CN108911515A - Glass powder with low melting point, glass powder slurry and preparation method thereof and panel encapsulating structure - Google Patents
Glass powder with low melting point, glass powder slurry and preparation method thereof and panel encapsulating structure Download PDFInfo
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- CN108911515A CN108911515A CN201810852680.8A CN201810852680A CN108911515A CN 108911515 A CN108911515 A CN 108911515A CN 201810852680 A CN201810852680 A CN 201810852680A CN 108911515 A CN108911515 A CN 108911515A
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- glass powder
- melting point
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
Abstract
The invention discloses glass powder with low melting point, using BiNO4、B2O3、ZnCO3And Cu2The material system of O, obtaining partial size using vacuum ball-milling method is nanoscale glass powder, and the sealing temperature of glass powder slurry, and stock utilization and high conversion rate is effectively reduced.The present invention also provides a kind of glass powder slurries and preparation method thereof.
Description
Technical field
The invention belongs to technical field of semiconductor encapsulation, it is related to a kind of glass powder with low melting point, slurry, the invention further relates to this
The preparation method of glass powder with low melting point and slurry, the invention also discloses a kind of panel encapsulating structures.
Background technique
Seal glass is mainly used in field of semiconductor package, especially shows in OLED, OLED illumination, solar energy and calcium
In the packaging technology of the semiconductor photoelectric devices such as titanium ore.Existing seal glass mainly uses bismuth zinc boron system lead-free glass powder system,
The mixed raw material heating of multicomponent material need to usually be made its fusing by the system glass powder preparation process, by the mixture after fusing
With ball mill, ball milling is powdery again after cooling, and finally sieve takes the part of 100~400 mesh, the glass powder that this kind of mode obtains
Grain partial size can only achieve micron order, and needs to sieve repeatedly and take, and stock utilization is low.On the other hand, glass powder in the prior art
It usually needs to add rare earth element in order to reduce its fusing point or has the metal oxide of certain toxicity and not environmentally friendly enough.
Summary of the invention：
In view of this, a kind of glass powder with low melting point is provided it is an object of the invention to overcome the above-mentioned prior art,
Include：BiNO4、B2O3、ZnCO3And Cu2O。
Further, the component is by weight ratio：50~100 parts of BiNO4, 20~50 parts of B2O3, 15~30 parts
ZnCO3, 5~10 parts of Cu2O。
Bismuth subnitrate decomposes in preparation or encapsulation process or decomposed, generates nanoscale bismuth oxide and nitrogen oxidation
Object makes the fusing point of glass powder entirety be reduced to 260~450 DEG C.Zinc carbonate is preparing or is encapsulating decomposition or part in use process
It decomposes, generates nanoscale zinc oxide and carbon dioxide, the fusing point of glass powder entirety is made to be reduced to 260~450 DEG C.
In preparation or encapsulation process, Cu2O can play the role of reducing agent and catalyst, reduce the nitrogen in bismuth subnitrate
Element valence accelerates bismuth subnitrate to decompose, meanwhile, Cu2The CuO that O is generated after being oxidized can be used as colorant, improve encapsulating material
Optical absorption characteristics；On the other hand, not oxidized cuprous ion can also weaken the crystallization property of frit, when playing high temperature
The adjustment effect of material internal stress generates crack in use caused by avoiding encapsulating structure from becoming fragile because of crystallization, improve quilt
The reliability of packaging.
And 825 DEG C of the fusing point of bismuth oxide in general；The vitreum of boron oxide softens at 325-450 DEG C；Oxidation
1975 DEG C of zinc fusing point, cause in the prior art micron order glass powder can not really reach molten condition in packaging sintering, only
It is the low melting material cladding fusion being melted, so that package interior is generated stress and is easy to appear cracking, or need higher
Sealing temperature.
Further, the glass powder further includes by weight ratio：1~5 part of colorant.
Further, the colorant is carbon black, MnO2、CuO、Fe3O4、Ni2O3、Co2O3One of, it is any two kinds or
A variety of compositions.
Further, the glass powder further includes by weight ratio：1~5 part of fluxing agent.
Further, the fluxing agent is Li2O、MgCl2、CaO、Al2O3、SiO2In any one, it is two or more of
Composition, fluxing agent can reduce BiNO when being packaged4And ZnCO3Decomposition temperature, accelerated decomposition process, promoted glass
The overall performance of powder when packaged.
Further, glass powder further includes by weight ratio：10~40 parts of negative thermal expansion coefficient low-expansion is filled out
Material.
Further, the negative thermal expansion coefficient or low-expansion filler include tungsten wire array, aluminium titanates, cordierite, two
In tin oxide, spodumene, zircon etc. any one, two or more of compositions.
The present invention further provides a kind of glass powder with low melting point slurries, and wherein the partial size of glass powder is in 80~800nm.
Further, the partial size of the glass powder is in 100~500nm.
Further, the organic dispersing agent of the glass powder with low melting point slurry is ethers or alcohols solvent.
The present invention further provides a kind of preparation methods of glass powder with low melting point slurry, specifically include the following steps：
S1：Prepare the glass powder materials and is mixed：50~100 parts of BiNO4, 15~30 parts of ZnCO3With 1~5 part
Toner；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
S3：20~60 parts of B are added into S2 step mixture obtained2O3With 5~10 parts of Cu2O continues at ball milling
Reason；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By the S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step glass powder slurry obtained is sealed preservation.
Further, the ball-milling treatment of the S2 step is to carry out under vacuum conditions.
Further, ball grinder is heated when the ball-milling treatment of the S2 step.
Further, after carrying out heat treatment 1 hour to ball grinder when the ball-milling treatment of the S2 step, then in room temperature or
Ball-milling treatment 2 hours under low temperature.May make that powder reaches nanoscale in heat treatment, be conducive to improve slurry viscosity and
Even property.
Further, temperature when heating when the ball-milling treatment of the S2 step to ball grinder is more than or equal to
150℃。
Further, temperature when heating when the ball-milling treatment of the S2 step to ball grinder is less than or equal to
250℃。
Further, the temperature of low-temperature treatment is carried out at -30 DEG C or less to ball grinder when the ball-milling treatment of the S2 step.
Further, the ball-milling treatment time of the S2 step was at 1~5 hour.
Further, the ball-milling treatment time of the S2 step is 3 hours.
The present invention also provides a kind of encapsulating structure of display panel, the display panel has substrate and encapsulation cover plate,
It is equipped with the first sealing ring between the substrate and the encapsulation cover plate, is additionally provided with the second sealing in first sealing ring periphery
Circle, between first sealing ring and second sealing ring be filled with desiccant, the desiccant be chosen as CaO, BaO and
Other desiccant.
Bismuth subnitrate BiNO4Decomposition or decomposed in encapsulation process, generate nanoscale bismuth oxide and nitrogen oxides,
Nitrogen oxides is not acidic oxide, will not directly be reacted with desiccant such as CaO or BaO, but when external water Oxygen permeation enters
When, nitrogen oxides can accelerate the absorption to water oxygen, and product produced can be absorbed by desiccant such as CaO or BaO, improve to water oxygen
Absorption efficiency.
The invention also discloses composition BiNO4、B2O3、ZnCO3And Cu2O is preparing the purposes in semiconductor sealing material.
The present invention utilizes BiNO4、B2O3And ZnCO3As glass powder and the material of main part of glass powder slurry, coloring is utilized
Agent, fluxing agent and filler regulate and control the light absorption, cladding temperature and thermal expansion coefficient of glass powder, and BiNO4And ZnCO3At this
The glass powder of invention can carry out mixed processing in the ball mill of heating in vacuum, and nanoscale powder can be obtained after processing
Grain increases the gap between powder body material and specific surface area, promotes CO2Diffusion, formed low melting point fused matter, to substantially reduce
The cladding temperature of glass powder and glass powder slurry enhances packaging effect.
Specific embodiment
Taken technical means and efficacy are achieved the object of the present invention to be further described, the glass of the invention to acquisition
The method of powder and glass powder slurry is specifically described, and those skilled in the art are it will be clearly understood that below specifically describe is only example
The property shown, to facilitate the understanding of the present invention, the protection scope being not intended to limit the invention, it is intended to the present invention be provided further
Explanation.Unless otherwise specified, all technical and scientific terms used herein has general with the technical field of the invention
The logical normally understood identical meanings of technical staff.
The present invention provides a kind of glass powder with low melting point formula：
The component formed by weight ratio：BiNO4、B2O3、ZnCO3And Cu2O。
Further, the component is by weight ratio：50~100 parts of BiNO4, 20~50 parts of B2O3, 15~30 parts
ZnCO3, 5~10 parts of Cu2O。
Bismuth subnitrate decomposes in preparation or encapsulation process or decomposed, generates nanoscale bismuth oxide and nitrogen oxidation
Object makes the fusing point of glass powder entirety be reduced to 260~450 DEG C.Zinc carbonate is preparing or is encapsulating decomposition or part in use process
It decomposes, generates nanoscale zinc oxide and carbon dioxide, the fusing point of glass powder entirety is made to be reduced to 260~450 DEG C.
In preparation or encapsulation process, Cu2O can play the role of reducing agent and catalyst, reduce the nitrogen in bismuth subnitrate
Element valence accelerates bismuth subnitrate to decompose, meanwhile, Cu2The CuO that O is generated after being oxidized can be used as colorant, improve encapsulating material
Optical absorption characteristics；On the other hand, not oxidized cuprous ion can also weaken the crystallization property of frit, when playing high temperature
The adjustment effect of material internal stress generates crack in use caused by avoiding encapsulating structure from becoming fragile because of crystallization, improve quilt
The reliability of packaging.
And 825 DEG C of the fusing point of bismuth oxide in general；The vitreum of boron oxide softens at 325-450 DEG C；Oxidation
1975 DEG C of zinc fusing point, cause in the prior art micron order glass powder can not really reach molten condition in packaging sintering, only
It is the low melting material cladding fusion being melted, so that package interior is generated stress and is easy to appear cracking, or need higher
Sealing temperature.
Further, the glass powder further includes by weight ratio：1~5 part of colorant.
Further, the colorant is carbon black, MnO2、CuO、Fe3O4、Ni2O3、Co2O3One of, it is any two kinds or
A variety of compositions.
Further, the glass powder further includes by weight ratio：1~5 part of fluxing agent.
Further, the fluxing agent is Li2O、MgCl2、CaO、Al2O3、SiO2In any one, it is two or more of
Composition, fluxing agent can reduce BiNO when being packaged4And ZnCO3Decomposition temperature, accelerated decomposition process, promoted glass
The overall performance of powder when packaged.
Further, glass powder further includes by weight ratio：10~40 parts of negative thermal expansion coefficient low-expansion is filled out
Material.
Further, the negative thermal expansion coefficient or low-expansion filler include tungsten wire array, aluminium titanates, cordierite, two
In tin oxide, spodumene, zircon etc. any one, two or more of compositions.
The present invention further provides a kind of glass powder with low melting point slurries, and wherein the partial size of glass powder is in 80~800nm.
Further, the partial size of the glass powder is in 100~500nm.
Further, the organic dispersing agent of the glass powder with low melting point slurry is ethers or alcohols solvent.
The present invention further provides a kind of preparation methods of glass powder with low melting point slurry, specifically include the following steps：
S1：Prepare the glass powder materials and is mixed：50~100 parts of BiNO4, 15~30 parts of ZnCO3With 1~5 part
Toner；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
Further, the ball-milling treatment of S2 step is to carry out under vacuum conditions.
Further, ball grinder is heated when the ball-milling treatment of S2 step.
Further, after carrying out heat treatment 1 hour to ball grinder when the ball-milling treatment of S2 step, then at room temperature or low temperature
Reason 2 hours.It may make the powder nanometer in heat treatment.
Further, temperature when heating when the ball-milling treatment of S2 step to ball grinder is more than or equal to 150 DEG C.
Further, temperature when heating when the ball-milling treatment of S2 step to ball grinder is less than or equal to 250 DEG C.
Further, the temperature of low-temperature treatment is carried out at -30 DEG C or less to ball grinder when the ball-milling treatment of S2 step.
Further, the ball-milling treatment time of S2 step was at 1~5 hour.
Further, the ball-milling treatment time of S2 step is 3 hours.
S3：20~60 parts of B are added into S2 step mixture obtained2O3With 5~10 parts of Cu2O continues at ball milling
Reason；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By the S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step glass powder slurry obtained is sealed preservation.
The present invention also provides a kind of encapsulating structure of display panel, the display panel has substrate and encapsulation cover plate,
It is equipped with the first sealing ring between the substrate and the encapsulation cover plate, is additionally provided with the second sealing in first sealing ring periphery
Circle, between first sealing ring and second sealing ring be filled with desiccant, the desiccant be chosen as CaO, BaO and
Other desiccant.
Bismuth subnitrate decomposes in encapsulation process or decomposed, generates nanoscale bismuth oxide and nitrogen oxides, nitrogen oxygen
Compound is not acidic oxide, will not directly and the desiccant reaction such as CaO or BaO, but described in the entrance of external water Oxygen permeation
When space between the first sealing ring and second sealing ring, nitrogen oxides under the action of metal oxide nanoparticles and
It can rapidly be reacted with water oxygen, product generated can be absorbed by desiccant such as CaO or BaO, improve the absorption efficiency to water oxygen.
The invention also discloses composition BiNO4、B2O3、ZnCO3And Cu2O is preparing the purposes in semiconductor sealing material.
The present invention utilizes BiNO4、B2O3And ZnCO3As glass powder and the material of main part of glass powder slurry, coloring is utilized
Agent, fluxing agent and filler regulate and control the light absorption, cladding temperature and thermal expansion coefficient of glass powder, and BiNO4And ZnCO3At this
The glass powder of invention can carry out mixed processing in the ball mill of heating in vacuum, and nanoscale powder can be obtained after processing
Grain increases the gap between powder body material and specific surface area, promotes CO2Diffusion, formed low melting point fused matter, to substantially reduce
The cladding temperature of glass powder and glass powder slurry enhances packaging effect.
The specific embodiment of several groups of glass powder, preparation method thereofs is given below, each component content is with the number table of unit mass
Show：
Embodiment 1
S1：50 parts of BiNO are weighed according to unit mass4, 20 parts of B2O3, 15 parts of ZnCO3, 5 parts of Cu2O and 1 part of carbon black；
S2：S1 step mixture obtained is carried out ball-milling treatment 5 hours.
Embodiment 2
S1：100 parts of BiNO are weighed according to unit mass4, 20 parts of B2O3, 10 parts of ZnCO3, 10 parts of Cu2O and 5 part of MnO2；
S2：S1 step mixture obtained is carried out ball-milling treatment 3 hours under vacuum conditions.
Embodiment 3
S1：90 parts of BiNO are weighed according to unit mass4, 50 parts of B2O3, 30 parts of ZnCO3, 8 parts of Cu2O and 3 part of Fe3O4, 1 part
Ni2O3With 1 part of Co2O3, additionally incorporate MgCl2, BaO and Al2O3Each 1 part and 10 parts of tungsten wire array；
S2：S1 step mixture obtained is carried out ball-milling treatment 1 hour under 250 DEG C of vacuum, heating states.
Embodiment 4
S1：50 parts of BiNO are weighed according to unit mass4, 50 parts of B2O3, 20 parts of ZnCO3, 3 parts of Cu2O and 1 part of MgCl2, and
Each 10 parts of aluminium titanates, cordierite, stannic oxide；
S2：S1 step mixture obtained is carried out ball-milling treatment 4 hours in the case where heating 150 DEG C of states.
The present invention further provides a kind of preparation methods of glass powder with low melting point slurry, specifically include the following steps：
S1：Prepare the glass powder materials and is mixed：50~100 parts of BiNO4, 15~30 parts of ZnCO3, 1~5 part help
Flux and 1~5 part of colorant；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
S3：20~50 parts of B are added into S2 step mixture obtained2O3With 5~10 parts of Cu2O continues at ball milling
Reason；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By the S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step glass powder slurry obtained is sealed preservation.
Further, the ball-milling treatment of the S2 step is to carry out under vacuum conditions.
Further, ball grinder is heated when the ball-milling treatment of the S2 step.
Further, after carrying out heat treatment 1 hour to ball grinder when the ball-milling treatment of the S2 step, then room temperature or low
Temperature processing 2 hours.It may make the powder nanometer in heat treatment and the powder body material blended be fined, be conducive to improve
The viscosity and uniformity of slurry,
Further, temperature when heating when the ball-milling treatment of the S2 step to ball grinder is more than or equal to
150℃。
Further, temperature when heating when the ball-milling treatment of the step to ball grinder is less than or equal to 250
℃。
Further, the temperature of low-temperature treatment is carried out at -30 DEG C or less to ball grinder when the ball-milling treatment of the S2 step.
Further, the ball-milling treatment time of the S2 step was at 1~5 hour.
Further, the ball-milling treatment time of the S2 step is 3 hours.
Further, the organic dispersing agent of the glass powder with low melting point slurry is ethers or alcohols solvent.
Embodiment 5
S1：50 parts of BiNO are weighed according to unit mass4, 50 parts of B2O3, 30 parts of ZnCO3, 5 parts of Cu2O and 1 part of Li2O and lithium
Each 20 parts of pyroxene, zircon.
S2：S1 step mixture obtained is carried out vacuum ball-milling treatment 2 hours in the case where heating 200 DEG C of states；
S3：It takes out to S2 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S4：By the S3 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S5：S4 step slurry obtained is carried out shading to be sealed.
Embodiment 6
S1：60 parts of BiNO are weighed according to unit mass4, 40 parts of B2O3, 20 parts of ZnCO3, 10 parts of Cu2O and 1 part of SiO2, and
20 parts of tungsten wire array.
S2：S1 step mixture obtained is carried out vacuum ball-milling treatment 2 hours in the case where heating 200 DEG C of states；
S3：It takes out to S2 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S4：By the S3 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S5：S4 step slurry obtained is carried out shading to be sealed.
Embodiment 7
S1：60 parts of BiNO are weighed according to unit mass4, 50 parts of B2O3, 30 parts of ZnCO3, 5 parts of Cu2O and 1 part of SiO2And tungsten
20 parts of sour zirconium.
S2：S1 step mixture obtained is carried out vacuum ball-milling treatment 2 hours in the case where heating 200 DEG C of states；
S3：It takes out to S2 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S4：By the S3 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S5：S4 step slurry obtained is carried out shading to be sealed.
Glass powder with low melting point of the present invention is compared with traditional glass powder, using BiNO4、B2O3、ZnCO3And Cu2The material bodies of O
System can obtain the glass powder partial size of 100~800nm range during the preparation process, obtain 260~400 DEG C of sealing temperature, and
Stock utilization and nanoscale conversion rate are high.
The present invention also provides a kind of encapsulating structure of display panel, the display panel has substrate and encapsulation cover plate,
The first sealing ring is equipped between the substrate and the encapsulation cover plate, wherein first sealing ring uses BiNO4、B2O3、
ZnCO3And Cu2Main component of the composition of O as seal glass material is additionally provided with the second sealing in first sealing ring periphery
Circle, between first sealing ring and second sealing ring be filled with desiccant, the desiccant be chosen as CaO, BaO and
Other desiccant.
Bismuth subnitrate decomposes in encapsulation process or decomposed, generates nanoscale bismuth oxide and nitrogen oxides, nitrogen oxygen
Compound is not acidic oxide, will not directly and the desiccant reaction such as CaO or BaO, but described in the entrance of external water Oxygen permeation
When space between the first sealing ring and second sealing ring, nitrogen oxides under the action of metal oxide nanoparticles and
It can rapidly be reacted with water oxygen, product generated can be absorbed by desiccant such as CaO or BaO, improve the absorption efficiency to water oxygen.
The invention also discloses composition BiNO4、B2O3、ZnCO3And Cu2O is preparing the purposes in semiconductor sealing material.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, technician in the art is under this invention's idea on the basis of existing technology
By the available technical solution of logical analysis, reasoning, or a limited experiment, it is regarded as falling within what the present invention was advocated
In protection scope.
Claims (10)
1. a kind of glass powder with low melting point, which is characterized in that the component of the low-melting glass feed powder body includes：BiNO4、B2O3、
ZnCO3And Cu2O。
2. glass powder with low melting point according to claim 1, which is characterized in that the colorant is carbon black, MnO2、CuO、
Fe3O4、Ni2O3、Co2O3In any one, two or more of compositions.
3. glass powder with low melting point according to claim 1, which is characterized in that component by weight ratio further includes 1~5 part
Fluxing agent, optionally, the fluxing agent are Li2O、MgCl2、CaO、Al2O3、SiO2In any one, two or more of groups
Close object.
4. glass powder with low melting point according to claim 1, which is characterized in that the glass powder further includes filler, optionally,
The filler include tungsten wire array, aluminium titanates, stannic oxide, in spodumene any one, two or more of compositions.
5. a kind of glass powder with low melting point slurry, which is characterized in that the glass powder with low melting point slurry includes claim 1-4 institute
Any one glass powder and organic dispersing agent stated.
6. a kind of preparation method of glass powder with low melting point slurry, it is characterised in that comprise the following steps：
S1：Prepare glass powder materials and is mixed：BiNO4、ZnCO3, fluxing agent and colorant；
S2：S1 step mixture obtained is subjected to ball-milling treatment；
S3：B is added into S2 step mixture obtained2O3And Cu2O continues ball-milling treatment；
S4：It takes out to S3 step mixture obtained and organic dispersing agent is added and obtain solidliquid mixture；
S5：By S4 step solidliquid mixture stir process obtained to dispersing evenly and stably；
S6：S5 step slurry obtained is sealed preservation.
7. the preparation method of glass powder with low melting point slurry according to claim 6, which is characterized in that the ball of the S2 step
Mill processing is to carry out under vacuum conditions.
8. a kind of encapsulating structure of display panel, the display panel has substrate and encapsulation cover plate, which is characterized in that described
The first sealing ring is equipped between substrate and the encapsulation cover plate, first sealing ring uses any one of claim 1-4 institute
Slurry described in any one of the glass powder stated or claim 5.
9. the encapsulating structure of display panel according to claim 8, it is characterised in that first sealing ring periphery is also set
There is the second sealing ring, desiccant is filled between first sealing ring and second sealing ring.
10. a kind of composition according to any one of claims 1-4 is preparing the purposes in semiconductor sealing material.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114571377A (en) * | 2021-11-15 | 2022-06-03 | 宜兴市泽润高分子新材料有限公司 | PAI resin-based grinding wheel and preparation method thereof |
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| CN103739200A (en) * | 2013-11-28 | 2014-04-23 | 苏州长风航空电子有限公司 | Low-temperature sealing glass and preparation method thereof |
| CN107846902A (en) * | 2015-05-05 | 2018-03-27 | 康宁股份有限公司 | Show the antimicrobial material of cooperative effect |
| CN104891803A (en) * | 2015-05-14 | 2015-09-09 | 贵研铂业股份有限公司 | Bi system lead-free low-melting glass powder for conductive paste and preparation method thereof |
| CN107840575A (en) * | 2017-11-29 | 2018-03-27 | 苏州福莱威封装技术有限公司 | A kind of glass powder with low melting point and preparation method thereof |
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| CN114571377A (en) * | 2021-11-15 | 2022-06-03 | 宜兴市泽润高分子新材料有限公司 | PAI resin-based grinding wheel and preparation method thereof |
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