CN108857588A - Burnishing device and polishing method - Google Patents
Burnishing device and polishing method Download PDFInfo
- Publication number
- CN108857588A CN108857588A CN201810653280.4A CN201810653280A CN108857588A CN 108857588 A CN108857588 A CN 108857588A CN 201810653280 A CN201810653280 A CN 201810653280A CN 108857588 A CN108857588 A CN 108857588A
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- Prior art keywords
- cavity
- thrown
- polishing
- burnishing device
- detection
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of burnishing device and polishing methods, are related to polishing technology field.The embodiment of the present invention proposes a kind of burnishing device, including：Cabin, the first cavity and the second cavity being separated by isolation board are equipped in the cabin, the isolation board is connected to or is isolated between first cavity and second cavity for making, it is equipped with the detection device for detecting element shape characteristic to be thrown in first cavity, is equipped in second cavity for treating the polissoir for throwing element polishing.The present invention is mainly used for improving the processing efficiency of element to be thrown.
Description
Technical field
The present invention relates to polishing technology field more particularly to a kind of burnishing device and polishing methods.
Background technique
The hard brittle materials such as silicon carbide, sapphire, quartz glass are made into photoelectricity with its unique physics and chemical characteristic
Element is widely used in the sciemtifec and technical spheres such as space exploration, electronics, nuclear energy.However, due to itself there are hardness big and process
In the characteristics of being easy to appear brittle fracture, the processing and forming of hard brittle material is a big difficulty in Precision Machining field, especially needle
To the polishing of large and medium-sized hard brittle material element surface.The optical element of high quality usually requires that more accurately surface face type,
Smaller surface roughness and sub-surface damage few as far as possible, and component size increase makes the satisfaction of these requirements become more to be stranded
It is difficult.
It is realized currently, main for the surface polishing processing of large and medium-sized hard brittle material optical element by following steps：Milling
Type, abrasive sand corase grinding, abrasive sand fine grinding, polishing powder polishing are worn into, cleaning, dry, detection faces type mark face type error, do over again
Color-buffing finish face type again, so circulation are until face type reaches requirement.But traditional bulk cargo polishing is not easy to remove sub-surface damage
Wound, therefore, the novel polishings technology such as particle beams polishing, Magnetorheological Polishing, plasma polishing are used as last throwing together
Light process modifies face type repeatedly, while achieving the purpose that remove sub-surface damage.However, since polishing and the detection of face type are adopted
With different equipment, so modifying the stage in component side type, element will back and forth be carried more between polissoir and detection device
It is secondary, while element also needs the fixation that is loaded, therefore the process of accurate repair whole face type is very time-consuming, processing efficiency is lower.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of burnishing device and polishing method, it is mainly used for improving member to be thrown
The processing efficiency of part.
In order to achieve the above objectives, present invention generally provides following technical solutions：
The embodiment of the invention provides a kind of burnishing devices, including：
Cabin, the cabin is interior to be equipped with the first cavity and the second cavity being separated by isolation board, and the isolation board is used
It is connected to or is isolated between first cavity and second cavity in making, be equipped in first cavity for detecting member to be thrown
The detection device of part, second cavity is interior to be equipped with for treating the polissoir for throwing element polishing.
Optionally, the burnishing device further includes：
Support platform, the support platform are movably connected in the cabin, enable the support platform activity to institute
It states in the first cavity or second cavity, the support platform is used to support element to be thrown.
Optionally, the first sliding rail is equipped in the cabin, the both ends of first sliding rail extend into first chamber respectively
In body and second cavity, the support platform is slidably connected to first sliding rail.
Optionally, the support platform includes support portion and rotatable platform, and one end of the support portion is slidably connected to institute
The first sliding rail is stated, the rotatable platform is rotationally connected on the other end, the rotatable platform is used to support element to be thrown.
Optionally, the support portion includes the first pedestal, the second pedestal and lifter, and first pedestal is slidably connected to
First sliding rail, first pedestal are equipped with the second sliding rail, and second pedestal is slidably connected to second sliding rail, institute
It states the second pedestal and the rotatable platform is connected to by the lifter.
Optionally, the polissoir includes plasma torch and plasma generator, the plasma torch connection
It is used in the output port of the plasma generator, the plasma torch towards element to be thrown.
Optionally, it is equipped with the first photographic device in first cavity, is equipped with the second photographic device in second cavity.
Optionally, second cavity is connected with exhaust pipe, and the exhaust pipe is used for second chamber is intracorporal
Gas discharge.
Optionally, the exhaust pipe is connected to emission-control equipment.
Optionally, the burnishing device further includes：
Processing system, the processing system are connected to the detection device and the polissoir, and the processing system is used
In the detection parameters for obtaining the detection device, and the polissoir is controlled according to the detection parameters and treats throwing element progress
Polishing.
On the other hand, the embodiment of the invention also provides a kind of polishing methods, are used for burnishing device as mentioned, including：
Element to be thrown is detected, the first detection parameters are obtained；
According to first detection parameters, polishing is carried out to the element to be thrown；
After described after throwing element polishing, the element to be thrown is detected again, obtains the second detection parameters；
Second detection parameters are judged whether in preset parameter range, if the time detection parameters are not described default
In parameter area, then according to second detection parameters, polishing again is carried out to the element to be thrown.
The embodiment of the invention provides a kind of burnishing devices, and the detection for throwing element is treated for more convenient realization
And polishing, and in the prior art, different equipment is used since polishing is detected from face type, so modifying rank in component side type
Section, element will back and forth be carried repeatedly between polissoir and detection device, and then lead to the process of accurate repair whole face type very
Time-consuming reduces polishing efficiency.Compared with prior art, burnishing device provided by the present application includes cabin, be equipped in cabin by
The first cavity and the second cavity that isolation board is separated, isolation board for make between the first cavity and the second cavity connection or every
From in application process, element to be thrown can be set in the first cavity, treat throwing member by the intracorporal detection device of the first chamber
The face type of the machined surface of part is detected, and isolation board then can be opened, and will be closed after throwing element and being transferred in the second cavity
Isolation board is treated throwing element by the intracorporal polissoir of the second chamber and is processed according to detection parameters, thus be may be implemented
The detection for throwing element and polishing are treated in burnishing device, improve polishing and detection efficiency.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of burnishing device provided in an embodiment of the present invention；
Fig. 2 is a kind of flow chart of polishing method provided in an embodiment of the present invention.
Specific embodiment
It is of the invention to reach the technical means and efficacy that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Attached drawing and preferred embodiment, to burnishing device proposed according to the present invention and polishing method its specific embodiment, structure, feature
And its effect, detailed description is as follows.
As shown in Figure 1, the embodiment of the invention provides a kind of burnishing devices, including：
Cabin 1, cabin 1 is interior to be equipped with the first cavity 21 and the second cavity 22 being separated by isolation board 2, and isolation board 2 is used
It is connected to or is isolated between the first cavity 21 and the second cavity 22 in making, be equipped in the first cavity 21 for detecting element 3 to be thrown
Detection device 4, the interior polissoir 5 being equipped with for treating the throwing polishing of element 3 of the second cavity 22.
Wherein, for placing element 3 to be thrown in cabin 1, in order to guarantee that the service life of cabin 1, cabin 1 can be by metals
Material is made, and isolation board 2 is equipped in cabin 1, and isolation board 2 can be movable in cabin 1, makes 21 He of the first cavity in cabin 1
The connection of second cavity 22 or isolation, optionally, isolation board 2 is expansion plate, when isolation board 2 is in extended state, 2 energy of isolation board
It is enough that first cavity 21 and the second cavity 22 is mutually isolated, so that the first cavity 21 and the second cavity 22 is in opposite sealed shape
State, when isolation board 2 is in contraction state, the first cavity 21 and the second cavity 22 can be interconnected by isolation board 2, make wait throw
Element 3 can be movable between the first cavity 21 and the second cavity 22.
Wherein, it is equipped with detection device 4 in the first cavity 21, is equipped with polissoir 5 in the second cavity 22, wherein detection is set
The standby 4 face molded dimension parameters for being able to detect finished surface in element 3 to be thrown are detected, it is preferable that detection device 4 can be sharp
Optical scanning measuring device fast can accurately obtain data to be tested；Polissoir 5 can treat throwing element 3 and be thrown
Light, it is preferable that polissoir 5 can for etching polissoir 5, etching mode can with using plasma etching mode,
The progress polishing of element 3 is thrown in can be finer treat.Above-mentioned detection device 4 and polissoir 5 is the prior art,
So not being illustrated herein to the specific structure of above-mentioned polissoir 5 and detection device 4.
The dress of the polishing in the present embodiment is illustrated below by way of the working process and principle of burnishing device in the present embodiment
It sets：
Firstly, being arranged element 3 to be thrown in the first cavity 21, isolation board 2 is closed, throwing is treated by detection device 4
The face molded dimension of element 3 is detected, to obtain practical face type data；
Then, the practical face type data that will test are compared and analyzed with default face type data, obtain practical face type number
According to the differential location and the amount of deflection between default face type data；
Finally, opening isolation board 2, isolation board 2 will be closed after throwing 3 activity to the second cavity 22 of element, according to upper
The differential location and the amount of deflection stated are treated by polissoir 5 and throw the progress polishing of element 3.
It is above-mentioned after throwing element 3 and carrying out polishing, can again activity to 4 institute of tested equipment in the first cavity 21
Detection stops processing if the practical face type data fit detected presets the range of face type data, if not meeting, basis
Differential location and the amount of deflection continue to process, until the range that the practical face type data fit detected presets face type data is
Only.
The embodiment of the invention provides a kind of burnishing devices, and the detection for throwing element is treated for more convenient realization
And polishing, and in the prior art, different equipment is used since polishing is detected from face type, so modifying rank in component side type
Section, element will back and forth be carried repeatedly between polissoir and detection device, and then lead to the process of accurate repair whole face type very
Time-consuming reduces polishing efficiency.Compared with prior art, burnishing device provided by the present application includes cabin, be equipped in cabin by
The first cavity and the second cavity that isolation board is separated, isolation board for make between the first cavity and the second cavity connection or every
From in application process, element to be thrown can be set in the first cavity, treat throwing member by the intracorporal detection device of the first chamber
The face type of the machined surface of part is detected, and isolation board then can be opened, and will be closed after throwing element and being transferred in the second cavity
Isolation board is treated throwing element by the intracorporal polissoir of the second chamber and is processed according to detection parameters, thus be may be implemented
The detection for throwing element and polishing are treated in burnishing device, improve polishing and detection efficiency.
Transfer of the element 3 to be thrown in cabin 1 for convenience, further, above-mentioned burnishing device further includes support platform
6, the support platform 6 is movably connected in the cabin 1, enables 6 activity of support platform to first cavity 21
Or in second cavity 22, wherein the support platform 6 is used to support element 3 to be thrown.In the present embodiment, in support platform 6
Element 3 to be thrown can be set, element to be thrown can be transferred to the first cavity 21 or the second cavity 22 in support platform 6, improve
The convenience that element 3 to be thrown shifts, wherein the table top of support platform 6 can be round or rectangle etc.；Support platform 6 and cabin
Movable connection method between 1 bottom of body can there are many, such as：Support platform 6 can be slidably connected to the cunning of 1 bottom of cabin
Road, to realize the activity between the first cavity 21 and the second cavity 22, in another example：Support platform 6 is connected to by rotatable platform
The bottom of cabin 1, so that support platform 6 under the action of rotatable platform, rotates between the first cavity 21 and the second cavity 22.
In some embodiments, it is equipped with the first sliding rail 7 in the cabin 1, the both ends of first sliding rail 7 extend into respectively
In first cavity 21 and second cavity 22, the support platform 6 is slidably connected to first sliding rail 7.This implementation
In example, since the both ends of the first sliding rail 7 are extended into respectively in the first cavity 21 and the second cavity 22, and support platform 6 can be slided
It is dynamic to be connected to the first sliding rail 7, and then support platform 6 can slide into the first cavity 21 or the second cavity 22 along the first sliding rail 7
It is interior, the transfer for throwing element 3 is treated to realize, so that element 3 to be thrown is completed detection and polishing, improves transfer efficiency.
In addition, also improving the automatization level of optical element polishing, polishing precision, quality of finish are improved.
In some embodiments, support platform 6 includes support portion and rotatable platform 61, and one end of support portion is slidably connected to
First sliding rail 7 is rotationally connected with the rotatable platform 61 on the other end, and the rotatable platform 61 is used to support element to be thrown
3.In the present embodiment, element 3 to be thrown is arranged on rotatable platform 61, since rotatable platform 61 is rotationally connected with support portion, so
Element 3 to be thrown rotates in etching process, and since the etched shape of element 3 to be thrown is axially symmetric structure, in this way to
It throws element 3 and performs etching processing during rotation, it is ensured that the uniformity of etching improves quality of finish.In addition, also being promoted
The automatization level of optical element polishing improves polishing precision, quality of finish.
In some embodiments, support portion includes the first pedestal 62, the second pedestal 63 and lifter 64, and the first pedestal 62 is sliding
Dynamic to be connected to first sliding rail 7, first pedestal 62 is equipped with the second sliding rail, and second pedestal 63 is slidably connected to institute
The second sliding rail is stated, second pedestal 63 is connected to the rotatable platform 61 by the lifter 64.In the present embodiment, rotation
After 61 activity to the second cavity 22 of platform, it can be treated by polissoir 5 and throw the progress polishing of element 3, in order to guarantee to throw
Light precision, it usually needs precision adjustment is carried out in the position to the element to be thrown 3 on rotatable platform 61, and in the present embodiment, the
One pedestal 62 is slidably connected to the first sliding rail 7, the activity of rotatable platform 61 can be made to the first cavity 21 by the first pedestal 62 or
In second cavity 22, after 62 activity to the second cavity 22 of the first pedestal, slide the second pedestal 63 the second of the first pedestal 62
It is slided on rail, to adjust the position of 61 horizontal direction of rotatable platform；Then, it is gone up and down by lifter 64, to adjust rotation
The position of 61 vertical direction of platform, it is found that can be to the member to be thrown on rotatable platform 61 by support portion according to above-described embodiment
Part 3 carries out adjustment vertically and horizontally, improves the accuracy of polishing.
In some embodiments, the polissoir 5 includes plasma torch 51 and plasma generator 52, described etc.
Gas ions torch 51 is connected to the plasma generator 52, and the output port of plasma torch 51 is used for towards element 3 to be thrown.
In the present embodiment, plasma generator 52 leads to for generating plasma, and by Plasma Transport to plasma torch 51
It crosses plasma torch 51 to be injected on element 3 to be thrown, treats the etching polishing for throwing element 3 to realize, improve the throwing of element 3 to be thrown
Light quality.
In some embodiments, it is equipped with the first photographic device 71 in first cavity 21, is set in second cavity 22
There is the second photographic device 72.In the present embodiment, it can be obtained in real time in the first cavity 21 by the first photographic device 71 wait throw
The detection case of element 3 can obtain the polishing feelings of element 3 to be thrown in the second cavity 22 by the second photographic device 72 in real time
Condition can be understood in the first cavity 21 and the second cavity 22 by the first photographic device 71 and the second photographic device 72 wait throw in real time
The case where element 3, avoids going wrong in detection or polishing process.
In some embodiments, second cavity 22 is connected with exhaust pipe 81, and the exhaust pipe 81 is used for institute
State the gas discharge in the second cavity 22.In the present embodiment, since polissoir 5 is performed etching by plasma, such
A large amount of exhaust gas will be generated in two cavitys 22, it, can be by exhaust pipe by second in order to avoid the safety of exhaust gases polishing
Exhaust gas discharge in cavity 22, to improve the safety of burnishing device.
In some embodiments, the exhaust pipe 81 is connected to emission-control equipment 82.In the present embodiment, pass through exhaust gas
Processing unit 82 can purify the exhaust gas that exhaust pipe 81 is discharged, in case pollution environment, improves above-mentioned burnishing device
The feature of environmental protection.
In some embodiments, the burnishing device further includes：Processing system 9, the processing system 9 are connected to institute
Detection device 4 and the polissoir 5 are stated, the processing system 9 is used to obtain the detection parameters of the detection device 4, and root
Throwing element 3 is treated according to the detection parameters control polissoir 5 to be polished.In the present embodiment, pass through 9 energy of processing system
The detection parameters of detection device 4 are enough obtained, and controls the polissoir 5 according to the detection parameters and treats the throwing progress of element 3
Polishing, due to being controlled automatically by processing system 9, it is ensured that the machining accuracy of element 3 to be thrown.
On the other hand, it as shown in Fig. 2, the embodiment of the invention also provides a kind of polishing method, is filled for above-mentioned polishing
It sets, including：
Step 101 detects element to be thrown, and obtains the first detection parameters；
Wherein, the first detection parameters are mainly the face molded dimension parameter wait throw finished surface in element, can be by above-mentioned
Detection device in burnishing device is treated throwing element and is detected, which can be laser scanner, can
Fast accurately to obtain the first detection parameters.
Step 102, according to first detection parameters, polishing is carried out to the element to be thrown；
Wherein, the polishing for throwing element is being treated, can be being polished using the polissoir in above-mentioned burnishing device
Processing, the parameter of polishing can be set according to the first detection parameters, such as：First detection parameters and standard are joined
Several differences can be used as the polishing amount of element to be thrown, and in order to guarantee machining accuracy, above-mentioned polissoir can be used
Element progress polishing is thrown in plasma etch apparatus, can be finer treat.
Step 103, after described after throwing element polishing, detect the element to be thrown again, obtain the second detection ginseng
Number；
Wherein, it in order to guarantee the precision of polishing, after carrying out polishing, needs to treat again and throws element and examined
It surveys, to determine whether the precision of polishing meets the requirements, the content of detection is identical as the detection data in step 101,
This is not repeated.
Step 104 judges second detection parameters whether in preset parameter range, if the time detection parameters do not exist
The preset parameter range carries out polishing again to the element to be thrown then according to second detection parameters.
Wherein, by comparison the second detection parameters and preset parameter range may determine that the throwing element polishing precision whether
It complies with standard, if the second detection parameters meet processing criterion in preset parameter range, can terminate to process, if the second inspection
Parameter is surveyed not in preset parameter range, then does not meet processing criterion, then needs to treat again and throws element progress polishing, until
Meet processing criterion position.
The embodiment of the invention provides a kind of polishing methods, and the detection for throwing element is treated for more convenient realization
And polishing, and in the prior art, different equipment is used since polishing is detected from face type, so modifying rank in component side type
Section, element will back and forth be carried repeatedly between polissoir and detection device, and then lead to the process of accurate repair whole face type very
Time-consuming reduces polishing efficiency.Compared with prior art, polishing method provided by the present application, including：Firstly, detecting member to be thrown
Part obtains the first detection parameters；Secondly, carrying out polishing to the element to be thrown according to first detection parameters；So
Afterwards, after described after throwing element polishing, the element to be thrown is detected again, obtains the second detection parameters；Finally, judging institute
The second detection parameters are stated whether in preset parameter range, if the time detection parameters are not in the preset parameter range, root
According to second detection parameters, polishing again is carried out to the element to be thrown.And above-mentioned burnishing device is being polished
In the process, in the conversion process between detection process and polishing processing, until need will element be thrown from the first cavity and
It is mutually shifted between second cavity, so that it may realize and treat the detection for throwing element and polishing in burnishing device, improve
Polishing and detection efficiency.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (11)
1. a kind of burnishing device, which is characterized in that including：
Cabin, the cabin is interior to be equipped with the first cavity and the second cavity being separated by isolation board, and the isolation board is for making
It is connected to or is isolated between first cavity and second cavity, be equipped in first cavity and detect element pattern spy to be thrown
The detection device of sign, second cavity is interior to be equipped with the polissoir treated and throw element polishing.
2. burnishing device according to claim 1, which is characterized in that further include：
Support platform, the support platform are movably connected in the cabin, enable support platform activity to described the
In one cavity or second cavity, the support platform is used to support element to be thrown.
3. burnishing device according to claim 2, which is characterized in that
The first sliding rail is equipped in the cabin, the both ends of first sliding rail extend into first cavity and described second respectively
In cavity, the support platform is slidably connected to first sliding rail.
4. burnishing device according to claim 3, which is characterized in that
The support platform includes support portion and rotatable platform, and one end of the support portion is slidably connected to first sliding rail,
The other end is connected to the rotatable platform, and the rotatable platform is used to support element to be thrown.
5. burnishing device according to claim 4, which is characterized in that
The support portion includes the first pedestal, the second pedestal and lifter, and it is sliding that first pedestal is slidably connected to described first
Rail, first pedestal are equipped with the second sliding rail, and second pedestal is slidably connected to second sliding rail, second pedestal
The rotatable platform is connected to by the lifter.
6. burnishing device according to claim 1, which is characterized in that
The polissoir includes plasma torch and plasma generator, and the plasma torch is connected to the plasma
Generating device, the output port direction element to be thrown of the plasma torch.
7. burnishing device according to claim 1, which is characterized in that
It is equipped with the first photographic device in first cavity, is equipped with the second photographic device in second cavity.
8. burnishing device according to claim 1, which is characterized in that
Second cavity is connected with exhaust pipe, and the exhaust pipe is used to for the intracorporal gas of second chamber being discharged.
9. burnishing device according to claim 8, which is characterized in that
The exhaust pipe is connected to emission-control equipment.
10. burnishing device according to claim 1, which is characterized in that further include：
Processing system, the processing system are connected to the detection device and the polissoir, and the processing system is for obtaining
The detection parameters of the detection device are taken, and throwing element is treated according to the detection parameters control polissoir and is thrown
Light.
11. a kind of polishing method, for the burnishing device as described in any one of claims 1 to 10, which is characterized in that packet
It includes：
Element to be thrown is detected, the first detection parameters are obtained；
According to first detection parameters, polishing is carried out to the element to be thrown；
After described after throwing element polishing, the element to be thrown is detected again, obtains the second detection parameters；
Second detection parameters are judged whether in preset parameter range, if the time detection parameters are not in the parameter preset
In range, then according to second detection parameters, polishing again is carried out to the element to be thrown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810653280.4A CN108857588A (en) | 2018-06-22 | 2018-06-22 | Burnishing device and polishing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810653280.4A CN108857588A (en) | 2018-06-22 | 2018-06-22 | Burnishing device and polishing method |
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| CN108857588A true CN108857588A (en) | 2018-11-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109940404A (en) * | 2019-05-09 | 2019-06-28 | 天津市汇通仪器设备公司 | A kind of numerical controlled machinery processing turning polishing all-in-one machine |
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