CN108856918B - Electric spark machining method for array type fine stepped groove - Google Patents
Electric spark machining method for array type fine stepped groove Download PDFInfo
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- CN108856918B CN108856918B CN201710330837.6A CN201710330837A CN108856918B CN 108856918 B CN108856918 B CN 108856918B CN 201710330837 A CN201710330837 A CN 201710330837A CN 108856918 B CN108856918 B CN 108856918B
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- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
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Abstract
The invention relates to an electric spark machining method of an array type superfine stepped groove. The method comprises the steps of firstly preparing micro array electrodes with different patterns, and then respectively adopting the micro array electrodes with different patterns to carry out different-depth electric spark machining on a workpiece to form a stepped groove of the micro array. The number of the steps of the stepped groove is more than or equal to 2, and the number of different patterns corresponds to the number of the steps of the stepped groove. Further, electrode loss compensation can be performed by adding a fine array electrode with the same pattern. The invention can finish the processing of N (N is more than or equal to 2) step micro step grooves of the array by a micro electric spark technology, and can ensure the verticality of the step grooves by a mode of compensating electrode loss.
Description
Technical Field
The invention relates to the technical field of micro electric spark machining, in particular to a 2.5D electric spark machining method of an array type micro stepped groove.
Background
The micro electric spark technology utilizes the pulse spark discharge between the workpiece and the tool electrode to generate instantaneous high temperature to locally melt and vaporize the workpiece material, thereby achieving the purpose of erosion machining. Because the machining has the characteristics of non-contact, almost no cutting force, no limitation of the strength and hardness of the material and the like, the micro electric discharge machining technology is particularly suitable for the characteristic machining of high-precision and deformation-free micro parts and the micro machining of hard and brittle conductive materials. Therefore, micro electro discharge machining technology has become an important direction in the field of micro manufacturing, and is increasingly widely applied to the machining of key parts in aerospace, electronic information, molds, and optical and medical instruments.
The traditional micro electric spark forming adopts a single-electrode serial machining mode, so that the efficiency is very low, and the consistency of the mode is difficult to ensure, so that the machining precision is limited. Aiming at the problem, a plurality of micro electric spark batch processing technologies are provided, including manufacturing a square electrode by adopting electric spark cutting, manufacturing an array electrode in any shape by utilizing a LIGA (laser induced plasma) process of a photoetching technology and manufacturing an array electrode in any shape by adopting a metal etching process. However, since these methods are processing techniques in which a two-dimensional array pattern is processed by controlling a processing depth, the processed shapes and structures are limited.
Disclosure of Invention
Aiming at the problems, the invention provides a 2.5D electric spark machining method of an array type micro stepped groove. The invention is called as 2.5D because it can process the structure between 2D plane figure and 3D solid figure, that is, 2.5D structure with certain solid structure is formed by stacking 2D figure structures with different depths and different sizes.
The invention discloses a 2.5D electric spark processing method of an array type fine stepped groove.
Further, the position, the size and the positioning structure of the micro array electrode with the patterns of different sizes are designed, and the manufacturing of the micro array electrode is completed by adopting an electric spark cutting process (manufacturing a square electrode), a LIGA process utilizing a photoetching technology, an electroforming process, a metal etching process and the like. Furthermore, the positioning structure is a fine positioning structure added in the manufacturing of the electrode array pattern, such as a straight line, a square block, a point, a circle and the like, and the positioning structure plays a role in positioning when electrode loss compensation and step-type processing are carried out.
Further, the material of the micro array electrode comprises copper and alloy thereof, nickel and alloy thereof, graphite and compound thereof, tungsten and alloy thereof, and other electric spark electrode materials.
Furthermore, the number of steps of the stepped groove is not limited, and is more than or equal to 2; the number of the figures with different sizes corresponds to the number of the steps of the step groove, and the number is not limited.
Further, in the fine array electrodes, the same pattern is subjected to electrode loss compensation by adding array electrodes with the same pattern, the number of the array electrodes for electrode loss compensation is not limited, and the number is more than or equal to 2. In the process of electric spark machining, not only is the workpiece material corroded and removed due to high temperature, but also the tool electrode has loss, particularly the loss at the edge of the electrode is obvious, and the electrode has certain fillet, which is called electrode loss. Electrode loss compensation refers to multi-electrode machining correction, so that the existence of workpiece fillets can be reduced as much as possible, and machining precision is improved.
Further, the forming mode of the stepped groove is divided into three types according to the inclusion relation of different patterns, and the processing sequence is divided into two types as an example:
a) firstly, processing a small graph structure with deeper processing depth, and then processing a large graph structure with shallower processing depth;
b) firstly, processing a large graph structure with shallow processing depth, and then processing a small graph structure with deep processing depth;
c) firstly, processing a small graph structure, wherein the processing depth is deeper, and then processing a large graph structure, wherein the processing depth is shallower, and an electrode structure does not exist at the overlapped part of the large graph and the small graph, namely, the electric discharge processing cannot be generated at the position.
Compared with the existing step groove processing mode, the invention has the advantages and beneficial effects as follows:
1) the invention can finish the processing of N (N is more than or equal to 2) step micro step grooves of the array by a micro electric spark technology, and can ensure the verticality of the step grooves by a mode of compensating electrode loss.
2) Compared with the step groove machining mode of the traditional machining, the machining precision of the method is greatly improved to reach the micron level, and compared with the traditional machining method, the array machining mode can greatly improve the machining efficiency.
3) Compared with the existing MEMS stepped groove processing methods, such as LIGA multilayer electroforming, multilayer etching and the like, the precision and the efficiency can be greatly limited compared with the processing method, and only electroformed materials such as copper, nickel and the like or etchable materials such as silicon, tungsten and the like can be processed; and the size requirement on the substrate material is strict, the substrate material is compatible with the MEMS process, and the selection of the front-end and the back-end procedures is also greatly limited.
4) The processing mode of the invention can not only carry out array batch processing with micron-scale precision, but also carry out processing of multilayer 2.5D superfine stepped grooves on any material and workpiece size capable of finishing electric spark processing, and has higher compatibility on the former and later processes and wide application prospect.
The micro-arrayed stepped grooves processed by the method can be used in the following fields (the following fields are only examples, and the invention is not limited to the following fields):
1. the multilayer metal micro-mold is mainly applied to micron-scale multilayer injection molds, such as micro-fluidic chips, biocompatible polymer micro-devices and the like.
2. Various micron-sized multilayer 2.5D micromechanical parts, such as axial multistage micro-gears (duplicate gears, reduction gears, etc.), micro-engines, micro-propellers applied to aerospace and small aircraft, and the like.
3. THz signal metal transmission line.
Drawings
FIG. 1 is a schematic diagram of a second-order micro-array stepped groove structure for micro electro discharge machining.
FIG. 2 is a schematic diagram of the arrangement of different patterns of the second order micro array electrode with electrode loss compensation.
FIG. 3 is a schematic diagram of an array pattern, wherein: a) the electrode of the overlapped part of the large pattern electrode and the small pattern has a pattern, b) the electrode of the overlapped part of the large pattern electrode and the small pattern has no pattern.
Fig. 4 is a schematic view of a fine positioning structure added in manufacturing an electrode array pattern.
Fig. 5 is a schematic view of the second-order fine stepped groove processing, in which:
(a) by adopting the electrode in the figure 3-a), firstly processing a small graph structure with deeper processing depth, and then processing a large graph structure with shallower processing depth;
(b) by adopting the electrode in the figure 3-a), firstly processing a large graph structure with shallow processing depth, and then processing a small graph structure with deep processing depth;
(c) the electrode in the figure 3-b) is adopted to process the small graph structure firstly, the processing depth is deeper, and then the large graph structure is processed, the processing depth is shallower, wherein the electrode structure does not exist at the overlapped part of the large graph electrode and the small graph electrode, namely, the electric discharge processing does not occur at the position.
Detailed Description
The present invention will be described in further detail below by way of examples and the accompanying drawings. The embodiments described by referring to the drawings are exemplary only for the purpose of illustrating the invention and are not to be construed as limiting the invention.
Fig. 1 is a schematic diagram of a two-order micro-array stepped groove structure for micro electric discharge machining, wherein the number of steps of the stepped groove is not limited, and is more than or equal to 2. The shapes of the stepped grooves in the figures include square, round, long strip and triangle, and other shapes including special-shaped patterns such as gears can be adopted, and the four shapes are only taken as examples and are not limited to the above patterns.
Fig. 2 is a schematic diagram of arrangement of different patterns of the second-order micro array electrode, where the number of the patterns with different sizes corresponds to the number of steps of the stepped groove, and the number is not limited. In the shown fine electrodes, the same pattern is used for electrode loss compensation by adding array electrodes with the same pattern, the number of the compensated array electrodes is not limited, and the number is more than or equal to 2.
FIG. 3 is a schematic diagram of array patterns of different patterns, which includes two categories, i.e., a) a pattern in which the large pattern and the small pattern overlap each other (i.e., an electrode structure exists, where electro-discharge machining occurs), and b) a pattern in which the large pattern and the small pattern overlap each other (i.e., an electrode structure does not exist, where electro-discharge machining does not occur).
Fig. 4 shows the added fine positioning structure in the process of manufacturing electrode array pattern, such as rectangle, square, dot, circle, etc.
The processing mode of the micro-array electrode comprises linear cutting, etching, a LIGA process, electroforming and the like. The array electrode material comprises copper and alloy thereof, nickel and alloy thereof, graphite and compound thereof, tungsten and alloy thereof, and other electric spark electrode materials.
Fig. 5 is a schematic diagram of processing a second-order fine stepped groove, and the center of the electrode is accurately aligned by one-time clamping (i.e., only one-time clamping) and spindle translation, so that alignment errors caused by a conventional electrode replacement method are avoided. Firstly, processing of a certain depth is completed on one micro array pattern, then processing of different depths is completed on the other micro array pattern through positioning and alignment, the number of steps of the stepped groove is not limited, and the number is more than or equal to 2. According to different processing sequences of different patterns and difference of coincidence degree of the patterns, the processing method is divided into three processing modes:
a) by adopting the electrode in the graph (a) of FIG. 3, firstly, a small graph structure is processed, the processing depth is deeper, and then, a large graph structure is processed, and the processing depth is shallower;
b) by adopting the electrode in the graph (a) of FIG. 3, firstly, a large graph structure is processed, the processing depth is shallow, and then, a small graph structure is processed, and the processing depth is deep;
c) by adopting the electrode in the graph (b) of FIG. 3, firstly, a small graph structure is processed, and the processing depth is deeper; and then processing a large pattern structure with shallow processing depth, wherein an electrode structure does not exist at the overlapped part of the large pattern and the small pattern, namely, the electric discharge processing is not generated at the position.
Although the present invention has been described in detail with respect to the exemplary embodiments and advantages thereof, it should be understood that various changes, substitutions, and alterations can be made hereto without departing from the spirit and scope of the invention as defined by the appended claims. For other examples, one of ordinary skill in the art will readily appreciate that the order of the process steps may be varied while maintaining the scope of the present invention. The protection scope of the present invention is subject to the scope defined by the claims.
Claims (8)
1. A2.5D electric spark processing method of an array type superfine stepped groove is characterized in that superfine array electrodes with different patterns are firstly prepared, then the superfine array electrodes with different patterns are respectively adopted to carry out electric spark processing with different depths on a workpiece, and a superfine array stepped groove stacked with 2D pattern structures with different depths and different sizes is formed; the number of the steps of the stepped groove is more than or equal to 2, and the number of the patterns with different sizes corresponds to the number of the steps of the stepped groove; and a fine positioning structure is added during the preparation of the fine array electrode and is used for positioning during the step groove processing.
2. The method of claim 1, wherein the micro-array electrode is prepared using one of the following methods: an electric spark cutting process, a LIGA process, an electroforming process and a metal etching process.
3. The method of claim 1, wherein the material of the micro-array electrode is: copper and its alloys, nickel and its alloys, graphite and its compounds, or tungsten and its alloys.
4. The method of claim 1, wherein the fine positioning structure has a shape of a straight line, a square, a dot, or a circle.
5. The method of claim 1, wherein the fine array electrode has the same pattern for electrode loss compensation by adding an array electrode having the same pattern, and the fine positioning structure is also used for positioning when electrode loss compensation is performed.
6. The method of claim 1, wherein the micro-array electrodes of different sizes are classified into two categories: a) the overlapping part of the large pattern and the small pattern has an electrode structure, and b) the overlapping part of the large pattern and the small pattern does not have an electrode structure.
7. The method of claim 6, wherein the second step groove is formed in three ways:
a) firstly, processing a small graph structure, wherein the processing depth is deeper; then processing a large graph structure, wherein the processing depth is shallow, and an electrode structure exists at the overlapped part of the large graph and the small graph;
b) firstly, processing a large graph structure, wherein the processing depth is shallow; then, processing a small graph structure, wherein the processing depth is deeper;
c) firstly, processing a small graph structure, wherein the processing depth is deeper; and then processing a large graph structure, wherein the processing depth is shallow, and an electrode structure does not exist in the overlapped part of the large graph and the small graph.
8. The method of claim 1, wherein the precise alignment of the center of the electrode is achieved by one clamping and spindle translation during the machining of the stepped slot.
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Effective date of registration: 20230925 Address after: 100871, Peking University, 5 the Summer Palace Road, Beijing, Haidian District Patentee after: Peking University Address before: Room A7-504, Bionano Park, No. 218 Xinghu Street, Industrial Park, Suzhou City, Jiangsu Province, 215123 Patentee before: HICOMP MICROTECH(SUZHOU) CO.,LTD. |