CN108676532A - A kind of epoxy resin binding material - Google Patents
A kind of epoxy resin binding material Download PDFInfo
- Publication number
- CN108676532A CN108676532A CN201810337107.3A CN201810337107A CN108676532A CN 108676532 A CN108676532 A CN 108676532A CN 201810337107 A CN201810337107 A CN 201810337107A CN 108676532 A CN108676532 A CN 108676532A
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- China
- Prior art keywords
- epoxy
- epoxy resin
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- component
- resin
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The present invention discloses a kind of epoxy resin binding material.Instant component includes the raw materials such as epoxy resin, toughener, filler, coupling agent, additive, polymercaptan, polyamide, filler, pigment.The present invention is added to using additive sodium alginate in epoxy viscose, when the resin plate that this epoxy glue bonds is impregnated with steel workpiece plate needs in normal-temperature water, epoxy viscose is set to fail since additive sodium alginate can absorb large quantity of moisture, thus resin plate can be easily separated in normal-temperature water with steel workpiece plate.Material environmental protection of the present invention, greatly reduces the injury of staff；Compared with the prior art, can realize quickly makes epoxy viscose fail under normal-temperature water.
Description
Technical field
The invention belongs to technical field of material, are related to the preparation of macromolecule binding material, specifically a kind of asphalt mixtures modified by epoxy resin
Fat binding material.
Background technology
Solar energy power generating refers generally to a kind of energy form that semiconductor can be utilized directly to convert light energy into electric energy.Light
The volt energy has many advantages, such as that pollution-free, noiseless, maintenance cost are low, service life is long, is developed rapidly in recent years.With silicon
The crystal silicon class solar cell of piece structure is a kind of most common form of photovoltaic generation, must be made in silicon chip cuts production process
Silicon rod and resin plate are fixed with silicon rod gluing knot, while using boiling gluing knot resin plate and steel workpiece plate.This boiling gluing
The resin plate of knot and steel workpiece plate in the hot water can degumming, enable steel workpiece plate Reusability.Since epoxy resin viscose glue has
There is the features such as high adhesive strength, versatile and relative low price, and electrical insulating property is excellent, stable chemical performance and processing
A series of excellent properties such as functional, therefore silicon chip cutting boiling glue mainly uses bicomponent epoxy resin viscose glue at present.Often
State university Tao Yu etc. discloses a kind of silicon rod cutting epoxy epoxy glue and preparation method patent of invention (application number：
201210258425.3) ammonium hydrogen carbonate, sodium bicarbonate, sodium dithionite or calcium monohydrogen phosphate, are used in epoxide-resin glue
Equal powder inorganic salts are used as degumming agent, and decomposition reaction generates gas at 50~60 DEG C in water, to make this epoxy glue bonding
Resin plate and steel workpiece plate in the hot water can degumming.But these inorganic salts decompose the narrow-minded of generation in the hot water, therefore de-
The glue time is very long.Shanghai Dou Wei photovoltaics Science and Technology Ltd. is permitted the phase and refined etc. has invented a kind of double-component epoxy adhesive and preparation side
Method (application number：201310016067.X), ammonium hydrogen carbonate, ammonium carbonate, azodiisobutyronitrile, idol are used in epoxide-resin glue
Nitrogen dicarboxylate or unifor are that foaming agent and zinc oxide, urea etc. are blowing promotor, are decomposed in the hot water
Generated reactive gas, to make the resin plate that this epoxy glue bonds in the hot water can degumming with steel workpiece plate.But these foam
Agent only could generate gas, therefore the resin plate and steel workpiece that this epoxy glue bonds higher than 90 DEG C or more quickly in temperature
Plate is needed could degumming in high-temperature-hot-water.In addition, epoxy adhesive usually using polysulfide rubber as toughener, but polysulfide rubber
Glue has unpleasant foul smell taste.
Invention content
In view of the above-mentioned deficiencies in the prior art, it is an object of the present invention to provide a kind of epoxy of the automatic degumming of the energy in normal-temperature water
Viscose glue, overcoming existing boiling epoxy glue needs the deficiency of high-temperature water degumming.Simultaneously using synthesis vegetable esters chloromethoxy fat
Sour methyl esters not only has toughening special, environmentally friendly odorlessness, simultaneously because being bonded with to metal material containing chlorine as toughener
Facilitation.
Macromolecule binding material of the present invention, is made of A, B bi-component, and raw material contained by component and proportioning (mass ratio) are such as
Under：
The epoxy resin is bisphenol A epoxide resin, one kind of bisphenol F epoxy resin or two kinds of mixing；
The toughener is chloromethoxy fatty acid methyl ester；
The filler is one or more in calcium carbonate, silica, aluminium oxide and talcum powder；
The coupling agent is r- glycidol ether propyl trimethoxy silicanes；
The additive is sodium alginate；
The pigment is that phthalocyanine blue or the phthalein mountain valley with clumps of trees and bamboo are green.
In use, A, B component are uniformly mixed, mixed proportion is that mass ratio is 1：1.
The present invention also provides the preparation method of above-mentioned material, this method is specific as follows:
The preparation of component A:Stirring is added in the raw materials such as epoxy resin, toughener, filler, coupling agent, additive according to the ratio
In machine, high speed dispersor is uniformly mixed under vacuum, is dispensed later.
It is prepared by B component:The raw materials such as polymercaptan, polyamide, filler, pigment are added in blender according to the ratio, in vacuum item
High speed dispersor is uniformly mixed under part, is dispensed later.
The present invention is added to using additive sodium alginate in epoxy viscose, when the resin plate and steel that this epoxy glue bonds
When work plate needs impregnate in normal-temperature water, epoxy viscose is set to fail since additive sodium alginate can absorb large quantity of moisture, because
And resin plate can be easily separated in normal-temperature water with steel workpiece plate.Material environmental protection of the present invention, it is great to the injury of staff
It reduces；Compared with the prior art, can realize quickly makes epoxy viscose fail under normal-temperature water.
Specific implementation mode
With reference to specific embodiment, the present invention is further analyzed.
Embodiment 1：
(1) preparation of component A:By 80 kilograms of bisphenol A epoxide resin, 10 kilograms of chloromethoxy fatty acid methyl ester, carbonic acid
The addition of the raw materials such as 12 kilograms of calcium, 0.8 kilogram of r- glycidol ethers propyl trimethoxy silicane, 10 kilograms of additive sodium alginate is stirred
It mixes in machine, high speed dispersor is uniformly mixed under vacuum, is dispensed later.
(2) prepared by B component:By originals such as 50 kilograms of polymercaptan, 0 kilogram of kymene, 20 kilograms of calcium carbonate, 2 kilograms of phthalocyanine blues
Material is added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
It needs A, B component being uniformly mixed when use, mixed proportion is that mass ratio is 1：1, for bonding tree
Fat plate and steel workpiece plate.
Embodiment 2：
(1) preparation of component A:By 100 kilograms of bisphenol F epoxy resin, 25 kilograms of chloromethoxy fatty acid methyl ester, dioxy
The addition of the raw materials such as 10 kilograms of SiClx, 1 kilogram of r- glycidol ethers propyl trimethoxy silicane, 30 kilograms of additive sodium alginate is stirred
It mixes in machine, high speed dispersor is uniformly mixed under vacuum, is dispensed later.
(2) prepared by B component:By 80 kilograms of polymercaptan, 40 kilograms of polyamide, 0 kilogram of silica 1, green 4 kilograms of phthalein mountain valley with clumps of trees and bamboo etc.
Raw material is added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
It needs A, B component being uniformly mixed when use, mixed proportion is that mass ratio is 1：1, for bonding tree
Fat plate and steel workpiece plate.
Embodiment 3：
(1) preparation of component A:By 45 kilograms of bisphenol A epoxide resins, 45 kilograms of bisphenol F epoxy resins, 30 kilograms of chloro first
Oxygroup fatty acid methyl ester, 40 kilograms of aluminium oxide, 0.5 kilogram of r- glycidol ethers propyl trimethoxy silicane, additive alginic acid
The equal raw materials of 10 kilograms of sodium are added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
(2) prepared by B component:By originals such as 60 kilograms of polymercaptan, 0 kilogram of kymene, 40 kilograms of aluminium oxide, 1 kilogram of phthalocyanine blues
Material is added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
It needs A, B component being uniformly mixed when use, mixed proportion is that mass ratio is 1：1, for bonding tree
Fat plate and steel workpiece plate.
Embodiment 4：
(1) preparation of component A:By 85 kilograms of bisphenol A epoxide resin, 15 kilograms of chloromethoxy fatty acid methyl ester, talcum
The addition of the raw materials such as 30 kilograms of powder, 0.6 kilogram of r- glycidol ethers propyl trimethoxy silicane, 25 kilograms of additive sodium alginate is stirred
It mixes in machine, high speed dispersor is uniformly mixed under vacuum, is dispensed later.
(2) prepared by B component:By originals such as 70 kilograms of polymercaptan, 0 kilogram of kymene, 25 kilograms of talcum powder, green 2 kilograms of the phthalein mountain valley with clumps of trees and bamboos
Material is added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
It needs A, B component being uniformly mixed when use, mixed proportion is that mass ratio is 1：1, for bonding tree
Fat plate and steel workpiece plate.
Embodiment 5：
(1) preparation of component A:By 95 kilograms of bisphenol F epoxy resin, 15 kilograms of chloromethoxy fatty acid methyl ester, carbonic acid
10 kilograms of calcium, 0 kilogram of silica 1,0.9 kilogram of r- glycidol ethers propyl trimethoxy silicane, additive sodium alginate 15
Kilogram equal raw materials are added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
(2) prepared by B component:By 65 kilograms of polymercaptan, 5 kilograms of kymene, 0 kilogram of silica 1,10 kilograms of aluminium oxide,
The equal raw materials of 4 kilograms of phthalocyanine blue are added in blender, and high speed dispersor is uniformly mixed under vacuum, is dispensed later.
It needs A, B component being uniformly mixed when use, mixed proportion is that mass ratio is 1：1, for bonding tree
Fat plate and steel workpiece plate.
Epoxy resin binding material performance test:
1. shearing and tensile strength are according to GB7124-86【Adhesive tensile shear strength assay method (metal-metal)】
It measures.
2. usually time measures in water：Resin sheet and stainless steel substrates (long 10cm, wide 1cm) are bonded, bond area is (long
8cm, wide 1cm), rear overhang is fully cured and is placed in 25 DEG C of normal-temperature water, record resin plate detached with steel workpiece plate disengagement when
Between.
The performance of 1 epoxy resin binding material of table
| Sample | Shear strength (MPa) | Tensile strength (MPa) | Usually time (min/25 DEG C) |
| Embodiment 1 | 18.1 | 20.2 | 20 |
| Embodiment 2 | 18.3 | 18.6 | 18 |
| Embodiment 3 | 18.9 | 21.5 | 20 |
| Embodiment 4 | 16.7 | 19.7 | 18 |
| Embodiment 5 | 17.6 | 19.8 | 18 |
Claims (2)
1. a kind of epoxy resin binding material, is made of A, B bi-component, it is characterised in that raw material contained by its component and with such as
Under：
The epoxy resin is bisphenol A epoxide resin, one kind of bisphenol F epoxy resin or two kinds of mixing；
The toughener is chloromethoxy fatty acid methyl ester；
The filler is one or more in calcium carbonate, silica, aluminium oxide and talcum powder；
The coupling agent is r- glycidol ether propyl trimethoxy silicanes；
The additive is sodium alginate；
The pigment is that phthalocyanine blue or the phthalein mountain valley with clumps of trees and bamboo are green.
2. a kind of epoxy resin binding material as described in claim 1, it is characterised in that A when use, B component mixing quality
Than being 1：1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337107.3A CN108676532B (en) | 2018-04-16 | 2018-04-16 | Epoxy resin bonding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337107.3A CN108676532B (en) | 2018-04-16 | 2018-04-16 | Epoxy resin bonding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108676532A true CN108676532A (en) | 2018-10-19 |
| CN108676532B CN108676532B (en) | 2021-06-01 |
Family
ID=63800245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810337107.3A Active CN108676532B (en) | 2018-04-16 | 2018-04-16 | Epoxy resin bonding material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108676532B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210331A (en) * | 2020-09-29 | 2021-01-12 | 晶科能源有限公司 | Solar crystal bar bottom plate glue, preparation method thereof and solar crystal bar cutting method |
Citations (7)
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|---|---|---|---|---|
| CN102850980A (en) * | 2012-07-25 | 2013-01-02 | 常州大学 | Epoxy resin glue for silicon rod cutting and preparation method thereof |
| CN103184022A (en) * | 2011-12-30 | 2013-07-03 | 汉高股份有限公司 | Adhesive composition used for temporary adhesion in wafer preparation |
| WO2014010934A1 (en) * | 2012-07-11 | 2014-01-16 | (주)엘지하우시스 | Adhesive composition for optical film |
| CN103571415A (en) * | 2013-01-16 | 2014-02-12 | 上海都为电子有限公司 | Double-component epoxy adhesive and preparation method thereof |
| CN104371614A (en) * | 2014-11-07 | 2015-02-25 | 苏州维泰生物技术有限公司 | Medical hydrocolloid pressure-sensitive adhesive and preparation method thereof |
| CN105255425A (en) * | 2015-11-19 | 2016-01-20 | 杭州得力科技有限公司 | Bi-component epoxy adhesive for temporary adhesion as well as preparation method and application of bi-component epoxy adhesive |
| CN106336834A (en) * | 2016-08-24 | 2017-01-18 | 刘景阳 | Hot-melt adhesive capable of losing adhesion after contacting of water, and product thereof |
-
2018
- 2018-04-16 CN CN201810337107.3A patent/CN108676532B/en active Active
Patent Citations (7)
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| CN103184022A (en) * | 2011-12-30 | 2013-07-03 | 汉高股份有限公司 | Adhesive composition used for temporary adhesion in wafer preparation |
| WO2014010934A1 (en) * | 2012-07-11 | 2014-01-16 | (주)엘지하우시스 | Adhesive composition for optical film |
| CN102850980A (en) * | 2012-07-25 | 2013-01-02 | 常州大学 | Epoxy resin glue for silicon rod cutting and preparation method thereof |
| CN103571415A (en) * | 2013-01-16 | 2014-02-12 | 上海都为电子有限公司 | Double-component epoxy adhesive and preparation method thereof |
| CN104371614A (en) * | 2014-11-07 | 2015-02-25 | 苏州维泰生物技术有限公司 | Medical hydrocolloid pressure-sensitive adhesive and preparation method thereof |
| CN105255425A (en) * | 2015-11-19 | 2016-01-20 | 杭州得力科技有限公司 | Bi-component epoxy adhesive for temporary adhesion as well as preparation method and application of bi-component epoxy adhesive |
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|---|
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112210331A (en) * | 2020-09-29 | 2021-01-12 | 晶科能源有限公司 | Solar crystal bar bottom plate glue, preparation method thereof and solar crystal bar cutting method |
| CN112210331B (en) * | 2020-09-29 | 2022-02-25 | 晶科能源股份有限公司 | Solar crystal bar bottom plate glue, preparation method thereof and solar crystal bar cutting method |
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| Publication number | Publication date |
|---|---|
| CN108676532B (en) | 2021-06-01 |
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Effective date of registration: 20230921 Address after: Building 2 #, No. 228 Xixi Street, Linjiang Industrial Park, Wucheng District, Jinhua City, Zhejiang Province, 321000 (self declared) Patentee after: Zhejiang Huisheng New Material Co.,Ltd. Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Effective date of registration: 20230921 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Address before: 310018 No. 2 street, Xiasha Higher Education Zone, Hangzhou, Zhejiang Patentee before: HANGZHOU DIANZI University |
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