CN108811477B - Electronic product film for reducing electromagnetic radiation - Google Patents
Electronic product film for reducing electromagnetic radiation Download PDFInfo
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- CN108811477B CN108811477B CN201810500228.5A CN201810500228A CN108811477B CN 108811477 B CN108811477 B CN 108811477B CN 201810500228 A CN201810500228 A CN 201810500228A CN 108811477 B CN108811477 B CN 108811477B
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Abstract
The invention discloses an electronic product film for reducing electromagnetic radiation, wherein a second adhesive layer is arranged between a metal layer and a wave absorbing layer, a third adhesive layer is arranged between the wave absorbing layer and a release material layer, a plurality of first prism convex parts and first prism convex parts are arranged on the surface of the metal layer, which is in contact with the wave absorbing layer, the heights of the first prism convex parts are larger than those of the second prism convex parts, the first prism convex parts and the second prism convex parts are alternately arranged, and a gap is reserved between the bottoms of the adjacent first prism convex parts and the adjacent second prism convex parts), and the thickness of the second adhesive layer is smaller than that of the third adhesive layer. The electronic product film for reducing electromagnetic radiation avoids over concentration of heat, is beneficial to heat diffusion, avoids the phenomenon that the film is upwarped due to temperature rise, and improves the stability of product performance.
Description
Technical Field
The invention belongs to the technical field of electronic materials, and particularly relates to an electronic product film for reducing electromagnetic radiation.
Background
Conventionally, a metal sheet or mesh widely used as a shielding material is heavy, and it takes time and labor to dispose the metal sheet or mesh in a housing of a device. Further, a metallic sheet or mesh tends to have a large anisotropy of electromagnetic wave absorption ability, that is, a tendency that the electromagnetic wave absorption ability is significantly reduced when the incident angle of the electromagnetic wave is increased. Electromagnetic waves released by electronic products can bring electromagnetic interference to other surrounding electronic equipment, so that the electronic equipment works abnormally; and also can cause harm to human health. At present, miniaturization and high integration are the main trends in the development of electronic products, and the internal space of the products is relatively narrow. Among the wave-absorbing materials, the patch type wave-absorbing material has the advantages of thin thickness, convenient use, good effect on reducing electromagnetic radiation and preventing electromagnetic interference, and is more suitable for being applied to electronic products. Therefore, the design and development of a patch-type electromagnetic wave absorbing material having a small thickness and a light weight and suitable for a narrow space have been the direction of efforts of those skilled in the art.
Disclosure of Invention
The invention provides an electronic product film for reducing electromagnetic radiation, which improves the utilization rate of a metal layer to reflect an electromagnetic field, can form multiple absorption due to the arrangement of the metal layer, and obviously improves the wave-absorbing performance of a wave-absorbing patch.
In order to achieve the purpose, the invention adopts the technical scheme that: an electronic product film for reducing electromagnetic radiation comprises a PET insulating layer, a metal layer, a wave absorbing layer and a release material layer; the wave-absorbing layer is formed by mixing ferrite powder and a polymer matrix, a first adhesive layer is arranged between the PET insulating layer and the metal layer, a second adhesive layer is arranged between the metal layer and the wave-absorbing layer, a third adhesive layer is arranged between the wave-absorbing layer and the release material layer, the surface of the metal layer, which is in contact with the wave-absorbing layer, is provided with a plurality of first prism bulges and second prism bulges, the heights of the first prism bulges are greater than those of the second prism bulges, the first prism bulges and the second prism bulges are alternately arranged, and intervals are reserved between the bottoms of the first prism bulges and the second prism bulges which are adjacent to each other;
the height ratio of the first prism to the second prism is 1: 0.6-0.4, the height of the first prism is 26 μm, the height of the second prism is 13 μm, and the thickness of the second adhesive layer is smaller than that of the third adhesive layer.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
according to the electronic product film for reducing electromagnetic radiation, the surface of the metal layer, which is in contact with the wave-absorbing layer, is provided with the first prism convex parts and the first prism convex parts, the heights of the first prism convex parts are larger than those of the second prism convex parts, the first prism convex parts and the second prism convex parts are alternately arranged, and the bottoms of the adjacent first prism convex parts and the adjacent second prism convex parts are spaced, so that the utilization rate of the electromagnetic field reflected by the metal layer is improved, multiple absorption can be formed by the arrangement of the metal layer, and the wave-absorbing performance of the wave-absorbing patch is obviously improved; meanwhile, the temperature is increased due to the fact that a large amount of electromagnetic waves are absorbed in the use process, and the metal layer with the plurality of prism protrusions avoids over concentration of heat, is beneficial to heat diffusion, avoids membrane upwarping due to temperature rise, and improves stability of product performance; secondly, the use of the insulating layer and the PET film layer improves the strength of the material on the one hand.
Drawings
FIG. 1 is a schematic view of a film structure of an electronic product for reducing electromagnetic radiation according to the present invention;
FIG. 2 is a schematic structural diagram of a film of an electronic product for reducing electromagnetic radiation in a comparative example;
fig. 3 is a partial schematic view of fig. 1.
In the above drawings: 1. a PET insulating layer; 2. a metal layer; 3. a wave-absorbing layer; 4. a release material layer; 5. a first adhesive layer; 6. a second adhesive layer; 7. a third adhesive layer; 81. a first prism projection; 82. a second prism projection; 9. and (4) spacing.
Detailed Description
The invention is further described with reference to the following figures and examples:
example (b): an electronic product film for reducing electromagnetic radiation is shown in figure 1 and comprises a PET insulating layer 1, a metal layer 2, a wave absorbing layer 3 and a release material layer 4; a first adhesive layer 5 is arranged between the PET insulating layer 1 and the metal layer 2, a second adhesive layer 6 is arranged between the metal layer 2 and the wave absorbing layer 3, a third adhesive layer 7 is arranged between the wave absorbing layer 3 and the release material layer 4, a plurality of first prism protrusions 81 and second prism protrusions 82 are arranged on the surface of the metal layer 2 contacting the wave absorbing layer 3, the height of each first prism protrusion 81 is larger than that of each second prism protrusion 82, and the first prism protrusions 81 and the second prism protrusions 82 are alternately arranged and have a gap 9 between the bottoms of the first prism protrusions 81 and the second prism protrusions 82 which are adjacent to each other.
The height of the first prism projection 81 is 26 μm, and the height of the second prism projection 82 is 13 μm. The thickness of the first adhesive layer 5 is smaller than that of the second adhesive layer 6, and the thickness of the second adhesive layer 6 is smaller than that of the third adhesive layer 7.
The wave absorbing layer is formed by mixing soft magnetic powder and a polymer matrix, converts electromagnetic waves released by electronic products into heat energy or energy in other forms in the modes of electric loss, magnetic loss and the like so as to achieve the effect of reducing electromagnetic radiation, has good absorption in the range of 2-18 GHz, and can reflect incident electromagnetic waves back to the wave absorbing layer to form multiple absorption.
The thickness of the PET insulating layer 1 is 8 microns; the first adhesive layer 5, the second adhesive layer 6 and the third adhesive layer 7 are all acrylate adhesive layers.
The thickness of the first adhesive layer 5 is smaller than that of the second adhesive layer 6, and the thickness of the second adhesive layer 6 is smaller than that of the third adhesive layer 7.
The wave-absorbing performance is detected by a reflectivity bow test method, and the minimum reflectivity is lower than-10 dB.
When the electronic product film for reducing electromagnetic radiation is adopted, the surface of the metal layer, which is in contact with the wave-absorbing layer, is provided with a plurality of first prism convex parts and first prism convex parts, the height of the first prism convex parts is greater than that of the second prism convex parts, the first prism convex parts and the second prism convex parts are alternately arranged, and intervals are reserved between the bottoms of the first prism convex parts and the second prism convex parts which are adjacent to each other, so that the utilization rate of the electromagnetic field reflected by the metal layer is improved, multiple absorption can be formed by the arrangement of the metal layer, and the wave-absorbing performance of the wave-absorbing patch is obviously improved; meanwhile, the temperature is increased due to the fact that a large amount of electromagnetic waves are absorbed in the use process, and the metal layer with the plurality of prism protrusions avoids over concentration of heat, is beneficial to heat diffusion, avoids membrane upwarping due to temperature rise, and improves stability of product performance; secondly, the use of the insulating layer and the PET film layer improves the strength of the material on the one hand.
Comparative example: an electronic product film for reducing electromagnetic radiation is shown in figure 2 and comprises a PET insulating layer 1, a metal layer 2, a wave absorbing layer 3 and a release material layer 4; the wave-absorbing layer 3 is formed by mixing ferrite powder and a polymer matrix, a first adhesive layer 5 is arranged between the PET insulating layer 1 and the metal layer 2, a second adhesive layer 6 is arranged between the metal layer 2 and the wave-absorbing layer 3, a third adhesive layer 7 is arranged between the wave-absorbing layer 3 and the release material layer 4, and a prism bulge 8 is arranged on the surface of the metal layer 2, which is in contact with the wave-absorbing layer 3.
And (3) testing performance: the wave absorbing performance in the 2GHZ-4GHZ frequency band is as follows:
thickness of wave-absorbing layer | 100μm | 200μm | 500μm | 1㎜ | 2㎜ | 5㎜ |
Comparative example | -2.1dB | -3.2dB | -5.3 dB | -7dB | -10.2 dB | -12.2 dB |
Examples | -2.7 dB | -3.5 dB | -6 dB | -7.5 dB | -10.6 dB | -13.8 dB |
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (1)
1. An electronic product film for reducing electromagnetic radiation, comprising: the composite material comprises a PET insulating layer (1), a metal layer (2), a wave absorbing layer (3) and a release material layer (4); the wave absorbing layer (3) is formed by mixing ferrite powder and a polymer matrix, a first adhesive layer (5) is arranged between a PET (polyethylene terephthalate) insulating layer (1) and a metal layer (2), a second adhesive layer (6) is arranged between the metal layer (2) and the wave absorbing layer (3), a third adhesive layer (7) is arranged between the wave absorbing layer (3) and a release material layer (4), a plurality of first prism bulges (81) and second prism bulges (82) are arranged on the surface of the metal layer (2) in contact with the wave absorbing layer (3), the height of each first prism bulge (81) is greater than that of each second prism bulge (82), the first prism bulges (81) and the second prism bulges (82) are alternately arranged, and a gap (9) is reserved between the bottoms of the adjacent first prism bulges (81) and the second prism bulges (82);
the height ratio of the first prism protrusion (81) to the second prism protrusion (82) is 1: 0.5, the height of the first prism convex part (81) is 26 mu m, the height of the second prism convex part (82) is 13 mu m, and the thickness of the second adhesive layer (6) is smaller than that of the third adhesive layer (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201810500228.5A CN108811477B (en) | 2014-09-01 | 2014-09-01 | Electronic product film for reducing electromagnetic radiation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810500228.5A CN108811477B (en) | 2014-09-01 | 2014-09-01 | Electronic product film for reducing electromagnetic radiation |
CN201410440407.6A CN104202957B (en) | 2014-09-01 | 2014-09-01 | The wave absorbing patch of use for electronic products |
Related Parent Applications (1)
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CN201410440407.6A Division CN104202957B (en) | 2014-09-01 | 2014-09-01 | The wave absorbing patch of use for electronic products |
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CN108811477A CN108811477A (en) | 2018-11-13 |
CN108811477B true CN108811477B (en) | 2020-02-14 |
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CN201810500904.9A Active CN108728005B (en) | 2014-09-01 | 2014-09-01 | High heat conduction type wave-absorbing film |
CN201810500531.5A Active CN108738291B (en) | 2014-09-01 | 2014-09-01 | Film with shielding function |
CN201410440407.6A Active CN104202957B (en) | 2014-09-01 | 2014-09-01 | The wave absorbing patch of use for electronic products |
CN201810500228.5A Active CN108811477B (en) | 2014-09-01 | 2014-09-01 | Electronic product film for reducing electromagnetic radiation |
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CN201810500904.9A Active CN108728005B (en) | 2014-09-01 | 2014-09-01 | High heat conduction type wave-absorbing film |
CN201810500531.5A Active CN108738291B (en) | 2014-09-01 | 2014-09-01 | Film with shielding function |
CN201410440407.6A Active CN104202957B (en) | 2014-09-01 | 2014-09-01 | The wave absorbing patch of use for electronic products |
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CN104999735B (en) * | 2015-05-21 | 2017-12-12 | 斯迪克新型材料(江苏)有限公司 | Composite film-stuck with shielding electromagnetic field function |
WO2018210333A1 (en) * | 2017-05-19 | 2018-11-22 | 上海浦健科技有限公司 | Device for absorbing negative particles |
CN113337248A (en) * | 2021-06-01 | 2021-09-03 | 浙江原邦材料科技有限公司 | Composite wave-absorbing material and preparation method thereof |
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JP4649466B2 (en) * | 2006-12-11 | 2011-03-09 | 大日本印刷株式会社 | Optical laminate and display device |
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JP2011030323A (en) * | 2009-07-23 | 2011-02-10 | Yazaki Corp | Shield member and wire harness |
CN202626089U (en) * | 2012-03-31 | 2012-12-26 | 常州宏巨电子科技有限公司 | Conductive cloth adhesive tape |
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CN202808679U (en) * | 2012-08-31 | 2013-03-20 | 苏州斯迪克新材料科技股份有限公司 | Antistatic light-shading reflective pasting film |
CN103013371A (en) * | 2012-12-21 | 2013-04-03 | 苏州金禾新材料股份有限公司 | Electromagnetic shielding adhesive tape |
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CN204272584U (en) * | 2014-09-01 | 2015-04-15 | 苏州斯迪克新材料科技股份有限公司 | The suction ripple paster of use for electronic products |
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2014
- 2014-09-01 CN CN201810500904.9A patent/CN108728005B/en active Active
- 2014-09-01 CN CN201810500531.5A patent/CN108738291B/en active Active
- 2014-09-01 CN CN201410440407.6A patent/CN104202957B/en active Active
- 2014-09-01 CN CN201810500228.5A patent/CN108811477B/en active Active
Patent Citations (5)
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JP2002021013A (en) * | 2000-05-01 | 2002-01-23 | Takenaka Komuten Co Ltd | Paving structure |
TW201104880A (en) * | 2009-07-21 | 2011-02-01 | Nexpower Technology Corp | Structure of solar cell |
CN103781338A (en) * | 2012-10-22 | 2014-05-07 | 张成大 | Multi-functional thin sheet and manufacturing method thereof |
CN103035981A (en) * | 2012-12-11 | 2013-04-10 | 电子科技大学 | Ultrathin metal membrane terahertz absorbed layer and preparation method thereof |
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Also Published As
Publication number | Publication date |
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CN108728005A (en) | 2018-11-02 |
CN108811477A (en) | 2018-11-13 |
CN104202957A (en) | 2014-12-10 |
CN104202957B (en) | 2018-09-18 |
CN108728005B (en) | 2020-03-06 |
CN108738291B (en) | 2020-02-14 |
CN108738291A (en) | 2018-11-02 |
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