CN213260673U - High-quality laser transfer paper mould pressing equipment - Google Patents
High-quality laser transfer paper mould pressing equipment Download PDFInfo
- Publication number
- CN213260673U CN213260673U CN202021674679.XU CN202021674679U CN213260673U CN 213260673 U CN213260673 U CN 213260673U CN 202021674679 U CN202021674679 U CN 202021674679U CN 213260673 U CN213260673 U CN 213260673U
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- Prior art keywords
- groove
- main part
- transfer paper
- mould main
- sides
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- 238000003825 pressing Methods 0.000 title claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 238000013016 damping Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 2
- 230000002349 favourable effect Effects 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 5
- 238000007723 die pressing method Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
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Abstract
The utility model discloses a radium-shine transfer paper molding equipment of high quality relates to radium-shine transfer paper processing equipment technical field, including base plate, square groove and mould main part, wherein the square groove has been seted up at base plate top middle part, and square inslot portion lower extreme is provided with the mould main part, and the circular slot has all been seted up to square groove both sides inner wall bottom, and logical groove has all been seted up to base plate top both sides, and two bottoms that lead to the groove extend to the circular inslot portion respectively, and the draw-in groove has all been seted up at mould main part both sides middle part, and circular slot tank bottom middle part is. The utility model has the advantages that the bottom ends of the two ejector rods are respectively clamped into the chute by pressing the two press plates, and the clamping rods move towards the direction far away from the clamping groove, so that the main body of the die is disassembled, the dust and impurities in the main body of the die can be conveniently cleaned, and the quality of the die pressing is improved; through the setting of second telescopic link, second spring and kicking block, can be when dismantling the mould main part, the automatic jack-up mould main part of kicking block is favorable to making things convenient for the staff to take out the mould main part.
Description
Technical Field
The utility model relates to a radium-shine transfer paper processing equipment technical field, in particular to radium-shine transfer paper molding equipment of high quality.
Background
The laser transfer paper is also called laser (laser) holographic transfer paper, a layer of resin is coated on a PET film, a special mould press is used for copying a special laser holographic pattern onto the resin, the film and the paper are compounded and peeled after aluminum plating, and the resin with the laser holographic pattern and the aluminum layer are transferred onto the paper, namely the laser (laser) holographic transfer paper.
Radium-shine transfer paper need use the molding equipment to carry out the shaping in the course of working, but present radium-shine transfer paper molding equipment is when using, and the mould is fixed or inconvenient dismantlement, in case impurity such as the inside entering dust of mould, leads to the mould pressing effect to descend easily, influences product quality.
Therefore, it is necessary to invent a high-quality laser transfer paper molding device to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a radium-shine transfer paper molding equipment of high quality to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-quality laser transfer paper molding device comprises a substrate, a square groove and a mold main body, wherein the middle part of the top end of the substrate is provided with the square groove, the lower end of the inner part of the square groove is provided with the mold main body, the bottom ends of the inner walls of the two sides of the square groove are respectively provided with a circular groove, the two sides of the top end of the substrate are respectively provided with a through groove, the bottom ends of the two through grooves respectively extend to the inner part of the circular groove, the middle parts of the two sides of the mold main body are respectively provided with a clamping groove, the middle part of the bottom of the circular groove is fixedly provided with a first telescopic rod, one end of the first telescopic rod is fixedly provided with a clamping rod, one end of the clamping rod extends to the inner part of the clamping groove, the first telescopic rod is movably sleeved with a first spring, the two ends of the first spring are respectively fixedly connected with, and the bottom and the chute looks adaptation of ejector pin, it has seted up the spacing groove to lead to groove inside wall middle part, the fixed spacing ring that cup joints in ejector pin middle part, and the spacing ring edge extends to the spacing inslot portion, the activity of ejector pin middle part cup joints and is provided with reset spring, and reset spring is located the spacing ring bottom, reset spring's both ends respectively with spacing ring bottom and spacing inslot end inner wall fixed connection.
Preferably, the inner wall of the clamping groove is fixedly provided with a sealing layer, and the sealing layer is attached to the clamping rod.
Preferably, the top end of the ejector rod is fixedly provided with a pressing plate, and the bottom of the square groove is fixedly provided with a damping layer.
Preferably, both sides of the bottom of the square groove are provided with grooves, the grooves penetrate through the damping layer and extend to the bottom end of the die main body, and a second telescopic rod is fixedly arranged in the middle of the bottom of the groove.
Preferably, the top end of the second telescopic rod is fixedly provided with a top block, and the top end of the top block is attached to and connected with the bottom end of the die main body.
Preferably, the second telescopic rod is sleeved with a second spring, and two ends of the second spring are fixedly connected with the bottom end of the top block and the bottom of the groove respectively.
Preferably, positive inner wall both sides of square groove and back inner wall both sides are all fixed to be provided with to wedge the piece, block one side that the top is close to the mould main part and seted up oblique opening, wedge one side that the piece is close to the mould main part is fixed to be provided with the damping fin, and the damping fin is connected with the laminating of mould main part.
The utility model discloses a technological effect and advantage:
1. the utility model has the advantages that the bottom ends of the two ejector rods are respectively clamped into the chute by pressing the two press plates, and the clamping rods move towards the direction far away from the clamping groove, so that the main body of the die is disassembled, the dust and impurities in the main body of the die can be conveniently cleaned, and the quality of the die pressing is improved;
2. the utility model discloses a setting of second telescopic link, second spring and kicking block can be when dismantling the mould main part, and the automatic jack-up mould main part of kicking block is favorable to making things convenient for the staff to take out the mould main part.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a partially enlarged schematic structural diagram of fig. 1 according to the present invention.
Fig. 3 is a schematic top view of fig. 1 according to the present invention.
Fig. 4 is the utility model discloses a block structure schematic diagram blocks for a wedge.
In the figure: 1. a substrate; 2. a square groove; 3. a mold body; 4. a circular groove; 5. a through groove; 6. a first telescopic rod; 7. a clamping rod; 8. a card slot; 9. a chute; 10. a top rod; 11. pressing a plate; 12. a limiting ring; 13. a limiting groove; 14. a return spring; 15. a first spring; 16. a sealing layer; 17. a damping layer; 18. a groove; 19. a second telescopic rod; 20. a second spring; 21. a top block; 22. block checking; 23. an oblique opening; 24. a damping fin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a radium-shine transfer paper molding equipment of high quality as shown in fig. 1-4, including base plate 1, square groove 2 and mould main part 3, wherein square groove 2 has been seted up at 1 top middle part of base plate, the inside lower extreme of square groove 2 is provided with mould main part 3.
The bottom ends of the inner walls of the two sides of the square groove 2 are respectively provided with a round groove 4, the two sides of the top end of the substrate 1 are respectively provided with a through groove 5, the bottom ends of the two through grooves 5 respectively extend into the round grooves 4, the middle parts of the two sides of the die main body 3 are respectively provided with a clamping groove 8, the middle part of the bottom of the round groove 4 is fixedly provided with a first telescopic rod 6, one end of the first telescopic rod 6 is fixedly provided with a clamping rod 7, one end of the clamping rod 7 extends into the clamping groove 8, the first telescopic rod 6 is movably sleeved with a first spring 15, the two ends of the first spring 15 are respectively fixedly connected with one side of the clamping rod 7 and the bottom of the round groove 4, one side of the top end of the clamping rod 7 is provided with a chute 9, a top rod 10 penetrates through the inside of the through groove 5, the bottom end of the top rod 10 is arranged in, the fixed spacing ring 12 that cup joints in ejector pin 10 middle part, and inside 12 edges of spacing ring extended to spacing groove 13, the activity of ejector pin 10 middle part is cup jointed and is provided with reset spring 14, and reset spring 14 is located spacing ring 12 bottom, reset spring 14's both ends respectively with 12 bottoms of spacing ring and 13 bottom inner wall fixed connection in spacing groove, press board 11 through pressing two, make two ejector pins 10 bottom card respectively go into chute 9 inside, the kelly 7 removes to the direction of keeping away from draw-in groove 8 simultaneously to dismantle mould main part 3, be favorable to conveniently clearing up 3 inside dust and impurity of mould main part, improve the mould pressing quality.
Further, 2 tank bottom both sides in square groove all set up flutedly 18, and recess 18 runs through damping layer 17 to extend to 3 bottoms of mould main part, the fixed second telescopic link 19 that is provided with in recess 18 tank bottom middle part, the fixed kicking block 21 that is provided with in 19 tops of second telescopic link, and the kicking block 21 top is connected with the laminating of 3 bottoms of mould main part, cup joint on the second telescopic link 19 and be provided with second spring 20, and the both ends of second spring 20 respectively with kicking block 21 bottom and recess 18 tank bottom fixed connection, through the setting of second telescopic link 19, second spring 20 and kicking block 21, can be when dismantling mould main part 3, kicking block 21 automatic jack-up mould main part 3, be favorable to making things convenient for the staff to take out mould main part 3.
Secondly, the fixed sealing layer 16 that is provided with in 8 inner walls of draw-in groove, and the sealing layer 16 is connected with the laminating of card pole 7, the fixed press board 11 that is provided with in ejector pin 10 top, the fixed damping layer 17 that is provided with in 2 tank bottoms of square groove, 2 positive inner wall both sides of square groove are all fixed being provided with back inner wall both sides and are wedge piece 22, wedge piece 22 top is close to one side of mould main part 3 and has seted up oblique opening 23, through a plurality of settings of wedge piece 22, can block mould main part 3, is favorable to preventing that mould main part 3 from sliding, wedge piece 22 is close to the fixed damping fin 24 that is provided with in one side of mould main part 3, and damping fin 24 is connected with the laminating of mould main part 3, through the setting of damping fin 24, is favorable to increasing frictional force.
The utility model discloses the theory of operation:
use a period of time after, if the inside dust or impurity of scraping up of mould main part 3, need dismantle the clearance with mould main part 3, during the dismantlement, at first press board 11 through pressing two, make ejector pin 10 downstream, inside the card goes into chute 9 when ejector pin 10 downstream, drive the card pole 7 simultaneously and remove to the direction of keeping away from draw-in groove 8, one end until two card poles 7 all breaks away from draw-in groove 8, two second springs 20 lose the confining force this moment, and resume deformation, thereby make second telescopic link 19 extend, two kicking blocks 21 are ejecting with mould main part 3 simultaneously, thereby realize the dismantlement of mould main part 3.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides a radium-shine transfer paper molding equipment of high quality, includes base plate (1), square groove (2) and mould main part (3), wherein square groove (2) have been seted up at base plate (1) top middle part, the inside lower extreme in square groove (2) is provided with mould main part (3), its characterized in that: the die is characterized in that circular grooves (4) are respectively formed in the bottom ends of the inner walls of the two sides of the square groove (2), through grooves (5) are respectively formed in the two sides of the top end of the substrate (1), the bottoms of the two through grooves (5) respectively extend into the circular grooves (4), clamping grooves (8) are respectively formed in the middle parts of the two sides of the die main body (3), a first telescopic rod (6) is fixedly arranged in the middle part of the bottom of each circular groove (4), a clamping rod (7) is fixedly arranged at one end of the first telescopic rod (6), one end of the clamping rod (7) extends into each clamping groove (8), a first spring (15) is movably sleeved on the first telescopic rod (6), the two ends of the first spring (15) are respectively and fixedly connected with one side of the clamping rod (7) and the bottom of each circular groove (4), a chute (9) is formed in one side of the top end of the clamping rod, the bottom of ejector pin (10) is sharp-pointed angle setting, and the bottom and chute (9) looks adaptation of ejector pin (10), lead to groove (5) inside wall middle part and seted up spacing groove (13), the fixed cover of ejector pin (10) middle part is cup jointed and is provided with spacing ring (12), and inside spacing ring (12) edge extended to spacing groove (13), ejector pin (10) middle part activity is cup jointed and is provided with reset spring (14), and reset spring (14) are located spacing ring (12) bottom, reset spring (14)'s both ends respectively with spacing ring (12) bottom and spacing groove (13) bottom inner wall fixed connection.
2. The high-quality laser transfer paper molding device of claim 1, wherein: the inner wall of the clamping groove (8) is fixedly provided with a sealing layer (16), and the sealing layer (16) is attached to and connected with the clamping rod (7).
3. The high-quality laser transfer paper molding device of claim 2, wherein: the top end of the ejector rod (10) is fixedly provided with a pressing plate (11), and the bottom of the square groove (2) is fixedly provided with a damping layer (17).
4. The high-quality laser transfer paper molding device of claim 3, wherein: grooves (18) are formed in two sides of the bottom of the square groove (2), the grooves (18) penetrate through the damping layer (17) and extend to the bottom end of the die main body (3), and a second telescopic rod (19) is fixedly arranged in the middle of the bottom of the groove (18).
5. The high-quality laser transfer paper molding device of claim 4, wherein: the top end of the second telescopic rod (19) is fixedly provided with a top block (21), and the top end of the top block (21) is attached to and connected with the bottom end of the die main body (3).
6. The high-quality laser transfer paper molding device of claim 5, wherein: the second telescopic rod (19) is sleeved with a second spring (20), and two ends of the second spring (20) are fixedly connected with the bottom end of the top block (21) and the bottom of the groove (18) respectively.
7. The high-quality laser transfer paper molding device of claim 6, wherein: block (22) are wedge to all fixed being provided with in positive inner wall both sides of square groove (2) and back inner wall both sides, block (22) top is close to one side of mould main part (3) and has seted up oblique opening (23), block (22) are wedge one side of being close to mould main part (3) is fixed and is provided with damping fin (24), and damping fin (24) are connected with the laminating of mould main part (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021674679.XU CN213260673U (en) | 2020-08-13 | 2020-08-13 | High-quality laser transfer paper mould pressing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021674679.XU CN213260673U (en) | 2020-08-13 | 2020-08-13 | High-quality laser transfer paper mould pressing equipment |
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CN213260673U true CN213260673U (en) | 2021-05-25 |
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CN202021674679.XU Expired - Fee Related CN213260673U (en) | 2020-08-13 | 2020-08-13 | High-quality laser transfer paper mould pressing equipment |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115026962A (en) * | 2022-05-26 | 2022-09-09 | 先之科半导体科技(东莞)有限公司 | Dicing saw for packaging semiconductor diode |
-
2020
- 2020-08-13 CN CN202021674679.XU patent/CN213260673U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115026962A (en) * | 2022-05-26 | 2022-09-09 | 先之科半导体科技(东莞)有限公司 | Dicing saw for packaging semiconductor diode |
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210525 |
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CF01 | Termination of patent right due to non-payment of annual fee |