CN108832273A - Center component, electronic device and center module processing method - Google Patents

Center component, electronic device and center module processing method Download PDF

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Publication number
CN108832273A
CN108832273A CN201810601089.5A CN201810601089A CN108832273A CN 108832273 A CN108832273 A CN 108832273A CN 201810601089 A CN201810601089 A CN 201810601089A CN 108832273 A CN108832273 A CN 108832273A
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CN
China
Prior art keywords
extension
middle plate
edge frame
metal edge
plate ontology
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CN201810601089.5A
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Chinese (zh)
Inventor
李�杰
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810601089.5A priority Critical patent/CN108832273A/en
Publication of CN108832273A publication Critical patent/CN108832273A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/44Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/50Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/04Metal casings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)

Abstract

The application provides a kind of center component, electronic device and center module processing method.The center component is applied to electronic device, including:Metal edge frame, the metal edge frame are in hollow form, form accommodating space, the metal edge frame at least partially constitutes antenna radiator;Middle plate, the middle plate is located in the accommodating space, the middle plate includes middle plate ontology and the first extension and the second extension that extend out from the middle plate ontology side, first extension with constituting the feedback of antenna radiator portion, the antenna radiator is grounded by first extension for being electrically connected the metal edge frame with the middle plate ontology;Second extension constitutes the current feed department of the antenna radiator, and second extension is for receiving radiofrequency signal and by radio signal transmission to the metal edge frame.The technical solution of the application helps to save cost.

Description

Center component, electronic device and center module processing method
Technical field
This application involves field of mechanical technique more particularly to a kind of center components, electronic device and center component processing side Method.
Background technique
Electronic device generally includes front cover, rear cover and center component.Front cover is oppositely arranged with rear cover, and front cover, rear cover And center component cooperates to accommodate function element in electronic device, such as circuit board, battery etc..Center component generally wraps Middle plate and frame are included, frame includes multistage, and multistage is all set in the edge of center, the end face of two adjacent segmentation frames Between formed day linear slit.In traditional technology, mobile phone center mostly uses the structure type of plate and metal edge frame in die casting, Ci Zhongjie Configuration formula can greatly reduce computer digital control machine tool (Computerized Numerical Control Machine, CNC) process time, metal edge frame material can also select the metals such as aluminium alloy, titanium alloy, stainless steel.But use this structure shape The center antenna feed point of formula, which is realized mostly, to be processed by frame CNC, will increase material thickness and the CNC process time of frame, Especially for the unmanageable material such as stainless steel, titanium alloy, higher cost.
Summary of the invention
The application provides a kind of center component, and the center component includes:
Metal edge frame, the metal edge frame are in hollow form, form accommodating space, the metal edge frame at least partially constitutes Antenna radiator;
Middle plate, the middle plate are located in the accommodating space, and the middle plate includes middle plate ontology and from the middle plate ontology The first extension and the second extension that side extends out, first extension is with constituting the feedback of the antenna radiator Portion, first extension connect the antenna radiator for being electrically connected the metal edge frame with the middle plate ontology Ground;Second extension constitutes the current feed department of the antenna radiator, and second extension is for receiving radiofrequency signal simultaneously By radio signal transmission to the metal edge frame.
Center component provided by the present application, including metal edge frame and middle plate, the metal edge frame are in hollow form, form receiving Space, the metal edge frame at least partially constitute antenna radiator;The middle plate includes middle plate ontology and from the middle plate sheet The first extension and the second extension that body side extends out, first extension is with constituting the feedback of the antenna radiator Portion, first extension connect the antenna radiator for being electrically connected the metal edge frame with the middle plate ontology Ground;Second extension constitutes the current feed department of the antenna radiator, and second extension is for receiving radiofrequency signal simultaneously By radio signal transmission to the metal edge frame.Due to first extension and second extension and the middle plate ontology Die cast can be used, is formed in same manufacturing procedure, compared to the feedback using CNC processing frame shape at antenna radiator Electric portion and feedback ground portion, can shorten process time, and then help to reduce processing cost.
The application also provides a kind of electronic device, and the electronic device includes center component as described above.
The application also provides a kind of center module processing method, and the center module processing method includes:
Blank is provided, die casting is carried out to the blank, is extended with plate ontology in formation and from the middle plate ontology side The first extension and the second extension come;
The metal edge frame of hollow form is provided;
The middle plate ontology and the metal edge frame are spliced, so that the middle plate ontology is located at the metal edge frame In the accommodating space of formation, the middle plate ontology passes through first extension and second extension and the metal edge frame Electrical connection.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the application embodiment Attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the application, for this field For those of ordinary skill, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram for the center component that the embodiment of the present application one provides.
Fig. 2 is the structural schematic diagram for the center component that the embodiment of the present application two provides.
Fig. 3 is the structural schematic diagram for the center component that the embodiment of the present application three provides.
Fig. 4 is the structural schematic diagram for the electronic device that one preferred embodiment of the application provides.
Fig. 5 (a) is the structural schematic diagram of the electronic device of the embodiment of the present application two.
Fig. 5 (b) is the structural schematic diagram of the AA sectional view of electronic device in Fig. 5 (a).
Fig. 6 is a kind of flow chart for center module processing method that the embodiment of the present application one provides.
Fig. 7 is a kind of corresponding local flow chart of step S100 of the embodiment of the present application.
Fig. 8 is corresponding local flow chart after a kind of step S120 of the embodiment of the present application.
Fig. 9 is a kind of corresponding local flow chart of step S130 of the embodiment of the present application.
Figure 10 corresponding part flow chart before being a kind of step S135 of the embodiment of the present application.
Figure 11 is corresponding local flow chart after a kind of step S135 of the embodiment of the present application.
Figure 12 is corresponding local flow chart after a kind of step S138 of the embodiment of the present application.
Figure 13 is a kind of corresponding local flow chart of step S300 of the embodiment of the present application.
Figure 14 is corresponding local flow chart after a kind of step S320 of the embodiment of the present application.
Figure 15 is corresponding another local flow chart after a kind of step S300 of the embodiment of the present application.
Figure 16 corresponding part flow chart before being a kind of step S500 of the embodiment of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear Chu is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute under that premise of not paying creative labor The every other embodiment obtained, shall fall in the protection scope of this application.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram for the center component that the embodiment of the present application one provides.In present embodiment In, the center component 10 includes metal edge frame 100 and middle plate 200, and the metal edge frame 100 is in hollow form, and it is empty to form receiving Between 100A, the metal edge frame 100 at least partially constitutes antenna radiator 1001;It is empty that the middle plate 200 is located at the receiving Between in 100A, the middle plate 200 includes middle plate ontology 210 and first extends from what middle 210 side of plate ontology extended out Portion 220 and the second extension 230, first extension 220 with constituting the feedback of the antenna radiator 1001 portion 1001a, institute The first extension 220 is stated for the metal edge frame 100 to be electrically connected with the middle plate ontology 210, by the aerial radiation Body 1001 is grounded;Second extension 230 constitutes the current feed department 1001b of the antenna radiator 1001, and described second extends Portion 230 is for receiving radiofrequency signal and by radio signal transmission to the metal edge frame 100.
Wherein, antenna radiator 1001 is also known as antenna, is a kind of converter, it the guided wave propagated on transmission line, It is transformed into the electromagnetic wave propagated in unbounded medium (usually free space), or carries out opposite transformation.It is set in radio It is used to emit or receive the component of electromagnetic wave in standby.Feedback ground portion 1001a, which refers to, to be electrically connected on antenna radiator 1001 with earth polar The position connect.Current feed department 1001b refer on antenna radiator 1001 with the radiofrequency signal on main circuit board 320 (referring to Fig. 5 (b)) The position that source is electrically connected.
Optionally, the material of the metal edge frame 100 can be aluminium alloy, titanium alloy either stainless steel etc..
Optionally, in one embodiment, 200 the being integrally formed structure of middle plate, i.e., described middle 210 He of plate ontology First extension 220 and second extension 230 are formed in same manufacturing procedure.Help to save processing work Sequence shortens the process-cycle, to reduce processing cost.Optionally, in another embodiment, middle 210 He of plate ontology First extension 220 and second extension 230 constitute absolute construction, respectively the shape in different manufacturing procedures At so as to opposite between the middle plate ontology 210, first extension 220 and second extension 230 Position carries out flexibly adjustment, enhances current feed department 1001b and presents the flexibility of positional relationship between ground portion 1001a.And it feeds Length between portion 1001b and feedback ground portion 1001a is the electrical length of the antenna radiator 1001, by adjusting the antenna The electrical length of radiator 1001, so that it may the frequency modulation of antenna radiator 1001 is realized, to help to realize antenna radiator 1001 more wide band work.
The center component 10 that the technical program provides, including metal edge frame 100 and middle plate 200, the metal edge frame 100 be in Hollow form, forms accommodating space 100A, and the metal edge frame 100 at least partially constitutes antenna radiator 1001;The middle plate 200 include middle plate ontology 210 and the first extension 220 and the second extension that extend out from middle 210 side of plate ontology 230, use with constituting the feedback of the antenna radiator 1001 by portion 1001a, first extension 220 for first extension 220 In the metal edge frame 100 to be electrically connected with the middle plate ontology 210, the antenna radiator 1001 is grounded;Described Two extensions 230 constitute the current feed department 1001b of the antenna radiator 1001, and second extension 230 is for receiving radio frequency Signal and by radio signal transmission to the metal edge frame 100.Due to first extension 220 and second extension 230 can use die cast with the middle plate ontology 210, be formed in same manufacturing procedure, process side compared to using CNC Frame forms the current feed department 1001b and feedback ground portion 1001a of antenna radiator 1001, can shorten process time, and then help to drop Low processing cost.
Referring to Fig. 2, Fig. 2 is the structural schematic diagram for the center component that the embodiment of the present application two provides.The knot of embodiment two Structure and the structure of embodiment one are essentially identical, the difference is that, in the present embodiment, the center component 10 further includes solid Determine part 300, the fixing piece 300 is arranged between the metal edge frame 100 and the middle plate 200, and the fixing piece 300 is used for The middle plate 200 is fixedly connected with the metal edge frame 100, the material of the fixing piece 300 is non-conductive material.
Specifically, the fixing piece 300 is plastic cement material, the fixing piece 300 can be formed using injection molding.The fixation Part 300 has the function of at least two aspects, first, the fixing piece 300 is used for the middle plate 200 and the metal edge frame 100 are fixedly connected;Second, the fixing piece 300 is used to completely cut off second extension 230 and the middle plate ontology 210, It prevents from being formed between second extension 230 and the middle plate ontology 210 and be electrically connected, to influence the work of metal edge frame 100 For the function of antenna radiator 1001.
Optionally, in one embodiment, the fixing piece 300 coats first extension 220.Described first prolongs Portion 1001a, the fixing piece 300 can be to first extensions with constituting the feedback of the antenna radiator 1001 for extending portion 220 220 form protection, and first extension 220 is prevented to be oxidized, and facilitate the use longevity for extending first extension 220 Life.
Optionally, in another embodiment, the fixing piece 300 coats first extension 220 and institute simultaneously State the second extension 230.First extension 220 with constituting the feedback of the antenna radiator 1001 portion 1001a, described second Extension 230 constitutes the current feed department 1001b of the antenna radiator 1001, and the fixing piece 300 can extend to described first Portion 220 and second extension 230 form protection, prevent first extension 220 and second extension 230 by oxygen Change, facilitates the service life for extending first extension 220 and second extension 230.And it is further, it is described solid Determine portion to be arranged between second extension 230 and the middle plate ontology 210, for second extension 230 and institute It states the formation of middle plate ontology 210 to be dielectrically separated from, prevents from being formed between second extension 230 and the middle plate ontology 210 and be electrically connected It connects, to influence function of the metal edge frame 100 as antenna radiator 1001.
Referring to Fig. 3, Fig. 3 is the structural schematic diagram for the center component that the embodiment of the present application three provides.The knot of embodiment three Structure and the structure of embodiment two are essentially identical, the difference is that, in the present embodiment, the center component 10 further includes feedback Electric portion 1001b and connector 310, the current feed department 1001b are fixed on the metal edge frame 100 by the connector 310 On, the current feed department 1001b is for receiving radiofrequency signal and by the radio signal transmission to the metal edge frame 100.
Wherein, second extension 230 constitutes the current feed department 1001b.
Specifically, the connector 310 can be rivet either screw, or conducting resinl, the connector 310 For the current feed department 1001b to be fixedly connected with the metal edge frame 100.
Optionally, the connector 310 can also be obtained using the welding slag cooling formed after welding.
In the technical program, the first extension 220 and the second extension 230 are formed on the middle plate ontology 210 first, Portion 1001a, second extension 230 constitute institute to first extension 220 with constituting the feedback of the antenna radiator 1001 The current feed department 1001b of antenna radiator 1001 is stated, then the middle plate ontology 210 and the metal edge frame 100 are spliced, and are made It is real by first extension 220 and second extension 230 and the metal edge frame 100 to obtain the middle plate ontology 210 It is now electrically connected, then uses connector 310 by first extension 220 and second extension 230 and the metal edges Frame 100 is fixedly connected, and then cuts off second extension 230 adjacent to the position of the middle plate ontology 210, so that described the Two extensions 230 disconnect the electrical connection between the middle plate ontology 210, so that 230 structure of the second extension At the current feed department 1001b of the antenna radiator 1001, realizing will be transferred on the second extension 230 therefrom plate ontology 210 Effect on the metal edge frame 100, and middle plate ontology 210 and the first extension 220 and the second extension 230 can use Die cast is formed in same manufacturing procedure, avoid using CNC to metal edge frame 100 carry out processing expend the time it is longer The drawbacks of, and there is high requirement to the material thickness of metal edge frame 100, therefore, the technical program helps to shorten process time, from And processing cost can be reduced.
Referring to Fig. 4, Fig. 4 is the structural schematic diagram for the electronic device that one preferred embodiment of the application provides.The electronics Device 1 includes the center component 10 that any embodiment as above provides, and the center component 10 includes metal edge frame 100 and middle plate 200, the metal edge frame 100 is in hollow form, forms accommodating space 100A, and the metal edge frame 100 at least partially constitutes day Beta radiation body 1001;The middle plate 200 is located in the accommodating space 100A, and the middle plate 200 is including middle plate ontology 210 and certainly The first extension 220 and the second extension 230 that middle 210 side of plate ontology extends out.About metal edge frame 100 in Plate 200 please refers to being discussed in detail for front, and details are not described herein.
Optionally, the electronic device 1 can be any equipment for having communication and store function.Such as:Tablet computer, Mobile phone, electronic reader, remote controler, personal computer (Personal Computer, PC), laptop, mobile unit, Web TV, wearable device etc. have the smart machine of network function.
Fig. 5 (a) is please referred to, Fig. 5 (a) is the structural schematic diagram of the electronic device of the embodiment of the present application two.In this embodiment party In formula, the electronic device 1 is other than including the center component 10 of any embodiment as above offer, and the electronic device 1 is also Including main circuit board 320, the main circuit board 320 is fixedly connected with the middle plate 200, the main circuit board 320 and described the The electrical connection of two extensions 230 transmits the radiofrequency signal that the main circuit board 320 generates by second extension 230 The antenna radiator 1001 constituted to the metal edge frame 100.
It is to be appreciated that above-mentioned each embodiment and respective drawings illustrate in electronic device 1 and the application compared with For relevant component, main component in the electronic device of the application 1 is introduced below, so as to the electricity to the application The mutual cooperation relationship of component in sub-device 1 and the framework of entirety are recognized.
Referring to Figure 4 together, Fig. 5 (a) and Fig. 5 (b), Fig. 5 (b) is the structure of the AA sectional view of electronic device in Fig. 5 (a) Schematic diagram.The electronic device 1 includes center component 10, and the center component 10 includes metal edge frame 100 and middle plate 200, institute Metal edge frame 100 is stated in hollow form, forms accommodating space 100A, the metal edge frame 100 at least partially constitutes aerial radiation Body 1001;The middle plate 200 is located in the accommodating space 100A, and the middle plate 200 includes middle plate ontology 210 and in described The first extension 220 and the second extension 230 that 210 side of plate ontology extends out, first extension 220 constitute described The feedback of antenna radiator 1001 ground portion 1001a, first extension 220 are used for the metal edge frame 100 and the middle plate Ontology 210 is electrically connected, and the antenna radiator 1001 is grounded;Second extension 230 constitutes the antenna radiator 1001 current feed department 1001b, second extension 230 is for receiving radiofrequency signal and by radio signal transmission to the metal Frame 100.
The electronic device 1 further includes screen 1010, and the screen 1010 can be but be not limited to LCD screen (Liquid Crystal Display, LCD) or Organic Light Emitting Diode (Original Light Emitting Diode, OLED) screen.The screen 1010 can be only display panel 1800 having a display function, can also only have touch-control The touch panel 1700 of function can also have the display panel 1800 and touch panel 1700 of display and touch function simultaneously Combining form.
In the present embodiment, the antenna radiator 1001 can be for the metal edge frame 100 in electronic device 1 at least A part is in the present embodiment that a part in the metal edge frame 100 of electronic device 1 is with the antenna radiator 1001 Example is illustrated.The electronic device 1 further includes rear cover 1002, sealant 1400.The metal edge frame 100 may make up the electricity The partial appearance face of sub-device 1, at least part of the metal edge frame 100 is as the antenna radiator 1001, the gold Belong to frame 100 and the setting of the rear cover 1002 interval and forms gap.The sealant 1400 be located at the metal edge frame 100 with In gap between the rear cover 1002, the sealant 1400 is used for the metal edge frame 100 and 1002 knot of rear cover It is combined, the sealant 1400 does not have shielding action to electromagnetic wave signal, and the electromagnetic wave signal can be via described Sealant 1400 is radiate.
In addition, the electronic device 1 further includes cover board 1100.The rear cover 1002, the metal edge frame 100 and the lid The cooperation of plate 1100 is to form accommodating space, and the accommodating space will be for that will accommodate the screen 1010, support plate 1600 and main electricity Road plate 320.The main circuit board 320 is for the fixed radio-frequency signal source 400 and corresponding match circuit for generating radiofrequency signal 700.Illustrated so that the screen 1010 includes touch panel 1700 and display panel 1800 as an example in embodiments, that is, The screen 1010 includes the touch panel 1700 and display panel 1800 being stacked.The support plate 1600 is adjacent to described aobvious Show that panel 1800 is arranged, the support plate 1600 is used to support touch panel 1700 and display panel 1800.The main circuit board 320 are arranged in side of the support plate 1600 far from the screen 1010.The rear cover 1002 is arranged in the main circuit board 320 sides far from the support plate 1600, the rear cover 1002 are the battery cover of the electronic device 1.The cover board 1100 Side of the screen 1010 far from the support plate 1600 is set, for protecting the screen 1010.The cover board 1100 Generally transparent material, the material of the cover board 1100 can be but be not limited only to for glass.
Referring to Fig. 6, Fig. 6 is a kind of flow chart for center module processing method that the embodiment of the present application one provides.It is described Center module processing method is used to process the center component 10 that any embodiment as above provides.The center module processing method packet Step S100, S200 and S300 are included but are not limited to, about being described in detail as follows for step S100, S200 and S300.
S100:Blank is provided, die casting is carried out to the blank, with plate ontology 210 in being formed and from the middle plate ontology 210 The first extension 220 and the second extension 230 that side extends out.
Wherein, die casting is a kind of metal casting technique, its main feature is that applying high pressure to molten metal using mold inner-cavity. Mold is usually to be made of higher strength alloys, this process some similar to injection molding.According to die casting type Difference is needed using cold-chamber die casting machine or hot chamber machine.
Wherein, first extension 220 and second extension 230 are located at the side of the middle plate ontology 210.
Referring to Fig. 7, Fig. 7 is a kind of corresponding local flow chart of step S100 of the embodiment of the present application.Specifically, described "S100:Blank is provided, die casting is carried out to the blank, is prolonged with plate ontology 210 in formation and from middle 210 side of plate ontology The first extension 220 and the second extension 230 " stretched include but is not limited to step S110, S120, S130 and S140, are closed In being described in detail as follows for step S110, S120, S130 and S140.
S110:The blank is melted at high temperature, to obtain the melting charge of liquid.
Specifically, the blank is placed in high temperature-resistant vessel, then high temperature-resistant vessel is heated, works as high temperature resistant When the temperature of vessel reaches the fusing point of the blank, the blank will be melted, and then can be obtained by the melting of liquid Material.
S120:Casting mould is provided.
Wherein, casting mould refers to obtain the planform of part, is easy molding material with other in advance and is made into Then the planform of part is put into mold in sand mold again, one and design of part size one are then formed in sand mold The cavity of sample, then it is poured mobility liquid in the cavity, it can be formed after the liquid cooled and solidified and mold shape structure Duplicate part.
S130:The melting charge of liquid is poured into the type chamber of the casting mould by the feed inlet of the casting mould It is interior.
Specifically, casting mould is the melting charge high speed press-in die type chamber by Driven by Hydraulic Cylinder injection plunger by liquid In, due to being to use oil pressure, pressure is higher, therefore is commonly called as casting mould technique.
Referring to Fig. 8, Fig. 8 is corresponding local flow chart after a kind of step S120 of the embodiment of the present application.Optionally, exist " the S120:Casting mould is provided " after, in " the S130:The melting charge of liquid is passed through into the charging of the casting mould The type that mouth is poured into the casting mould is intracavitary " before, the center module processing method further includes but is not limited to step S122, About being described in detail as follows for step S122.
S122:The type chamber of the casting mould is cleaned, and coats lubricant on the inner wall of the type chamber, it is described Lubricant is for preventing the casting mould temperature excessively high, and the lubricant is also used to so that the middle plate ontology 210 and institute Extension is stated to demould from the casting mould.
Wherein, most common lubricant type is water base lubricant, also referred to as emulsifier, this is for health, environment And the considerations of in terms of safety.Unlike solvent type lubricant, if the minerals in water got rid of with suitable technique, It will not leave by-product in casting.If the process for handling water is not proper, the minerals in water will lead to casting table Planar defect and discontinuity.There are mainly four types of water base lubricants:Water mixes oil, oily water mixing, semi-synthetic and synthesis.What water was mixed oil Lubricant is best, because can be by the surface of the cooling mold of evaporation while depositing oil using water when lubricant, this can To help to demould.In general, the water that the ratio of this series lubricant agent is 30 parts mixes 1 part of oil.And in extreme circumstances, this ratio It can achieve 100:1.
Optionally, the oil that can be used for lubricant includes heavy oil, animal tallow, plant fat and Synthetic Oil.Heavy Viscosity is higher at room temperature for Residual oil, and at a high temperature of in die-casting process, it will become film.Other materials are added in lubricant It can control emulsion viscosity and thermal property.These substances include graphite, aluminium and mica.Other chemical addition agents can be kept away Exempt from dust and oxidation.Emulsifier can be added in water base lubricant, such oil lubricant can add in water inlet, including Soap, alcohol and ethylene oxide.
Optionally, the lubricant based on usually used solvent includes diesel oil and gasoline.It is de- that they are conducive to casting Out, however small blasting can occur in press casting procedure every time, this causes to build up carbon in die cavity wall.Compared to water based lubrication Agent, the lubricant based on solvent are more uniform.
Referring to Fig. 9, Fig. 9 is a kind of corresponding local flow chart of step S130 of the embodiment of the present application.Optionally, described "S130:Type that the melting charge of liquid is poured into the casting mould by the feed inlet of the casting mould is intracavitary " include but It is not limited to step S135, is described in detail as follows about step S135.
S135:The pressure that pressure is greater than default pressure is applied to the melting charge of liquid, the melting charge is injected Type to the casting mould is intracavitary, until the melting charge of liquid solidifies.
Wherein, pressure limit is about between 10 to 175 megapascal.
Specifically, high-pressure injection melting charge causes the speed for filling casting mould very fast, in this way any portion of molten Before melting material solidification, so that it may fill full entire casting mould.In this way, the thin-walled portion for being just difficult filling at last can also To avoid the discontinuity on casting mould surface.
Referring to Fig. 10, Figure 10 before being a kind of step S135 of the embodiment of the present application it is corresponding part flow chart.Optionally, In " the S135:The pressure that pressure is greater than default pressure is applied to the melting charge of liquid, the melting charge is injected into The type of the casting mould is intracavitary, until the melting charge of liquid solidifies " before, the center module processing method further includes But it is not limited to step S132, about being described in detail as follows for step S132.
S132:Mould position is divided to open up several exhaust outlets in the casting mould, the exhaust outlet is described for being discharged Remaining air in casting mould, to reduce the stomata generated on the middle plate ontology 210 and the extension.
Wherein, what the exhaust outlet was arranged in the casting mould divides mould position, since high-pressure injection melting charge causes to fill out The speed for filling casting mould is very fast, leads to air trapping, and air is difficult to escape from casting mould, and result is exactly shape At cast member on can leave more stomata, the form of quality of cast member can be adversely affected.Therefore, in the casting mould Divide mould position to open up several exhaust outlets, air remaining in the casting mould can be discharged, help to reduce in described The stomata generated on plate ontology 210 and the extension, to guarantee the middle plate ontology 210 to be formed and the extension Quality.
Figure 11 is please referred to, Figure 11 is corresponding local flow chart after a kind of step S135 of the embodiment of the present application.Optionally, In " the S135:The pressure that pressure is greater than default pressure is applied to the melting charge of liquid, the melting charge is injected into The type of the casting mould is intracavitary, until the melting charge of liquid solidifies " after, the center module processing method further includes But it is not limited to step S136, S137 and S138, about being described in detail as follows for step S136, S137 and S138.
S136:A point mould is carried out to the casting mould, to obtain manufacturing the first profile of the middle plate ontology 210, and is obtained To the second profile for manufacturing first extension 220 and second extension 230.
Specifically, casting mould consists of two parts, it is covering part and movable part respectively, the part that they are combined is then Referred to as parting line, melting charge can enter mold from parting line, the shape at this position in hot chamber diecasting injection nozzle or It is that injection room in cold chamber die casting matches.Movable part generally includes push rod and runner, and so-called runner is cast gate and die cavity Between channel, melting charge enters die cavity by this channel.Covering part is generally connected on fixation clip or front pressuring plate, and Movable part is then connected on movable pressure plate.Die cavity is divided into two die cavity inserts, they are independent components, can pass through Bolt is relatively easily removed or is installed from mold.
Wherein, dividing mould is exactly to separate the covering part of casting mould with movable part along the parting line, from And obtain manufacturing the first profile of the middle plate ontology 210, and obtain manufacturing first extension 220 and second extension Second profile in portion 230.
S137:First profile is processed, to obtain the middle plate ontology 210.
S138:Second profile is processed, to obtain first extension 220 and second extension 230。
Figure 12 is please referred to, Figure 12 is corresponding local flow chart after a kind of step S138 of the embodiment of the present application.Optionally, In " the S137:First profile is processed, to obtain the middle plate ontology 210;S138:To second profile Processed, to obtain the extension " after, the center group valence processing method further include but be not limited to step S1381 and S1382, about being described in detail as follows for step S1381 and S1382.
S1381:The first overlap on first profile is removed using polishing and polishing process, to obtain the middle plate Ontology 210.
S1382:The second overlap on second profile is removed using polishing and polishing process, to obtain described first Extension 220 and second extension 230.
S140:The melting charge is cooled down, to obtain the middle plate ontology 210, first extension 220 and institute State the second extension 230.
Wherein, cooling is the process for instigating the temperature of hot object to reduce without phase change.Cooling mode can be Natural cooling, or cooling etc. in water cooling, oily cold, air-cooled and furnace.
S200:The metal edge frame 100 of hollow form is provided.
Wherein, the material of metal edge frame 100 can be aluminium alloy, titanium alloy either stainless steel material etc..
Optionally, since the metal edge frame 100 constitutes the partial appearance face of electronic device 1, then, the metal edge frame 100 can process to be formed using CNC, help to obtain the preferable appearance of metal edge frame 100.
S300:The middle plate ontology 210 and the metal edge frame 100 are spliced, so that described middle plate ontology 210 In in the accommodating space 100A that the metal edge frame 100 is formed, the middle plate ontology 210 passes through 220 He of the first extension Second extension 230 is electrically connected with the metal edge frame 100.
Optionally, the mode middle plate ontology 210 and the metal edge frame 100 spliced can with rivet, It either welds, or is that bolt is fixedly connected, can also be the fixed form of other forms.
Figure 13 is please referred to, Figure 13 is a kind of corresponding local flow chart of step S300 of the embodiment of the present application.Specifically, described "S300:The middle plate ontology 210 and the metal edge frame 100 are spliced, so that the middle plate ontology 210 is positioned at described In the accommodating space 100A that metal edge frame 100 is formed, the middle plate ontology 210 passes through first extension 220 and described the Two extensions 230 are electrically connected with the metal edge frame 100 " include but is not limited to step S310 and S320, about step S310 and S320's is described in detail as follows.
S310:First by first extension 220 and second extension 230 respectively with the metal edge frame 100 It is fixedly connected by rivet.
Wherein it is possible to using rivet by first extension 220 and second extension 230 respectively with the gold Belong to frame 100 to be riveted.Rivet is for connecting two band through-holes, and there is the spike part of the part (or component) of cap in one end. In riveting, the part being riveted is connected using self-deformation or interference.There are many rivet type, and informal.
S320:Then the position being fixedly connected is welded again, to enhance first extension 220 and institute State the bonding strength between the second extension 230 and the metal edge frame 100.
Specifically, helping so that first extension 220 and described second by the way of first riveting and welding again Connection between extension 230 and the metal edge frame 100 is more firm.
Figure 14 is please referred to, Figure 14 is corresponding local flow chart after a kind of step S320 of the embodiment of the present application.Specifically, In " the S320:Then the position being fixedly connected is welded again, to enhance first extension 220 and institute State the bonding strength between the second extension 230 and the metal edge frame 100 " after, the center module processing method also wraps Step S400 is included but is not limited to, about being described in detail as follows for step S400.
S400:Milling Process is carried out to first extension 220 and second extension 230, so that the middle plate Ontology 210 is electrically connected by first extension 220 with the metal edge frame 100, and second extension 230 with it is described The setting of the middle interval of plate ontology 210.
Wherein, Milling Process can be processed using milling machine, can also use computer digital control machine tool (Computerized Numerical Control Machine, CNC) processing.By second extension 230 with it is described in Connecting portion milling between plate ontology 210 is disconnected, to cut off between the middle plate ontology 210 and second extension 230 Electrical connection.
Figure 15 is please referred to, Figure 15 is corresponding another local flow chart after a kind of step S300 of the embodiment of the present application. Specifically, in the " S300:The middle plate ontology 210 and the metal edge frame 100 are spliced, so that the middle plate sheet Body 210 is located in the accommodating space 100A of the metal edge frame 100 formation, and the middle plate ontology 210 extends by described first Portion 220 and second extension 230 are electrically connected with the metal edge frame 100 " after, the center module processing method also wraps Step S500 is included but is not limited to, about being described in detail as follows for step S500.
S500:Injection molding forms the fixing piece 300 between the metal edge frame 100 and the middle plate 200, the fixing piece 300 for the middle plate 200 to be fixedly connected with the metal edge frame 100.
Specifically, the fixing piece 300 has the function of at least two aspects, first, the fixing piece 300 is used for institute It states middle plate 200 and the metal edge frame 100 is fixedly connected;Second, the fixing piece 300 extends for completely cutting off described second Portion 230 and the middle plate ontology 210, prevent from being formed between second extension 230 and the middle plate ontology 210 and are electrically connected, To influence function of the metal edge frame 100 as antenna radiator 1001.
Optionally, in one embodiment, the fixing piece 300 coats first extension 220.Described first prolongs Portion 1001a, the fixing piece 300 can be to first extensions with constituting the feedback of the antenna radiator 1001 for extending portion 220 220 form protection, and first extension 220 is prevented to be oxidized, and facilitate the use longevity for extending first extension 220 Life.
Optionally, in another embodiment, the fixing piece 300 coats first extension 220 and institute simultaneously State the second extension 230.First extension 220 with constituting the feedback of the antenna radiator 1001 portion 1001a, described second Extension 230 constitutes the current feed department 1001b of the antenna radiator 1001, and the fixing piece 300 can extend to described first Portion 220 and second extension 230 form protection, prevent first extension 220 and second extension 230 by oxygen Change, facilitates the service life for extending first extension 220 and second extension 230.And it is further, it is described solid Determine portion to be arranged between second extension 230 and the middle plate ontology 210, for second extension 230 and institute It states the formation of middle plate ontology 210 to be dielectrically separated from, prevents from being formed between second extension 230 and the middle plate ontology 210 and be electrically connected It connects, to influence function of the metal edge frame 100 as antenna radiator 1001.
Please refer to Figure 16, Figure 16 corresponding part flow chart before being a kind of step S500 of the embodiment of the present application.Specifically, In " the S500:Injection molding forms the fixing piece 300 between the metal edge frame 100 and the middle plate 200, the fixing piece 300 For the middle plate 200 to be fixedly connected with the metal edge frame 100 " before, the center module processing method further include but It is not limited to step S480, about being described in detail as follows for step S480.
S480:Form the protective layer for covering the metal edge frame 100, it is described protective layer used in forming the metal in injection molding During fixing piece 300 between frame 100 and the middle plate 200, the metal edge frame 100 is formed and is protected, institute is prevented State the appearance that fixing piece 300 destroys the metal edge frame 100.
Optionally, the protective layer can be protective film, and the protective film forms the metal edge frame 100 and wraps up, when When forming the fixing piece 300 between the metal edge frame 100 and the middle plate 200 using injection molding machine, the protective film can be to prevent Only plastic cement falls in the surface of the metal edge frame 100, protects, avoids described solid so as to be formed to the metal edge frame 100 Determine the appearance that part 300 destroys the metal edge frame 100.
In the technical program, the first extension 220 and second is formed on the middle plate ontology 210 using die casting first and is prolonged Extending portion 230, first extension 220 with constituting the feedback of the antenna radiator 1001 portion 1001a, second extension 230 constitute the current feed department 1001b of the antenna radiators 1001, then the middle plate ontology 210 and the metal edge frame 100 into Row splicing, so that the middle plate ontology 210 passes through first extension 220 and second extension 230 and the metal Frame 100 realizes electrical connection, then uses connector 310 by first extension 220 and second extension 230 and institute It states metal edge frame 100 to be fixedly connected, second extension 230 is cut off adjacent to the position of the middle plate ontology 210 then, is made The electrical connection between the disconnection of the second extension 230 and the middle plate ontology 210 is obtained, so that described second extends Portion 230 constitutes the current feed department 1001b of the antenna radiator 1001, and realizing will be on the second extension 230 therefrom plate ontology 210 The effect being transferred on the metal edge frame 100, and middle plate ontology 210 and the first extension 220 and the second extension 230 can With use die cast, formed in same manufacturing procedure, avoid using CNC to metal edge frame 100 carry out processing expend when Between longer drawback, and to the material thickness of metal edge frame 100 have high requirement, therefore, the technical program facilitate shorten processing Time, so as to reduce processing cost.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas; At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.

Claims (17)

1. a kind of center component, it is applied to electronic device, which is characterized in that the center component includes:
Metal edge frame, the metal edge frame are in hollow form, form accommodating space, the metal edge frame at least partially constitutes antenna Radiator;
Middle plate, the middle plate are located in the accommodating space, and the middle plate includes middle plate ontology and from the middle plate ontology side The first extension and the second extension to extend out, first extension with constituting the feedback of antenna radiator portion, institute The first extension is stated for the metal edge frame to be electrically connected with the middle plate ontology, the antenna radiator is grounded;Institute State the current feed department that the second extension constitutes the antenna radiator, second extension is for receiving radiofrequency signal and by radio frequency Signal is transmitted to the metal edge frame.
2. center component as described in claim 1, which is characterized in that the center component further includes fixing piece, the fixation Part is arranged between the metal edge frame and the middle plate, and the fixing piece is for fixing the middle plate and the metal edge frame Connection, the material of the fixing piece are non-conductive material.
3. center component as claimed in claim 2, which is characterized in that the fixing piece also coats first extension.
4. the center component as described in claims 1 to 3 any one, which is characterized in that the center component further includes feed Portion and connector, the current feed department are fixed on the metal edge frame by the connector, and the current feed department is for receiving Radiofrequency signal and by the radio signal transmission to the metal edge frame.
5. a kind of electronic device, which is characterized in that the electronic device include as described in Claims 1 to 4 any one in Frame component.
6. electronic device as claimed in claim 5, which is characterized in that the electronic device further includes main circuit board, the master Circuit board is fixedly connected with the middle plate, and the main circuit board is electrically connected with second extension, by the main circuit board The radiofrequency signal of generation is transmitted to the antenna radiator that the metal edge frame is constituted by second extension.
7. a kind of center module processing method, which is characterized in that the center module processing method includes:
Blank is provided, die casting is carried out to the blank, is extended out with plate ontology in formation and from the middle plate ontology side First extension and the second extension;
The metal edge frame of hollow form is provided;
The middle plate ontology and the metal edge frame are spliced, so that the middle plate ontology is located at the metal edge frame and is formed Accommodating space in, the middle plate ontology is electrically connected by first extension and second extension with the metal edge frame It connects.
8. center module processing method as claimed in claim 7, which is characterized in that described " to the middle plate ontology and described Metal edge frame is spliced, so that the middle plate ontology is located in the accommodating space of metal edge frame formation, the middle plate sheet Body is electrically connected by first extension and second extension with the metal edge frame " include:
First first extension and second extension are fixedly connected with the metal edge frame by rivet respectively;
Then the position being fixedly connected is welded again, to enhance first extension and second extension With the bonding strength between the metal edge frame.
9. center module processing method as claimed in claim 8, which is characterized in that it is described " and then again to it is described it is fixed even The position connect is welded, and is then welded again to the position being fixedly connected, with enhance first extension and After bonding strength between second extension and the metal edge frame ", the center module processing method further includes:
Milling Process is carried out to first extension and second extension, so that the middle plate ontology passes through described first Extension is electrically connected with the metal edge frame, and second extension and the middle plate ontology interval are arranged.
10. center module processing method as claimed in claim 7, which is characterized in that described " to the middle plate ontology and institute Metal edge frame is stated to be spliced, so that the middle plate ontology is located in the accommodating space of metal edge frame formation, the middle plate Ontology is electrically connected by first extension and second extension with the metal edge frame " after, the center component Processing method further includes:
Injection molding forms fixing piece between the metal edge frame and the middle plate, and the fixing piece is used for the middle plate and described Metal edge frame is fixedly connected.
11. center module processing method as claimed in claim 10, which is characterized in that " injection molding forms the metal described Fixing piece between frame and the middle plate, the fixing piece is for the middle plate to be fixedly connected with the metal edge frame " it Before, the center module processing method further includes:
Form the protective layer for covering the metal edge frame, it is described it is protective layer used in injection molding formed the metal edge frame and it is described in During fixing piece between plate, the metal edge frame is formed and is protected, prevents the fixing piece from destroying the metal edge frame Appearance.
12. center module processing method as claimed in claim 7, which is characterized in that described " blank to be provided, to the blank Die casting is carried out, with plate ontology and the first extension and the second extension that extend out from the middle plate ontology side in formation " Including:
The blank is melted at high temperature, to obtain the melting charge of liquid;
Casting mould is provided;
The type that the melting charge of liquid is poured into the casting mould by the feed inlet of the casting mould is intracavitary;
The melting charge is cooled down, to obtain the middle plate ontology, first extension and second extension.
13. center module processing method as claimed in claim 12, which is characterized in that " provide casting mould " it Afterwards, " type that the melting charge of liquid is poured into the casting mould by the feed inlet of the casting mould is intracavitary " it Before, the center module processing method further includes:
The type chamber of the casting mould is cleaned, and coats lubricant on the inner wall of the type chamber, the lubricant is used In preventing the casting mould temperature excessively high, and the lubricant is also used to so that the middle plate ontology and the extension are from institute It states in casting mould and demoulds.
14. center module processing method as claimed in claim 12, which is characterized in that described " to pass through the melting charge of liquid The type that the feed inlet of the casting mould is poured into the casting mould is intracavitary " include:
The pressure that pressure is greater than default pressure is applied to the melting charge of liquid, the melting charge is injected into the casting The type of mold is intracavitary, until the melting charge of liquid solidifies.
15. center module processing method as claimed in claim 14, which is characterized in that in " the melting to liquid Material applies the pressure that pressure is greater than default pressure, and the type that the melting charge is injected into the casting mould is intracavitary, until liquid The melting charge of state solidifies " before, the center module processing method further includes:
Mould position is divided to open up several exhaust outlets in the casting mould, the exhaust outlet is for being discharged in the casting mould Remaining air, to reduce the stomata generated on the middle plate ontology and the extension.
16. center module processing method as claimed in claim 14, which is characterized in that in " the melting to liquid Material applies the pressure that pressure is greater than default pressure, and the type that the melting charge is injected into the casting mould is intracavitary, until liquid The melting charge of state solidifies " after, the center module processing method further includes:
A point mould is carried out to the casting mould, to obtain manufacturing the first profile of the middle plate ontology, and obtains manufacturing described Second profile of one extension and second extension;
First profile is processed, to obtain the middle plate ontology;
Second profile is processed, to obtain first extension and second extension.
17. center module processing method as claimed in claim 16, which is characterized in that it is described " to first profile into Row processing, to obtain the middle plate ontology;Second profile is processed, to obtain the extension " after, it is described in Frame group valence processing method further includes:
The first overlap on first profile is removed using polishing and polishing process, to obtain the middle plate ontology;
The second overlap on second profile is removed using polishing and polishing process, to obtain first extension and institute State the second extension.
CN201810601089.5A 2018-06-12 2018-06-12 Center component, electronic device and center module processing method Pending CN108832273A (en)

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CN113747718A (en) * 2021-09-09 2021-12-03 维沃移动通信有限公司 Housing assembly and electronic device
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CN117840590A (en) * 2024-03-07 2024-04-09 成都天成电科科技有限公司 Method for protecting inner cavity chip during laser re-welding and laser re-welding system
CN117840590B (en) * 2024-03-07 2024-06-04 成都天成电科科技有限公司 Method for protecting inner cavity chip during laser re-welding and laser re-welding system

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Application publication date: 20181116