CN108863082A - Glass powder with low melting point, glass powder slurry and preparation method thereof and composition purposes - Google Patents
Glass powder with low melting point, glass powder slurry and preparation method thereof and composition purposes Download PDFInfo
- Publication number
- CN108863082A CN108863082A CN201810855668.2A CN201810855668A CN108863082A CN 108863082 A CN108863082 A CN 108863082A CN 201810855668 A CN201810855668 A CN 201810855668A CN 108863082 A CN108863082 A CN 108863082A
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- Prior art keywords
- glass powder
- melting point
- low melting
- parts
- ball
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C12/00—Powdered glass; Bead compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
Abstract
The invention discloses glass powder with low melting point, using (BiO)2CO3、B2O3And ZnCO3Material system, using vacuum ball-milling method obtain partial size be nanoscale glass powder, the sealing temperature of glass powder slurry, and stock utilization and high conversion rate is effectively reduced.The present invention also provides a kind of glass powder slurries and preparation method thereof.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, it is related to a kind of glass powder with low melting point, slurry, the invention further relates to this
The preparation method of glass powder with low melting point and slurry, the invention also discloses a kind of panel encapsulating structures.
Background technique
Seal glass is mainly used in field of semiconductor package, especially shows in OLED, OLED illumination, solar battery
In the packaging technology of the semiconductor photoelectric devices such as perovskite battery.Existing seal glass mainly uses bismuth zinc boron system lead-free glass
Powder system, which usually need to make its fusing for the mixed raw material heating of multicomponent material, after fusing
Mixture it is cooling after with ball mill, ball milling is powdery again, finally sieve takes the part of 100~400 mesh, what this kind of mode obtained
Glass powder particles partial size can only achieve micron order, and needs to sieve repeatedly and take, and stock utilization is low.On the other hand, in the prior art
Glass powder need to add rare earth element usually in order to reduce its fusing point or have the metal oxide of certain toxicity and not environmentally friendly enough.
Summary of the invention：
In view of this, a kind of glass powder with low melting point is provided it is an object of the invention to overcome the above-mentioned prior art,
Including the component formed by weight ratio：30~90 parts (BiO)2CO3, 20~60 parts of B2O3, 20~45 parts of ZnCO3And 1~5
Part colorant.
Carbon Dioxide oxygen bismuth prepare or encapsulate use process in decompose or decomposed, generate nanoscale bismuth oxide and
Carbon dioxide makes the fusing point of glass powder entirety be reduced to 300~450 DEG C.
On the other hand, zinc carbonate is preparing or is encapsulating decomposition or decomposed in use process, generates nanoscale oxidation
Zinc and carbon dioxide make the fusing point of glass powder entirety be reduced to 300~450 DEG C.
And 825 DEG C of the fusing point of bismuth oxide in general；The vitreum of boron oxide softens at 325~450 DEG C；Oxidation
1975 DEG C of zinc fusing point, causes micron order glass powder that can not really reach molten condition in packaging sintering, be only melted
Low melting material cladding fusion, makes package interior generate biggish stress and be easy to appear cracking, or need higher sealing-in
Temperature.
Further, the colorant is carbon black, MnO2、CuO、Fe3O4、Ni2O3、Co2O3In any one, two kinds or
A variety of compositions.
Further, glass powder further includes by weight ratio：1~5 part of fluxing agent.
Further, the fluxing agent is Li2O、MgCl2、BaO、Al2O3、SiO2In any one, it is two or more of
Composition, fluxing agent can reduce (BiO) when being packaged2CO3And ZnCO3Decomposition temperature, accelerated decomposition process, promoted
The overall performance of glass powder when packaged, furthermore the presence of Li ion or Mg ion can also promote the production of gas release channel
It is raw, avoid the formation of packaging area air entrapment.
Further, glass powder further includes by weight ratio：10~40 parts of negative thermal expansion coefficient low-expansion is filled out
Material.
Further, the negative thermal expansion coefficient or low-expansion filler include tungsten wire array, aluminium titanates, cordierite, two
In tin oxide, spodumene, zircon etc. any one, two or more of compositions.
The present invention further provides a kind of glass powder with low melting point slurries, and wherein the partial size of glass powder is in 80~800nm.
Further, the partial size of the glass powder is in 100~500nm.
Further, the organic dispersing agent of the glass powder with low melting point slurry is ethers or alcohols solvent.
The present invention further provides a kind of preparation methods of glass powder with low melting point slurry, specifically include the following steps：
S1：Prepare the glass powder materials and is mixed：30~90 parts (BiO)2CO3, 20~45 parts of ZnCO3, 1~5
Part fluxing agent and 1~5 part of colorant；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
S3：20~60 parts of B are added into S2 step mixture obtained2O3Continue ball-milling treatment；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By the S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step glass powder slurry obtained is sealed preservation.
Further, the ball-milling treatment of the S2 step is to carry out under vacuum conditions.
Further, ball grinder is heated when the ball-milling treatment of the S2 step.
Further, after carrying out heat treatment 1 hour to ball grinder when the ball-milling treatment of the S2 step, then room temperature or low
Temperature processing 2 hours.It may make that powder reaches nanoscale in heat treatment, be conducive to the viscosity and uniformity that improve slurry.
Further, temperature when heating when the ball-milling treatment of the S2 step to ball grinder is more than or equal to
150℃。
Further, temperature when heating when the ball-milling treatment of the step to ball grinder is less than or equal to 300
℃。
Further, the temperature of low-temperature treatment is carried out at -30 DEG C or less to ball grinder when the ball-milling treatment of the S2 step.
Further, the ball-milling treatment time of the S2 step was at 1~5 hour.
Further, the ball-milling treatment time of the S2 step is 3 hours.
Invention additionally discloses a kind of panel encapsulating structure, (BiO) is utilized in the packaging method2CO3、B2O3And ZnCO3Make
For packaged glass powder, the encapsulating structure has inside and outside two layers of sealing ring, and outer ring is UV solidification glue, and inner ring uses of the present invention
Frit.In packaging manufacturing process, need to vacuumize implementation environment in the encapsulation of UV solidification glue, in a vacuum into
It is capable the problem of rushing glue occur to avoid in pressing, but a negative pressure state can be formed in the sealing ring of UV glue and caused outside
The acceleration of portion's air is penetrated into；Middle part of the invention is divided into (BiO) for completing conversion2CO3And ZnCO3Receiving heating or laser sealing-in
When can decompose completely, and discharge CO2Gas reduces the negative pressure condition in UV solidification glue sealing ring, improves the stability of encapsulation,
Therefore the invention also discloses a kind of methods that decrease encapsulating structure internal cause packaging technology causes negative pressure.
The present invention utilizes (BiO)2CO3、B2O3And ZnCO3As glass powder and the material of main part of glass powder slurry, utilize
Toner, fluxing agent and filler regulate and control the light absorption, cladding temperature and thermal expansion coefficient of glass powder, and (BiO)2CO3With
ZnCO3Mixed processing can be carried out in the ball mill of heating in vacuum, nanoscale powder granule can be obtained after processing, increase powder
The specific surface area of body storeroom, Li ion or Mg ion promote CO2Diffusion, formed low melting point fused matter, to substantially reduce
The cladding temperature of glass powder and glass powder slurry enhances packaging effect.
Specific embodiment
Taken technical means and efficacy are achieved the object of the present invention to be further described, the glass of the invention to acquisition
The method of powder and glass powder slurry is specifically described, and those skilled in the art are it will be clearly understood that below specifically describe is only example
The property shown, to facilitate the understanding of the present invention, the protection scope being not intended to limit the invention, it is intended to the present invention be provided further
Explanation.Unless otherwise specified, all technical and scientific terms used herein has general with the technical field of the invention
The logical normally understood identical meanings of technical staff.
The present invention provides a kind of glass powder with low melting point formula：
The component formed by weight ratio：30~90 parts (BiO)2CO3, 20~60 parts of B2O3, 20~45 parts of ZnCO3And 1
~5 parts of colorants.
In ball milling preparation or in encapsulation use process decomposed can occur for Carbon Dioxide oxygen bismuth, generate nanoscale oxygen
Change bismuth and carbon dioxide.Meanwhile zinc carbonate will appear decomposed in ball milling preparation or encapsulation use process, generate nanoscale
Zinc oxide and carbon dioxide, so that the fusing point of glass powder entirety is reduced to 300~400 DEG C.
And 825 DEG C of the fusing point of bismuth oxide in general；The vitreum of boron oxide softens at 325~450 DEG C；Oxidation
1975 DEG C of zinc fusing point, leads to when the packaging sintering of micron order glass powder and can not really reach molten condition, be only melted
Low melting material coat fusion, so that package interior is generated biggish stress and is easy to appear cracking, or the higher envelope of needs
Jointing temp.
Further, the colorant is carbon black, MnO2、CuO、Fe3O4、Ni2O3、Co2O3In any one, two kinds or
A variety of compositions.
Further, glass powder further includes by weight ratio：1~5 part of fluxing agent.
Further, the fluxing agent is Li2O、MgCl2、BaO、Al2O3、SiO2In any one, it is two or more of
Composition.Fluxing agent can reduce (BiO) when being packaged2CO3And ZnCO3Decomposition temperature, promote releasing for carbon dioxide
It puts, and then accelerated decomposition process, promotes the overall performance of glass powder when packaged.
Further, glass powder further includes by weight ratio：10~40 parts of negative thermal expansion coefficient low-expansion is filled out
Material.
Further, the negative thermal expansion coefficient or low-expansion filler include tungsten wire array, aluminium titanates, cordierite, two
In tin oxide, spodumene, zircon etc. any one, two or more of compositions.
Further, the partial size of the glass powder is in 100-800nm.
The present invention further provides a kind of preparation methods of glass powder with low melting point, specifically include the following steps：
S1：Prepare glass powder materials and mixes：30~90 parts (BiO)2CO3, 20~45 parts of ZnCO3, 1~5 part of fluxing agent
And 1~5 part of colorant；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
Further, the ball-milling treatment of S2 step is to carry out under vacuum conditions.
Further, ball grinder is heated when the ball-milling treatment of S2 step.
Further, after carrying out heat treatment 1 hour to ball grinder when the ball-milling treatment of S2 step, then at room temperature or low temperature
Reason 2 hours.It may make the powder nanometer in heat treatment.
Further, temperature when heating when the ball-milling treatment of S2 step to ball grinder is more than or equal to 150
℃。
Further, temperature when heating when the ball-milling treatment of S2 step to ball grinder is less than or equal to 300
℃。
Further, the temperature of low-temperature treatment is carried out at -30 DEG C or less to ball grinder when the ball-milling treatment of S2 step.
Further, the ball-milling treatment time of S2 step was at 1~5 hour.
Further, the ball-milling treatment time of S2 step is 3 hours.
The specific embodiment of several groups of glass powder, preparation method thereofs is given below, each component content is with the number table of unit mass
Show：
Embodiment 1
S1：30 parts (BiO) are weighed according to unit mass2CO3, 20 parts of B2O3, 10 parts of ZnCO3And 1 part of carbon black；
S2：S1 step mixture obtained is carried out ball-milling treatment 5 hours.
Embodiment 2
S1：60 parts (BiO) are weighed according to unit mass2CO3, 20 parts of B2O3, 10 parts of ZnCO3And 5 parts of MnO2；
S2：S1 step mixture obtained is carried out ball-milling treatment 3 hours under vacuum conditions.
Embodiment 3
S1：90 parts (BiO) are weighed according to unit mass2CO3, 45 parts of B2O3, 10 parts of ZnCO3And 3 parts of Fe3O4, 1 part
Ni2O3With 1 part of Co2O3, additionally incorporate MgCl2, BaO and Al2O3Each 1 part and 10 parts of tungsten wire array；
S2：S1 step mixture obtained is carried out ball-milling treatment 1 hour under 300 DEG C of vacuum, heating states.
Embodiment 4
S1：30 parts (BiO) are weighed according to unit mass2CO3, 60 parts of B2O3, 20 parts of ZnCO3, 3 parts of CuO and 1 part of MgCl2,
And each 10 parts of aluminium titanates, cordierite, stannic oxide；
S2：S1 step mixture obtained is carried out ball-milling treatment 4 hours in the case where heating 150 DEG C of states.
The present invention further provides a kind of preparation methods of glass powder with low melting point slurry, specifically include the following steps：
S1：Prepare the glass powder materials and is mixed：30~90 parts (BiO)2CO3, 20~45 parts of ZnCO3, 1~5 part
Fluxing agent and 1~5 part of colorant；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
S3：20~60 parts of B are added into S2 step mixture obtained2O3Continue ball-milling treatment；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By the S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step glass powder slurry obtained is sealed preservation.
Further, the ball-milling treatment of the S2 step is to carry out under vacuum conditions.
Further, ball grinder is heated when the ball-milling treatment of the S2 step.
Further, after carrying out heat treatment 1 hour to ball grinder when the ball-milling treatment of the S2 step, then room temperature or low
Temperature processing 2 hours.It may make the powder nanometer in heat treatment and the powder body material blended be fined, be conducive to improve
The viscosity and uniformity of slurry.
Further, temperature when heating when the ball-milling treatment of the S2 step to ball grinder is more than or equal to
150℃。
Further, temperature when heating when the ball-milling treatment of the step to ball grinder is less than or equal to 300
℃。
Further, the temperature of low-temperature treatment is carried out at -30 DEG C or less to ball grinder when the ball-milling treatment of the S2 step.
Further, the ball-milling treatment time of the S2 step was at 1~5 hour.
Further, the ball-milling treatment time of the S2 step is 3 hours.
Further, the organic dispersing agent of the glass powder with low melting point slurry is ethers or alcohols solvent.
Embodiment 5
S1：30 parts (BiO) are weighed according to unit mass2CO3, 60 parts of B2O3, 30 parts of ZnCO3, 5 parts of CuO and 1 part of Li2O, with
And each 20 parts of spodumene, zircon.
S2：S1 step mixture obtained is carried out vacuum ball-milling treatment 2 hours in the case where heating 200 DEG C of states；
S3：It takes out to S2 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S4：By the S3 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S5：S4 step slurry obtained is carried out shading to be sealed.
Embodiment 6
S1：60 parts (BiO) are weighed according to unit mass2CO3, 60 parts of B2O3, 30 parts of ZnCO3, 5 parts of CuO and 1 part of SiO2, with
And 20 parts of tungsten wire array.
S2：S1 step mixture obtained is carried out vacuum ball-milling treatment 2 hours in the case where heating 200 DEG C of states；
S3：It takes out to S2 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S4：By the S3 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S5：S4 step slurry obtained is carried out shading to be sealed.
Embodiment 7
S1：60 parts (BiO) are weighed according to unit mass2CO3, 60 parts of B2O3, 30 parts of ZnCO3, 5 parts of CuO and 1 part of SiO2, with
And 20 parts of tungsten wire array.
S2：S1 step mixture obtained is carried out vacuum ball-milling treatment 2 hours in the case where heating 200 DEG C of states；
S3：It takes out to S2 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S4：By the S3 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S5：S4 step slurry obtained is carried out shading to be sealed.
Glass powder with low melting point of the present invention is compared with traditional glass powder, using (BiO)2CO3、B2O3And ZnCO3Material bodies
System can obtain the glass powder partial size of 100~800nm range during the preparation process, obtain 300~400 DEG C of sealing temperature,
And stock utilization and nanoscale conversion rate are high, therefore the present invention also discloses above-mentioned composition and is used to prepare glass powder encapsulating material
Purposes.
Invention additionally discloses a kind of panel encapsulating structure, (BiO) is utilized in the packaging method2CO3、B2O3And ZnCO3Make
For packaged glass powder, the encapsulating structure has inside and outside two layers of sealing ring, and outer ring is UV solidification glue, and inner ring uses of the present invention
Frit.In packaging manufacturing process, need to vacuumize implementation environment in the encapsulation of UV solidification glue, in a vacuum into
It is capable the problem of rushing glue occur to avoid in pressing, but a negative pressure state can be formed in the sealing ring of UV glue and caused outside
The acceleration of portion's air is penetrated into；Middle part of the invention is divided into (BiO) for completing conversion2CO3And ZnCO3Receiving heating or laser sealing-in
When can decompose completely, and discharge CO2Gas reduces the negative pressure condition in UV solidification glue sealing ring, improves the stability of encapsulation,
Therefore the invention also discloses a kind of methods that decrease encapsulating structure internal cause packaging technology causes negative pressure, i.e., in advance in encapsulated space
The solid material of the middle decomposable release gas of setting can be by way of local heating or illumination after completing encapsulation in a vacuum
The solid material is decomposed, the optional solid material is carbonate, ammonium azide.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, technician in the art is under this invention's idea on the basis of existing technology
By the available technical solution of logical analysis, reasoning, or a limited experiment, it is regarded as falling within what the present invention was advocated
In protection scope.
Claims (10)
1. a kind of glass powder with low melting point, which is characterized in that the component of the low-melting glass feed powder body by weight ratio includes：30
~90 parts (BiO)2CO3, 20~60 parts of B2O3, 10~30 parts of ZnCO3And 1~5 part of colorant.
2. glass powder with low melting point according to claim 1, which is characterized in that the colorant is carbon black, MnO2、CuO、
Fe3O4、Ni2O3、Co2O3In any one, two or more of compositions.
3. glass powder with low melting point according to claim 1, which is characterized in that component by weight ratio further includes fluxing
Agent, optionally, the fluxing agent are Li2O、MgCl2、BaO、Al2O3、SiO2In any one, two or more of compositions.
4. glass powder with low melting point according to claim 1, which is characterized in that the glass powder further includes 10~40 parts and fills out
Material, optionally, the filler includes any one in tungsten wire array, aluminium titanates, cordierite, stannic oxide, spodumene, zircon etc.
Kind, two or more of compositions.
5. a kind of glass powder with low melting point slurry, which is characterized in that the glass powder with low melting point slurry includes claim 1-4 institute
Any one glass powder with low melting point and organic dispersing agent stated.
6. glass powder with low melting point slurry according to claim 5, which is characterized in that the partial size of the glass powder 80~
800nm；Further, the partial size of the glass powder is in 100~500nm.
7. glass powder with low melting point slurry according to claim 5, which is characterized in that the organic dispersing agent is ethers or alcohol
Class solvent.
8. a kind of preparation method of glass powder with low melting point slurry, it is characterised in that comprise the following steps：
S1：Prepare glass powder materials and is mixed：(BiO)2CO3、ZnCO3, 1~5 part of fluxing agent and 1~5 part of colorant；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
S3：B is added into S2 step mixture obtained2O3Continue ball-milling treatment；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By the S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step slurry obtained is sealed preservation.
9. the preparation method of glass powder with low melting point slurry according to claim 8, which is characterized in that
The ball-milling treatment of the S2 step is to carry out under vacuum conditions.
10. a kind of composition according to any one of claims 1-4 is preparing the purposes in semiconductor sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810855668.2A CN108863082A (en) | 2018-08-01 | 2018-08-01 | Glass powder with low melting point, glass powder slurry and preparation method thereof and composition purposes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810855668.2A CN108863082A (en) | 2018-08-01 | 2018-08-01 | Glass powder with low melting point, glass powder slurry and preparation method thereof and composition purposes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108863082A true CN108863082A (en) | 2018-11-23 |
Family
ID=64306680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810855668.2A Pending CN108863082A (en) | 2018-08-01 | 2018-08-01 | Glass powder with low melting point, glass powder slurry and preparation method thereof and composition purposes |
Country Status (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113450943A (en) * | 2021-09-02 | 2021-09-28 | 西安宏星电子浆料科技股份有限公司 | Thermal shock resistant conductor paste for thick film circuit |
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| SU1501475A1 (en) * | 1987-08-25 | 1994-10-15 | Н.Н. Максимов | Low-melting glass for joining magnetic head components |
| CN103889911A (en) * | 2011-10-13 | 2014-06-25 | 中央硝子株式会社 | Bismuth-containing glass composition |
| CN107414228A (en) * | 2017-08-01 | 2017-12-01 | 合肥利裕泰玻璃制品有限公司 | A kind of processing technology of sapphire glass component |
| CN107840575A (en) * | 2017-11-29 | 2018-03-27 | 苏州福莱威封装技术有限公司 | A kind of glass powder with low melting point and preparation method thereof |
| CN108238723A (en) * | 2016-12-26 | 2018-07-03 | 西安宏星电子浆料科技有限责任公司 | Solar energy crystal silicon battery back silver paste lead-free electronic glass powder and preparation method thereof |
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2018
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1501475A1 (en) * | 1987-08-25 | 1994-10-15 | Н.Н. Максимов | Low-melting glass for joining magnetic head components |
| CN103889911A (en) * | 2011-10-13 | 2014-06-25 | 中央硝子株式会社 | Bismuth-containing glass composition |
| CN108238723A (en) * | 2016-12-26 | 2018-07-03 | 西安宏星电子浆料科技有限责任公司 | Solar energy crystal silicon battery back silver paste lead-free electronic glass powder and preparation method thereof |
| CN107414228A (en) * | 2017-08-01 | 2017-12-01 | 合肥利裕泰玻璃制品有限公司 | A kind of processing technology of sapphire glass component |
| CN107840575A (en) * | 2017-11-29 | 2018-03-27 | 苏州福莱威封装技术有限公司 | A kind of glass powder with low melting point and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113450943A (en) * | 2021-09-02 | 2021-09-28 | 西安宏星电子浆料科技股份有限公司 | Thermal shock resistant conductor paste for thick film circuit |
| CN113450943B (en) * | 2021-09-02 | 2022-01-04 | 西安宏星电子浆料科技股份有限公司 | Thermal shock resistant conductor paste for thick film circuit |
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