导体材料股份有限公司 | Barrel plating neutral tin plating process |
| CN113930812A (en) * | 2021-11-15 | 2022-01-14 | 广东羚光新材料股份有限公司 | Tin plating solution and tin plating method for chip electronic component |
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