CN108808601A - A kind of heat dissipation bus duct - Google Patents
A kind of heat dissipation bus duct Download PDFInfo
- Publication number
- CN108808601A CN108808601A CN201810774693.8A CN201810774693A CN108808601A CN 108808601 A CN108808601 A CN 108808601A CN 201810774693 A CN201810774693 A CN 201810774693A CN 108808601 A CN108808601 A CN 108808601A
- Authority
- CN
- China
- Prior art keywords
- plate
- bus duct
- side plate
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/06—Totally-enclosed installations, e.g. in metal casings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/10—Cooling
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to field of electrical equipment, specifically a kind of heat dissipation bus duct.A kind of heat dissipation bus duct, including side plate and bottom plate, the bottom plate both sides are connect with side plate respectively, it is both provided with card slot on the inner side and outer side of the side plate, it is connected with top plate between two card slots of the side plate interior sides, it is fixed with cooling fin in card slot on the outside of the side plate, there is mounting hole on cooling fin；Core is provided in the cavity that bottom plate, side plate and top plate surround, the outside of the core is coated with insulating sleeve, and the top and bottom of the insulating sleeve have heat conduction film, the heat conduction film connection top plate and bottom plate.This kind of bus duct has good heat dissipation effect, the fast effect of radiating rate.
Description
Technical field
The present invention relates to field of electrical equipment, specifically a kind of heat dissipation bus duct.
Background technology
Bus duct is a kind of closed metal device being made of copper, aluminium busbar column, is used for being each element of decentralized system
Distribute relatively high power.Indoors more and more instead of electric wire in the power Transmission trunk project project of low pressure.It is female
Wire casing is new circuit mode developed by the U.S., being referred to as " Bus-Way-System ", it is using copper or aluminium as leading
Body, with non-alkene insulating supporting, be then attached in metallic channel and the novel conductor that is formed.Japanese really practical application be
1954, bus duct was developed from then on.Nowadays build in high level, the electrical equipments such as factory, in electric system at not
The wiring mode that can lack.Due to building, factory etc. it is various building electric power needs, and it is this need year by year it is increased become
Gesture, using original circuit wiring pattern, i.e. poling mode, when construction, brings many difficulties, moreover, when to change distribution system
When, so that it is become simple, some are nearly impossible, however, if using bus duct, are very easy to reach
In addition purpose can also make building become more beautiful.For economic aspect, bus duct itself is compared with cable, price
Some, but can make construction cost just using bus duct compared with the various attachmentes comprising wiring and entire electric system
Cheaply mostly (looking at schematic diagram), especially current capacity it is big in the case of, such case is with regard to more obvious.
As modernization project facility is emerged in large numbers with what is equipped, the fast increasing of electricity consumption of all trades and professions, especially numerous buildings
With the appearance in large-sized workshop workshop, the traditional cable as transmission pressure has been unable to meet requirement in high current transport system,
The used in parallel of multiway cable brings inconvenience to in-site installation construction connection, and plug type bus duct is used as one kind is novel to match
Point conducting wire comes into being, and compared with traditional cable, its superiority is fully demonstrated when high current conveys, simultaneously because adopting
With new technology, new process, the contact resistance and Wen Sheng of the bus duct both ends junction and branching port splicing position that substantially reduce,
And the insulating materials of high quality has been used in bus duct, to improve the security reliability of bus duct.But for busbar
For slot, good cooling effect is the important indicator for improving its service life and its performance.
Invention content
Problem to be solved by this invention is to overcome the deficiencies of the prior art and provide a kind of heat dissipation bus duct, this kind of busbar
Slot has good heat dissipation effect, the fast effect of radiating rate.
The technical solution adopted by the present invention is：A kind of heat dissipation bus duct, including side plate and bottom plate, the bottom plate both sides difference
It is connect with side plate, card slot is both provided on the inner side and outer side of the side plate, is connected between two card slots of the side plate interior sides
There is top plate, cooling fin is fixed in the card slot on the outside of the side plate, there is mounting hole on cooling fin；In bottom plate, side plate and top plate
Core is provided in the cavity surrounded, the outside of the core is coated with insulating sleeve, the top and bottom of the insulating sleeve
With heat conduction film, the heat conduction film connection top plate and bottom plate.
Preferably, it is screwed between the card slot and top plate.
Preferably, the cooling fin bottom has several fins.
Preferably, it is screwed between the card slot and cooling fin.
Preferably, several heat emission holes are provided on side plate.
Preferably, several grooves being recessed inwardly are provided on side plate and bottom plate.
The beneficial effects of the present invention are：It radiates in several ways, improves the radiating rate of bus duct, effectively extend it
Service life：1, several grooves being recessed inwardly are set on side plate and bottom plate, heat dissipation area can be effectively increased, improve heat dissipation speed
Degree；2, several heat emission holes on side plate are set, by cross-ventilation, can in time take the heat in bus duct out of；3, in side
It is provided with cooling fin on plate, and fin is set in the bottom of cooling fin, substantially increases heat dissipation area, improves the heat dissipation of bus duct
Speed；4, heat conduction film, heat conduction film connecting bottom board and top plate are set on insulating sleeve, since core is main fever member
Part, after heat is spread to by fuel factor on insulating sleeve, heat is smoothly transmitted to top by heat conduction film from insulating sleeve
It on plate and bottom plate, and then is radiated again by top plate and bottom plate, therefore avoids and heat is locked in bottom plate, side plate and top plate
It in the cavity surrounded, is transmitted in time on bottom plate, side plate and top plate, makes the radiating rate of bus duct faster.
Card slot is both provided on the inner side and outer side of side plate, and top plate and cooling fin are fixed on side plate by way of grafting
On, installation it is more convenient, top plate and cooling fin are inserted into card slot, for ensure be more firmly mounted, top plate with
Be respectively provided with mounting hole at the position that card slot overlaps, at the position that cooling fin and card slot overlap, by screw by top plate and card slot, dissipate
Backing and card slot are fixed respectively.
Cooling fin is fixed in card slot on the outside of side plate, the bottom of cooling fin is provided with fin, and fin is vertical with cooling fin,
It can radiate to greatest extent.And cooling fin extends outwardly, and can also provide and block for the heat emission hole on side plate, avoid rainwater
Deng intrusion, play the effect of waterproof.It is provided with mounting hole on cooling fin, when bus duct is installed, will can directly dissipate
Backing is fixed with equipment is connect, and to ensure heat dissipation effect, directly cooling fin and a cooling device can also be fixed,
It is whole again that cooling fin, cooling device are installed along on wall or other positions.
Core is provided in the cavity that bottom plate, side plate and top plate surround, the outside of the core is coated with insulating sleeve, institute
The top and bottom for stating insulating sleeve have heat conduction film, the heat conduction film connection top plate and bottom plate.In general, bus duct
The interior multiple cores of setting, core give off heat when working, and insulating sleeve fever, heat is transmitted to top plate and bottom along heat conduction film
Plate carries out the transmission of heat so that on side plate.It, can directly will be in bus duct by the way that heat conduction film is arranged on insulating sleeve
In the heat transfer of core to bus duct shell, the heat for the core in the prior art of comparing slowly is transmitted to by medium of air
On bus duct shell, speed is faster.
Several heat emission holes are set on side plate, can directly be dissipated the heat to the air, to ensure heat dissipation to greatest extent
Speed, the position of heat emission hole is corresponding relatively good on opposite two side plates.
Several grooves being recessed inwardly are provided on side plate and bottom plate, the structure that plate face indent is stretched out again can increase
Heat dissipation area improves radiating rate.
Reference numeral
Fig. 1 is the structural schematic diagram of the invention；
Fig. 2 is the diagrammatic cross-section along line A-A in Fig. 1；
Fig. 3 is the structural schematic diagram of second embodiment of the present invention.
Wherein reference numeral is as follows：
1, side plate；2, bottom plate；3, card slot；4, top plate；5, cooling fin；6, mounting hole；7, core；8, insulating sleeve；9, heat-conducting glue
Piece；10, fin；11, heat emission hole；12, groove；13, heat-dissipating pipe.
Specific implementation mode
The present invention is described further below in conjunction with the accompanying drawings：
Embodiment 1：Such as Fig. 1,2, a kind of heat dissipation bus duct, including side plate 1 and bottom plate 2,2 both sides of the bottom plate respectively with side plate 1
It connects, card slot 3 is both provided on the inner side and outer side of the side plate 1, is connected between two card slots 3 of 1 inside of the side plate
Top plate 4 is fixed with cooling fin 5 in the card slot 3 in the outside of the side plate 1, has mounting hole 6 on cooling fin 5；In bottom plate 2, side plate 1
Core 7 is provided in the cavity surrounded with top plate 4, the outside of the core 7 is coated with insulating sleeve 8, the insulating sleeve 8
There is heat conduction film 9, the heat conduction film 9 to connect top plate 4 and bottom plate 2 for top and bottom.
Be screwed between card slot 3 and top plate 4,5 bottom of cooling fin have several fins 10, the card slot 3 and dissipate
It is screwed between backing 5.
It is provided with several heat emission holes 11 on side plate 1, several grooves being recessed inwardly are provided on side plate 1 and bottom plate 2
12。
The beneficial effects of the present invention are：It radiates in several ways, improves the radiating rate of bus duct, effectively extend it
Service life：1, several grooves 12 being recessed inwardly are set on side plate 1 and bottom plate 2, heat dissipation area can be effectively increased, improve and dissipate
Thermal velocity；2, several heat emission holes 11 on side plate 1 are set, by cross-ventilation, can in time take the heat in bus duct out of；
3, it is provided with cooling fin 5 on side plate 1, and fin 10 is set in the bottom of cooling fin 5, substantially increases heat dissipation area, improves
The radiating rate of bus duct；4, heat conduction film 9,9 connecting bottom board 2 of heat conduction film and top plate 4 are set on insulating sleeve 8, due to
Core 7 is main heater element, and after heat is spread to by fuel factor on insulating sleeve 8, heat conduction film 9 is smooth by heat
Slave insulating sleeve 8 be transmitted on top plate 4 and bottom plate 2, and then radiated again by top plate 4 and bottom plate 2, thus avoid by
Heat is locked in the cavity that bottom plate 2, side plate 1 and top plate 4 surround, and is transmitted in time on bottom plate 2, side plate 1 and top plate 4, is made mother
The radiating rate of wire casing is faster.
Card slot 3 is both provided on the inner side and outer side of side plate 1, and top plate 4 and cooling fin 5 are fixed on by way of grafting
On side plate 1, installation is more convenient, and top plate 4 and cooling fin 5 are inserted into card slot 3, to ensure to be more firmly mounted,
It is respectively provided with mounting hole 6 at the position that top plate 4 and card slot 3 overlap, at the position that cooling fin 5 and card slot 3 overlap, it will by screw
Top plate 4 and card slot 3, cooling fin 5 and card slot 3 are fixed respectively.
Be fixed with cooling fin 5 in the card slot 3 in the outside of side plate 1, the bottom of cooling fin 5 is provided with fin 10, fin 10 with dissipate
Backing 5 is vertical, can radiate to greatest extent.And cooling fin 5 extends outwardly, and can also be that the heat emission hole 11 on side plate 1 carries
For blocking, the intrusion of rainwater etc. is avoided, the effect of waterproof is played.Mounting hole 6 is provided on cooling fin 5, when bus duct is pacified
When dress, directly cooling fin 5 can be fixed with equipment is connect, for ensure heat dissipation effect, can also directly by cooling fin 5 with
One cooling device is fixed, then cooling fin 5, cooling device are installed along on wall or other positions by entirety.
Core 7 is provided in the cavity that bottom plate 2, side plate 1 and top plate 4 surround, the outside of the core 7 is coated with insulation sleeve
There is heat conduction film 9, the heat conduction film 9 to connect top plate 4 and bottom plate 2 for the top and bottom of pipe 8, the insulating sleeve 8.Generally
For, the multiple cores 7 of setting in bus duct, core 7 gives off heat when working, and insulating sleeve 8 generates heat, and heat is along heat conduction film
9 are transmitted to top plate 4 and bottom plate 2, so that on side plate 1, carry out the transmission of heat.By the way that heat conduction film is arranged on insulating sleeve 8
9, it can be directly by the heat for the core 7 in the prior art of in the heat transfer of core in bus duct 7 to bus duct shell, comparing
It is slowly transmitted on bus duct shell by medium of air, speed is faster.
Several heat emission holes 11 are set on side plate 1, can directly be dissipated the heat to the air, to ensure to dissipate to greatest extent
Thermal velocity, the position of heat emission hole 11 is corresponding relatively good on opposite two side plates 1.
It is provided with several grooves 12 being recessed inwardly on side plate 1 and bottom plate 2, the structure that plate face indent is stretched out again can be with
Increase heat dissipation area, improves radiating rate.
Embodiment 2：Such as Fig. 1,3, it is clear that, it, can also be in the groove of 2 bottom of bottom plate in order to further increase heat dissipation effect
Heat-dissipating pipe 13 is set at 12, refrigerant is filled in heat-dissipating pipe 13（Such as water）, the both ends of heat-dissipating pipe 13 be separately connected intake chamber and
Water pump is arranged in effluent trough at intake chamber, ensures that heat-dissipating pipe 13 can suck cold water, and cold water can be transported in heat-dissipating pipe 13
It is dynamic.Obvious, after heat-dissipating pipe 13 are arranged in the bottom of bottom plate 2, structure is relative complex, and the sucking to heat-dissipating pipe 13 is needed to fill
It sets and carries out power supply connection.The concrete structure of the part has example more referring to various water pumps due in the prior art, therefore herein not
It repeats.
It the above is only presently preferred embodiments of the present invention, be not that the invention has other forms of limitations.It is any ripe
Know the equivalent reality that professional and technical personnel was changed or be modified as equivalent variations possibly also with the technology contents of the disclosure above
Apply example.But it is every without departing from technical solution of the present invention content, construction according to the present invention and operation principle are to above example
Made by any simple modification, equivalent variations and remodeling, still fall within the protection domain of technical solution of the present invention.
Claims (6)
1. a kind of heat dissipation bus duct, including side plate and bottom plate, the bottom plate both sides are connect with side plate respectively, it is characterised in that：Institute
It states and is both provided with card slot on the inner side and outer side of side plate, top plate, the side are connected between two card slots of the side plate interior sides
It is fixed with cooling fin in card slot on the outside of plate, there is mounting hole on cooling fin；It is set in the cavity that bottom plate, side plate and top plate surround
It is equipped with core, the outside of the core is coated with insulating sleeve, and the top and bottom of the insulating sleeve have heat conduction film, institute
State heat conduction film connection top plate and bottom plate.
2. a kind of heat dissipation bus duct according to claim 1, it is characterised in that：Pass through screw between the card slot and top plate
It is fixed.
3. a kind of heat dissipation bus duct according to claim 2, it is characterised in that：The cooling fin bottom has several wings
Piece.
4. a kind of heat dissipation bus duct according to claim 1 or 3, it is characterised in that：Lead between the card slot and cooling fin
Screw is crossed to fix.
5. a kind of heat dissipation bus duct according to claim 4, it is characterised in that：Several heat emission holes are provided on side plate.
6. a kind of heat dissipation bus duct according to claim 5, it is characterised in that：Be provided on side plate and bottom plate it is several to
The groove of sunken inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810774693.8A CN108808601A (en) | 2018-07-16 | 2018-07-16 | A kind of heat dissipation bus duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810774693.8A CN108808601A (en) | 2018-07-16 | 2018-07-16 | A kind of heat dissipation bus duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108808601A true CN108808601A (en) | 2018-11-13 |
Family
ID=64076879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810774693.8A Pending CN108808601A (en) | 2018-07-16 | 2018-07-16 | A kind of heat dissipation bus duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108808601A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755910A (en) * | 2019-02-09 | 2019-05-14 | 新疆特变电工自控设备有限公司 | A kind of concentration bus duct |
| CN113964693A (en) * | 2021-10-28 | 2022-01-21 | 江苏瑞珀电气设备有限公司 | Intelligent power distribution box with cable protection structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206412721U (en) * | 2017-01-20 | 2017-08-15 | 广州市锐赛机电设备有限公司 | A kind of bus plugging box easy to assemble |
| CN206432637U (en) * | 2017-01-16 | 2017-08-22 | 北京立耀兴业电气设备有限公司 | A kind of Novel cable bridge |
| CN107404098A (en) * | 2017-07-24 | 2017-11-28 | 扬州振宇电器设备有限公司 | A kind of heat-resisting bus duct |
| CN206806940U (en) * | 2017-05-10 | 2017-12-26 | 江苏宏强电气集团有限公司 | A kind of high sealing water proof bus bar slot |
| CN208548673U (en) * | 2018-07-16 | 2019-02-26 | 向荣集团有限公司 | A kind of heat dissipation bus duct |
-
2018
- 2018-07-16 CN CN201810774693.8A patent/CN108808601A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206432637U (en) * | 2017-01-16 | 2017-08-22 | 北京立耀兴业电气设备有限公司 | A kind of Novel cable bridge |
| CN206412721U (en) * | 2017-01-20 | 2017-08-15 | 广州市锐赛机电设备有限公司 | A kind of bus plugging box easy to assemble |
| CN206806940U (en) * | 2017-05-10 | 2017-12-26 | 江苏宏强电气集团有限公司 | A kind of high sealing water proof bus bar slot |
| CN107404098A (en) * | 2017-07-24 | 2017-11-28 | 扬州振宇电器设备有限公司 | A kind of heat-resisting bus duct |
| CN208548673U (en) * | 2018-07-16 | 2019-02-26 | 向荣集团有限公司 | A kind of heat dissipation bus duct |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109755910A (en) * | 2019-02-09 | 2019-05-14 | 新疆特变电工自控设备有限公司 | A kind of concentration bus duct |
| CN113964693A (en) * | 2021-10-28 | 2022-01-21 | 江苏瑞珀电气设备有限公司 | Intelligent power distribution box with cable protection structure |
| CN113964693B (en) * | 2021-10-28 | 2022-09-20 | 江苏瑞珀电气设备有限公司 | Intelligent power distribution box with cable protection structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181113 |