CN108676532B - Epoxy resin bonding material - Google Patents
Epoxy resin bonding material Download PDFInfo
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- CN108676532B CN108676532B CN201810337107.3A CN201810337107A CN108676532B CN 108676532 B CN108676532 B CN 108676532B CN 201810337107 A CN201810337107 A CN 201810337107A CN 108676532 B CN108676532 B CN 108676532B
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- epoxy resin
- epoxy
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- epoxy adhesive
- additive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses an epoxy resin bonding material. The components of the invention comprise raw materials such as epoxy resin, toughening agent, filler, coupling agent, additive, polythiol, polyamide, filler, pigment and the like. According to the invention, the additive sodium alginate is added into the epoxy adhesive, and when the resin plate and the steel workpiece plate bonded by the epoxy adhesive need to be soaked in normal-temperature water, the epoxy adhesive is ineffective because the additive sodium alginate can absorb a large amount of water, so that the resin plate and the steel workpiece plate can be easily separated in the normal-temperature water. The material is environment-friendly, and the harm to workers is greatly reduced; compared with the prior art, the epoxy adhesive can be rapidly disabled under normal temperature water.
Description
Technical Field
The invention belongs to the technical field of material preparation, relates to preparation of a high-molecular bonding material, and particularly relates to an epoxy resin bonding material.
Background
Solar photovoltaic power generation generally refers to an energy form that can directly convert light energy into electrical energy using semiconductors. The photovoltaic energy has the advantages of no pollution, no noise, low maintenance cost, long service life and the like, and is rapidly developed in recent years. A crystalline silicon solar cell constructed by silicon wafers is the most common form of photovoltaic power generation, and a silicon rod glue is used for fixing a silicon rod and a resin plate in a silicon wafer cutting production process, and a resin plate and a steel workpiece plate are simultaneously bonded by a water boiling glue. The resin plate and the steel workpiece plate bonded by the boiled water glue can be degummed in hot water, so that the steel workpiece plate can be repeatedly used. Because the epoxy resin adhesive has the characteristics of high bonding strength, strong universality, relatively low price and the like, and has a series of excellent performances of excellent electrical insulation, stable chemical performance, good processing performance and the like, the silicon wafer cutting boiled water adhesive mainly adopts two-component epoxy resin adhesive at present. The invention discloses epoxy adhesive for silicon rod cutting and a preparation method thereof (application number: 201210258425.3), wherein powdery inorganic salts such as ammonium bicarbonate, sodium hydrosulfite or calcium hydrophosphate are adopted as degumming agents in epoxy resin adhesive, and the epoxy resin adhesive is decomposed and reacted in water at 50-60 ℃ to generate gas, so that a resin plate and a steel workpiece plate bonded by the epoxy adhesive can be degummed in hot water. However, these inorganic salts are decomposed in hot water to produce a small amount of gas, and thus the degumming time is long. A two-component epoxy adhesive and a preparation method thereof are invented by Shanghai Wei photovoltaic science and technology Limited company for a long time, and the application number is 201310016067. X.ammonium bicarbonate, ammonium carbonate, azodiisobutyronitrile, diethyl azodicarboxylate or p-toluenesulfonyl hydrazide are adopted as foaming agents and zinc oxide, urea and the like are adopted as foaming auxiliary agents in epoxy resin adhesive, and the epoxy resin adhesive is decomposed in hot water to react to generate gas, so that the resin plate and the steel workpiece plate bonded by the epoxy adhesive can be degummed in the hot water. However, these foaming agents can generate gas quickly only when the temperature is higher than 90 ℃, so that the epoxy resin plate and the steel workpiece plate bonded by the epoxy resin can be degummed in high-temperature hot water. Furthermore, epoxy adhesives typically use polysulfide rubber as a toughening agent, but polysulfide rubber has an unpleasant odor.
Disclosure of Invention
The invention aims to provide the epoxy adhesive capable of automatically degumming in normal-temperature water aiming at the defects of the prior art, and overcomes the defect that the conventional epoxy adhesive needs high-temperature water for degumming. Meanwhile, the synthetic plant ester chloro-methoxy fatty acid methyl ester is used as a toughening agent, so that the special toughening agent is special for toughening, is environment-friendly and odorless, and has a promoting effect on the adhesion of a metal material due to the chlorine.
The invention relates to a high polymer bonding material, which consists of A, B bi-components, and comprises the following raw materials in percentage by mass:
the component A comprises: 80-100 parts by weight of epoxy resin
10-30 parts of toughening agent
10-40 parts by weight of filler
0.5-1.0 part by weight of coupling agent
10-30 parts of additive
And B component: 50-80 parts by weight of polythiol
30-40 parts by weight of polyamide
10-40 parts by weight of filler
1-4 parts by weight of pigment
The epoxy resin is one or a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin;
the toughening agent is chloro-methoxy fatty acid methyl ester;
the filler is one or more of calcium carbonate, silicon dioxide, alumina and talcum powder;
the coupling agent is gamma-glycidol ether oxygen propyl trimethoxy silane;
the additive is sodium alginate;
the pigment is phthalocyanine blue or phthalocyanine green.
When in use, A, B components are uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1.
the invention also provides a preparation method of the material, which comprises the following steps:
the component A is prepared by adding the raw materials of epoxy resin, toughening agent, filler, coupling agent, additive and the like into a stirrer according to a ratio, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
And the component B is prepared by adding polythiol, polyamide, filler, pigment and other raw materials into a stirrer according to a ratio, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
According to the invention, the additive sodium alginate is added into the epoxy adhesive, and when the resin plate and the steel workpiece plate bonded by the epoxy adhesive need to be soaked in normal-temperature water, the epoxy adhesive is ineffective because the additive sodium alginate can absorb a large amount of water, so that the resin plate and the steel workpiece plate can be easily separated in the normal-temperature water. The material is environment-friendly, and the harm to workers is greatly reduced; compared with the prior art, the epoxy adhesive can be rapidly disabled under normal temperature water.
Detailed Description
The present invention is further analyzed with reference to the following specific examples.
Example 1:
(1) the component A is prepared by adding raw materials of 80 kg of bisphenol A epoxy resin, 10 kg of chloromethoxy fatty acid methyl ester, 12 kg of calcium carbonate, 0.8 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 10 kg of sodium alginate serving as an additive and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 50 kg of polythiol, 30 kg of polyamide, 20 kg of calcium carbonate, 2 kg of phthalocyanine blue and the like into a stirrer, uniformly mixing by using a high-speed disperser under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 2:
(1) the component A is prepared by adding 100 kg of bisphenol F epoxy resin, 25 kg of chloromethoxy fatty acid methyl ester, 10 kg of silicon dioxide, 1 kg of gamma-glycidyl ether oxypropyl trimethoxysilane, 30 kg of sodium alginate serving as an additive and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 80 kg of polythiol, 40 kg of polyamide, 10 kg of silicon dioxide, 4 kg of phthalocyanine green and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 3:
(1) the component A is prepared by adding raw materials of 45 kg of bisphenol A epoxy resin, 45 kg of bisphenol F epoxy resin, 30 kg of chloromethoxy fatty acid methyl ester, 40 kg of alumina, 0.5 kg of gamma-glycidyl ether oxypropyl trimethoxysilane, 10 kg of additive sodium alginate and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 60 kg of polythiol, 30 kg of polyamide, 40 kg of alumina, 1 kg of phthalocyanine blue and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and then subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 4:
(1) the component A is prepared by adding 85 kg of bisphenol A epoxy resin, 15 kg of chloromethoxy fatty acid methyl ester, 30 kg of talcum powder, 0.6 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 25 kg of sodium alginate serving as an additive and the like into a stirrer, uniformly mixing by a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 70 kg of polythiol, 30 kg of polyamide, 25 kg of talcum powder, 2 kg of phthalocyanine green and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Example 5:
(1) the component A is prepared by adding raw materials of 95 kg of bisphenol F epoxy resin, 15 kg of chloromethoxy fatty acid methyl ester, 10 kg of calcium carbonate, 10 kg of silicon dioxide, 0.9 kg of gamma-glycidyl ether oxypropyl trimethoxy silane, 15 kg of additive sodium alginate and the like into a stirrer, uniformly mixing the raw materials in a high-speed dispersion machine under a vacuum condition, and then subpackaging.
(2) And the component B is prepared by adding 65 kg of polythiol, 35 kg of polyamide, 10 kg of silicon dioxide, 10 kg of alumina, 4 kg of phthalocyanine blue and the like into a stirrer, uniformly mixing by using a high-speed dispersion machine under a vacuum condition, and subpackaging.
When in use, A, B components are required to be uniformly mixed, and the mixing ratio is that the mass ratio is 1: 1, bonding the resin plate and the steel workpiece plate.
Epoxy resin adhesive material performance experiment:
1. shear and tensile strength were determined according to GB7124-86 [ method for determining adhesive tensile shear strength (metal-metal) ].
2. And (3) determining the degumming time in water: and (3) bonding the resin sheet and a stainless steel sheet (with the length of 10cm and the width of 1 cm) with the bonding area of 8cm and 1cm, suspending the resin sheet and the stainless steel sheet in normal-temperature water at 25 ℃ after the resin sheet and the stainless steel sheet are completely cured, and recording the time for separating and releasing the resin sheet and the steel workpiece plate.
TABLE 1 Properties of epoxy Binder materials
| Sample (I) | Shear strength (MPa) | Tensile Strength (MPa) | Degumming time (min/25 ℃ C.) |
| Example 1 | 18.1 | 20.2 | 20 |
| Example 2 | 18.3 | 18.6 | 18 |
| Example 3 | 18.9 | 21.5 | 20 |
| Example 4 | 16.7 | 19.7 | 18 |
| Example 5 | 17.6 | 19.8 | 18 |
Claims (1)
1. An epoxy resin bonding material is composed of A, B bi-components, and is characterized in that the components comprise the following raw materials in proportion:
the component A comprises: 100 kg of bisphenol F epoxy resin, 25 kg of chloromethoxy fatty acid methyl ester, 10 kg of silicon dioxide, 1 kg of gamma-glycidyl ether oxypropyl trimethoxy silane and 30 kg of additive sodium alginate;
and B component: 80 kg of polythiol, 40 kg of polyamide, 10 kg of silicon dioxide and 4 kg of phthalocyanine green;
when in use, the A, B components are mixed in a mass ratio of 1: 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337107.3A CN108676532B (en) | 2018-04-16 | 2018-04-16 | Epoxy resin bonding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337107.3A CN108676532B (en) | 2018-04-16 | 2018-04-16 | Epoxy resin bonding material |
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| Publication Number | Publication Date |
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| CN108676532A CN108676532A (en) | 2018-10-19 |
| CN108676532B true CN108676532B (en) | 2021-06-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112210331B (en) * | 2020-09-29 | 2022-02-25 | 晶科能源股份有限公司 | Solar crystal bar bottom plate glue, preparation method thereof and solar crystal bar cutting method |
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| CN103184022B (en) * | 2011-12-30 | 2017-09-19 | 汉高股份有限及两合公司 | Temporary bonding adhesive composition in being prepared for silicon chip |
| KR101594210B1 (en) * | 2012-07-11 | 2016-02-15 | (주)엘지하우시스 | Adhesive composition for optical film |
| CN102850980A (en) * | 2012-07-25 | 2013-01-02 | 常州大学 | Epoxy resin glue for silicon rod cutting and preparation method thereof |
| CN103571415B (en) * | 2013-01-16 | 2015-05-27 | 上海都伟光伏科技有限公司 | Double-component epoxy adhesive and preparation method thereof |
| CN104371614B (en) * | 2014-11-07 | 2016-08-24 | 苏州维泰生物技术有限公司 | A kind of medical use hydrocolloid pressure sensitive adhesive and preparation method thereof |
| CN105255425B (en) * | 2015-11-19 | 2018-01-12 | 杭州得力科技股份有限公司 | Temporary bond bi-component epoxy adhesive and its preparation method and application |
| CN106336834B (en) * | 2016-08-24 | 2019-01-15 | 刘景阳 | A kind of hot melt adhesive and its product met water and lose cohesive force |
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Effective date of registration: 20230921 Address after: Building 2 #, No. 228 Xixi Street, Linjiang Industrial Park, Wucheng District, Jinhua City, Zhejiang Province, 321000 (self declared) Patentee after: Zhejiang Huisheng New Material Co.,Ltd. Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Effective date of registration: 20230921 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Address before: 310018 No. 2 street, Xiasha Higher Education Zone, Hangzhou, Zhejiang Patentee before: HANGZHOU DIANZI University |
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