CN108822780B - Bonding material for cutting semiconductor silicon wafer - Google Patents
Bonding material for cutting semiconductor silicon wafer Download PDFInfo
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- CN108822780B CN108822780B CN201810337084.6A CN201810337084A CN108822780B CN 108822780 B CN108822780 B CN 108822780B CN 201810337084 A CN201810337084 A CN 201810337084A CN 108822780 B CN108822780 B CN 108822780B
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- water
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- epoxy adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/02—Polythioethers; Polythioether-ethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a bonding material for cutting a semiconductor silicon wafer. The components of the invention comprise epoxy resin, toughening agent, filler, coupling agent, water-absorbing material, polythiol, polyamide, filler and pigment. The invention adopts the water-absorbing and heat-releasing material calcium oxide to be added into the epoxy adhesive, when the resin plate and the steel workpiece plate bonded by the epoxy adhesive need to be soaked in water at normal temperature, the water-absorbing and heat-releasing material calcium oxide can absorb a large amount of water and release heat to cause the epoxy adhesive to lose efficacy, so that the resin plate and the steel workpiece plate can be easily separated in the water at normal temperature. The material is environment-friendly, and the harm to workers is greatly reduced; compared with the prior art, the epoxy adhesive can be rapidly disabled under normal temperature water.
Description
Technical Field
The invention belongs to the technical field of material preparation, relates to preparation of a polymer composite material, and particularly relates to a bonding material for cutting a semiconductor silicon wafer.
Background
The development of semiconductors is continuously driven by the development of scientific technology. The development of automation and computers has reduced the cost of high technology products such as silicon wafers (integrated circuits) to a very low level. Particularly, photovoltaic energy has the advantages of no pollution, no noise, low maintenance cost, long service life and the like, and is rapidly developed in recent years, so that silicon wafers for constructing crystalline silicon solar cells are rapidly developed. In the process of cutting silicon wafers, silicon rods and resin plates must be fixed by silicon rod glue, and the resin plates and steel workpiece plates must be bonded by water boiling glue. The resin plate and the steel workpiece plate bonded by the boiled water glue can be degummed in hot water, so that the steel workpiece plate can be repeatedly used. Because the epoxy resin adhesive has the characteristics of high bonding strength, strong universality, relatively low price and the like, and has a series of excellent performances of excellent electrical insulation, stable chemical performance, good processing performance and the like, the silicon wafer cutting boiled water adhesive mainly adopts two-component epoxy resin adhesive at present. The invention discloses epoxy adhesive for silicon rod cutting and a preparation method thereof (application number: 201210258425.3), wherein powdery inorganic salts such as ammonium bicarbonate, sodium hydrosulfite or calcium hydrophosphate are adopted as degumming agents in epoxy resin adhesive, and the epoxy resin adhesive is decomposed and reacted in water at 50-60 ℃ to generate gas, so that a resin plate and a steel workpiece plate bonded by the epoxy adhesive can be degummed in hot water. However, these inorganic salts are decomposed in hot water to produce a small amount of gas, and thus the degumming time is long. A two-component epoxy adhesive and a preparation method thereof are invented by Shanghai Wei photovoltaic science and technology Limited company for a long time, and the application number is 201310016067. X.ammonium bicarbonate, ammonium carbonate, azodiisobutyronitrile, diethyl azodicarboxylate or p-toluenesulfonyl hydrazide are adopted as foaming agents and zinc oxide, urea and the like are adopted as foaming auxiliary agents in epoxy resin adhesive, and the epoxy resin adhesive is decomposed in hot water to react to generate gas, so that the resin plate and the steel workpiece plate bonded by the epoxy adhesive can be degummed in the hot water. However, these foaming agents can generate gas quickly only when the temperature is higher than 90 ℃, so that the epoxy resin plate and the steel workpiece plate bonded by the epoxy resin can be degummed in high-temperature hot water. Furthermore, epoxy adhesives typically use polysulfide rubber as a toughening agent, but polysulfide rubber has an unpleasant odor.
Disclosure of Invention
The invention aims to provide a bonding material for cutting a semiconductor silicon wafer aiming at the defects of the prior art, and the bonding material uses a water-absorbing heat-releasing material in an epoxy adhesive, so that the defect that the existing boiled epoxy adhesive needs high-temperature water degumming is overcome. Meanwhile, the synthetic plant ester chloro-methoxy fatty acid methyl ester is used as a toughening agent, so that the special toughening agent is special for toughening, is environment-friendly and odorless, and has a promoting effect on the adhesion of a metal material due to the chlorine.
The invention relates to a bonding material for cutting a semiconductor silicon wafer, which consists of A, B double components, wherein the components comprise the following raw materials in percentage by mass:
the component A comprises: 80-100 parts by weight of epoxy resin
10-30 parts of toughening agent
10-40 parts by weight of filler
0.5-1.0 part by weight of coupling agent
30-80 parts by weight of water-absorbing and heat-releasing material
And B component: 50-80 parts by weight of polythiol
30-40 parts by weight of polyamide
10-40 parts by weight of filler
1-4 parts by weight of pigment
The epoxy resin is one or a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin;
the toughening agent is chloro-methoxy fatty acid methyl ester;
the filler is one or more of calcium carbonate, silicon dioxide, alumina and talcum powder;
the coupling agent is gamma-glycidol ether oxygen propyl trimethoxy silane;
the water-absorbing exothermal material is calcium oxide;
the pigment is phthalocyanine blue or phthalocyanine green.
When in use, A, B components are uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1.
the invention also provides a preparation method of the material, which comprises the following steps:
the component A is prepared by adding the raw materials of epoxy resin, toughening agent, filler, coupling agent, water-absorbing material and the like into a stirrer according to a ratio, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
And the component B is prepared by adding polythiol, polyamide, filler, pigment and other raw materials into a stirrer according to a ratio, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
The invention adopts the water-absorbing and heat-releasing material calcium oxide to be added into the epoxy adhesive, when the resin plate and the steel workpiece plate bonded by the epoxy adhesive need to be soaked in water at normal temperature, the water-absorbing and heat-releasing material calcium oxide can absorb a large amount of water and release heat to cause the epoxy adhesive to lose efficacy, so that the resin plate and the steel workpiece plate can be easily separated in the water at normal temperature. The material is environment-friendly, and the harm to workers is greatly reduced; compared with the prior art, the epoxy adhesive can be rapidly disabled under normal temperature water.
Detailed Description
The present invention is further analyzed with reference to the following specific examples.
Example 1:
(1) the component A is prepared by adding raw materials of 80 kg of bisphenol A epoxy resin, 10 kg of chloromethoxy fatty acid methyl ester, 12 kg of calcium carbonate, 0.8 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 30 kg of calcium oxide and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 50 kg of polythiol, 30 kg of polyamide, 20 kg of calcium carbonate, 2 kg of phthalocyanine blue and the like into a stirrer, uniformly mixing by using a high-speed disperser under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 2:
(1) the component A is prepared by adding 100 kg of bisphenol F epoxy resin, 25 kg of chloromethoxy fatty acid methyl ester, 10 kg of silicon dioxide, 1 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 30 kg of calcium oxide and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 80 kg of polythiol, 40 kg of polyamide, 10 kg of silicon dioxide, 4 kg of phthalocyanine green and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 3:
(1) the component A is prepared by adding raw materials of 45 kg of bisphenol A epoxy resin, 45 kg of bisphenol F epoxy resin, 30 kg of chloromethoxy fatty acid methyl ester, 40 kg of alumina, 0.5 kg of gamma-glycidyl ether oxypropyl trimethoxysilane, 80 kg of calcium oxide and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 60 kg of polythiol, 30 kg of polyamide, 40 kg of alumina, 1 kg of phthalocyanine blue and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and then subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 4:
(1) the component A is prepared by adding 85 kg of bisphenol A epoxy resin, 15 kg of chloromethoxy fatty acid methyl ester, 30 kg of talcum powder, 0.6 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 80 kg of calcium oxide and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 70 kg of polythiol, 30 kg of polyamide, 25 kg of talcum powder, 2 kg of phthalocyanine green and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 5:
(1) the component A is prepared by adding raw materials of 95 kg of bisphenol F epoxy resin, 15 kg of chloromethoxy fatty acid methyl ester, 10 kg of calcium carbonate, 10 kg of silicon dioxide, 0.9 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 60 kg of calcium oxide and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) B, preparation of a component: adding 65 kg of polythiol, 35 kg of polyamide, 10 kg of silicon dioxide, 10 kg of alumina, 4 kg of phthalocyanine blue and the like into a stirrer, uniformly mixing by a high-speed disperser under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Performance test of the bonding material for cutting the semiconductor silicon wafer:
1. shear and tensile strength were determined according to GB7124-86 [ method for determining adhesive tensile shear strength (metal-metal) ].
2. And (3) determining the degumming time in water: and (3) bonding the resin sheet and a stainless steel sheet (with the length of 10cm and the width of 1 cm) with the bonding area of 8cm and 1cm, suspending the resin sheet and the stainless steel sheet in normal-temperature water at 25 ℃ after the resin sheet and the stainless steel sheet are completely cured, and recording the time for separating and releasing the resin sheet and the steel workpiece plate.
TABLE 1 Properties of Binder for semiconductor silicon wafer dicing
| Sample (I) | Shear strength (MPa) | Tensile Strength (MPa) | Degumming time (min/25 ℃ C.) |
| Example 1 | 19.2 | 20.5 | 17 |
| Example 2 | 17.8 | 19.7 | 18 |
| Example 3 | 18.6 | 20.3 | 18 |
| Example 4 | 16.7 | 18.8 | 19 |
| Example 5 | 18.9 | 19.1 | 17 |
Claims (1)
1. A bonding material for cutting semiconductor silicon wafers consists of A, B double components and is characterized in that the components comprise the following raw materials in percentage by weight:
the epoxy resin is one or a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin;
the toughening agent is chloro-methoxy fatty acid methyl ester;
the filler is one or more of calcium carbonate, silicon dioxide, alumina and talcum powder;
the coupling agent is gamma-glycidol ether oxygen propyl trimethoxy silane;
the water-absorbing exothermal material is calcium oxide;
the pigment is phthalocyanine blue or phthalocyanine green;
when in use, the A, B components are mixed in a mass ratio of 1: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337084.6A CN108822780B (en) | 2018-04-16 | 2018-04-16 | Bonding material for cutting semiconductor silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337084.6A CN108822780B (en) | 2018-04-16 | 2018-04-16 | Bonding material for cutting semiconductor silicon wafer |
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| Publication Number | Publication Date |
|---|---|
| CN108822780A CN108822780A (en) | 2018-11-16 |
| CN108822780B true CN108822780B (en) | 2021-06-01 |
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| CN201810337084.6A Active CN108822780B (en) | 2018-04-16 | 2018-04-16 | Bonding material for cutting semiconductor silicon wafer |
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| CN111873200B (en) * | 2020-07-15 | 2022-04-22 | 中锗科技有限公司 | Method for improving yield of rounding of germanium/silicon infrared crystal |
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| SE374759B (en) * | 1969-03-24 | 1975-03-17 | Litton Business Systems Inc | |
| CN102786904B (en) * | 2012-07-30 | 2014-02-19 | 东莞市永固绝缘材料有限公司 | Fixing glue for cutting crystalline materials and preparation method thereof |
| EP3170860B1 (en) * | 2015-11-19 | 2020-07-29 | 3M Innovative Properties Company | Structural adhesive with improved corrosion resistance |
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