CN108838561A - A kind of device and cutting method quick and precisely orienting laser cutting for crystal - Google Patents
A kind of device and cutting method quick and precisely orienting laser cutting for crystal Download PDFInfo
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- CN108838561A CN108838561A CN201810708098.4A CN201810708098A CN108838561A CN 108838561 A CN108838561 A CN 108838561A CN 201810708098 A CN201810708098 A CN 201810708098A CN 108838561 A CN108838561 A CN 108838561A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention belongs to field of crystal processing, are related to crystal-cut, and in particular to a kind of device and cutting method that laser cutting is quick and precisely oriented for crystal, device include slicing mechanism, laser body and scale mechanism；Slicing mechanism includes inside diameter slicer, and inside diameter slicer includes interior circular knife, material frame, dovetail clip, flitch and glass-mirror；Flitch is fixed on dovetail clip, for fixing crystal；Glass-mirror is installed on dovetail clip, and is in different sides with flitch；Laser body and scale mechanism are respectively positioned on the side of dovetail clip；The laser of laser body transmitting is fallen on scale mechanism after being reflected by glass-mirror.The device of the application can quickly adjust corner cut degree, and be cut into accurately crystal face in the case where not needing precisely to grind accurate crystal face.
Description
Technical field
The invention belongs to field of crystal processing, are related to crystal-cut, and in particular to one kind is quick and precisely oriented for crystal
The device and cutting method of laser cutting.
Background technique
The use of crystalline material has high requirement to the direction of crystal, and the processing of some crystals is accurate to crystal orientation
The requirement of degree is within 1-2 points, therefore accurate orientation when crystal-cut is very crucial.Since the appearance of common crystal is not advised
It is whole, it needs manually to refine out accurate crystal face before cutting, this has the processing technology of personnel high requirement, and takes time and effort.This
Outside, the crystal face precisely polished easily causes error because glue-line became uneven is even when being adhered to flitch；Before cutting, using right angle
Also there can be operational error when knife-edge ruler is adjusted cutting angle, this can all lead to the deviation of orientation accuracy.
A kind of prior art device of accurate-oriented cutting crystals as disclosed in Chinese patent CN1201915C, it includes swashing
Light device, inner circle cutting machine, laser issue the plane of reference and the subsequent inner circle of crystal before laser beam directive above crystal to be cut
The blade of cutting machine, and perpendicular with blade, laser, crystal to be cut, cutting machine blade the center of circle on an axis,
A straight line N parallel with it is right above this axis, and guarantee the vertical line M of arbitrary point N on by laser beam, vertical line M with it is sharp
Plane is perpendicular to blade determined by light beam；Laser is followed by the screen of display reflection laser beam, it is vertical with straight line N.
But it on the basis of it is in order to accurately cut and need refine one side, then adjusts, adjustable range, which needs to calculate, to be obtained.
Summary of the invention
The present invention provides a kind of device and cutting method that laser cutting is quick and precisely oriented for crystal, can not need
In the case where precisely grinding accurate crystal face, corner cut degree is quickly adjusted, and be cut into accurately crystal face.
To realize the above-mentioned technical purpose, the technical scheme adopted by the invention is as follows, one kind is quick and precisely oriented for crystal to swash
The device of light cutting, including slicing mechanism, laser body and scale mechanism；
Slicing mechanism includes inside diameter slicer, and inside diameter slicer includes interior circular knife, material frame, dovetail clip, flitch and glass mirror
Face；Displacement relative to interior circular knife can occur for material frame, while the rotation relative to interior circular knife can occur；It is set on material frame
There is installation axle, dovetail clip is installed on material frame by installation axle, and dovetail clip can be subjected to displacement and be turned under the drive of material frame
It is dynamic；Flitch is fixed on dovetail clip, for fixing crystal；Glass-mirror is installed on dovetail clip, and is in different sides with flitch；
Laser body and scale mechanism are respectively positioned on the side of dovetail clip；The laser of laser body transmitting passes through glass mirror
It is fallen on scale mechanism after the reflection of face, and the relationship between the scale of distance and scale mechanism of the scale mechanism apart from glass-mirror
It can guarantee that crystal diffraction angle is every and change 1 point, the reflection luminous energy of laser body mobile scale on scale mechanism.
As the improved technical solution of the present invention, laser body can occur consistent with material frame with scale mechanism
Displacement.
As the improved technical solution of the present invention, scale mechanism includes the first lifting support and graduated scale, graduated scale
It is installed on the first lifting support, and can be rotated in perpendicular around the first lifting support；Laser body transmitting swashs
Light is fallen on graduated scale after being reflected by glass-mirror.
As the improved technical solution of the present invention, scale mechanism includes the first lifting support and orthogonal two scales
Scale is installed on the first lifting support at 0 scale of two graduated scales, and the laser of laser body transmitting passes through glass
It can be fallen within simultaneously on two graduated scales after mirror-reflection.
As the improved technical solution of the present invention, laser body includes the second lifting support and laser emitter, is swashed
Optical transmitting set is installed on the second lifting support, and the laser of laser transmitter projects falls within scale machine after reflecting by glass-mirror
On structure.
It is a further object of the present invention to provide one kind quick and precisely to orient laser cutting method for crystal, including walks as follows
Suddenly：
S1, the crystal face to be cut for determining crystal, by Binding on flitch；
S2, control material frame are mobile, and crystal shifts to interior circular knife, so that plane of crystal is cut into a cut surface；
S3, horizontal direction and vertical direction are marked in cut surface, determines the directional angle data of cut surface in the horizontal direction
It is leftward or rightward for dividing with the overgauge X of the directional angle data of index plane with bias direction A, A, represents overgauge X points to the left
For positive number, overgauge X points are represented to the right as negative；Determine determining for the directional angle data and index plane on cut surface vertical direction
To the overgauge Y of angle-data points and bias direction B, B is upward or downward；B is upward or downward, to represent overgauge Y upwards
For positive number, overgauge Y is represented downwards as negative；
S4, adjust laser emitter and graduated scale relative position so that graduated scale between glass-mirror at a distance from guarantee
Every 1 point of the variation in crystal diffraction angle, the reflection luminous energy of laser body mobile scale on scale, and laser emitter
The laser of transmitting drops down at 0 scale of graduated scale by the reflection of glass-mirror；
S5, control material frame rotation adjust graduated scale so that the flare on graduated scale deviates X scale to the direction A
For vertical direction and fixation, lifting support is adjusted, flare is fallen on 0 scale, controls the rotation of material frame, make reflected light
Spot is in the direction B offset Y scale；
S6, starting inside diameter slicer, again to one cut surface of crystal-cut, which is face to be cut, and and index plane
Deviation is interior 3 '.
It is an advantage of the invention that：
1, the device of the application does not specially require the shape of crystalline substance material, can securely be sticked on flitch.
2, crystal is not necessarily to accurate fine grinding, does not need to find out accurate crystal face, it is only necessary to substantially grind required crystal face.（But
It is limited to the adjustable range of inside diameter slicer and the range of scale, is accurately adjusted, is needed as far as possible also for more convenient
Make deviation less than 3 °.）
3, crystal faceted accurate, precision is can be controlled within 1 point.
4, easy to operate, it is fast, accurately, low to the processing technology level requirement of operator.
Detailed description of the invention
The overall structure diagram of Fig. 1 the application device；
The structural schematic diagram of the scale mechanism of Fig. 2 the application；
The structural schematic diagram of Fig. 3 the application laser body；
In figure：1, crystal；2, flitch；3, dovetail clip；4, interior circular knife；5, glass-mirror；6, graduated scale；7, screw；8,
One lifting support；9, laser emitter；10, the second lifting support.
Specific embodiment
To keep purpose and the technical solution of the embodiment of the present invention clearer, below in conjunction with the attached of the embodiment of the present invention
Figure, is clearly and completely described the technical solution of the embodiment of the present invention.Obviously, described embodiment is of the invention
A part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, those of ordinary skill in the art
Every other embodiment obtained, shall fall within the protection scope of the present invention under the premise of being not necessarily to creative work.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein（Including technology art
Language and scientific term）With meaning identical with the general understanding of those of ordinary skill in fields of the present invention.Should also
Understand, those terms such as defined in the general dictionary, which should be understood that, to be had and the meaning in the context of the prior art
The consistent meaning of justice, and unless defined as here, it will not be explained in an idealized or overly formal meaning.
The meaning of heretofore described " connection " can be between component be directly connected to be also possible to pass through between component
Other components are indirectly connected with.
As shown in Figure 1, a kind of device that laser cutting is quick and precisely oriented for crystal, including slicing mechanism, laser hair
Penetrate mechanism and scale mechanism；
Slicing mechanism includes inside diameter slicer（Since inside diameter slicer is the prior art, and for including material frame and interior circular knife 4
Position on diameter slicer is also known technology, in addition, the emphasis of the application and does not lie in the improvement of inside diameter slicer yet, therefore this
Its structural schematic diagram and its working principle are omitted in application text）, inside diameter slicer includes interior circular knife 4, material frame, dovetail
Folder 3, flitch 2 and glass-mirror 5；Displacement relative to interior circular knife 4 can occur for material frame, while can occur relative to interior dise knife
The rotation of piece 4；Material frame is equipped with installation axle（I.e. the material frame of the prior art is used to install the part of material to be cut using peace
It fills axis to replace, mainly facilitates the fixation of dovetail clip 3）, dovetail clip 3 is installed on material frame by installation axle（Dovetail clip 3 is held on
In installation axle）, dovetail clip 3 can be subjected to displacement and rotate under the drive of material frame；Flitch 2 is fixed on dovetail clip 3（That is flitch
2 are fixed on dovetail clip 3 back in the one side of opening）, for fixing crystal 1；Glass-mirror 5 is installed on dovetail clip 3（Glass mirror
Face 5 is installed on the side of dovetail clip 3）, and different sides are in flitch 2；
Laser body and scale mechanism are respectively positioned on the side of dovetail clip；The laser of laser body transmitting passes through glass mirror
It is fallen on scale mechanism after the reflection of face, and the relationship between the scale of distance and scale mechanism of the scale mechanism apart from glass-mirror
It can guarantee that crystal diffraction angle is every and change 1 point, the reflection luminous energy of laser body mobile scale on scale is specifically set
Meter, can be used fixed glass-mirror and graduated scale distance is fixed as 1 meter, 2 meters or 3 meters etc., then by analogue simulation or
Mathematical computations obtain each graduation range of graduated scale；Once it is determined that the graduated scale is permanently to reuse.
Laser body and scale mechanism can occur with material frame relative to interior circular knife 4 for operating easily,
It is displaced and identical displacement occurs.
At this point, cutting method mainly includes the following steps：
S1, the crystal face to be cut for determining crystal 1, crystal 1 is adhered on flitch 2；
S2, adjust laser emitter 9 and graduated scale 6 relative position so that graduated scale 6 between glass-mirror 5 at a distance from
It is 1 meter, the laser that each scale is on graduated scale at this time and laser emitter 9 emits is fallen by the reflection of glass-mirror 5
To 0 scale of graduated scale 6；
S3, horizontal direction and vertical direction are marked in cut surface, determines the directional angle data of cut surface in the horizontal direction
With the overgauge X point and bias direction A of the directional angle data of index plane, A is or to the right to the left, A be it is leftward or rightward, to the left
Overgauge X points are represented as positive number, represents overgauge X points to the right as negative；Determine the orientation angle degree on cut surface vertical direction
It is upward or downward according to overgauge Y points and bias direction B, B of the directional angle data with index plane；Overgauge Y is represented upwards
For positive number, overgauge is represented downwards as negative；
S4, adjust laser emitter and graduated scale relative position so that graduated scale between glass-mirror at a distance from guarantee
Every 1 point of the variation in crystal diffraction angle, the reflection luminous energy of laser body mobile scale on scale, and laser emitter
The laser of transmitting drops down at 0 scale of graduated scale by the reflection of glass-mirror；
S5, control material frame rotation adjust graduated scale so that the flare on graduated scale deviates X scale to the direction A
For vertical direction and fixation, lifting support is adjusted, flare is fallen on 0 scale, controls the rotation of material frame, make reflected light
Spot is in the direction B offset Y scale；
S6, starting inside diameter slicer, again to one cut surface of crystal-cut, which is face to be cut.
Specifically, one kind is quick and precisely oriented for crystal 1 when laser body and scale mechanism are subjected to displacement respectively
Laser cutting method includes the following steps：
S1, the crystal face to be cut for determining crystal 1, crystal 1 is adhered on flitch 2；
S2, control material frame are mobile, and crystal 1 shifts to interior circular knife 4, so that 1 surface of crystal is cut into a cut surface；
S3, horizontal direction and vertical direction are marked in cut surface, determines the directional angle data of cut surface in the horizontal direction
With the overgauge X point and bias direction A of the directional angle data of index plane, A is or to the right to the left, A be it is leftward or rightward, to the left
Overgauge X points are represented as positive number, represents overgauge X points to the right as negative；Determine the orientation angle degree on cut surface vertical direction
It is upward or downward according to overgauge Y points and bias direction B, B of the directional angle data with index plane；Overgauge Y is represented upwards
For positive number, overgauge is represented downwards as negative；
S4, adjust laser emitter 9 and graduated scale 6 relative position so that graduated scale 6 between glass-mirror 5 at a distance from
It is 1 meter, each scale of graduated scale 6 passes through glass-mirror 5 for the laser of the value less than 1mm and the transmitting of laser emitter 9
Reflection drop down at 0 scale of graduated scale 6；
S5, control material frame rotation adjust graduated scale so that the flare on graduated scale deviates X scale to the direction A
For vertical direction and fixation, lifting support is adjusted, flare is fallen on 0 scale, controls the rotation of material frame, make reflected light
Spot is in the direction B offset Y scale；
S6, starting inside diameter slicer, obtain face to be cut to the cutting of crystal 1 again.
Wherein, the position that laser reflection falls in scale mechanism is adjusted for convenience, and laser body includes the second lifting
Bracket 10 and laser emitter 9, laser emitter 9 are installed on the second lifting support 10, and the laser that laser emitter 9 emits is logical
It crosses after glass-mirror 5 reflects and falls on scale mechanism.
Scale mechanism includes the first lifting support 8 and graduated scale 6, and graduated scale 6 is installed on the first lifting by screw 7
On bracket 8, and it can be rotated in perpendicular around the first lifting support 8；The laser of laser body transmitting passes through glass mirror
Face 5 is fallen on graduated scale 6 after reflecting.
At this point, step S5, first guaranteeing graduated scale to realize the direction for adjusting material frame with vertical direction in the horizontal direction
Ruler 6 is horizontally oriented, control material frame rotation, so that reflected light of the laser on glass-mirror 5 deviates X quarter to the direction A
Degree；Followed by graduated scale 6 be in vertical direction, control material frame rotation, so that reflected light of the laser on glass-mirror 5
To the direction B offset Y scale.
Preferably, it rotate in place in order to disposably control material frame, scale mechanism is including the first lifting support 8 and mutually
Two vertical graduated scales 6 are installed on the first lifting support 8 at 0 scale of two graduated scales 6, laser body
The laser of transmitting can be fallen on two graduated scales 6 simultaneously after being reflected by glass-mirror 5, control material frame rotation, so that swashing
Reflected light of the light on glass-mirror 5 is to the direction A offset distance Y, to the direction B offset distance X.
Embodiment 1
Accurate cutting YAG crystal<111>Crystal face
1,1 blank of YAG crystal of growth is taken, the blank direction of growth is<111>Direction, 1 blank of crystal are shuttle shape, both ends
Point.A plane is roughly ground into out in one end of 1 blank of crystal, oriented instrument orients in the horizontal and vertical directions, roughly grinds the side of plane
To in the horizontal and vertical directions and about 70 points of index plane deviation.
2, crystal 1 is sticked on flitch 2.And it is fixed on the material frame of inside diameter slicer.Frame direction up and down is expected in adjustment,
The corase grinding plane of 1 blank of crystal is set to be roughly parallel to cutting machine blade.
3, start inside diameter slicer, cut the crystal microchip of a piece of 1mm thickness.With pencil on the cut surface of thin slice along
Vertically draw 2 mark lines in the horizontal and vertical direction of the edge of a knife.
4, it is oriented along mark line, determines accurate offset differences and offset direction in the horizontal and vertical directions.Level side
It is 65 points to positively biased difference, it is to the left.Vertical direction positively biased difference is 54 points, on the upper side.
5, graduated scale 6 is installed on the first lifting support 8, with tape measure and adjusts distance, makes it from reflecting mirror
Face 1m.Laser is installed on the second lifting support 10, the height of the second lifting support 10 is adjusted, makes to be emitted wide cause level
On directive glass-mirror 5, and adjusting enables flare just to fall on the upright graduated scale 6 in side.
6, material frame is adjusted in the horizontal direction, and graduated scale 6 is horizontally oriented at this time, makes flare in graduated scale
It is moved to the left 65 scales on ruler 6, locks.Then graduated scale 6 is tuned into vertical direction, and adjusts incident ray direction, made
Hot spot is fallen in again on graduated scale 6（Lifting support is adjusted, hot spot is made to be located at 0）.Then material frame is adjusted in the vertical direction,
So that reflected light plate is moved up 54 scales, locks.
7, start inside diameter slicer, cut a small plate sheet again, remove orientation, orientation result is horizontal direction overgauge
2 points, vertical direction overgauge 1 is divided.Cutting result reaches high precision.It can carry out subsequent cutting requirement cutting.
Concrete application, by taking YAG crystal as an example, the crystal plane rod end of processing is<111>Face, precision are ± 10 ',<111>Face
The standard diffraction angle angle θ numerical value be equal to 26 ° 23 ', two straight lines are arbitrarily drawn on index plane, are surveyed along this two rectilinear directions
Examination, it is 26 ° 23 ' that the angle of diffraction one, which is established a capital, this is standard<111>Face, in production and processing, usually require that accomplish 26 ° 23 ' ±
10′。
In actual processing, first find<111>Face, arbitrarily corase grinding obtains floated finish, material is then adhered to flitch to 24-28 °
On, flitch is placed on dovetail clip, is fastened.Dovetail clip is adjusted up and down, is kept floated finish and inner circle knife face substantially parallel, is opened
Dynamic patio's cutting machine, directly cuts the first knife, cuts a piece of very thin material head, horizontal and vertical two lines, water are drawn on cut surface
Square upwardly-directed numerical value is assumed to be 27 ° 23 ' to the left, then being to the right 25 ° 23 ', 1 ° of deviation（60 ', i.e., 60 points）, at this moment it is
It can start to adjust, open laser, project hot spot, be irradiated on glass-mirror 5, fall in the hot spot reflected by glass-mirror
0 scale position of horizontal direction graduated scale（Or any position）, rotation adjusts dovetail clip and flitch in the horizontal direction（Rotate material
Frame is realized）, so that hot spot is moved to the left 60 lattice on scale, it is same originally with operation to adjust vertical direction,）Both direction is all
After regulating, start the face cut, cut out, as accurately<111>Face, the angle of diffraction usually tested in the horizontal direction
Data can control ± 2 ' interior at 26 ° 23 '.）
The above is only embodiments of the present invention, and the description thereof is more specific and detailed, and but it cannot be understood as to this hair
The limitation of bright the scope of the patents.It should be pointed out that for those of ordinary skill in the art, not departing from present inventive concept
Under the premise of, various modifications and improvements can be made, these are all belonged to the scope of protection of the present invention.
Claims (6)
1. a kind of device for quick and precisely orienting laser cutting for crystal, which is characterized in that including slicing mechanism, Laser emission
Mechanism and scale mechanism；
Slicing mechanism includes inside diameter slicer, and inside diameter slicer includes interior circular knife, material frame, dovetail clip, flitch and glass mirror
Face；Displacement relative to interior circular knife can occur for material frame, while the rotation relative to interior circular knife can occur；It is set on material frame
There is installation axle, dovetail clip is installed on material frame by installation axle, and dovetail clip can be subjected to displacement and be turned under the drive of material frame
It is dynamic；Flitch is fixed on dovetail clip, for fixing crystal；Glass-mirror is installed on dovetail clip, and is in different sides with flitch；
Laser body and scale mechanism are respectively positioned on the side of dovetail clip；The laser of laser body transmitting passes through glass mirror
It is fallen on scale mechanism after the reflection of face, and the relationship between the scale of distance and scale mechanism of the scale mechanism apart from glass-mirror
It can guarantee that crystal diffraction angle is every and change 1 point, the reflection luminous energy of laser body mobile scale on scale mechanism.
2. a kind of device for quick and precisely orienting laser cutting for crystal according to claim 1, which is characterized in that swash
Light-transmitting means and scale mechanism can occur and the consistent displacement of material frame.
3. a kind of device for quick and precisely orienting laser cutting for crystal according to claim 1, which is characterized in that mark
Ruler mechanism includes the first lifting support and graduated scale, and graduated scale is installed on the first lifting support, and can be in perpendicular
It is interior to be rotated around the first lifting support；The laser of laser body transmitting is fallen on graduated scale after being reflected by glass-mirror.
4. a kind of device for quick and precisely orienting laser cutting for crystal according to claim 1, which is characterized in that mark
Ruler mechanism includes the first lifting support and orthogonal two graduated scales, and the is installed at 0 scale of two graduated scales
On one lifting support, the laser of laser body transmitting can fall within two graduated scales after reflecting by glass-mirror simultaneously
On.
5. a kind of device for quick and precisely orienting laser cutting for crystal according to claim 1, which is characterized in that swash
Light-transmitting means includes the second lifting support and laser emitter, and laser emitter is installed on the second lifting support, laser hair
The laser of emitter transmitting is fallen on scale mechanism after being reflected by glass-mirror.
6. a kind of quick and precisely orient laser cutting method based on any crystal that is used for of claim 1-5, feature exists
In including the following steps：
S1, the crystal face to be cut for determining crystal, by Binding on flitch；
S2, control material frame are mobile, and crystal shifts to interior circular knife, so that plane of crystal is cut into a cut surface；
S3, horizontal direction and vertical direction are marked in cut surface, determines the directional angle data of cut surface in the horizontal direction
It is leftward or rightward for dividing with the overgauge X of the directional angle data of index plane with bias direction A, A, represents overgauge X points to the left
For positive number, overgauge X points are represented to the right as negative；Determine determining for the directional angle data and index plane on cut surface vertical direction
To the overgauge Y of angle-data points and bias direction B, B is upward or downward；B is upward or downward, to represent overgauge Y upwards
For positive number, overgauge Y is represented downwards as negative；
S4, adjust laser emitter and graduated scale relative position so that graduated scale between glass-mirror at a distance from guarantee
Every 1 point of the variation in crystal diffraction angle, the reflection luminous energy of laser body mobile scale on scale, and laser emitter
The laser of transmitting drops down at 0 scale of graduated scale by the reflection of glass-mirror；
S5, control material frame rotation adjust graduated scale so that the flare on graduated scale deviates X scale to the direction A
For vertical direction and fixation, lifting support is adjusted, flare is fallen on 0 scale, controls the rotation of material frame, make reflected light
Spot is in the direction B offset Y scale；
S6, starting inside diameter slicer, again to one cut surface of crystal-cut, which is face to be cut, and and index plane
Deviation is interior 3 '.
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| CN201810708098.4A CN108838561B (en) | 2018-07-02 | 2018-07-02 | Device and method for quickly and accurately orienting laser cutting of crystal |
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| CN201810708098.4A CN108838561B (en) | 2018-07-02 | 2018-07-02 | Device and method for quickly and accurately orienting laser cutting of crystal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111267249A (en) * | 2020-03-18 | 2020-06-12 | 中国科学院福建物质结构研究所 | Crystal orientation method and device |
| CN114311350A (en) * | 2022-03-15 | 2022-04-12 | 天通控股股份有限公司 | Head and tail cutting method for lithium tantalate crystal |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111267249A (en) * | 2020-03-18 | 2020-06-12 | 中国科学院福建物质结构研究所 | Crystal orientation method and device |
| CN114311350A (en) * | 2022-03-15 | 2022-04-12 | 天通控股股份有限公司 | Head and tail cutting method for lithium tantalate crystal |
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| CN108838561B (en) | 2020-10-23 |
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Effective date of registration: 20221221 Address after: No. 22, Jingang Road, Dongping Street, Lishui District, Nanjing, Jiangsu 210000 Patentee after: Nanjing Guangbao Crystal Technology Co.,Ltd. Address before: Room A01 and A03, Qualcomm Base, No. 3, Hengda Road, Nanjing Economic and Technological Development Zone, Nanjing, Jiangsu 210038 Patentee before: NANJING GUANGBAO OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |