CN108866548B - Metal coating and preparation method and application thereof - Google Patents

Metal coating and preparation method and application thereof Download PDF

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Publication number
CN108866548B
CN108866548B CN201810763461.2A CN201810763461A CN108866548B CN 108866548 B CN108866548 B CN 108866548B CN 201810763461 A CN201810763461 A CN 201810763461A CN 108866548 B CN108866548 B CN 108866548B
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layer
gold
palladium
plating
nickel
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CN108866548A (en
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苏星宇
黄明起
刘强
夏建文
陈元甫
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Shenzhen Samcien Semiconductor Materials Co ltd
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Shenzhen Samcien Semiconductor Materials Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02697—Forming conducting materials on a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

The invention provides a metal coating, a preparation method and application thereof. The invention provides a novel metal plating protective layer, wherein a nickel layer is arranged between a palladium layer and a gold layer, so that the problem that the gold layer is difficult to plate on the palladium layer can be solved, and the problems of metal interphase diffusion and the like caused by lower density of the nickel layer can be solved.

Description

Metal coating and preparation method and application thereof
Technical Field
The invention belongs to the technical field of surface treatment, and relates to a metal coating, and a preparation method and application thereof.
Background
In the electronic packaging industry, including the surface treatment processes of wafer level packaging, IC carrier boards, PCBs, FPCs and the like, and the chemical nickel gold process proposed in the last 80 th century, a plating layer formed by chemical gold immersion has good oxidation resistance and conductivity, nickel is used as a barrier layer to prevent mutual diffusion of copper and gold, but the nickel layer of the chemical nickel gold has low density, and the quality problems of plating leakage, gold infiltration, black nickel or gold layer whitening often occur; a chemical nickel-palladium-gold surface treatment process is proposed later, which is a re-development of the chemical nickel-gold process, and a chemical palladium-plating layer is added between a chemical nickel-plating layer and a gold-dipping layer, so that the corrosion of the chemical nickel-plating layer during chemical gold-dipping is well avoided.
With the rapid development of the electronic industry, electronic products gradually develop towards high performance, multifunction, high reliability, light weight, small size and the like, so the chemical nickel-palladium-gold process is emphasized due to the excellent performance; the process can meet the requirements of plating layers of various packaging processes, achieve good conductivity, corrosion resistance and friction resistance, and meet the requirements of electronic products.
CN105543818A discloses a method and equipment for optimizing a chemical nickel-palladium-gold plating layer, which solves the problem of how to uniformly and quickly press tin paste into a die hole of a steel template in the range of equipment, but does not solve the problem of the nickel-palladium-gold process essentially; CN105112892A discloses a chemical nickel-palladium-gold plating process for a printed circuit board, which comprises the steps of oil removal, micro etching, presoaking, activation, chemical nickel, chemical palladium, chemical gold and the like; CN102956604A provides a thin ni-pd-au plating layer, a package structure formed by the plating layer with wires, and a method for making the same. Although the ni-pd-au process can meet the plating requirements of various packaging processes, some problems still exist, such as lower density of the nickel layer, higher porosity and possibility of interdiffusion between the pd layer and the copper substrate; the problems that copper wires or copper-palladium wires cannot be smoothly bonded in a subsequent routing manner due to the fact that the hardness of the material is increased and the ductility is reduced due to the high hardness of the metal nickel, and a gold layer is difficult to plate on the palladium layer exist.
There is a need to develop a new process to solve the above problems.
Disclosure of Invention
The invention aims to provide a metal coating and a preparation method and application thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a metal plating layer, which is located on a substrate and sequentially comprises a palladium layer, a nickel layer and a gold layer from bottom to top.
The invention provides a novel metal plating protective layer, wherein the nickel layer is arranged between the palladium layer and the gold layer, and compared with the palladium layer, the gold layer is easier to plate on the nickel layer, so that the problem that the gold layer is difficult to plate on the palladium layer can be solved; on the other hand, the palladium layer has higher density, and the problem of interdiffusion among the base material, the palladium layer and the gold layer due to lower density of the nickel layer can be solved.
In the present invention, the thickness of the palladium layer is 0.05 to 0.2. mu.m, for example, 0.08. mu.m, 0.1. mu.m, 0.12. mu.m, 0.15. mu.m, 0.18. mu.m, etc.
Preferably, the material of the palladium layer is pure palladium or palladium-phosphorus alloy.
Preferably, the thickness of the nickel layer is 0.05-1 μm, such as 0.08 μm, 0.1 μm, 0.3 μm, 0.5 μm, 0.8 μm, etc., preferably 0.05-0.08 μm.
In the present invention, the thickness of the nickel layer can be specifically selected according to actual conditions, and the nickel layer is preferably made as thin as possible, so that the problem that the hardness of the finally obtained material is increased and the ductility is reduced due to the existence of the nickel layer can be alleviated to a certain extent.
It is known to those skilled in the art that when the plating layer is thinner, the porosity of the plating layer is higher, the compactness is worse, and if the thickness of the nickel layer is reduced to solve the problem that the hardness of the finally obtained material is increased and the ductility is reduced due to the nickel layer, the porosity of the nickel layer is increased, and the mutual diffusion between the substrate and the palladium layer and between the substrate and the gold layer is further accelerated.
Preferably, the gold layer has a thickness of 0.05-0.15 μm, such as 0.08 μm, 0.1 μm, 0.12 μm, 0.14 μm, etc.
Preferably, the material of the base material is copper.
The thickness of the coating is within the conventional thickness range which can be achieved by the coating in the field, and in the actual production process, the actual thickness of the coating needs to be selected according to specific conditions so as to meet the application requirements.
In a second aspect, the present invention provides a method for producing a metal plating layer as defined in the first aspect, the method comprising: and plating a palladium layer, a nickel layer and a gold layer on the substrate in sequence to obtain the metal plating layer.
The preparation method provided by the invention is simple and easy to implement, the steps for forming the palladium layer, the nickel layer and the gold layer can be realized by using the commonly known methods in the technical field, such as chemical plating or electroplating and other processes, and a chemical plating method of displacement type, reduction type or semi-displacement semi-reduction type reaction can be selected within the chemical plating range; the present invention is not limited to the above-described method, and any method may be used as long as it can form the palladium layer, the nickel layer, and the gold layer.
Preferably, the palladium layer, the nickel layer and the gold layer are prepared by methods each independently selected from electroless plating or electroplating.
Preferably, the preparation method of the gold layer comprises the following steps: and performing chemical gold plating on the nickel layer by utilizing a displacement type and/or reduction type reaction to obtain a gold layer.
Preferably, the preparation method of the gold layer comprises the following steps: and performing chemical gold plating on the nickel layer by using a displacement type reaction to obtain a gold layer.
In the present invention, electroless gold plating by displacement reaction can make the nickel plating layer thin, and thus can alleviate the problem of the nickel layer that the hardness of the finally obtained material is increased and the ductility is reduced to a certain extent.
Preferably, the preparation method of the gold layer comprises the following steps: and (4) plating gold on the nickel layer by using a semi-replacement semi-reduction reaction to obtain the gold layer.
Gold is plated by utilizing a semi-replacement semi-reduction type reaction, gold can grow under the catalysis of nickel through a replacement type reaction, and gold can continue to grow under the catalysis of a gold layer grown through replacement through a reduction type reaction, so that the gold layer is finally obtained.
In a third aspect, the present invention provides the use of the metal plating layer according to the first aspect in a wafer level package, an IC carrier, a printed circuit board or a flexible circuit board.
Compared with the prior art, the invention has the following beneficial effects:
(1) the invention provides a novel metal plating protective layer, wherein a nickel layer is arranged between a palladium layer and a gold layer, and the gold layer is easier to plate on the nickel layer compared with the palladium layer, so that the problem that the gold layer is difficult to plate on the palladium layer can be solved; on the other hand, the palladium layer has higher density, so that the problem of mutual diffusion between the plating layer and the base metal due to lower density of the nickel layer can be solved;
(2) the preparation method provided by the invention is simple and easy to implement, any preparation method capable of realizing the purpose of plating the palladium layer, the nickel layer and the gold layer can be used, and the technical scheme of the invention is realized by preferably selecting a chemical plating or electroplating mode.
Drawings
FIG. 1 is a schematic structural diagram of a metal coating provided by the present invention.
Wherein, 1-substrate, 2-plating, 201-palladium layer, 202-nickel layer, 203-gold layer.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Example 1
A metal plating layer is shown in figure 1, and a metal plating layer (2) is positioned on a substrate (1) and sequentially comprises a palladium layer (201), a nickel layer (202) and a gold layer (203) from bottom to top.
The preparation method comprises the following steps:
(1) oil removal: soaking in acidic deoiling liquid at 35-45 deg.C for 2-3min, and washing with water;
(2) micro-etching: soaking in a mixed solution of sodium persulfate (60g/L) and sulfuric acid (20mL/L) for 1-2min at normal temperature, and then washing with water;
(3) and (3) activation: with an activator (10ppm Pd2+(complex palladium salt), 5ppm surfactant, 30ppm complexing agent and sulfuric acid, adjusting the pH value to 1-1.5), activating for 1-2min at normal temperature, and then washing with water;
(4) chemical palladium: adopting chemical palladium plating solution (about 0.1g/L palladium salt, matched with 0.5-1 g/L nitrogen heterocyclic organic complexing agent, adopting sodium hypophosphite as a reducing agent, and having a pH value of 6.5-7), wherein the plating temperature is 50-60 ℃, and the plating time is 10-20 min;
(5) nickel melting: adopting chemical nickel plating solution (NiSO)4·6H2O 20g/L；NaH2PO2·H2O25 g/L; malic acid 20 g/L; 15g/L of other coordination agents), and the plating temperature is 80-85 ℃ and the time is 8-10 min;
(6) gold plating: gold plating is carried out for 10min at 60-70 ℃ by using chemical gold plating solution (20 g/L of sodium gold sulfite, 16g/L of sodium thiosulfate, 5g/L of nitrilotriacetic acid, 8g/L of hydrazine hydrate and 20g/L of other complexing agents).
Example 2
A metal coating is arranged on a substrate and sequentially comprises a palladium layer, a nickel layer and a gold layer from bottom to top.
The preparation method is different from example 1 only in that, in this example, the method of plating the palladium layer in step (4) is different, and in this example, the plating method of the palladium layer is palladium plating: using palladium plating solution (complex palladium salt 15 g/L; NH)4SO4 80g/L；(NH4)2HPO460 g/L; 1g/L sulfamic acid; urea 10g/L) is plated at 45-55 ℃.
Example 3
A metal coating is arranged on a substrate and sequentially comprises a palladium layer, a nickel layer and a gold layer from bottom to top.
The preparation method is different from the embodiment 1 only in that, in the embodiment, the method of plating the nickel layer in the step (5) is different, and in the embodiment, the plating method of the nickel layer is electroplating: plating is carried out at 50-60 ℃ by adopting nickel electroplating solution (280 g/L of nickel sulfate, 40g/L of nickel chloride, 45g/L of boric acid, 9mL/L of cylinder opening agent, 0.2mL/L of brightening agent and 4.2 of pH value).
Example 4
A metal coating is arranged on a substrate and sequentially comprises a palladium layer, a nickel layer and a gold layer from bottom to top.
The preparation method differs from embodiment 1 only in that, in this embodiment, the method of plating the gold layer in step (6) is different, and in this embodiment, the plating method of the gold layer is electroplating: gold plating solution (gold sodium sulfite 12.8g/L, adenine 24.3g/L, sodium nitrate 8.5g/L, sodium hydroxide 40g/L, L-cysteine 0.2g/L, pH 12) is adopted for plating at 50-60 ℃.
Comparative example 1
The only difference from example 1 is that in this comparative example, nickel plating is performed in step (5) first, then palladium plating is performed in step (4), and the thickness of the nickel plating layer in this comparative example is controlled to be the same as that of the palladium plating layer in example 1, that is, the metal plating layer provided in this comparative example is a nickel layer, a palladium layer and a gold layer in this order from bottom to top.
In the treatment schemes provided in examples 1 to 4 and comparative example 1, the same temperature and the same time were used for the degreasing process, and the same treatment methods were used for the microetching and activating process.
The process parameters (time and temperature) in the nickel plating process are the same in example 1 and comparative example 1, and the same treatment method is adopted in the palladium plating process.
Performance testing
The metal coatings provided in examples 1 to 4 and comparative example 1 were subjected to a performance test:
(1) thickness of gold layer: measuring the thickness of the gold layer in the metal coatings provided in examples 1 to 4 and comparative example 1 using a metal coating thickness detector;
the test results are shown in table 1:
TABLE 1
Sample (I) Thickness of gold layer/mum
Example 1 0.135
Example 2 0.112
Example 3 0.148
Example 4 0.151
Comparative example 1 0.07
As can be seen from example 1 and comparative example 1, under the same plating conditions, the thickness of the gold layer finally obtained by the present invention is higher than that of the gold layer obtained by comparative example 1, which indicates that the gold layer is more easily plated on the nickel layer, i.e., the present invention solves the problem that the gold layer is difficult to be plated on the palladium layer; and the metal density of the palladium layer is better than that of the nickel layer, so that the problem of interdiffusion among the base material, the palladium layer and the gold layer caused by high porosity and low density of the nickel layer can be avoided by applying the palladium layer and the nickel layer first and then applying the nickel layer.
The applicant states that the invention is illustrated by the above examples of the metal coating and the method of preparation and use thereof, but the invention is not limited to the above process steps, i.e. it is not meant that the invention must rely on them for its implementation. It will be apparent to those skilled in the art that any modification of the present invention, equivalent substitutions of selected materials and additions of auxiliary components, selection of specific modes and the like, which are within the scope and disclosure of the present invention, are contemplated by the present invention.

Claims (10)

1. The metal coating is characterized in that the metal coating is positioned on a substrate and sequentially comprises a palladium layer, a nickel layer and a gold layer from bottom to top;
the thickness of the palladium layer is 0.05-0.2 μm; the thickness of the nickel layer is 0.05-1 μm; the thickness of the gold layer is 0.05-0.15 μm;
the metal coating is prepared by adopting the following method, and the method comprises the following steps:
(1) oil removal: soaking in acidic deoiling liquid at 35-45 deg.C for 2-3min, and washing with water;
(2) micro-etching: soaking in a mixed solution of 60g/L sodium persulfate and 20mL/L sulfuric acid for 1-2min at normal temperature, and then washing with water;
(3) and (3) activation: with an activating agent: 10ppm Pd provided by a Complex Palladium salt2+Adjusting the pH value to 1-1.5 by 5ppm of surfactant, 30ppm of complexing agent and sulfuric acid, activating for 1-2min at normal temperature, and then washing with water;
(4) and plating a palladium layer, a nickel layer and a gold layer on the substrate in sequence to obtain the metal plating layer.
2. The metal coating according to claim 1, wherein the palladium layer is made of pure palladium or a palladium-phosphorus alloy.
3. The metal coating of claim 1, wherein the nickel layer has a thickness of 0.05-0.08 μm.
4. The metal coating of claim 1, wherein the substrate is copper.
5. A method of producing a metal coating according to any one of claims 1 to 4, characterized in that the production method comprises:
(1) oil removal: soaking in acidic deoiling liquid at 35-45 deg.C for 2-3min, and washing with water;
(2) micro-etching: soaking in a mixed solution of 60g/L sodium persulfate and 20mL/L sulfuric acid for 1-2min at normal temperature, and then washing with water;
(3) and (3) activation: with an activating agent: 10ppm Pd provided by a Complex Palladium salt2+Adjusting the pH value to 1-1.5 by 5ppm of surfactant, 30ppm of complexing agent and sulfuric acid, activating for 1-2min at normal temperature, and then washing with water;
(4) and plating a palladium layer, a nickel layer and a gold layer on the substrate in sequence to obtain the metal plating layer.
6. The method of claim 5, wherein the palladium layer, the nickel layer, and the gold layer are each independently selected from electroless plating or electroplating.
7. The method according to claim 6, wherein the gold layer is prepared by: and (3) plating gold on the nickel layer by utilizing a replacement type and/or reduction type reaction to obtain a gold layer.
8. The method according to claim 7, wherein the gold layer is prepared by: and (4) plating gold on the nickel layer by utilizing a displacement type reaction to obtain a gold layer.
9. The method according to claim 7, wherein the gold layer is prepared by: and (4) plating gold on the nickel layer by using a semi-replacement semi-reduction reaction to obtain the gold layer.
10. Use of a metal coating according to any of claims 1-4 in wafer level packaging, IC carrier, printed circuit board or flexible circuit board.
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