CN108857869A - Grinding or grinding processing carrier and its manufacturing method, the manufacturing method of substrate - Google Patents

Abstract

Grinding or grinding processing carrier and its manufacturing method, the manufacturing method of substrate are provided.Milled processed carrier is by including that the composite material of the fiber and resin material that are oriented at least one direction is formed, and is had when being clamped disk-shaped substrate by upper flat plate and lower plate and being ground to a pair of of main surface of the substrate for keeping the retaining hole of the substrate.The retaining hole is having the 1st wall portion that is constituted in a manner of making the substrate and the fiber contacts in the state that retaining hole keeps the substrate and the 2nd wall portion constituted in a manner of making the substrate not with the fiber contacts in the state that retaining hole keeps the substrate on the week of the inner peripheral wall of the retaining hole.2nd wall portion is formed in the part of the differently- oriented directivity for the fiber that the direction in the inner peripheral wall includes one direction.

Description

Grinding or grinding processing carrier and its manufacturing method, the manufacturing method of substrate

The application be based on the 42nd article of Patent Law detailed rules for the implementation proposition, be the applying date be on December 1st, 2014, application No. is Application for a patent for invention " the milled processed carrier, grinding of (201480064905.3 international application no PCT/JP2014/081800) The divisional application of the manufacturing method of processing carrier and the manufacturing method of substrate for magnetic disc ".

Technical field

The present invention relates to the grinding of the milled processed for substrate or grinding processing carrier and its manufacturing methods, substrate Manufacturing method.

Background technique

As the disk for being used as one of information recording carrier, it is preferable to use glass substrates in the past.Now, hard with increasing The demand of memory capacity in disk drive device, it is intended to carry out the densification of magnetic recording.In the case of such, make magnetic head From the floating in magnetic recording face apart from extremely short, the magnetic recording information area is miniaturized.About the glass for being used in such disk The size and shape of substrate, is preferably accurately proceed production according to target.

In order to accurately make the size and shape of glass substrate, the surface of glass substrate is ground and is ground. It is used in the grinding and grinding of glass substrate using the grinding of plate or abradant carrier, the carrier is used to be ground or grind The glass substrate that middle retaining clip is lapped or ground between two plates.It is equipped in the carrier for keeping glass substrate Retaining hole.

In the past, it as the carrier, from the aspects of mechanical strength and cost, is widely used for being orientated glass fibre For the resin impregnated material in the glass fabric of different both directions impregnated of resin material.It will in particular it is preferred that having used In the carrier that glass fabric is constituted impregnated of the layer stackup multilayer of epoxy resin.But in the carrier, it is being ground or is grinding When glass substrate, in the end face (peripheral side wall surface) of glass substrate it sometimes appear that the scar of defect such as recess.The scar Depth is deeper and long than other scars for being formed in end face.It is attached with grinding slurry Zhong Mo in the part of the recess of the scar, And the glass-chip generated according to scar is attached to end face and becomes the root that dust occurs.Particularly, it is finally grinding Used in grinding slurry Zhong Mo be clipped between end face and carrier, and be attached in concave scar in turn as particulate It is fastened.From the end of glass substrate in the sputtering that the particulate adhered in this way carries out when forming magnetosphere on the glass substrate sometimes Emaciated face in main surface from and pass through, thus in magnetosphere manufacturing defect.Therefore, above-mentioned scar become manufacture glass substrate or The reason of reducing yield rate when manufacturing disk.

Under Zhuan Condition as, a kind of fiber protection glass substrate of known glass fibre by constituting above-mentioned carrier etc. Carrier (patent document 1).The carrier has such as flowering structure：Multiple recess portions are configured in the inner peripheral wall of the retaining hole of glass substrate, There is the retaining hole buffer area only formed by resin material in the outside of the inner peripheral wall and in the outer of retaining hole buffer area The retaining hole strengthening region that side is formed by composite material.That is, will not be from the inner peripheral wall for the retaining hole for being formed by glass substrate Fiber is oozed out, therefore can prevent from being damaged in the peripheral side wall surface for the glass substrate for carrying out grinding work sequence Time insertion retaining hole.

Also, it is also known that can prevent from generating in the circumferential lateral surface for being ground body by the inner circumferential of the retaining hole of grinding carrier The grinding of scar is with carrier (patent document 2) caused by the sliding of face and the circumferential lateral surface for being ground body.It is carried in the grinding In body, is contacted in the inner peripheral surface setting of retaining hole with the circumferential lateral surface for being ground body and supports the multiple protrusions for being ground body, The interval of these protrusions is set greater than to the width of the circumferential direction of the protrusion in the inner peripheral surface of retaining hole.

Existing technical literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2012-218103 bulletin

Patent document 2：Japanese Unexamined Patent Publication 2000-288921 bulletin

Summary of the invention

Subject to be solved by the invention

But in the carrier of patent document 1, the inner peripheral wall of the retaining hole of glass substrate becomes only by resin material shape At retaining hole buffer area, therefore the mechanical strength of original carrier can not be obtained, lack durability, therefore for example carrying out In the case where Continuous maching, it is possible to which the circumferential lateral surface that glass substrate occurs abuts with the angle of main surface and causes to constitute holding The case where a part of the resin material of hole buffer area is by defect.At this point, the resin material being detached from from retaining hole buffer area A part easily cause above-mentioned scar, and be attached to the main surface of glass substrate and form protrusion, and constitute defect.

Also, it in the grinding carrier recorded in patent document 2, is carried out as body is ground using glass substrate When grinding, inhibit the scar of the circumferential lateral surface (peripheral end face) of glass substrate with being unable to fully.

Therefore, the purpose of the present invention is to provide the systems of a kind of following milled processed carrier, milled processed carrier Make the manufacturing method of method and substrate for magnetic disc：It is able to suppress and scar occurs in the end face of substrate, in turn, inhibit particulate etc. attached Substrate main surface and form defect (can be avoided and deleterious effect is generated to the main surface of substrate).

The means to solve the problem

One aspect of the invention is milled processed carriers.The carrier has following form.

(form 1)

A kind of milled processed carrier, which is characterized in that

It is by including that the composite material of the fiber and resin material that are oriented at least one direction is formed, and is had by upper For keeping institute when plate and lower plate clamp disk-shaped substrate and are ground to a pair of of main surface of the substrate The retaining hole of substrate is stated,

The retaining hole has on the week of the inner peripheral wall of the retaining hole maintains the base in the retaining hole The 1st wall portion that is constituted in a manner of making the substrate and the fiber contacts in the state of plate and described in being kept in the retaining hole The 2nd wall portion constituted in a manner of making the substrate not with the fiber contacts in the state of substrate,

2nd wall portion is formed in the orientation that the direction in the inner peripheral wall includes the fiber in one direction The part in direction.

(form 2)

According to milled processed carrier described in form 1, wherein the 2nd wall portion, which is located at, more leans on institute than the 1st wall portion State the position in the outside of the radial direction of retaining hole.

In other words, the carrier of form 2 is with by upper flat plate and the disk-shaped glass substrate of lower plate clamping and to institute The glass main surface for stating glass substrate, which grind, rubs when handling for keeping the milled processed of the retaining hole of the glass substrate to use Carrier,

The milled processed carrier is characterized in that,

The milled processed is made of with carrier plate, which is oriented to 2 directions different from each other making glass fibre Impregnating resin material forms in glass fabric,

The profile of the retaining hole is determined as follows：In the inner peripheral wall of the retaining hole towards the glass The differently- oriented directivity wall portions for 2 differently-s oriented directivity that fiber is orientated be respectively positioned on in the profile of the inner peripheral wall of the retaining hole The outside for the inscribed circle cut.

(form 3)

According to milled processed carrier described in form 2, wherein the 1st wall portion is directed towards the radius of the retaining hole The 1st curved surface, plane or the 2nd curved surface of the convex form of the inside in direction, the curvature half of the radius of curvature of the 2nd curved surface than inscribed circle Diameter is big, and the 2nd curved surface is convex form, the inscribed circle and the holding relative to the outside of the radial direction of the retaining hole The profile inscribe of the inner peripheral wall in hole, the peripheral side wall surface of the substrate and the 1st curved surface, the plane or the 2nd song Face abuts.

In other words, milled processed described according to the carrier of form 32 in the form of above-mentioned another expression method statement With carrier, wherein the two sides of the circumferential direction along the retaining hole of the differently- oriented directivity wall portions of the retaining hole Wall surface is directed towards the 1st curved surface, plane or the 2nd curved surface of the convex form of the inside of the retaining hole, the radius of curvature of the 2nd curved surface Radius of curvature than the inscribed circle is big, and is convex form, the periphery of the glass substrate relative to the outside of the retaining hole Side wall surface is abutted with the 1st curved surface, the plane or the 2nd curved surface.

In addition, in the form of above-mentioned another expression method statement 2 or 3 carrier, the described 1st of the retaining hole the There is no the end of the glass fibre of the glass fabric, the end of the glass fibre in curved surface, the plane or the 2nd curved surface End can be located at the outside of the profile relative to the profile of the retaining hole.

(form 4)

According to milled processed carrier described in form 3, wherein the 1st curved surface, the plane or the 2nd curved surface More than being set on the week of the retaining hole at 4.

In other words, grinding described according to the carrier of form 42 or 3 in the form of above-mentioned another expression method statement Processing use carrier, wherein the 1st curved surface, the plane or the 2nd curved surface on the week of the retaining hole be set to 4 at On.

(form 5)

The milled processed carrier according to any one of form 2~4, wherein the internal perisporium with the retaining hole The inscribe diameter of a circle of the profile inscribe in face is bigger than the diameter of the circular plate shape of the substrate.

(form 6)

According to milled processed carrier described in form 5, wherein the inscribe diameter of a circle is the circular plate type of the substrate 1.002~1.031 times of the diameter of shape.

In other words, according to the carrier of form 6 any one of 2~5 in the form of above-mentioned another expression method statement The milled processed carrier, wherein the inscribe diameter of a circle is the diameter of the circular plate shape of the glass substrate 1.002~1.031 times.

Another aspect of the invention is the manufacturing methods of substrate for magnetic disc.The manufacturing method has following form.

(form 7)

A kind of manufacturing method of substrate for magnetic disc, which is characterized in that include the following steps：

Manufacture the substrate of circular plate shape；

Substrate is kept in the retaining hole for being set to the milled processed carrier according to any one of form 2~6 Under state, the substrate is clamped by upper flat plate and lower plate, makes the glass main surface, the upper flat plate and the lower plate phase It moves over the ground, to be ground to the main surface of the substrate.

In other words, the manufacturing method of the glass substrate for disc of form 7 is characterised by comprising：Milled processed, by glass Glass substrate, which is maintained at, to be set at the grinding according to any one of 2~6 in the form of above-mentioned another expression method statement In the state of in the retaining hole of reason carrier, the glass substrate is clamped by upper flat plate and lower plate, and make the main table of the glass Face, the upper flat plate and the lower plate relatively move, to grind to the main surface of the glass substrate.

(form 8)

According to the manufacturing method of substrate for magnetic disc described in form 7, wherein in the milled processed, the substrate Peripheral side wall surface is not abutted with the 2nd wall portion, and is abutted in the two sides of the 2nd wall portion.

In other words, disk described according to the manufacturing method of form 87 in the form of above-mentioned another expression method statement With the manufacturing method of glass substrate, wherein in the milled processed, the peripheral side wall surface of the glass substrate does not take with described It abuts to direction wall portions, and is abutted in the two sides of the differently- oriented directivity wall portions.

(form 9)

The manufacturing method of the substrate for magnetic disc according to form 7 or 8, wherein the milled processed is with carrier by such as Lower process and make：On the plate being made of the composite material of fiber and resin material including being oriented at least one direction Retaining hole is formed, after forming the retaining hole, the plate is etched.

Another aspect of the invention is milled processed carriers.The carrier has form below.

(form 10)

According to milled processed carrier described in form 1, wherein in the inner peripheral wall from the retaining hole to the holding Region is not present configured with fiber in the cricoid region that the outside of the radial direction in hole extends, the fiber there is no region relative to 2nd wall portion is set to the outside of the radial direction of the retaining hole, and fiber is not present in the differently- oriented directivity.

In other words, the carrier of form 10 is with by upper flat plate and the glass substrate of lower plate clamping plate and to described For keeping the carrier of the retaining hole of the glass substrate when main surface of glass substrate is ground,

The carrier is characterized in that,

The carrier according to multiple glass fibres towards any direction in 2 differently-s oriented directivity and the glass fabric that configures and It is reinforced, and is made of the dipping substrate of the resin made of the glass fabric impregnating resin material,

The cricoid region extended outward from the inner wall of the retaining hole, be separated from each other in the circumferential direction and alternately Configured with the 1st strengthening region and the 2nd strengthening region, the 1st strengthening region only passes through towards one in the differently- oriented directivity 1st glass fibre in direction and be reinforced, the 2nd strengthening region only passes through towards another direction in the differently- oriented directivity The 2nd glass fibre and be reinforced,

1st strengthening region is set to the orientation side towards the 2nd glass fibre in the inner wall of the retaining hole To the 1st inner wall part outside, the 2nd strengthening region be set to the inner wall in taking towards the 1st glass fibre To the outside of the 2nd inner wall part in direction.

(form 11)

According to milled processed carrier described in form 10, wherein there is no regions by towards the described 2nd for the fiber The end of the fiber of wall portion does not reach the inner peripheral wall of the retaining hole and is formed.

In other words, carrier described according to the carrier of form 11 10 in the form of above-mentioned another expression method statement, Wherein, the 1st strengthening region is formed by the inner wall that the end of the 2nd glass fibre does not reach the retaining hole, 2nd strengthening region is formed by the inner wall that the end of the 1st glass fibre does not reach the retaining hole.

Another aspect of the invention is the manufacturing methods of milled processed carrier.The manufacturing method has following form.

(form 12)

A kind of manufacturing method of milled processed carrier, milled processed carrier have by upper flat plate and lower plate folder For keeping the retaining hole of the substrate when holding disk-shaped substrate and being ground to the main surface of the substrate,

The manufacturing method of above-mentioned milled processed carrier is characterised by comprising：

Step 1 is rapid, in the plate being made of the composite material of fiber and resin material including being oriented at least one direction The retaining hole is formed on material；And

Second step is at least etched on the plate for being formed with the retaining hole, so that the carrier is made,

In the second step, in the inner circumferential of the differently- oriented directivity towards the fiber for including one direction The part of wall surface is etched the fiber.

In other words, the manufacturing method of form 12 is right with disk-shaped glass substrate is clamped by upper flat plate and lower plate The main surface of the glass substrate is ground the manufacturing method for the carrier for keeping the retaining hole of the glass substrate,

The manufacturing method of above-mentioned carrier is characterised by comprising：

Step 1 is rapid, the glass fabric quilt configured by multiple glass fibres towards any direction in 2 differently-s oriented directivity Strengthen, forms the retaining hole on the dipping substrate of the resin made of the glass fabric impregnating resin material；And

Second step makes the carrier by impregnating and substrate is etched to the resin for being formed with the retaining hole,

In the second step, the differently- oriented directivity towards the glass fibre in the inner wall of the retaining hole The inner wall part of any direction is etched the glass fibre exposed in a manner of towards the differently- oriented directivity, thus from institute State the cricoid region that the inner wall of the retaining hole of carrier extends outward and form strengthening region, the strengthening region only by with institute It states the glass fibre of the different differently- oriented directivity of differently- oriented directivity of the glass fibre of etching and is reinforced.

(form 13)

According to the manufacturing method of milled processed carrier described in form 12, wherein in the second step, carrying out Before the etching, the part towards the plate of the part other than the part of the inner peripheral wall of the differently- oriented directivity is being constituted Mask material is set, after carrying out the etching, removes the mask material.

In other words, load described according to the manufacturing method of form 13 12 in the form of above-mentioned another expression method statement The manufacturing method of body, wherein in the second step, before carrying out the etching, in the cricoid region described in Mask material is arranged in part other than strengthening region, after carrying out the etching, removes the mask material.

(form 14)

The manufacturing method of milled processed carrier according to form 12 or 13, wherein in the second step, The part of the plate towards the part of the inner peripheral wall of the differently- oriented directivity is constituted, is coated with for etching the fiber Etchant, to carry out the etching.

In other words, described according to the manufacturing method of form 14 12 or 13 in the form of above-mentioned another expression method statement Carrier manufacturing method, wherein in the second step, the resin dipping substrate cricoid region in composition The part of the strengthening region is coated with the etchant for etching the glass fibre, to carry out the etching.

(form 15)

According to the manufacturing method of described in any item milled processed carriers of form 12 to 14, wherein in the step 2 In rapid, before carrying out the etching, it is overlapped on plate thickness direction and configures the plate and one or more other bases Plate, the others substrate are formed with retaining hole in position corresponding with the position of the retaining hole is formed in the plate.

In other words, according to the manufacturing method of form 15 12 to 14 in the form of above-mentioned another expression method statement The manufacturing method of described in any item carriers, wherein in the second step, before carrying out the etching, in plate thickness Be overlapped on direction and configure resin dipping substrate and one or more other substrates, the others substrate with the tree The formation of rouge dipping substrate has the corresponding position in the position of the retaining hole to be formed with retaining hole.

(form 16)

According to the manufacturing method of milled processed carrier described in form 15, wherein the others substrate is by including taking It is constituted to the composite material of fiber and resin material at least one direction,

The plate is being known as the 1st plate, when other substrates are known as 2 plate, in the second step In, when the 1st plate and the 2nd plate to be overlapped and configure, it is orientated the fiber between the plate Direction is consistent.

In other words, load described according to the manufacturing method of form 16 15 in the form of above-mentioned another expression method statement The manufacturing method of body, the others substrate are configured by multiple glass fibres towards any direction in 2 differently-s oriented directivity Glass fabric be reinforced, and formed in the glass fabric impregnating resin material,

Resin dipping substrate is being known as the 1st resin dipping substrate, other substrates are known as the leaching of the 2nd resin When stain substrate, in the second step, match by the 1st resin dipping substrate and the 2nd resin dipping substrate overlapping When setting, keep the differently- oriented directivity consistent between resin dipping substrate.

(form 17)

According to the manufacturing method of milled processed carrier described in form 15, wherein the others substrate is by including taking It is constituted to the composite material of fiber and resin material at least one direction,

The plate is being known as the 1st plate, it is rapid in the step 1 when other substrates are known as 2 plate In, in the case where the 1st plate and the 2nd plate to be overlapped and configure, to make the fiber between the plate The consistent mode in the direction being orientated forms the retaining hole.

In other words, load described according to the manufacturing method of form 17 15 in the form of above-mentioned another expression method statement The manufacturing method of body, wherein the others substrate passes through any direction in 2 differently-s oriented directivity of multiple glass fibres directions The glass fabric of configuration and be reinforced, and formed in the glass fabric impregnating resin material,

Resin dipping substrate is being known as the 1st resin dipping substrate, other substrates are known as the leaching of the 2nd resin When stain substrate, in the step 1 is rapid, match by the 1st resin dipping substrate and the 2nd resin dipping substrate overlapping In the case where setting, the retaining hole is formed in a manner of keeping the differently- oriented directivity consistent between resin dipping substrate.

Another aspect of the invention is the manufacturing methods of substrate for magnetic disc.The manufacturing method has following form.

(form 18)

A kind of manufacturing method of substrate for magnetic disc, which is characterized in that have：

Milled processed, in described in any item milled processed carriers of form 10 and 11 or according in form 12 to 17 It is right in the state that the manufacturing method of described in any item milled processed carriers and the milled processed that manufactures keep substrate with carrier The main surface of the substrate is ground.

In other words, the manufacturing method of form 18 is the manufacturing method of glass substrate for disc, is had：

Milled processed, the carrier described in 10 or 11 in the form of above-mentioned another expression method statement or according to above-mentioned Another manufacturing method of carrier described in any one of form 12 to 17 of expression method statement and the carrier manufactured is kept In the state of glass substrate, the main surface of the glass substrate is ground.

Invention effect

The manufacturing method and milled processed carrier of substrate for magnetic disc according to the present invention, are able to suppress in the end face of substrate Scar occurs, in turn, inhibits to generate defect in the main surface of substrate.

Also, milled processed carrier according to the present invention, in the differently- oriented directivity in face of fiber (towards differently- oriented directivity) There is no the fibers towards the differently- oriented directivity near inner wall part, for example, according only to the fibre of the differently- oriented directivity different from the fiber It ties up and is strengthened.It as a result, in the case where carrying out the milled processed of substrate, can prevent from that scar occurs in the end face of substrate, And ensure the intensity of the carrier near the inner wall of retaining hole, so as to inhibit the pollution (foreign matter) as caused by resin material Occur.The manufacturing method of milled processed carrier according to the present invention, can obtain such carrier.Disk according to the present invention It with the manufacturing method of substrate, can prevent from generating scar in substrate end-face when being ground, and inhibit by resin material The generation of caused pollution, to inhibit the main surface sewage dye or the generation of scratch of substrate.

Detailed description of the invention

Fig. 1 is the exploded perspective view using an example of the grinding attachment (two sides grinding device) of the carrier of the 1st embodiment.

Fig. 2 is the sectional view of an example of grinding attachment shown in FIG. 1.

Fig. 3 is taken for illustrating two that the inner peripheral wall of the retaining hole in the 1st embodiment is orientated with glass fibre To the figure of an example of the relationship in direction.

Fig. 4 is the figure for indicating an example of the chamfered shape of the retaining hole of carrier of the 1st embodiment.

Fig. 5 is the perspective view paid close attention to a retaining hole and indicate carrier shown in FIG. 1.

Fig. 6 is the inner peripheral wall of the retaining hole for illustrating the carrier of the 1st embodiment and the abutting state of glass substrate Figure.

(a), (b) of Fig. 7 is another figure for indicating the chamfered shape of the retaining hole of carrier of the 1st embodiment.

(a) of Fig. 8~(c) is the chamfered shape for the retaining hole of carrier for indicating the 1st embodiment and another figure.

Fig. 9 is the chamfered shape for the retaining hole of carrier for indicating the 1st embodiment and another figure.

Figure 10 is the top view of the carrier of the 2nd embodiment.

Figure 11 is the perspective view paid close attention to a retaining hole and indicate carrier shown in Fig. 10.

Figure 12 is the figure for the carrier paid close attention to cricoid region and indicate Fig. 1.

Figure 13 is the figure for the carrier paid close attention to cricoid region and indicate Fig. 1.

Specific embodiment

1st embodiment

In the following, the manufacturing method of milled processed carrier and substrate for magnetic disc to the 1st embodiment carries out specifically It is bright.In the present embodiment, milled processed includes：The grinding of glass substrate and the glass master for reducing the glass substrate after grinding The grinding of the glass substrate of the roughness on surface.Therefore, milled processed is referred to carrier, can be used in glass substrate grinding and The carrier of grinding.It is illustrated, but can also be used to the case where being used in grinding in the carrier pin of embodiments described below In grinding.

Present inventor has carried out conscientiously carrier and substrate such as glass substrate to solve conventional problems Research.Carrier in the glass fabric for making glass fibre be oriented in for example orthogonal both direction of both direction different from each other by soaking Plate made of stain resin material (plate) is constituted.In the carrier, glass fabric is laminated into multilayer, and in each glass fabric The differently- oriented directivity of glass fibre is identical.Also, inventor has carried out following guess：In the internal perisporium of the retaining hole of glass substrate In face, in the differently- oriented directivity wall portions (aftermentioned 2nd wall portion) of two differently-s oriented directivity for facing glass fibre respectively and being orientated, When the end of glass fibre is abutted with the peripheral side wall surface of glass substrate, resin material slight curvature, thus glass fibre End is slightly prominent (flying out), and the end stamp of the glass fibre clean the windows substrate peripheral side wall surface or from resin material Whether face glass fibre outstanding stabs the peripheral side wall surface for the substrate that cleans the windows, to cause to produce in the peripheral side wall surface of glass substrate Raw scar.

In addition, the inventors discovered that：Known in above-mentioned in the grinding carrier of (patent document 2), although being equipped with protrusion, But the differently- oriented directivity of glass fibre is not considered.The present inventors have additionally discovered that：It is outstanding prominent in parallel with the differently- oriented directivity of glass fibre The glass fibre for the end risen causes to generate scar in the peripheral end face of glass substrate.Parallel with the differently- oriented directivity of glass fibre The end of ground protrusion outstanding, power are particularly easy to be concentrated, therefore are easy to produce scar in the peripheral end face of glass substrate.And And repeat test as a result, having invented the milled processed carrier of aspect as follows and the manufacturing method of substrate.

In the present specification, substrate further includes aluminum substrate, silicon wafer etc. other than glass substrate, but in theory below In bright, it is illustrated by taking glass substrate as an example as representative.In addition, in aluminum substrate, in addition to the substrate that is made of fine aluminium it It outside, further include the substrate being made of the aluminium alloy of other metallic elements including magnesium etc..In the settable example in the surface of aluminum substrate etc. The plated film of such as NiP (nickel nitride).

In the present specification, fiber further includes metallic fiber etc. other than glass fibre, but in the following description, It is illustrated by taking glass fibre as an example as representative.Also, in the case where being merely called fiber, in addition to particularly prior Except the case where illustrating, multiple fibers are indicated.In turn, the quantity of the differently- oriented directivity of fiber, either 1, it is also possible to 2 It is a, 3 etc. it is multiple, and in the following description, be illustrated in case where 2 directions as representative.

In the present specification, refer on the inside of retaining hole, outside the radial direction from the central part of retaining hole to retaining hole The direction that side or retaining hole narrow refers on the outside of retaining hole, in the radial direction from the central part of retaining hole to retaining hole The direction that side or retaining hole become larger.

(grinding device)

Referring to FIG. 1 and FIG. 2, the grinding device for the glass substrate for using the milled processed of present embodiment carrier is carried out Explanation.Milled processed with carrier have disk-shaped glass substrate is clamped by upper flat plate and lower plate and to the glass of glass substrate For keeping the retaining hole of glass substrate when glass main surface is ground.Fig. 1 is grinding device (two sides grinding device) Exploded perspective view.Fig. 2 is the sectional view of grinding device.Grinding attachment also has structure identical with grinding device, therefore omits Explanation about grinding attachment.

As shown in Figure 1, grinding device has upper and lower a pair of plates, i.e. upper flat plate 40 and lower plate 60.Upper flat plate 40 with Circular glass substrate G is clamped between lower plate 60, by any of moving operation upper flat plate 40 or lower plate 60 or The two, so that glass substrate G and each plate be made relatively to move, thus, it is possible to two main surfaces progress to glass substrate G Grinding.In addition, the grinding slurry comprising Yan Mo Mo is fed between glass substrate and plate.Hereinafter, by upper flat plate 40 and When lower plate 60 is referred to as and is illustrated, merely it is called plate.

Referring to FIG. 1 and FIG. 2, the structure of grinding device is more specifically illustrated.

In grinding device, grinding pad 10 is pasted in the upper surface of lower plate 60 and the lower surface of upper flat plate 40.? In Fig. 1, grinding pad 10 is sheet.As grinding pad 10, such as foaming urethane resin can be used etc..

Carrier 30 as one kind have disk-shaped glass substrate G is clamped by upper flat plate 40 and lower plate 60 and to glass substrate G's For keeping the retaining hole of glass substrate G when main surface is ground.Specifically, carrier 30 as one kind have set on peripheral part with The teeth portion 31 that sun gear 61 and internal gear 62 engage and one or more holdings for storing glass substrate G and being kept Hole 32.Sun gear 61 is constituted as a whole with central axis CTR set on outer peripheral internal gear 62 and disk-shaped carrier 30 as one kind Centered on planetary gear mechanism.Disk-shaped carrier 30 as one kind is engaged in inner circumferential side with sun gear 61, in peripheral side and internal gear 62 engagements, and store one or more glass substrates G and kept.On lower plate 60, carrier 30 as one kind as planetary gear and from It revolves while turning, moves glass substrate G relatively with lower plate 60.For example, if sun gear 61 is to counterclockwise Direction rotates, then carrier 30 as one kind rotates clockwise, and internal gear 62 rotates counterclockwise.As a result, in lower plate 60 Relative motion is generated between glass substrate G.It is equally possible that moving glass substrate G and upper flat plate 40 relatively.

In the above movement of the relative movement, upper flat plate 40 is to the glass substrate G (that is, vertical direction) for being held in carrier 30 as one kind With the pressing of defined pressure, grinding pad 10 thus is pressed to glass substrate G.Also, as shown in Fig. 2, grinding slurry is according to pump (not shown) and from supplying tank 71 via one or more piping 72 and be fed between glass substrate G and grinding pad 10.

(carrier)

Carrier 30 as one kind, which has, is laminated multiple glass fabric (JIS R3414：2012) stepped construction made of.Why by carrier 30 are configured to the stepped construction using glass fabric, are because of following reason：Carrier 30 as one kind in grinding because from sun gear 61 and Power that internal gear 62 is subject to and cause bending deformation, shear-deformable, as a result, glass substrate G is damaged in order to prevent, need really Protect the intensity of flexural rigidity, shear rigidity and machinery.Glass fabric is to weave the glass fiber being made of glass fibre (JISR3413：2012.Hereinafter referred to as organdy) prepared by.Carrier 30 as one kind is will be in above-mentioned glass fabric impregnating resin material Made of layer be overlapped and crimp and formed.That is, carrier 30 as one kind plate as made of the configuration glass fabric in resin material (with Under, referred to as resin impregnates substrate) it constitutes, which is oriented to 2 directions different from each other for glass fibre and is formed.Make For resin material, the thermoplastic resins such as epoxy resin, phenolic resin can be used.

Fig. 3 is the inner peripheral wall 36 and glass of the retaining hole 32 for illustrating the retaining hole 32 of the carrier 30 as one kind in present embodiment The figure of an example of the relationship for 2 differently-s oriented directivity that glass fiber is orientated.For the ease of indicating, by inner peripheral wall 36 shown in Fig. 3 Chamfered shape be shown as round, it is but as be described hereinafter, upper along the week of retaining hole 32 and have bumps.Carrier 30 as one kind is by glass fabric Plate made of impregnating resin material is constituted, which is oriented to glass fibre 2 directions (X-directions, Y different from each other Direction) and formed.The differently- oriented directivity of glass fibre in each layer of glass fabric is X-direction, Y-direction.Glass fabric be by Such as the glass fibre (33,34) that filament diameter is several μm is for example in the configuration of each unit 200~800 density arrays And the woven fabric constituted.

Fig. 4 is the figure for indicating an example of the chamfered shape of retaining hole 32 of carrier 30 as one kind.Fig. 5 be concern one retaining hole 32 and Indicate the perspective view of carrier 30 as one kind shown in FIG. 1.Fig. 6 is the inner peripheral wall 36 and glass base for illustrating the retaining hole 32 of carrier 30 as one kind The figure of the abutting state of plate G.

The carrier 30 as one kind of present embodiment by include be oriented at least one direction glass fibre and resin material it is compound Material is formed, and is had and ground clamping disk-shaped substrate by upper flat plate and lower plate to a pair of of main surface of substrate For keeping the retaining hole 32 of substrate when processing.Retaining hole 32 has on the week of the inner peripheral wall of retaining hole in retaining hole 32 The 1st wall portion for constituting the mode of substrate and fiber contacts in the state of middle holding substrate is (in aftermentioned 1st curved surface 37, plane 38, the part of the 2nd wall portion is removed in the 2nd curved surface 39) and the 2nd wall portion that is constituted in a manner of making the substrate not with fiber contacts (aftermentioned differently- oriented directivity wall portions 35).It includes a side that 2nd wall portion, which is formed in the direction in the inner peripheral wall of retaining hole 32, To fiber differently- oriented directivity part.Also, the carrier 30 as one kind of the 1st embodiment is characterized in that, the 2nd wall portion is located at than the 1st Wall portion more leans on the position in the outside of the radial direction of retaining hole.In addition, the differently- oriented directivity of the fiber including a direction refers to, wrap Include all directions that the fiber in carrier is orientated.Therefore, in all differently-s oriented directivity pair of the inner peripheral wall of retaining hole and fiber It is formed with the 2nd wall portion with answering, specifically, is formed with the 2nd of 2 times of quantity of the quantity of the differently- oriented directivity of fiber the in inner peripheral wall Wall portion.For example, the 2nd wall portion is formed at the 4 of inner peripheral wall in the case where the quantity of the differently- oriented directivity of fiber is 2.This Point is also identical in aftermentioned 2nd embodiment.

The profile of retaining hole 32 is set to as follows：In the side wall surface of retaining hole 32 shown in Fig. 4, towards glass fibre institute The differently- oriented directivity wall portions 35 of 2 differently-s oriented directivity (X-direction, Y-direction) of orientation are respectively positioned on the inner peripheral wall with retaining hole 32 Profile inscribe inscribed circle outside.As a result, the peripheral side wall surface of the glass substrate G in milled processed not with differently- oriented directivity wall Face part 35 abuts, and abuts in the two sides of differently- oriented directivity wall portions 35.

Here, assuming and the inner peripheral wall of retaining hole 32 as shown in figure 3, differently- oriented directivity wall portions 35 refer to When the inscribed circle C of profile inscribe, make the normal direction (direction orthogonal with the wiring of inscribed circle) and glass fibre of inscribed circle (33,34) part on the consistent inscribed circle of differently- oriented directivity is located at the holding for the azimuth direction seen from the central point of inscribed circle The part of the inner peripheral wall in hole 32 (in Fig. 3, by the part of heavy line expression).At this point, normal direction is consistent with differently- oriented directivity Refer to, as shown in figure 3, centered on the completely the same part in direction, by the range of θ=40 ° (for center line ± 20 ° of figure) Permissible range of the interior wall portions as differently- oriented directivity wall portions 35.In such permissible range, for example, can enumerate θ= The range of 22.5 ° (for center line ± 11.25 ° of figure).Retaining hole 32 be set as it is roughly circular, therefore have in X-direction Azimuth be 0 degree in the case where, respectively by θ=0 °, θ=90 °, θ=180 °, θ=270 ° position centered on 4 orientation sides To wall portions 35.In the inner peripheral wall 36 of retaining hole 32 shown in Fig. 4, differently- oriented directivity wall portions 35 are located at and retaining hole The outside of the inscribed circle (being indicated in Fig. 4 by dotted line) of the profile inscribe of 32 inner peripheral wall.Specifically, example shown in Fig. 4 In, in the wall surface of the two sides of the circumferential direction along retaining hole 32 of differently- oriented directivity wall portions 35, constitute towards retaining hole 32 Inside convex form the 1st curved surface 37.1st curved surface 37 of convex form connects with inscribed circle.Therefore, as shown in fig. 6, glass base The peripheral side wall surface of plate G is not abutted with differently- oriented directivity wall portions 35, and is abutted in the two sides of differently- oriented directivity wall portions 35.This Sample, the differently- oriented directivity wall portions 35 of the differently- oriented directivity towards glass fibre (33,34) are located at the inner peripheral wall with retaining hole 32 Profile inscribe inscribed circle outside, do not abutted with the peripheral side wall surface of glass substrate G.Therefore, even if in differently- oriented directivity wall Glass fibre (33,34) exposes from resin material in face part 35, and the end of glass fibre (33,34) is not outer with glass substrate G All side wall surface contacts, therefore can prevent from generating scar in the peripheral side wall surface of glass substrate G.Thereby, it is possible to inhibit in glass Main surface adhesion of particles of substrate G etc. and the problem of form defect.In addition, in the inner circumferential side and peripheral side of glass substrate G End face, the chamfering for being formed with the side wall surface orthogonal with main surface by carrying out chamfered and connecting side wall surface with main surface Face (via face), and in this case, it can prevent in the end face (peripheral side wall surface) of the peripheral side of glass substrate G, especially Scar is generated in side wall surface.

Also, be located at relative to differently- oriented directivity wall portions 35 two sides of the circumferential direction of the inner peripheral wall of retaining hole 32, It is abutted towards 2 the 1st curved surfaces 37 of the convex form of the inside of retaining hole 32 with glass substrate G, is applied to the outer of glass substrate G The power of all side wall surfaces is dispersed, therefore 2 the 1st curved surfaces 37 for being able to suppress convex form are abutted with the peripheral side wall surface of glass substrate G And generate scar.In addition, contacted at 1 in the case where the shape of retaining hole 32 is previous such simple circular, because This power is concentrated and is easy to appear scar.

Additionally, it is preferred that being, in the case where 1 carrier 30 as one kind is equipped with multiple retaining hole 32, to consider in all retaining holes 32 The differently- oriented directivity of glass fibre and the 1st curved surface 37 towards the convex form of the inside of retaining hole 32 is set.1st curved surface of convex form 37 needed in all retaining holes 32 for being formed in 1 carrier 30 as one kind consider include carrier 30 as one kind glass fibre direction and shape At.It is illustrated in the previous grinding carrier of the protrusion (notch) with convex form, such as in patent document 2, do not have The direction of notch is noticed, therefore in the case where 1 carrier forms multiple retaining holes, in the substrate support sector in Nick End portion Sometimes glass fibre protrudes in vertical direction.Therefore, it is ground or is handled using the carrier for having multiple retaining holes In the case where, for all substrates in batch, can not prevent and the contact of glass fibre outstanding in vertical direction.

The imaginary circles of a part are constituted to the center position of the imaginary circles from the wall portions of differently- oriented directivity wall portions 35 Imaginary circles radial direction on the maximum overhang of the 1st curved surface 37 of convex form be preferably 0.3~5mm, more preferably 1~ 3mm.In addition, the 1st curved surface 37 about convex form, as long as there is curved surface, as shown, can both have from convex form The part of the inside of 1st curved surface 37 is heaved and curved curved surface outward, can also having as shown in Figure 1 such as patent document 2 It is heaved and curved curved surface or plane inwardly from the outside of the 1st curved surface of convex form.Convex form the 1st curved surface 37 have from The part of the inside of 1st curved surface 37 of convex form heaves outward and in the case where curved curved surface, the radius of curvature R of curved surface Preferably 5~150mm, more preferably 10~50mm.The quantity of 1st curved surface of convex form is preferably 4 or more, and more preferably 8 More than a.

In the example shown in Figure 4, the 1st curved surface 37 of the convex form equipped with 8 insides towards retaining hole 32, but the 1st Configuration quantity on the week of curved surface 37 is not limited to 8.(a) of Fig. 7 is (b) chamfered shape for indicating the retaining hole 32 of carrier 30 as one kind Another figure.(b) shown such as (a) of Fig. 7, configuration quantity can be 6,10 etc..In this way, towards glass fibre In the wall surface of the two sides of the differently- oriented directivity wall portions 35 for 2 differently-s oriented directivity (X-direction, Y-direction) that (33,34) are orientated, only It is provided with the 1st curved surface 37 of convex form, then above-mentioned configuration quantity is unrestricted.

In turn, in the wall surface of the two sides of differently- oriented directivity wall portions 35, it can replace the 1st curved surface 37 of convex form and set Horizontalization face 38.(a) of Fig. 8~(c) is the chamfered shape of the retaining hole 32 of carrier 30 as one kind and another figure.As long as glass substrate The peripheral side wall surface of G is not abutted with differently- oriented directivity wall portions 35, and is abutted in the two sides of differently- oriented directivity wall portions 35, then such as Shown in (a) of Fig. 8~(c), in the chamfered shape of retaining hole 32, in 2 orientations being orientated towards glass fibre (33,34) Plane 38 can be formed in the wall surface of the two sides of the differently- oriented directivity wall portions 35 in direction (X-direction, Y-direction).Plane 38 with it is interior Circle of contact C connects.That is, the chamfered shape of retaining hole 32 can be the regular polygons or more such as regular hexagon, octagon, regualr decagon Side shape.In the example of the regular hexagon shown in (a) of Fig. 8,4 positions and positive six of differently- oriented directivity wall portions 35 can not be made The position on the vertex of side shape is corresponding, therefore as shown in (a) of Fig. 8, so that the position of differently- oriented directivity wall portions 35 is located at from just The mode for the position that the position on the vertex of hexagon is deviateed adjusts 2 orientation sides being orientated relative to glass fibre (33,34) To the direction of the regular hexagon of (X-direction, Y-direction).It similarly, can not in the example of the regualr decagon shown in (c) of Fig. 8 Keep 4 positions of differently- oriented directivity wall portions 35 corresponding with the position on the vertex of regualr decagon, therefore so that differently- oriented directivity wall surface The position of part 35 be located at the mode of position deviateed from the position on the vertex of regualr decagon adjust relative to glass fibre (33, 34) direction of the regualr decagon for 2 differently-s oriented directivity (X-direction, Y-direction) being orientated.

In addition, 4 positions of differently- oriented directivity wall portions 35 can be made in the example of the octagon shown in (b) of Fig. 8 Set corresponding with the position on the vertex of octagon, therefore so that the position of differently- oriented directivity wall portions 35 is located at the top of octagon The mode of the position of point adjusts positive the eight of 2 differently-s oriented directivity (X-direction, Y-direction) being orientated relative to glass fibre (33,34) The direction of side shape.

In the example shown in (a)~(c) of Fig. 8, in the inner peripheral wall of retaining hole 32, plane 38 and inscribed circle C phase It connects.It is outer with the inscribed circle C of the profile inscribe of the inner peripheral wall of retaining hole 32 by being respectively positioned on differently- oriented directivity wall portions 35 The mode of side sets the profile of retaining hole 32, thus the peripheral side wall surface of the glass substrate G in milled processed not with differently- oriented directivity Wall portions 35 abut, and abut in the two sides of differently- oriented directivity wall portions 35.That is, the differently- oriented directivity wall portions of retaining hole 32 The wall surface of the two sides of 35 circumferential direction along retaining hole 32 is plane 38, the outer peripheral sidewall of the glass substrate G in milled processed Face is abutted with the part of above-mentioned plane 38.Therefore, even if glass fibre (33,34) is from resin in differently- oriented directivity wall portions 35 Material exposes, and the case where end of glass fibre (33,34) and outer peripheral sidewall face contact of glass substrate G will not occurs, therefore It can prevent scar occur in the peripheral side wall surface of glass substrate G.Thereby, it is possible to inhibit the main surface attachment in glass substrate G Particulate etc. and form defect.

Also, the wall surface of the two sides of the circumferential direction along retaining hole 32 of the differently- oriented directivity wall portions 35 of retaining hole 32 can Not to be plane 38.Fig. 9 is the chamfered shape for the retaining hole for indicating carrier 30 as one kind and another figure.Can replace plane 38 and The 2nd curved surface 39 of radius of curvature greatly using radius of curvature than the inscribed circle C of the profile inscribe of the inner peripheral wall with retaining hole 30. 2nd curved surface 39 is convex form relative to the outside of retaining hole 32 (inside relative to retaining hole 32 is concave shape).2nd curved surface 39 connect with inscribed circle C.In this case, as shown, in the inner peripheral wall of retaining hole 32, differently- oriented directivity wall portions 35 are respectively positioned on the wheel that retaining hole 32 is set with the mode in the outside of the inscribed circle C of the profile inscribe of the inner peripheral wall of retaining hole 32 It is wide.To which the peripheral side wall surface of the glass substrate G in milled processed is not abutted with differently- oriented directivity wall portions 35, and is being orientated It is abutted in 2nd curved surface 39 of the two sides of direction wall portions 35.Therefore, even if in differently- oriented directivity wall portions 35 glass fibre (33,34) expose from resin material, and the end that glass fibre (33,34) will not occur and the peripheral side wall surface of glass substrate G connect The case where touching, therefore can prevent from generating scar in the peripheral side wall surface of glass substrate G.Thereby, it is possible to prevent in glass substrate G Main surface adhesion of particles etc. and form defect.

From the aspect of the mechanical strength for improving carrier 30 as one kind, the end of glass fibre (33,34) is preferably placed at retaining hole 32 inner peripheral wall 36.That is, preferably, the end of glass fibre (33,34) is located at the 1st curved surface 37, plane 38 or the 2nd curved surface 39 Face on.

But from further prevent glass substrate G peripheral side wall surface generate scar from the aspect of, be preferably located at The 1st curved surface 37, plane 38 or the 2nd curved surface 39 of the two sides of differently- oriented directivity wall portions 35 do not form the glass fibre of glass fabric The end of (33,34), and the end of glass fibre (33,34) is located at the outside of the profile relative to the profile of retaining hole 32.Position The 1st curved surface 37, plane 38 or the 2nd curved surface 39 in the two sides of differently- oriented directivity wall portions 35 are not differently- oriented directivity wall portions 35, so even the end of glass fibre (33,34) is located on the 1st curved surface 37, plane 38 or the 2nd curved surface 39, it is also difficult in glass The peripheral side wall surface of glass substrate G generates scar.But even if in differently- oriented directivity wall portions 35 glass fibre (33,34) from Resin material does not expose, and in grinding, the resin material surrounded around glass fibre (33,34) is abutted with glass substrate G When be slightly compressed, thus glass fibre (33,34) is sometimes prominent from resin material.It is sometimes above-mentioned also, in milled processed Resin material and glass substrate G rub and wear away resin material, so as to cause glass fibre (33,34) exposing.In such feelings Under condition, in order to inhibit the peripheral side wall surface in glass substrate G to generate scar, the end of preferably glass fibre (33,34) is opposite It is located at the outside of the profile of retaining hole 32 in the profile of retaining hole 32.In this case, from the mechanical strength for ensuring carrier 30 as one kind For viewpoint, the distance between the end of glass fibre (33,34) and the profile of retaining hole 32 are preferably less than 2 μm.In this way, last End does not reach the glass fibre (33,34) of the inner peripheral wall 36 of retaining hole 32 by using the etching solution for including fluoric acid and to dew It is etched and is made for the glass fibre (33,34) of the 1st curved surface 37 of carrier 30 as one kind, plane 38 or the 2nd curved surface 39. That is, preferably, it is strong by the glass fabric for configuring multiple glass fibres towards any direction in 2 differently-s oriented directivity Change, and the resin made of the glass fabric impregnating resin material dipping substrate formed retaining hole 32, formed retaining hole 32 it Afterwards, resin dipping substrate is etched and is made.

In addition, in the inner peripheral wall of the retaining hole 32 of carrier 30 as one kind, in the 1st curved surface 37, plane 38 or the 2nd curved surface 39, Glass fibre (33,34) is carried out using the etching process that is etched of etching solution for including fluoric acid, is then carried out using including The removal for the fluorine alkali aluminate that the acid electrolyte solution removal of metal ion is generated by etching process is handled.Firstly, By carrying out the etching process, there is the probability of scar in the peripheral end face that can be further decreased in glass substrate G.In turn, exist Above-mentioned removal processing is carried out after etching process, so that removal remains on the particulate of the fluorine alkali aluminate of carrier 30 as one kind, therefore Can prevent in grinding, the particulate of fluorine alkali aluminate enter between glass substrate G and upper flat plate 40 or lower plate 60 and The main surface of glass substrate G, which generates in the sputtering that scar or above-mentioned particulate are carried out when forming magnetosphere on glass substrate G, leads to It crosses in the main surface of glass substrate G and in magnetosphere manufacturing defect.

The 1st curved surface 37, plane 38 or the 2nd curved surface 39 of the two sides of differently- oriented directivity wall portions 35 are on the week of retaining hole 32 More than at 4, this disperse retaining hole 32 inner peripheral wall 36 abutted with the peripheral side wall surface of glass substrate G when power this It is preferred from a bit.In the case where the power of above-mentioned abutting is not dispersed and concentrated, carrier 30 as one kind is biggish by part Power and be locally deformed with, thus carrier 30 as one kind by damaged or glass substrate G enter carrier 30 as one kind deformation and in curved gap, The breakage of glass substrate G or grinding pad is likely to occur in grinding.

Also, from abutting the peripheral side wall surface of glass substrate G with differently- oriented directivity wall portions 35, and in differently- oriented directivity Inscribe for the point that the wall surface of the two sides of wall portions 35 reliably abuts, with the profile inscribe of the inner peripheral wall of retaining hole 32 The diameter of circle C is preferably, roughly the same with the circular plate shape for the glass substrate G to be ground or slightly bigger than it, constitutes glass base 1.002~1.031 times of the diameter of the circular plate shape of plate G.If smaller than the range, it is difficult to keep glass substrate sometimes In retaining hole or from retaining hole take out glass substrate operation.Also, if bigger than the range, work in-process glass substrate holds The inner peripheral wall for easily being abutted to retaining hole energetically is easy to appear scar in end face.

In Fig. 1 and grinding device shown in Fig. 2, grinding pad is pasted onto upper flat plate 40 or lower plate 60, but can also Mo are Dinged so that Gu is arranged in upper flat plate 40 or lower plate 60, and are supplied between glass substrate G and upper flat plate 40 or lower plate 60 Refrigerant.Also, carrier 30 as one kind can also be used in the grinding attachment of grinding glass substrate G other than grinding device.

Such carrier 30 as one kind can be used in grinding device, and then be used in and be configured to roughly the same with the grinding device The grinding attachment of structure, thus suitable for the manufacture of glass substrate for disc as shown below.In the mill using glass substrate In the grinding of turning device, compared with grinding, the roughness Ra of the main surface of glass substrate after grinding is larger.In such grinding In, the main table of glass substrate can be ground to supplying grinding fluid between upper flat plate and each plate and glass substrate of lower plate Face.Alternatively, Gu can be arranged in each plate of upper flat plate and lower plate Dings Mo, and to the Gu Ding Mo supply between glass substrate The main surface of glass substrate is ground to lubricating fluid.

(manufacturing method of substrate for magnetic disc)

Manufacturing method according to the present embodiment, firstly, become the disk glass of the plate with a pair of of main surface The forming processes of the glass blank of the raw material of glass substrate.Then, the corase grinding for carrying out the glass blank cuts processing.Later, to glass Glass blank carries out shape processing processing and end surface grinding processing.Later, Mo are Dinged to the glass obtained from glass blank using Gu Glass substrate carries out fine ginding processing.Later, glass substrate is carried out at the 1st milled processed, chemical intensification treatment and the 2nd grinding Reason.In addition, in the present embodiment, although being carried out by above-mentioned process, without all carrying out above-mentioned processing, for this A little processing can be omitted suitably.Also, the sequence of processing can be suitably changed.In the following, being illustrated to each processing.

(a) molding of glass blank

In the molding of glass blank, such as extrusion forming method can be used.By extrusion forming method, circular glass can get Glass blank.In turn, natural feather can be used to draw method, redraw method, fusion method, floating method etc. well known to manufacturing method and manufactured. The plate glass blank manufactured and to manufacturing method as well known to these suitably carries out shape processing, so as to obtain structure At the disk-shaped glass substrate of the basic components of glass substrate for disc.

(b) corase grinding is cut

In corase grinding is cut, specifically, glass blank is maintained to the main table in retaining hole and carrying out the two sides of glass blank The grinding in face, which, which is set to be mounted on, has well known to planetary gear mechanism identical with Fig. 1 and device shown in Fig. 2 The holding member (carrier) of double-side grinding apparatus.At this point, above-mentioned carrier 30 as one kind can be used.As grinding agent, such as trip can be used Li Mo.The flat of the plate thickness size for making glass blank approximately be used as target and main surface is ground in corase grinding is cut Degree.In addition, according to molding glass blank dimensional accuracy or surface roughness and carry out corase grinding and cut, according to circumstances can also be with It is cut without corase grinding.

(c) shape processing

Then, shape processing is carried out.In shape processing, after forming glass blank, well known processing side is utilized Method and the circular hole that is centrally formed in glass blank, to obtain the glass substrate for punching the circular plate shape of circular hole.Later, glass is carried out The chamfered of the end face of glass substrate.That is, by the processing for carrying out (a)~(c) to glass blank, so as to manufacture circular plate type The glass substrate of shape.

(d) end surface grinding

Then, the end surface grinding of glass substrate is carried out.End surface grinding be for example to the end face of abrasive brush and glass substrate it Between supply including You Li Mo lapping liquid and move abrasive brush and glass substrate relatively, thus the processing ground. In end surface grinding, using the inner circumferential side wall surface of glass substrate and peripheral side wall surface as grinding object, by inner circumferential side wall surface and outside All side wall surfaces are as mirror status.

(e) fine ginding

Then, fine ginding is carried out to the main surface of glass substrate.Preferably, use has pasted Gu and Dings Mo in fine ginding Plate, and using planetary gear mechanism identical with Fig. 1 and grinding device shown in Fig. 2 double-side grinding apparatus and to glass The main surface of substrate is ground.In such a situation it is preferred that for instead of the combination of You Li Mo and grinding pad and use is equipped with Gu Ding Mo plate and refrigerant combination.Specifically, glass substrate is being maintained to the holding as double-side grinding apparatus Component in the retaining hole of above-mentioned carrier 30 as one kind, and and Ding the main surface for the two sides that Mo are ground glass substrate using Gu. It is such as 10 μm~200 μm degree according to the substitution amount of grinding.The load applied by plate to substrate is preferably 100~ 250g/cm²。

In the fine ginding of present embodiment, and making includes that Gu is Dinged Mo grinding surfaces and contacted with the main surface of glass substrate The main surface of glass substrate is ground, but You Li Mo also can be used and be ground.

(f) the 1st grinding

Then, the 1st grinding is carried out to the main surface of glass substrate.Specifically, the peripheral side wall surface of glass substrate is kept In the retaining hole 32 of carrier 30 as one kind for being set to Fig. 1 and grinding device shown in Fig. 2, and the main surface of the two sides to glass substrate G It is ground.In the 1st grinding, using You Li Mo, and the grinding pad for being pasted on plate is used.1st grinding is for removing Such as by Gu Ding Mo be ground in the case where remain on slight crack, the skew of main surface.In the 1st grinding, main table is prevented The shape of face end is exceedingly recessed or protrudes, and reduces the surface roughness of main surface, such as arithmetic mean roughness Ra.And And main surface becomes mirror surface.

It is not particularly limited about You Li Mo for being used in the 1st grinding, such as uses Yangization Shi Mo or Yangization Gao Mo Grain etc..

Type about grinding pad is not particularly limited, such as polishes object using hard foamed urethane resin.

(g) chemical strengthening

Chemical strengthening appropriate is carried out to glass substrate using well known method.It can suitably determine to carry out chemical strengthening Periodically.About chemical strengthening, can carry out as needed, it can also be without the chemical strengthening.

(h) the 2nd grinding (final grinding)

Then, the 2nd grinding is carried out to the glass substrate after chemical strengthening.The purpose of 2nd grinding is to realize main surface Further low roughness, low bulk.Use and the two sides grinding device used in the 1st grinding in the 2nd grinding The two sides grinding device of mutually isostructural planetary gear mechanism.Specifically, the peripheral side wall surface of glass substrate is maintained at and is set to In the retaining hole 32 of the carrier 30 as one kind of grinding device shown in Fig. 1~3, and the main surface of the two sides of glass substrate G is ground. Thereby, it is possible to prevent the shape of the end of main surface to be exceedingly recessed or protrude, and reduce the roughness of main surface.It is ground the 2nd In mill, compared with the 1st grinding, the hardness of the resin finish object of type, particle size and grinding pad that You Li is Mo is different.

As being used in You Li Mo of the 2nd grinding, such as the particulates such as colloidal silicon dioxide are used.It is ground by cleaning The glass substrate of mill, to obtain glass substrate for disc.

2nd grinding is without must carry out, but from the horizontal of the concave-convex surface of the further main surface for improving glass substrate For point, the 2nd grinding is preferably carried out.In this way, having carried out the glass substrate of the 2nd grinding becomes glass substrate for disc.

Cut in the corase grinding carried out using grinding attachment or grinding device, fine ginding, the 1st grinding and the 2nd grinding at least In one milled processed, the upper flat plate and lower plate from up and down direction clamping glass substrate G are used.By to keep at grinding In the side wall surface of the retaining hole 32 of glass substrate G used in reason, differently- oriented directivity wall portions 35 are respectively positioned on and retaining hole 32 The mode in the outside of the circular shape of the profile inscribe of inner peripheral wall sets the profile of retaining hole 32, thus the glass in milled processed The peripheral side wall surface of glass substrate G do not abut with differently- oriented directivity wall portions 35, but differently- oriented directivity wall portions 35 along The two sides of the circumferential direction of retaining hole 32 abut.As preferred mode, the differently- oriented directivity wall portions 35 of retaining hole 32 along The wall surface of the two sides of the circumferential direction of retaining hole 32 is constituted shown in (a)~(c) of the 1st curved surface 37 of convex form shown in Fig. 4, Fig. 8 Plane 38 or the 2nd curved surface 39 shown in Fig. 9.The peripheral side wall surface and the 1st curved surface 37 of glass substrate G in milled processed are put down Face 38 or the 2nd curved surface 39 abut, and do not abut with differently- oriented directivity wall portions 35.Therefore, it is able to suppress in the periphery of glass substrate G Side wall surface generates scar, and then inhibits to form defect in the main surface of glass substrate G.

2nd embodiment

Then, to the manufacturing method and disk base of the milled processed carrier of the 2nd embodiment, milled processed carrier The manufacturing method of plate is described in detail.

The research of people is it is found that the carrier recorded in using patent document 1 and the feelings being ground through the invention Under condition, adhere to foreign matter and contaminated or occur scratch (small scar) in the main surface of glass substrate.Specifically, using formation After having the carrier of above-mentioned retaining hole buffer area and being ground it is found that under intensity near the inner wall of retaining hole Drop, so that a part for constituting the resin material of carrier is fallen off and (is lacked), the main surface of the glass substrate after milled processed Adhere to foreign matter Er Bei sewage dye.Also, scratch also is formed in the main surface of glass substrate sometimes.Also, the present inventor studies conscientiously Later, clearly obtain itself the reason is as follows that：In the cricoid region in the outside of the inner wall of retaining hole, glass fibre is gone completely It removes, to lose the strengthening effect realized according to glass fabric, the intensity near the inner wall of retaining hole is caused to decline, and In milled processed, conflict or crimping is repeated in the retaining hole buffer area of carrier in glass substrate, to constitute retaining hole A part of the resin material of buffer area is fallen off, and is contaminated and is entered between glass substrate and plate, thus glass base The main surface of plate is contaminated or generates scratch.Also, by repeating to test, grinding for aspect as follows is as a result invented Grind processing carrier, the manufacturing method of milled processed carrier and the manufacturing method of substrate for magnetic disc.

(milled processed carrier)

The carrier 1 of Figure 10 expression present embodiment.

Carrier 1 is used in aftermentioned grinding processing (corase grinding cuts processing and fine ginding processing) and milled processed (at the 1st grinding Reason, the 2nd milled processed) in keep as the glass substrate for being ground object or grinding object.In addition, in the present embodiment, In the case where being merely called milled processed, it is interpreted as further including the concept for being ground processing.Carrier 1 has for keeping glass base Multiple retaining holes 3 of plate.

Carrier 1 includes that resin impregnates substrate, and resin dipping substrate has glass fabric and is impregnated in the glass fabric Resin material, in above-mentioned glass fabric, multiple glass fibres are configured towards any a direction in 2 differently-s oriented directivity, and And above-mentioned glass fabric enhancement vector 1.

It is not particularly limited about glass fabric, can be used well known glass fabric, such as can be used and will be used as glass Fabric made of multiple organdy plain weaves of the beam of fiber.In the glass fabric being plainly woven, multiple organdies are toward each other just 2 differently-s oriented directivity handed over.In addition, in the present embodiment, in the case where being called orthogonal, in addition to 2 differently- oriented directivity shapes are in 90 ° The case where except, further include 2 differently-s oriented directivity formed substantially 90 ° (for example, 70~110 °, 78.75~101.25 °, 80~ 100 °) the case where.Also, 2 differently-s oriented directivity are either orthogonal differently- oriented directivity, are also possible to non-orthogonal each other take To direction (for example, the direction for forming 60 ° or 120 ° each other).Material about glass fibre is not particularly limited, such as using Aluminosilicate glass.

It is to be understood that resin material is impregnated in glass in a manner of surrounding each glass fibre in resin dipping substrate Glass fabric connects directly with one another but it is also possible to be a part of glass fibre.It is not particularly limited, such as makes about resin material With thermosetting resins such as epoxy resin, phenolic resins.Resin impregnates substrate and is made by well known method, such as by such as Lower method and obtain：In glass fabric impregnating resin material, by the prepreg obtained and resin material is dried with Make the consistent mode of the differently- oriented directivity between prepreg that multiple (for example, 5) be laminated, and is crimped.About glass fibre Diameter is not particularly limited, and for example, 5~10 μm.It is not particularly limited about the glass fabric being plainly woven, the thickness of organdy (along the width of the organdy of the in-plane of carrier) is, for example, 200~700 μm, and the thickness of organdy is (along the plate of carrier The organdy width of material thickness direction) it is, for example, 40~90 μm, the mutual interval (gap) of organdy is, for example, 300~700 μm.

The carrier 1 of present embodiment is in the same manner as the carrier 30 as one kind of the 1st embodiment, by including being oriented at least one direction Glass fibre and the composite material of resin material formed, and have clamping disk-shaped substrate by upper flat plate and lower plate and For keeping the retaining hole 3 of substrate when being ground to a pair of of main surface of substrate.Inner wall of the retaining hole 3 in retaining hole 3 Have on the week in face (inner peripheral wall) 5 and is constituted in a manner of making substrate and fiber contacts in the state that retaining hole 3 keeps substrate The 1st wall portion and constituted in a manner of making the substrate not with fiber contacts the 2nd wall portion (aftermentioned 1st inner wall 5a, in the 2nd Wall surface 5b).2nd wall portion is formed in the inner peripheral wall of retaining hole 3 towards the differently- oriented directivity for the fiber for including a direction Part.Also, the carrier 30 as one kind of the 2nd embodiment is characterized in that, in the inner peripheral wall from retaining hole 3 to the radius of retaining hole 3 The cricoid region 7 that the outside in direction extends be configured with relative to the 2nd wall portion be set to retaining hole radial direction outside and There is no the fibers of fiber, and region (aftermentioned 1st strengthening region 11, the 2nd strengthening region 13) is not present for differently- oriented directivity.

As shown in figure 12, from the cricoid region 7 that the inner wall 5 of retaining hole 3 extends outward, the 1st of carrier 1 is strengthened Region 11 and the 2nd strengthening region 13 are separated from each other and alternately configure in the circumferential direction of retaining hole 3.Figure 12 is that concern is cricoid Region 7 and the figure for indicating the retaining hole 3 of carrier 1.In addition, in Figure 12, for ease of description, instead of the glass for constituting glass fabric Glass yarn and illustrate 1 glass fibre for regarding 1 organdy as, and by the width in cricoid region 7 (along the straight of retaining hole 3 The length of diameter direction length) it exaggerates and expands and indicate.In the present embodiment, in addition to particularly illustrating in advance the case where it Outside, the inner wall of retaining hole indicates to delimit the inner wall of retaining hole.Also, the outside of inner wall extends outward from inner wall Refer to, in the composite material for constituting carrier, is extended to along the in-plane of carrier 1 from inner wall from retaining hole 3 Central part is towards the part of the composite material on the direction in the outside of the radial direction of retaining hole 3, in other words, indicates from inner wall To the outside of radial direction of retaining hole 3, there are defined width.

Width (along the length of the radial direction of retaining hole 3) about cricoid region 7 is not particularly limited, for example, 2~10 μm.1st strengthening region 11 only passes through a side in 2 differently-s oriented directivity (x-direction and y-direction shown in Figure 12) of direction It is reinforced to the 1st glass fibre 21 of (X-direction).In addition, the 2nd strengthening region 13 only by towards differently- oriented directivity another 2nd glass fibre in direction (Y-direction) and be reinforced.In other words, in the 1st strengthening region 11, the 2nd glass fibre is only removed 23, in the 2nd strengthening region 13, only remove the 1st glass fibre 21.In addition, strengthening the glass fibers of each strengthening region (11,13) The aspect that dimension (21,23) is not limited to what is shown in figure 12 in each strengthening region (11,13), is deposited according to the diameter of the glass fibre At 1 or more.In the 1st strengthening region 11, the 2nd glass fibre 23 is removed, to be formed by (not scheming with multiple recess portions Show) resin material constitute part, the recess portion for the differently- oriented directivity of the 2nd 23 directions of glass fibre (substantially with inner wall Vertical direction) extend shape.Also, in the 2nd strengthening region 13, the 1st glass fibre 21 is removed, to be formed similarly The part being made of the resin material with multiple recess portions (not shown).In addition, in the present embodiment, it is being called only by the It further include in the 1st strengthening region, the 2nd glass fibre exists to lack at least part of state in the case that 2 is glass fiber-reinforced The case where.It similarly, further include the 1st glass in the 2nd strengthening region in the case where being called only glass fiber-reinforced by the 1st Glass fiber with lack at least part of state there are the case where Ru.It ties the glass fibre from tens of to thousands of and forms yarn. In the present embodiment, exist on the surface of inner wall towards laterally (the differently- oriented directivity generally perpendicular direction with glass fibre) Yarn in the case where, even if the fibril (1 glass fibre) of a part on its surface is etched, but most fibril is residual It stays.Therefore, the intensity of carrier is almost maintained.

As shown in figure 13, the position of the 1st strengthening region 11 and the 2nd strengthening region 13 in cricoid region 7 is preferably set It is set to as follows：In the circumferential direction substantially to configure at equal intervals each other, and with any in 4 strengthening regions (11,13) it is Benchmark is located at (around central part) around the center of retaining hole 3 and forms 0 °, 90 °, 180 °, the position in 270 ° of direction, and Be preferably placed at relative to formed around the center of retaining hole 30 °, 90 °, 180 °, 270 ° of direction and respectively in ± 20 ° of (examples Such as, ± 11.25 °, ± 10 °) range position.It can reliably be removed and retaining hole 3 from strengthening region (11,13) as a result, The substantially orthogonal glass fibre of inner wall 5, and in other cricoid region 7 (in cricoid region 7, in addition to strengthening region (11,13) region except) in can ensure glass fibre.Figure 13 is the retaining hole paid close attention to cricoid region 7 and indicate carrier 1 3 figure.

It in the present embodiment, include two the 1st strengthening regions 11 and two the 2nd strengthening regions in cricoid region 7 13, and the quantity of the 1st strengthening region and the 2nd strengthening region is determined according to the angle that 2 differently-s oriented directivity are constituted.In addition, In addition to the 1st strengthening region 11 included by 1 cricoid region 7 and the portion in the cricoid region 7 other than the 2nd strengthening region 13 Points 15 identically as the part of carrier 3 in outside in cricoid region 7, by both the 1st organdy and the 2nd organdy by Strengthen.

1st strengthening region 11 is set to the differently- oriented directivity (court towards the 2nd glass fibre 23 in the inner wall 5 of retaining hole 3 To differently- oriented directivity) the 1st inner wall part 5a outside.In addition, the 2nd strengthening region 13 be set in inner wall 5 towards the 1st glass The outside of 2nd inner wall part 5b of the differently- oriented directivity (towards differently- oriented directivity) of fiber 21.In addition, in addition in the 1st inner wall part 5a and the 2nd Except wall portion 5b (being the 2nd wall portion), the part of the inner wall 5 of retaining hole 3 is the 1st wall portion.In other words, in retaining hole 3 In wall surface 5, the 1st inner wall part 5a and the 2nd inner wall part 5b be in the state that glass substrate is maintained at retaining hole 3 with glass substrate not The fiber contact surface constituted with the mode of fiberglass particle contact, the in addition portion other than the 1st inner wall part 5a and the 2nd inner wall part 5b Dividing is the fiber contact surface constituted in a manner of glass substrate and fiberglass particle contact in the above-described state.

In the present embodiment, inner wall part refers to inner wall part towards differently- oriented directivity, in other words, in expression towards differently- oriented directivity Wall portion towards differently- oriented directivity or the normal direction of inner wall part towards differently- oriented directivity or in the manufacturing process of carrier, out of plate Wall portion fiber orientation vertical direction and expose or prominent (flying out) to vertical direction.Vertical direction described herein refers to, relatively The normal direction of inner wall part and in the in-plane of carrier ± 20 ° (for example, ± 11.25 °, ± 10 °) range direction. In the case where being called inner wall part towards differently- oriented directivity, in addition to the inner wall part in the position for the inner wall part reported to the leadship after accomplishing a task with differently- oriented directivity Except the situation orthogonal with differently- oriented directivity (center line) of wiring direction, further include centered on the direction orthogonal by this ± The case where differently- oriented directivity of the angular range of 20 ° (for example, ± 11.25 °) is reported to the leadship after accomplishing a task.In other words, in addition to reporting to the leadship after accomplishing a task with differently- oriented directivity Except the normal direction of inner wall part in the position of inner wall part and the differently- oriented directivity unanimous circumstances, further include and with the orientation side The differently- oriented directivity unanimous circumstances in above-mentioned angular range centered on.Also, inner wall part towards glass fibre take To direction indicate opposed inner walls portion wiring direction and glass fibre generally perpendicularly direction outstanding.

In carrier 1, the end that the 1st strengthening region 11 is formed as the 2nd glass fibre 23 does not reach the inner wall of retaining hole 3 The end that 5, the 2nd strengthening region 13 is formed as the 1st glass fibre 21 does not reach the inner wall 5 of retaining hole 3.In other words, according to the 2nd The end of glass fibre 23 and a part for determining the range of the 1st strengthening region 11, determine according to the end of the 1st glass fibre 21 A part of the range of fixed 2nd strengthening region 13.

Carrier 1 more than use and when carrying out the milled processed of glass substrate, there is no the inner walls 5 from retaining hole 3 To the glass fibre of generally perpendicular direction prominent (flying out), therefore the end face in milled processed in glass substrate can be prevented Generate scar.In addition, existing in the 1st strengthening region 11 and the 2nd strengthening region 13 towards with opposed inner walls face 5 and towards substantially hanging down The glass fibre in the different direction of the glass fibre in straight direction, so that it is guaranteed that the intensity near the inner wall 5 of retaining hole 3.Cause This, can prevent the part near the inner wall 5 being made of the resin material with multiple recess portions in milled processed by external force Conflict, crimping, the friction of inner wall etc. of glass substrate (opposite) and be stripped, thus from carrier Tuo From.Therefore, it can inhibit tree Rouge material is contaminated and enters between glass substrate and plate and is attached to the main surface of glass substrate or the master in glass substrate Surface generates scratch.

Also, be present in the glass fibre of the 1st strengthening region and the 2nd strengthening region towards opposed inner walls face and it is substantially vertical Direction (for example, substantially parallel direction), so even being contacted in milled processed with the end face of glass substrate, with glass base The end face of plate contacts relative to the mode that the glass fibre slides and is rotated, and therefore, it is difficult to generate scar.

In carrier 1, the 1st strengthening region 11 and the 2nd strengthening region 13 are not necessarily to all retaining holes being set to include in carrier 1 3 inner wall 5 can only be set to the inner wall 5 of the retaining hole 3 of a part.In this case, only it is being equipped with the 1st strengthening region The retaining hole 3 of 11 and the 2nd strengthening region 13 keeps glass substrate and is ground.

(manufacturing method of milled processed carrier)

In the following, being illustrated to the manufacturing method of milled processed carrier.

The manufacturing method of the milled processed carrier of present embodiment includes machining (step 1 is rapid) and etching process (second step).

In machining, retaining hole 3 is formed in above-mentioned resin dipping substrate.Specifically, according to slotting cutter to tree Rouge impregnates substrate and carries out machining, makes the peripheral shape and retaining hole of carrier as shown in Figure 10.Figure 11 is concern one Retaining hole and the perspective view for indicating carrier shown in Fig. 10.In addition, in Figure 10, for ease of description, by the shape shape of carrier Shape is expressed as the form different from Figure 11.At this point, being cut in resin dipping substrate along the peripheral shape of carrier, retaining hole The glass fibre of disconnected glass fabric.In machining, the dipping substrate overlapping of multiple resins is configured in an etching process In the case of, from the aspect of aftermentioned mask material is arranged and is easily coated with etchant, preferably not to impregnate base in resin The consistent mode of the differently- oriented directivity of glass fibre is set to form retaining hole 3 between plate.For example, being overlapped resin in alignment orientation direction After impregnating substrate (plate), form retaining hole through multiple resins dipping substrate.Productivity can be improved as a result,. After carrying out machining, deburring can be carried out.

In an etching process, it impregnates substrate to the resin for being formed with retaining hole 3 to be at least etched, to make carrier. For example, by being cleaned, being dried, thus making carrier after being etched.In an etching process, specifically, it is protecting Hold the inner wall part (carrier shown in Figure 12 in any a direction of the differently- oriented directivity towards glass fibre in the inner wall 5 in hole 3 In, the part of the inner wall as shown in symbol 5a, 5b), the glass fibre exposed in a manner of towards the differently- oriented directivity is carried out Etching, so that the cricoid region 7 that extends outward of inner wall 5 in the retaining hole 3 from carrier forms strengthening region, the reinforcing Region is only reinforced by the glass fibre of the differently- oriented directivity different from the differently- oriented directivity for the glass fibre being etched.In short, As shown in figure 12, by the 2nd glass fibre 23 exposed in the 1st inner wall part 5a and the 1st glass exposed in the 2nd inner wall part 5b Fiber 21 is etched, to form the 1st strengthening region 11 and the 2nd strengthening region 13.In addition, in the present embodiment, in list In the case where being called exposing purely, other than the case where end of glass fibre is located at inner wall, further include from inner wall towards The prominent situation in inside.

In an etching process, the resin for being cut processing dipping substrate is impregnated into such as etchant, and to by cutting The glass fibre cutting processing and exposing is etched.In the present embodiment, include resin dipping substrate in fiber in, It only removes in a part (part for constituting the 2nd wall portion) of inner wall to the fiber of vertical direction prominent (flying out), therefore Fiber is woven in the major part of inner wall, i.e., towards the fiber of any differently- oriented directivity to be remained by remaining state, It can prevent the intensity of carrier from declining.Etchant in the case where about being etched by Jin Stains, as long as relatively Fiber and with etching etchant, be not particularly limited.In the case where etching glass fibre, such as it is preferable to use Etchant including fluoric acid, fluorine compounds.Example as the etchant for including fluoric acid can also enumerate fluorine other than fluoric acid Silicic acid etc..As the example of fluorine compounds, ammonium fluoride (NH can be enumerated₄F), ammonium acid fluoride (NH₅F₂) etc..And it is possible to by fluorine The mixed acid that the strong acid of acid, sulfuric acid, nitric acid etc. mixes is used as etchant, and then may also include viscosity modifier, solvent etc.. Also, above-mentioned substance can also be properly mixed and be used.It is etched resin impregnated material is impregnated into etchant In the case where, such as the etchant including fluoric acid and sulfuric acid can be used.In such a situation it is preferred that the concentration for fluoric acid be 0.01~ 2.0%, the concentration of sulfuric acid is 0.02~4.0% degree.In addition, in the present embodiment, % indicates mass percent.About leaching It the Stains time, can be according to the etch quantity of the glass fibre diametric length of the 2nd strengthening region 13 (the 1st strengthening region 11), erosion It carves the concentration of agent and suitably determines, such as preferably less than 60 minutes.If the excessive concentration of etchant or standing time are too long, By etching damage etc. occurs for the fiber that can then remove necessary degree or more in resin portion, thus the inner wall of retaining hole Intensity decline, in grinding, the resin of inner wall is easy to be stripped in grinding.

Etching process is not limited by Jin Stains and carries out, such as can also be coated with etchant in resin impregnated material and carry out Etching.About coatings, the coater units such as brush both can be used and carried out, can also be carried out by sprayer it is spraying equal into Row.As etchant in this case, such as use the aqueous solutions such as fluoric acid, ammonium acid fluoride or ammonium acid fluoride.About etchant The standing time of resin impregnated material after concentration, coating, as long as suitably setting, but out of, retaining hole that remain above-mentioned For the viewpoint of the intensity of wall surface, such as the concentration of etchant is preferably 0.1~20wt%.Also, the standing time after being coated with Preferably less than 60 minutes.

About etching process, other than above-mentioned Jin Stains, coating, can also be carried out by spray etc..

In an etching process, can also before etching is performed, the part of the formation strengthening region in cricoid region 7 Mask material (not shown) is arranged in part 15 (referring to Fig.1 2) in addition, and after the etching, removes mask material.As a result, by Etchant protects the part to be formed other than the part of strengthening region, and prevents from being etched in the segment glass fiber.Also, pass through Carrier 1 can be made using mask agent, such as by Jin Stains, spray.As mask material, such as use adhesive tape, resin layer. As the resin of resin layer, polytetrafluoroethylene (PTFE), epoxy resin etc. are used.In addition, about being arranged on the inner wall of mask material Usually there is folding line corresponding with the differently- oriented directivity of glass fibre in the main surface of carrier in position, therefore can be by visual observation and true Recognize these directions, and is thus set.In the case where Jin Stains, preferably by the main surface of the masks carrier such as resin.Also, make For mask, the plate (resin dipping substrate) of other composite materials can also be laminated.By stacking, carrier manufacture can be improved Efficiency simultaneously reduces cost.

In an etching process, instead of to above-mentioned etchant Jin Stains process, the ring-type of substrate can also be impregnated in resin Region 7 in the part of formation strengthening region be coated with above-mentioned etchant and be etched.Thereby, it is possible to only in the ring-type of carrier Region 7 in it is desired be formed as strengthening region part etching glass fibre.In addition, the position about coating etchant, with The confirmation method that the position of mask material is arranged in the same manner, can confirm glass in the folding line that the main surface of carrier occurs by visual observation The differently- oriented directivity of glass fiber, to be set.

In an etching process, preferably before etching is performed, it is overlapped on plate thickness direction and configures resin dipping Substrate (the 1st plate) and one or more other substrates, the others substrate have holding in the formation with resin dipping substrate The position in hole 3 is formed with retaining hole at corresponding position.As a result, in etching, prevent the main surface of resin dipping substrate sudden and violent It is exposed to etchant, avoids the intensity of carrier from declining and impregnating the glass fibre of main surface of substrate to resin and being etched. Other substrates, can also be with either the resin for manufacture carrier identical with above-mentioned carrier 1 impregnates substrate (the 2nd plate) It is the illusory substrate used to protect the main surface of the 1st plate.Illusory substrate can both be clamped to the 1st plate Mode is configured at the two sides of the 1st plate, and the 1st plate can also be configured to the two sides of illusory substrate.Other substrates and the 1st Plate is during etching according to for temporary adhesive being fixed temporarily each other etc. is glued.

Preferably, it when configuring multiple resins dipping substrate (the 1st plate and the 2nd plate) overlapping, is impregnated in resin Make the differently- oriented directivity of glass fibre consistent between substrate.Between multiple resins dipping substrate, in taking relative to glass fibre To in the identical situation of forming position of the retaining hole 3 in direction, can simply carry out that above-mentioned cover is arranged in the state of stacking Mold materials and the process for being coated with etchant.

The milled processed carrier of above embodiment or the load manufactured by the manufacturing method of milled processed carrier Body is for example used in the manufacturing method of aftermentioned substrate for magnetic disc, such as also can be used in glass such as aluminum substrate, silicon wafers In the manufacture of substrate other than substrate.

Also, milled processed carrier described above or the load manufactured by the manufacturing method of milled processed carrier Body not only can be used in milled processed, can also be used in grinding processing.For example, in the system of aftermentioned substrate for magnetic disc Make in method, can be used cut in corase grinding, fine ginding, the 1st grinding, the 2nd grinding etc. by planetary gear move grinding or grinding In the entire processing of main surface.

(manufacturing method of substrate for magnetic disc)

In the following, being illustrated to the manufacturing method of the substrate for magnetic disc of present embodiment.

This manufacturing method has following milled processed：In above explained milled processed carrier or pass through milled processed In the state that the milled processed manufactured with the manufacturing method of carrier keeps glass substrate with carrier, the main surface of substrate is carried out Grinding.In the following description, refer in the case where being called carrier, above explained milled processed carrier or pass through grinding The manufacturing method of processing carrier and the carrier manufactured.

It is as follows to the summary description of the manufacturing process carried out in present embodiment：Firstly, be used to form has a pair The forming processes of the glass blank of the plate of main surface.Glass blank becomes the raw material of glass substrate for disc.Then, to this Glass blank carries out corase grinding and cuts processing.Later, shape processing processing is carried out to glass blank and forms glass substrate, and then carried out End surface grinding processing.Later, Mo are Dinged to glass substrate progress fine ginding processing using Gu.Later, glass substrate is carried out 1st milled processed and the 2nd milled processed.In addition, in the present embodiment, although being carried out by above-mentioned process, for upper State process, the type of processing is not construed as limiting, also, as needed, can suitably omit above-mentioned processing.In the following, to above-mentioned each processing And it is illustrated.

(a) forming processes of glass blank

At the forming site in reason, such as formed using extrusion forming method.It is obtained by extrusion forming method disk-shaped Glass blank.It can replace pressurization and forming method well known to drawing method using natural feather, redrawing method, fusion method etc. and manufacture glass Glass blank.Suitably apply aftermentioned shape processing processing to by plate glass blank prepared by these methods, to obtain The disk-shaped glass substrate of basic components as glass substrate for disc.

(b) corase grinding cuts processing

Then, it carries out corase grinding and cuts processing.It is cut in processing in corase grinding, above-mentioned glass blank is maintained at double-side grinding apparatus Carrier, and the main surface of the two sides of glass blank is ground.Specifically, glass blank is maintained to the holding set on carrier Hole, and be clamped between upper flat plate and lower plate, while supply includes the grinding fluid of grinding agent, make in upper flat plate or lower plate Either one or two of or both moving operation, to make glass substrate and each plate relatively move, thus to two of glass substrate Main surface is ground.As grinding agent, such as use You Li Mo.It is cut in processing in corase grinding, glass blank is ground to greatly It causes close to as the plate thickness size of target and the flatness of main surface.In addition, according to molding glass blank size Precision or surface roughness and carry out corase grinding and cut processing, and the corase grinding is cut processing and can be suitably omitted.

(c) shape processing is handled

Then, shape processing processing is carried out.In shape processing processing, by well known processing method in glass blank Circular hole is formed, to obtain the round-meshed disk-shaped glass substrate of tool.Later, at the chamfering of end face for carrying out glass substrate Reason.Two end faces of inner circumferential side and peripheral side to glass substrate carry out chamfered.By carrying out chamfered, in glass base The fillet surface that the end face of plate forms the side wall surface orthogonal with main surface and couples side wall surface with main surface (via face).

(d) end surface grinding is handled

Then, the end surface grinding processing of glass substrate is carried out.In end surface grinding processing, to abrasive brush and glass substrate Supply includes You Li Mo lapping liquids between end face, keeps abrasive brush and glass substrate opposite on the thickness direction of glass substrate Ground is mobile, to be ground.It is handled by end surface grinding, the end face of inner circumferential side and peripheral side to glass substrate is ground Mill, to become mirror status.

(e) fine ginding is handled

Then, fine ginding processing is carried out to the main surface of glass substrate.In fine ginding processing, it is preferable to use in plate It has pasted Gu and has Dinged Mo double-side grinding apparatus, the main surface of glass substrate has been ground.Specifically, in addition to replacing above-mentioned trip Li Mo and using Gu Ding Mo other than the point that is ground, cut processing with above-mentioned corase grinding and be almost universally ground glass substrate Two main surfaces.Glass substrate is maintained at the carrier of above embodiment, and planetary gear fortune is carried out in double-side grinding apparatus It moves and is ground.In the carrier, near the inner wall part of the differently- oriented directivity towards glass fibre, there is no take towards this To the glass fibre in direction, therefore prevent from generating scar in the end face of glass substrate in fine ginding processing.Also, the carrier is logical It crosses the glass fibre of the differently- oriented directivity different from the glass fibre and is reinforced, thereby, it is ensured that strong near the inner wall of retaining hole Degree, to inhibit the generation of the pollution as caused by resin material.In the fine ginding processing, makes to be pasted with Gu and Ding Mo plates Grinding surface contacts and is ground the main surface of glass substrate with the main surface of glass substrate, can also instead, using free Mo and be ground.

(f) the 1st milled processed

Then, the 1st milled processed is carried out to the main surface of glass substrate.About the 1st milled processed, well known two sides is used Glass substrate is held in carrier and ground to the main surface of the two sides of glass substrate by grinding device.In the 1st milled processed In, using You Li Mo, contacts the grinding pad for being pasted on plate with the main surface of glass substrate and ground.About trip Li Mo are not particularly limited, such as use Yangization Shi Mo or Yangization Gao Mo etc..In the 1st milled processed, such as make Mo are Dinged with Gu in the case where being ground, and removal remains on the slight crack of main surface, skew or handles by crystallization and exists The small concave-convex surface that main surface generates.By appropriate adjustment substitution amount, to prevent the shape of the end of main surface excessive Ground recess is prominent, and can reduce the surface roughness of main surface, such as arithmetic mean roughness Ra.

(g) the 2nd grinding (mirror ultrafinish) processing

Then, the 2nd milled processed is carried out.The purpose of 2nd milled processed is to carry out the mirror ultrafinish of main surface.The 2nd Two sides grinding device identical with situation used in the 1st milled processed and grinding method can be used in milled processed, but It is preferable to use than Yan Mo Mo particle size is small used in the 1st milled processed Yan Mo Mo.To prevent the end of main surface Shape be exceedingly recessed or prominent, and can reduce the roughness of main surface.

Well known device can be used in the two sides grinding device for carrying out the 2nd milled processed.The device includes：It is a pair of Upper flat plate and lower plate；The internal gear being held between upper flat plate and lower plate；Set on the sun gear of lower plate；And and internal tooth Wheel and multiple carriers of sun gear engagement.Grinding pad is pasted in each plate.In the apparatus, in upper flat plate and lower plate Between clamp glass substrate, make upper flat plate and lower plate relatively counter-rotating, to keep the body rotation of glass substrate It revolves simultaneously, every trade of going forward side by side star gear movement.To make glass substrate and grinding pad make a relative move, and to glass The main surface of glass substrate is ground.In addition, above-mentioned processing unit (plant) and processing equally can be used in above-mentioned grinding, grinding Mechanism.

After the 2nd milled processed, glass substrate is removed from the two sides grinding device of each carrier and is cleaned, is terminated Manufacturing process.During manufacturing process described above is repeated, identical lapping liquid is used in the 2nd milled processed.

In the manufacturing method of the substrate for magnetic disc of present embodiment, carried out at grinding using above explained carrier Reason, therefore prevent from generating scar in the end face of glass substrate when being ground, and inhibit the dirt as caused by resin material Dye, to inhibit the main surface sewage of glass substrate to contaminate, the generation of scratch.

(embodiment corresponding with the 1st embodiment)

It has made other than the specification of the 1st following wall portion, has had jointly in the specification illustrated in the 1st embodiment Carrier (Examples 1 to 4, Comparative Examples 1 and 2).

Embodiment 1：As shown in figure 4, including the case where the 1st curved surface (notch) of 8 convex forms in 1 retaining hole

Embodiment 2：Include the case where 6 notches in 1 retaining hole

Embodiment 3：As shown in (a) of Fig. 6, include the case where 10 notches in 1 retaining hole

Embodiment 4：As shown in (b) of Fig. 8, include the case where 8 planes in 1 retaining hole

Comparative example 1：Not having the case where 1 wall portion (makes simple circular retaining hole without etching process Situation)

Comparative example 2：In comparative example 1, the plate for the part for forming retaining hole is etched in entire week, thus In retaining hole the case where entire week glass fibre being not present

About the notch of Examples 1 to 3, it is 2mm by maximum overhang, is 30mm by radius of curvature R, by embodiment 4 The maximum overhang of plane is (from a part of imaginary circles are made of the wall portions of differently- oriented directivity wall portions towards the imaginary circles Center position imaginary circles radial direction on overhang) be 2mm.About the etching process of comparative example 2, with aftermentioned ratio It is carried out similarly compared with example 5.

<Grinding experiment>

Using the carrier of Examples 1 to 4, Comparative Examples 1 and 2, and the two sides grinding device for having planetary gear mechanism is used, It is 100g/cm in the load to substrate², plate revolving speed is 25rpm, and milling time is under 60 minutes grinding conditions, in addition to right Glass substrate manufactured except the case where 2 milled processed of the first embodiment described above based on the first embodiment described above Glass substrate for disc.It is 2.5 inches of aluminosilicate glass substrate that outer diameter is used as glass substrate, finally by plate thickness Degree is formed as 0.653mm.

It after carrying out the 2nd milled processed, cleaned, dried, then examined using the surface examining device of laser type The defect for surveying the main surface of glass substrate, for the case where there are 20 defects from wherein randomly selected every substrate, into And SEM observation and elemental analysis are carried out, and measure the quantity (defects count) of resinae foreign matter.If the quantity of resin foreign matter In every substrate with 1 hereinafter, then there is no problem in practical.Also, (recess lacks the scar of the side wall surface about end face Fall into), it visually and by microscope is observed in dark screen using spotlight.The case where there are scars for end face Under, bright spot is continuously observed in entire week with the certain intervals of 1mm or less degree.The results are shown in Table 1.

Table 1

As shown in table 1, using the carrier (Examples 1 to 4) with the 1st wall portion illustrated in the 1st embodiment and into It has gone in the case where milled processed, has been carried out at grinding with using the carrier (Comparative Examples 1 and 2) without such 1st wall portion The case where reason, is compared, and the defects of main surface quantity is few.

Also, to side wall surface visually observe as a result, presumably the scar as caused by the friction with carrier in addition to comparative example 1 it Outside, it is not found in any glass substrate.

<Grinding experiment>

Then, in addition to using the carrier of Examples 1 to 4 and Comparative Examples 1 and 2, and the two sides for having planetary gear mechanism is used Grinding attachment and the case where carry out fine ginding except, glass substrate for disc has been manufactured based on the first embodiment described above.Flat On plate Nian paste Gu Ding Mo grinding gasket and use, the load to substrate be 150g/cm², plate revolving speed is 25rpm, is added The substrate that more renews between working hour to be changed without carrier under conditions of 60 minutes and the experiment that has carried out 100 batches is (respectively real Example 5~8 and comparative example 3,4) are applied, after cleaning to the glass substrate of the 1st batch and the 100th batch, has detected side wall surface Scar.In addition, processing 100 in every batch of, and 5 carriers for being able to maintain 20 are used in every batch of, therefore Total 10000 glass substrates have been manufactured in each secondary experimental example.

Table 2

In comparative example 3,4, scar is not observed in the 100th batch.Also, after the processing for carrying out 100 batches Carrier retaining hole inner wall detected as a result, it was observed that vertically glass fibre outstanding.Presumably including The part being only made of resin material in the part of the inner wall of retaining hole is stripped during grinding, and exposing vertically protrudes Glass fibre, there is scar in the end face of glass substrate.In contrast to this, in embodiment 5~8, in the 1st batch and In any batch of 100 batches, scar is not found in the side wall surface of glass substrate.

(embodiment corresponding with the 2nd embodiment)

Resin dipping substrate is prepared as follows：Epoxy resin is impregnated into the glass fabric being plainly woven, is gone forward side by side The prepreg that row is dry, hardens and obtains 0.1mm, which is laminated in a manner of keeping the differently- oriented directivity of glass fibre consistent 5, and crimped, the resin dipping substrate of the thickness of 0.5mm thereby is achieved.Base is impregnated to the resin using slotting cutter Plate carries out machining, and carries out foring shape shown in Fig. 10 after deburring.Add so as to be formed and carried out cutting The portion in the circumferential direction region of the 1st strengthening region 11 and the 2nd strengthening region 13 of the retaining hole inner wall of the resin dipping substrate of work It point is formed on the basis of any strengthening region, including 0 ° of formation, 90 °, 180 °, 270 ° around the center of retaining hole 3 The mode in the region of respectively ± 11.25 ° of range of circumferential direction position, is coated with the ammonium acid fluoride of 20% concentration and viscosity tune Liquid (etchant) made of whole glycerol cooperation, and place 10 minutes, to only carry out the erosion of glass to coated portion Quarter processing.After being etched, resin dipping substrate is washed with water, to obtain carrier (embodiment 9).Also, Other than the standing time (etching period) after coating is set as 20 minutes points, made with process same as Example 9 Carrier (embodiment 10).

(comparative example)

In addition, in addition in an etching process, by the resin for carrying out machining dipping substrate in the fluorine by 1.3% concentration Except the Stains 15 minutes points of etchant Zhong Jin that acid and the sulfuric acid of 2.6% concentration are constituted, obtained with process same as Example 9 Carrier (comparative example 5).Also, other than the point of the whole region of the circumferential direction in retaining hole inner wall coating etchant, Carrier (comparative example 6) is obtained with process same as Example 9.

<The observation in cricoid region>

Use optical microscopy and the inner wall of laser microscope and the retaining hole to the carrier of embodiment 9 and comparative example 5,6 Face is observed, and result is in the cricoid region of the carrier of embodiment 9, with substantially 90 ° in the circumferential direction of inner wall Interval be separated from each other and alternately formed only remove the 1st glass fibre and remain the region of the 2nd glass fibre and only remove 2nd glass fibre and the region for remaining the 1st glass fibre.In addition, in the cricoid region of the carrier of comparative example 5,6, whole A week is formed with the region for all removing the 1st glass fibre and the 2nd glass fibre.

<Grinding experiment>

Carrier in addition to using embodiment 9,10 and comparative example 5,6, and ground using the two sides for having planetary gear mechanism Device is 100g/cm in the load to substrate², plate revolving speed is 25rpm, and milling time is under 60 minutes grinding conditions, right Glass substrate carried out except the case where 2 milled processed of above-mentioned 2nd embodiment, was manufactured based on above-mentioned 2nd embodiment Glass substrate for disc.As glass substrate, the aluminosilicate glass substrate for the use of outer diameter being 2.5 inches, the plate finally obtained Material is with a thickness of 0.653mm.

It after carrying out the 2nd milled processed, cleaned, dried, then examined using the surface examining device of laser type The defect of the main surface of glass substrate is surveyed, to the case where there are 20 defects from wherein randomly selected every substrate, in turn Implement SEM observation and elemental analysis, measures the quantity (defects count) of resinae foreign matter.If existed in the quantity of resin foreign matter There are 1 hereinafter, then there is no problem in practical in every substrate.Also, (recess lacks the scar of the side wall surface about end face Fall into), it visually and by microscope is observed in dark screen using spotlight.In end face, there are the feelings of scar Under condition, bright spot is continuously observed in entire week with the certain intervals of 1mm degree below.The results are shown in Table 3.

Table 3

As shown in table 3, using have only by towards 2 differently-s oriented directivity glass fibre in a glass fibre and by The carrier (embodiment 9,10) of the strengthening region of reinforcing and in the case where being ground, have with using towards 2 orientations The carrier (comparative example 5,6) in the region that the glass fibre in direction is all removed and the case where being ground, are compared, main table The defects of face quantity is less, can be avoided the adverse effect to the main surface of glass substrate.

Also, to side wall surface visually observe as a result, not finding in any glass substrate presumably by rubbing with carrier Scar caused by wiping, and the surface examining device using laser type observe side wall surface as a result, using embodiment 9, 10 carrier and in the case where being ground, do not find scar in side wall surface, and the carrier using comparative example 5,6 and into In the case where row milled processed, scar is had found in side wall surface.

In addition, the carrier about embodiment 10, using laser microscope to the 1st strengthening region and the 2nd strengthening region into Observation is gone, the 1st glass fibre of result, the 2nd glass fibre are also etched a part respectively.In addition, using embodiment 10 Carrier and be ground learn under the above conditions, it is few in the defects of side wall surface and main surface quantity, can be avoided Adverse effect to glass substrate.

<Grinding experiment>

Then, in addition to using the carrier of embodiment 9,10 and comparative example 5,6, and the two sides for having planetary gear mechanism is used Grinding attachment and the case where carry out fine ginding except, glass substrate for disc has been manufactured based on above-mentioned 2nd embodiment.Flat Plate Nian patch Gu Ding Mo grinding gasket and use, the load to substrate be 150g/cm², plate revolving speed is 25rpm, processing Time was to be changed without carrier and the substrate that more renews carries out experiment (the respectively embodiments of 100 batches under conditions of 60 minutes 11,12 and comparative example 7,8), and after being cleaned to the glass substrate of the 1st batch and the 100th batch, have detected side wall surface Scar.In addition, carrying out 100 processing in every batch of, 5 carriers for being able to maintain 20 have been used in every batch of, because This has manufactured total 10000 glass substrates in each experimental example.

Table 4

In comparative example 7,8, in the 1st batch, scar is not observed in the side wall surface of glass substrate, but at the 100th batch Scar is observed in secondary.Also, the retaining hole inner wall of the carrier after the processing for carrying out 100 batches is detected, As a result vertically glass fibre outstanding is observed.That is, presumably include retaining hole inner wall part in only by resinous wood The part that material is constituted is stripped during grinding, is exposed vertically glass fibre outstanding, is hurt in the end face of glass substrate Trace.In this regard, in the 1st batch and the 100th batch, not finding to hurt in the side wall surface of glass substrate in embodiment 11,12 Trace.

About the evaluation according to laser microscope of the main surface to glass substrate, since the roughness of substrate surface is big, And it is difficult to carry out, therefore be not carried out.In addition, since machining load is big, compared with comparative example 5,6, in comparative example 7,8 more Add the scar for being clearly observed side wall surface.

More than, manufacturing method and substrate for magnetic disc to milled processed carrier of the invention, milled processed carrier Manufacturing method is described in detail, but the present invention is not limited to the above embodiments, in the model for not departing from the gist of the invention In enclosing, various improvement, change can be carried out to the present invention.

(explanation of symbol)

1,30 carriers

3,32 retaining holes

5,36 inner walls (inner peripheral wall)

The 1st inner wall of 5a

The 2nd inner wall of 5b

7 cricoid regions

10 grinding pads

11 the 1st strengthening regions

13 the 2nd strengthening regions

The other parts in 15 cricoid regions

21 the 1st glass fibres

23 the 2nd glass fibres

31 teeth portion

33,34 glass fibres

35 differently- oriented directivity wall portions

37 the 1st curved surfaces

38 planes

39 the 2nd curved surfaces

40 upper flat plates

60 lower plates

61 sun gears

62 internal gears

71 supplying tanks

72 pipings

Claims (18)

1. the manufacturing method of a kind of grinding or grinding processing carrier, the grinding or grinding processing have retaining hole with carrier, should Retaining hole carries out grinding or grinding to the main surface of the substrate clamping disk-shaped substrate by upper flat plate and lower plate For keeping the substrate when reason,

Above-mentioned grinding or the manufacturing method for being ground processing carrier are characterised by comprising：

Step 1 is rapid, on the plate being made of the composite material of fiber and resin material including being oriented at least one direction Form circular retaining hole；And

Second step is etched a part of the inner peripheral wall of the retaining hole,

In the second step, in the inner peripheral wall, according to the side for forming the region and the region not being etched that are etched Formula is etched,

In the region not being etched, the normal direction of the inner peripheral wall and the differently- oriented directivity of the fiber are inconsistent.

2. the manufacturing method of grinding according to claim 1 or grinding processing carrier, which is characterized in that

The region being etched include the inner peripheral wall normal direction and the fiber differently- oriented directivity it is consistent described Region in inner peripheral wall.

3. the manufacturing method of a kind of grinding or grinding processing carrier, the grinding or grinding processing have retaining hole with carrier, should Retaining hole carries out grinding or grinding to the main surface of the substrate clamping disk-shaped substrate by upper flat plate and lower plate For keeping the substrate when reason,

Above-mentioned grinding or the manufacturing method for being ground processing carrier are characterised by comprising：

Step 1 is rapid, on the plate being made of the composite material of fiber and resin material including being oriented at least one direction Form circular retaining hole；And

Second step is etched a part of the inner peripheral wall of the retaining hole,

In the second step, in the inner peripheral wall, according to the side for forming the region and the region not being etched that are etched Formula is etched,

The region being etched include the inner peripheral wall normal direction and the fiber differently- oriented directivity it is consistent described Region in inner peripheral wall.

4. the manufacturing method of grinding according to claim 3 or grinding processing carrier, which is characterized in that

The region not being etched include the inner peripheral wall normal direction and the fiber differently- oriented directivity it is inconsistent Region in the inner peripheral wall.

5. grinding described in any one according to claim 1~4 or the manufacturing method for being ground processing carrier, feature It is,

The plate is obtained from making glass fabric impregnating resin material, and the glass fabric is by the beam of glass fibre, i.e. Made of carrying out plain weave towards the organdy in 2 orthogonal directions,

In the inner peripheral wall, comprising around the center of the retaining hole at 0 °, 90 °, 180 °, 270 ° of direction and formed at 4 The region being etched.

6. the manufacturing method of grinding according to claim 5 or grinding processing carrier, which is characterized in that

One diameter of the glass fibre is 5 μm~10 μm,

It along the width of the organdy of the in-plane of the plate is 200 μm~700 μm in the plate.

7. the manufacturing method of grinding according to claim 5 or grinding processing carrier, which is characterized in that

In the region being etched, there is no in the organdy towards 2 orthogonal directions in the inner peripheral wall On towards normal direction organdy,

In the region not being etched, there are two sides of organdy towards 2 orthogonal directions.

8. according to claim 1~4, grinding described in any one in 6,7 or it is ground the manufacturing method of processing carrier, It is characterized in that,

In the second step, before carrying out the etching, carry out in the inner peripheral wall described in the area that is not etched The coverage of mask material is arranged in domain, after carrying out the etching, removes the mask material.

9. the manufacturing method of grinding according to claim 8 or grinding processing carrier, which is characterized in that

In the second step, before carrying out the etching, multiple plates of the retaining hole will be formed with the fiber Differently- oriented directivity and the retaining hole position overlapping mode overlap, to the internal perisporium of the retaining hole of the plate of the overlapping It is covered in face.

10. according to claim 1~4, grinding described in any one in 6,7,9 or being ground the manufacturer of processing carrier Method, which is characterized in that

In the second step, it is coated with the etchant for etching the fiber in the region being etched, to carry out institute State etching.

11. the manufacturing method of grinding according to claim 10 or grinding processing carrier, which is characterized in that

In the second step, before the coating for carrying out the etchant, by the multiple plates for being formed with the retaining hole with The mode of the position of the differently- oriented directivity of the fiber and retaining hole overlapping overlaps, to the retaining hole of the plate of the overlapping Inner peripheral wall be coated with the etchant.

12. according to claim 1~4, grinding described in any one in 6,7,9,11 or being ground the manufacture of processing carrier Method, which is characterized in that

In the step 1 is rapid, by multiple plates with the differently- oriented directivity weight of the fiber before forming the retaining hole After folded mode is overlapped, the retaining hole is formed in a manner of making the retaining hole run through multiple plates.

13. a kind of manufacturing method of substrate, which is characterized in that the manufacturing method of the substrate includes grinding or grinding processing, in institute It states in grinding or grinding processing, makes through grinding described in any one in claim 1~12 or grinding processing load In the state that grinding that the manufacturing method of body produces or grinding processing carrier keep substrate, to the main surface of the substrate into Row grinding or grinding.

14. a kind of grinding or grinding processing carrier, which is characterized in that

The grinding or grinding processing have glass fibre towards 2 orthogonal directions, circular retaining hole with carrier,

In the inner peripheral wall of the retaining hole, comprising around the center of the retaining hole at 0 °, 90 °, 180 °, 270 ° of direction and It is formed with strengthening region at 4,

There is only the glass fibers towards the direction different from the normal direction of the inner peripheral wall respectively in strengthening region at described 4 Dimension.

15. grinding according to claim 14 or grinding processing carrier, which is characterized in that

The strengthening region be respectively formed in the inner peripheral wall with around the center of the retaining hole at 0 °, 90 °, 180 °, Wall portions centered on 270 ° of direction in the range of ± 20 °.

16. grinding according to claim 14 or 15 or grinding processing carrier, which is characterized in that

The length of the radial direction along the retaining hole of the strengthening region is 2 μm~10 μm.

17. a kind of manufacturing method of substrate, it is characterised in that have following processing：Make any one of claim 14~16 The grinding is ground in the state of the retaining hole holding substrate of processing carrier, is ground to the main surface of the substrate Or grinding.

18. the manufacturing method of substrate described in 3 or 17 according to claim 1, which is characterized in that the substrate is disk base Plate.