CN108817229A - A kind of the laptop plate shell and precision die of heat dissipation structure - Google Patents
A kind of the laptop plate shell and precision die of heat dissipation structure Download PDFInfo
- Publication number
- CN108817229A CN108817229A CN201810788839.4A CN201810788839A CN108817229A CN 108817229 A CN108817229 A CN 108817229A CN 201810788839 A CN201810788839 A CN 201810788839A CN 108817229 A CN108817229 A CN 108817229A
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- Prior art keywords
- die
- heat dissipation
- plate shell
- lower die
- die cavity
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 238000004140 cleaning Methods 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 230000001154 acute effect Effects 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 4
- 238000003491 array Methods 0.000 claims description 3
- 239000004922 lacquer Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims 1
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 abstract description 2
- 230000033001 locomotion Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
- B21D37/12—Particular guiding equipment, e.g. pliers; Special arrangements for interconnection or cooperation of dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D45/00—Ejecting or stripping-off devices arranged in machines or tools dealt with in this subclass
- B21D45/06—Stripping-off devices
- B21D45/08—Stripping-off devices interrelated with motion of tool
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention relates to the laptop plate shells and precision die of a kind of heat dissipation structure.Two sides are equipped with sliding slot in lower die, sliding slot bottom end is equipped with slide plate and cleaning brush, due to telescopic rod setting at an acute angle in molding, it drives telescopic rod up to move when upper mold up moves die sinking and grants slide bar toward the active force close to die cavity direction, slide bar moves under the drive of the active force toward close to die cavity direction, slide bar pushes slide plate and cleaning brush to move along in sliding slot toward close to die cavity direction again, when reaching suitable position, take out the molded product in die cavity, continuation up moves, cleaning brush continues to be laterally into lower die die cavity and to cleaning in lower die die cavity, it finally shifts clast onto chip removal slot and through-hole is discharged, guarantee clean in lower die die cavity；When Ccope closing machine, pushing structure counter motion returns to initial position, realizes the miscellaneous bits in automatic cleaning lower die die cavity, improves working efficiency and product yield.
Description
Technical field
The present invention relates to laptop plate shell technical field of mold, and in particular to a kind of pen of heat dissipation structure
Remember this computer plate shell and precision die.
Background technique
Mold includes injection mould, stamping die etc., and laptop mold becomes more with gradually popularizing for laptop
Sample, copes with the mold of different position exploitation different models, and the mold of different model has an impact the qualification rate of product.
The mold of notebook computer casing usually lacks lower die die cavity cleaning plant in the prior art, can not be directly to lower die
It is cleared up in die cavity, needs to be cleared up manually, it is cumbersome while also reducing production efficiency.
Summary of the invention
Above-mentioned to solve the problems, such as, the purpose of the present invention is to provide a kind of laptops of heat dissipation structure
Plate shell and precision die.
In order to achieve the above objectives, the technical solution adopted by the present invention is that：
One of them of the invention is designed to provide a kind of laptop plate shell of heat dissipation structure, including bottom plate
Outer cover body, the first heat dissipation punching, the second heat dissipation punching, clamping groove and support heelpiece, the plate shell ontology use punching press
Mould punching molding, the plate shell ontology be square structure and which is provided with it is several first heat dissipation punchings and second heat dissipation punching
Hole, the first heat dissipation punching is arranged in arrays and is set to plate shell ontology upper end middle position, and described second
Punching radiate in waist-shaped hole structure and is arranged in plate shell ontology lower end two sides；The clamping groove is located at outside the bottom plate
The setting of shell ontology upper end, the support heelpiece are rubber material and set close to four apex angles of the plate shell ontology bottom face
It sets, the first heat dissipation punching is located at the inside setting of support heelpiece, and the second heat dissipation punching is located at two supports of lower end
The outside of heelpiece is arranged；Second heat dissipation hole site is equipped with filter screen.
Preferably, the clamping groove inner surface is coated with kirsite high temperature lacquer.
It is another object of the present invention to provide a kind of laptop plate shells of above-mentioned heat dissipation structure
Precision die, including upper die and lower die and pushing mechanism, the upper mold bottom end is equipped with upper mold plush copper, among the lower die upper end
Place is equipped with the lower die die cavity to match with upper mold plush copper, is located at the lower die die cavity two side ends in the lower die and is symmetrically arranged with cunning
Slot is equipped with postive stop baffle in the sliding slot at lower die die cavity；The pushing mechanism includes engaging lug, telescopic rod, telescopic
Pipe, adjustable spring, slide bar, slide plate and cleaning brush, the slide plate are positioned in the chute bottom end setting, and the slide plate bottom end is equipped with
Cleaning brush, the slide bar is located at one end setting in sliding slot far from lower die die cavity and lower end is connected with slide plate, the slide bar upper end
It is connected by shaft with telescopic sleeve, is equipped with adjustable spring in the telescopic sleeve, the other end of the telescopic sleeve and flexible
The other end of bar connection, the telescopic rod is connected by shaft with the engaging lug for being set to upper mold end side；In the lower die die cavity
Bottom end is equipped with longitudinally arranged chip removal slot；The setting at an acute angle between telescopic rod and horizontal plane in molding.
Preferably, the sliding slot top is additionally provided with cover board, and the slide bar upper end is fixedly connected with reset spring, the reset
The other end of spring is fixedly connected with cover board.Cover board slides inside under the promotion of slide bar, when slide bar is to suitable position, cover board
Lower die die cavity is covered, preventing exogenous impurity from falling in lower die die cavity causes product quality to be affected.
Preferably, be square structure and lower end surface of the upper mold plush copper is equipped with several the first punchings for forming the first heat dissipation punchings
Head and several the second formed punches for forming the second heat dissipation punchings, several first formed punches are that cross section is cubic cylindricality and several the
One formed punch is arranged in matrix, and first formed punch is located at the upper end middle position of the upper mold plush copper, and second formed punch is horizontal
Section is waist-shaped hole structure shape and is symmetricly set on upper mold plush copper lower end two sides.
Preferably, the third for being formed with clamping groove is equipped in the upper mold plush copper close to a line of first formed punch
Formed punch.
Preferably, the middle position of a line of the upper mold plush copper close to the second formed punch is equipped with the 4th formed punch, described
4th formed punch cross section is in isosceles trapezoid shape.
Preferably, first through hole is equipped at corresponding first forcer position in bottom end in the lower die die cavity and first through hole runs through
Lower die lower end surface is equipped with the second through-hole at corresponding second forcer position and the second through-hole also extends through lower die lower end surface.
Preferably, bottom end corresponds to and is equipped with third through-hole and third through-hole at third forcer position and also passes through in the lower die die cavity
Wear mould lower end surface.
Preferably, groove is equipped at corresponding 4th forcer position in bottom end in the lower die die cavity and groove does not run through under lower die
End face.
The beneficial effects of the present invention are：The laptop plate shell and essence of a kind of heat dissipation structure of the invention
Close mold is equipped with sliding slot by being located at die cavity two sides in lower die, and sliding slot bottom end is equipped with slide plate and cleaning brush, since telescopic rod exists
Setting at an acute angle when molding drives telescopic rod up to move and grants slide bar toward close to die cavity direction when upper mold up moves die sinking
Active force, slide bar under the drive of the active force toward close to die cavity direction move, slide bar push again slide plate and cleaning brush along
It is moved in sliding slot toward close to die cavity direction, when reaching suitable position, takes out the molded product in die cavity, continuation up moves, clearly
It scrubs and continues to be laterally into lower die die cavity and to cleaning in lower die die cavity, finally shift clast onto chip removal slot
It is discharged, guarantees clean in lower die die cavity, it is ensured that the yields and quality of product with through-hole；When molding upper die lowering, slide plate,
The counter motions such as slide bar return to initial position, realize the miscellaneous bits in automatic cleaning lower die die cavity during opening mould and compounding mould, mention
High working efficiency and product yield.
Detailed description of the invention
Fig. 1 is laptop plate shell structural schematic diagram of the invention；
Fig. 2 is laptop plate shell mold structure diagram of the invention；
Fig. 3 is upper die structure schematic diagram of the invention；
Fig. 4 is lower die structure schematic diagram of the invention.
Wherein, 1- upper mold, 11- upper mold plush copper, the first formed punch of 12-, the second formed punch of 13-, 14- third formed punch, 15- the 4th are rushed
Head, 2- lower die, 21- lower die die cavity, 22- sliding slot, 23- chip removal slot, 24- first through hole, the second through-hole of 25-, 26- third are logical
Hole, 27- groove, 3- pushing mechanism, 31- engaging lug, 32- telescopic rod, 33- telescopic sleeve, 34- slide bar, 35- slide plate, 36- cleaning
Brush, 4- cover board, 5- plate shell ontology, the heat dissipation punching of 51- first, the heat dissipation punching of 52- second, 521- filter screen, 53- support bottom
Pad, 54- clamping groove, 55- concave part, 6- reset spring, 7- postive stop baffle.
Specific embodiment
To keep purpose, the technical scheme and beneficial effects of the embodiment of the present invention clearer, below in conjunction with of the invention
Attached drawing, the technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
A part of the embodiments of the present invention, rather than whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative labor, belongs to protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", "left", "right", "top",
The orientation or positional relationship of the instructions such as "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, merely to just
In description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with
Specific orientation construction and operation, therefore should not be understood as limitation of the invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or integrally connected；It can be directly
It is connected, the connection inside two elements can also be can be indirectly connected through an intermediary.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Unless otherwise defined, the technical term or scientific term furthermore used, which is should be in fields of the present invention, to be had
The ordinary meaning that the personage of general technical ability is understood." one used in present patent application specification and claims
It is a " or the similar word such as " one " do not indicate that quantity limits yet, but indicate that there are at least one.
Embodiment 1
As shown in Figure 1, a kind of laptop plate shell of heat dissipation structure, including plate shell ontology 5, first radiate
The heat dissipation of punching 51, second punching 52, clamping groove 54 and support heelpiece 53, the plate shell ontology 5 use stamping die punching press
Molding, the plate shell ontology 5 be square structure and which is provided with it is several first heat dissipation punchings 51 and second heat dissipation punching 52,
The first heat dissipation punching 51 is arranged in arrays and is set to the 5 upper end middle position of plate shell ontology, and described second
Punching 52 radiate in waist-shaped hole structure and is arranged in the 5 lower end two sides of plate shell ontology；The clamping groove 54 is located at described
The setting of 5 upper end of plate shell ontology, the support heelpiece 53 are rubber material and the close 5 body bottom face of plate shell sheet
Four apex angle settings, the first heat dissipation punching 51 are located at the inside setting of two support heelpieces 53 of upper end, and described second dissipates
Hot piercing 52 is located at the outside setting of two support heelpieces 53 of lower end；Second heat release hole, 52 position is equipped with filter screen 521.
54 inner surface of clamping groove is coated with kirsite high temperature lacquer（It is not shown）.Plate shell ontology of the invention can be with
It is not specially limited using magnesium metal aluminum alloy material or titanium-aluminium alloy material or nonmetallic pc material, the present invention.
Embodiment 2
As shown in Figures 2 and 4, as the embodiment of the present invention, a kind of the laptop plate shell and essence of heat dissipation structure
Close mold, including upper mold 1, lower die 2 and pushing mechanism 3,1 bottom end of upper mold is equipped with upper mold plush copper 11, in 2 upper end of lower die
Between be equipped with the lower die die cavity 21 that matches with upper mold plush copper 11, be located at 21 two side ends pair of lower die die cavity in the lower die 2
Claim to be equipped with sliding slot 22, is equipped with postive stop baffle 7 at lower die die cavity 21 in the sliding slot 22；The pushing mechanism 3 includes connection
Ear 31, telescopic rod 32, telescopic sleeve 33, adjustable spring（It is not shown）, slide bar 34, slide plate 35 and cleaning brush 36, the slide plate 34
Bottom end is arranged in the sliding slot 22, and 35 bottom end of slide plate is equipped with cleaning brush 36, and the slide bar 34 is located in sliding slot 22 far
One end setting and lower end and slide plate 35 from lower die die cavity 21 connect, and 34 upper end of slide bar passes through shaft（It is not shown）With it is flexible
Casing 33 connects, and adjustable spring is equipped in the telescopic sleeve 33, and the other end and telescopic rod 32 of the telescopic sleeve 33 connect,
The other end of the telescopic rod 32 passes through shaft（It is not shown）It is connected with the engaging lug 31 for being set to 1 end side of upper mold；The lower die
Bottom end is equipped with longitudinally arranged chip removal slot 23 in die cavity 21；The setting at an acute angle between telescopic rod and horizontal plane in molding.
As shown in Figures 2 and 3,22 top of sliding slot is additionally provided with cover board 4, and 34 upper end of slide bar is fixedly connected with reset bullet
The other end of spring 6, the reset spring 6 is fixedly connected with cover board 4.Cover board slides inside under the promotion of slide bar, when slide bar arrives
When suitable position, cover board covers lower die die cavity, and preventing exogenous impurity from falling in lower die die cavity causes product quality by shadow
It rings.
As shown in Figures 3 and 4, be square structure and lower end surface of the upper mold plush copper 11 is equipped with and several forms the first heat dissipation punchings
51 the first formed punch 12 and several the second formed punches 13 for forming the second heat dissipation punching 52, several first formed punches 12 are cross section
For cubic cylindricality and several first formed punches 12 are arranged in matrix, and first formed punch 12 is located in the upper end of the upper mold plush copper 11
Between at position, 13 cross section of the second formed punch is waist-shaped hole structure shape and is symmetricly set on 11 lower end two of upper mold plush copper
Side.A kind of preferred embodiment of the invention is that several first formed punches 12 are equipped with two rows, and every row is equipped at least 30；Second formed punch
13 be 2.
As shown in Fig. 1 and 3-4, it is equipped with and is formed with close to a line of first formed punch 12 in the upper mold plush copper 11
The third formed punch 14 of clamping groove 54；The upper mold plush copper 11 is equipped with the 4th close to the middle position of a line of the second formed punch 13
Formed punch 15,15 cross section of the 4th formed punch are in isosceles trapezoid shape.
As shown in Fig. 1 and 3-4, first through hole 24 is equipped at corresponding first formed punch, 12 position in bottom end in the lower die die cavity 21
And first through hole 24 runs through 2 lower end surface of lower die, is equipped with the second through-hole 25 and the second through-hole 25 at corresponding second formed punch, 13 position
Through 2 lower end surface of lower die；Bottom end, which corresponds to, in the lower die die cavity 21 is equipped with third through-hole 26 and third at 14 position of third formed punch
Through-hole 26 also extends through 2 lower end surface of lower die；Be equipped at corresponding 4th formed punch, 15 position in bottom end in the lower die die cavity 21 groove 27 and
Groove 27 does not run through lower die lower end surface.
Finally, it should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting.Although ginseng
It is described the invention in detail according to above-described embodiment, those skilled in the art should understand that, it can be to invention
Technical solution is modified or replaced equivalently, and without departing from the range of technical solution of the present invention, should all be covered in the present invention
Scope of the claims in.
Claims (10)
1. a kind of laptop plate shell of heat dissipation structure, which is characterized in that dissipated including plate shell ontology, first
Hot piercing, the second heat dissipation punching, clamping groove and support heelpiece, the plate shell ontology use stamping die punch forming, institute
State plate shell ontology be square structure and which is provided with it is several first heat dissipation punchings and second heat dissipation punching, it is described first heat dissipation
Punching is arranged in arrays and is set to plate shell ontology upper end middle position, and the second heat dissipation punching is in waist-shaped hole
Structure and be arranged in plate shell ontology lower end two sides；The clamping groove is located at the setting of plate shell ontology upper end,
The support heelpiece is rubber material and is arranged close to four apex angles of the plate shell ontology bottom face that described first radiates
Punching is located at the inside setting of support heelpiece, and the second heat dissipation punching is located at the outside setting of two support heelpieces of lower end；
Second heat dissipation hole site is equipped with filter screen.
2. a kind of laptop plate shell of heat dissipation structure as described in claim 1, which is characterized in that the card
Access slot inner surface is coated with kirsite high temperature lacquer.
3. a kind of precision die of the laptop plate shell for heat dissipation structure of any of claims 1 or 2,
It is characterized in that, including upper die and lower die and pushing mechanism, the upper mold bottom end is equipped with upper mold plush copper, lower die upper end middle
It is located at the lower die die cavity two side ends equipped with the lower die die cavity to match with upper mold plush copper, in the lower die and is symmetrically arranged with sliding slot,
Postive stop baffle is equipped in the sliding slot at lower die die cavity；The pushing mechanism includes engaging lug, telescopic rod, telescopic sleeve,
Adjustable spring, slide bar, slide plate and cleaning brush, the slide plate are positioned in the chute bottom end setting, and the slide plate bottom end is equipped with clear
It scrubs, the slide bar is located at one end setting in sliding slot far from lower die die cavity and lower end is connected with slide plate, and the slide bar upper end is logical
It crosses shaft to connect with telescopic sleeve, adjustable spring, the other end and telescopic rod of the telescopic sleeve is equipped in the telescopic sleeve
The other end of connection, the telescopic rod is connected by shaft with the engaging lug for being set to upper mold end side；Bottom in the lower die die cavity
End is equipped with longitudinally arranged chip removal slot；The setting at an acute angle between telescopic rod and horizontal plane in molding.
4. a kind of laptop plate shell precision die of heat dissipation structure according to claim 3, feature
Be, the sliding slot top is additionally provided with cover board, and the slide bar upper end is fixedly connected with reset spring, the reset spring it is another
End is fixedly connected with cover board.
5. a kind of laptop plate shell precision die of heat dissipation structure according to claim 4, feature
It is, if the upper mold plush copper is square, structure and lower end surface are equipped with several the first formed punches and form for forming the first heat dissipation punching
At the second formed punch of the second heat dissipation punching, several first formed punches are that cross section is cubic cylindricality and several first formed punches are in square
Battle array arrangement, first formed punch are located at the upper end middle position of the upper mold plush copper, and second formed punch cross section is waist type
Pore structure shape and it is symmetricly set on upper mold plush copper lower end two sides.
6. a kind of laptop plate shell precision die of heat dissipation structure according to claim 5, feature
It is, is equipped with the third formed punch for being formed with clamping groove in the upper mold plush copper close to a line of first formed punch.
7. a kind of laptop plate shell precision die of heat dissipation structure according to claim 6, feature
It is, the middle position of a line of the upper mold plush copper close to the second formed punch is equipped with the 4th formed punch, and the 4th formed punch is horizontal
Section is in isosceles trapezoid shape.
8. a kind of laptop plate shell precision die of heat dissipation structure according to claim 7, feature
It is, is equipped with first through hole at corresponding first forcer position in bottom end in the lower die die cavity and first through hole runs through lower die lower end
Face is equipped with the second through-hole at corresponding second forcer position and the second through-hole also extends through lower die lower end surface.
9. a kind of laptop plate shell precision die of heat dissipation structure according to claim 8, feature
It is, bottom end, which corresponds to, in the lower die die cavity is equipped with third through-hole and third through-hole and also extends through lower die lower end at third forcer position
Face.
10. a kind of laptop plate shell precision die of heat dissipation structure according to claim 9, feature
It is, is equipped with groove at corresponding 4th forcer position in bottom end in the lower die die cavity and groove does not run through lower die lower end surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810788839.4A CN108817229A (en) | 2018-07-18 | 2018-07-18 | A kind of the laptop plate shell and precision die of heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810788839.4A CN108817229A (en) | 2018-07-18 | 2018-07-18 | A kind of the laptop plate shell and precision die of heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108817229A true CN108817229A (en) | 2018-11-16 |
Family
ID=64140849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810788839.4A Pending CN108817229A (en) | 2018-07-18 | 2018-07-18 | A kind of the laptop plate shell and precision die of heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108817229A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110794927A (en) * | 2019-12-05 | 2020-02-14 | 昆山市杰尔电子科技股份有限公司 | Method for processing notebook computer shell with heat dissipation function |
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|---|---|---|---|---|
| DE648397C (en) * | 1934-10-03 | 1937-07-30 | Guenther Klewer | Device for continuous automatic insertion of the blanks into the die of punching and pressing |
| CN203470687U (en) * | 2013-08-06 | 2014-03-12 | 六安市皖鑫管桩附件有限公司 | Mold structure with punching scraps convenient to clean |
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| CN206966417U (en) * | 2017-05-19 | 2018-02-06 | 昆山正合瑞特不锈钢制品有限公司 | A kind of iron pan perforating by punching machine provided with waste material automatic push mechanism |
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| CN110794927A (en) * | 2019-12-05 | 2020-02-14 | 昆山市杰尔电子科技股份有限公司 | Method for processing notebook computer shell with heat dissipation function |
| CN110794927B (en) * | 2019-12-05 | 2024-03-15 | 昆山市杰尔电子科技股份有限公司 | Notebook computer shell processing method with heat dissipation function |
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