CN108807480A - Display base plate motherboard and preparation method thereof and display device - Google Patents
Display base plate motherboard and preparation method thereof and display device Download PDFInfo
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- CN108807480A CN108807480A CN201810595868.9A CN201810595868A CN108807480A CN 108807480 A CN108807480 A CN 108807480A CN 201810595868 A CN201810595868 A CN 201810595868A CN 108807480 A CN108807480 A CN 108807480A
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- base plate
- display base
- layer
- display
- cutting region
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L2021/775—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- Electroluminescent Light Sources (AREA)
Abstract
A kind of display base plate motherboard of present invention offer and preparation method thereof and display device, wherein, after forming display element on underlay substrate, before forming the packaging film for covering the display element, the thickness of the cutting region of the display base plate motherboard is thinned.Display base plate motherboard provided by the invention and preparation method thereof and display device can solve the problem of that cracking water oxygen in display base plate after cutting enters viewing area by crackle by shorten display base plate service life.
Description
Technical field
The present invention relates to display technology fields more particularly to a kind of display base plate motherboard and preparation method thereof and display dress
It sets.
Background technology
With the development of display technology, Organic Light Emitting Diode (Organic Light-Emitting Diode,
OLED) technical, has developed active matrix organic light emitting diode panel (Active-matrix organic light
Emitting diode, abbreviation AMOLED), AMOLED screen since its gamut range is wide, thickness is thin and low power consumption and other advantages,
Application in electronic display unit gradually increases.
In the prior art, during being cut to AMOLED screen, it is also easy to produce crackle, when crack propagation to display
Qu Shi, water oxygen enter viewing area by crackle, there are problems that shortening the service life of display base plate.
Invention content
A kind of display base plate motherboard of offer of the embodiment of the present invention and preparation method thereof and display device, after solving to cut
It is cracked in display base plate, water oxygen is by the way that crackle enters viewing area by shortens display base plate service life the problem of.
It is as follows that in order to solve the above technical problem, the present invention provides technical solutions：
In a first aspect, the embodiment of the present invention provides a kind of production method of display base plate motherboard, including：
After forming display element on underlay substrate, before forming the packaging film for covering the display element, it is thinned
The thickness of the cutting region of the display base plate.
Further, after forming the display element, the film layer of the cutting region includes being located at the substrate successively
Barrier layer, buffer layer, gate insulating layer on substrate and interlayer insulating film, the cutting region that the display base plate is thinned
Thickness includes：
The gate insulating layer, the interlayer insulating film and the part institute in the cutting region are removed by etching technics
State buffer layer.
Further, it is described be thinned the display base plate cutting region thickness, further include：
The remaining buffer layer and the part barrier layer are removed by etching technics.
Further, the underlay substrate is flexible substrate substrate.
Second aspect, the embodiment of the present invention also provide a kind of display base plate motherboard, include multiple on underlay substrate
The thicknesses of layers of display element and the cutting region between Adjacent display elements, the cutting region is less than predetermined threshold value.
Further, the display base plate motherboard further includes the side between the display element and the cutting region
Frame region, the thickness of the film layer of the cutting region are less than the thickness of the film layer of the frame region.
Further, the film layer of the frame region successively include be located at the underlay substrate on barrier layer, buffer layer,
The film layer of gate insulating layer, interlayer insulating film and packaging film, the cutting region includes the portion being located on the underlay substrate
Divide the barrier layer and the packaging film.
Further, the display base plate motherboard further includes pre- between the frame region and the cutting region
Region is stayed, the film layer of the reserved area includes barrier layer, buffer layer and the packaging film being located on the underlay substrate successively.
Further, the underlay substrate is flexible substrate substrate.
The third aspect, the embodiment of the present invention also provide a kind of display base plate, and the display base plate is display as described above
Substrate motherboard is cut.
Fourth aspect, the embodiment of the present invention also provide a kind of display device, including display base plate as described above.
In technical solution provided by the invention, by the way that the thickness of cutting region in display base plate motherboard is thinned, reduces and cut
The ablation energy needed for display base plate motherboard is cut, and then reduces the thermal stress generated in cutting process, is being shown after preventing cutting
It is cracked in substrate, so as to solve to shorten asking for display base plate service life by water oxygen enters viewing area by crackle
Topic.Therefore, technical solution provided by the invention not only saves the ablation energy to display base plate motherboard, extends display base plate
Service life.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, needed in being described below to the embodiment of the present invention
Attached drawing to be used is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention,
For those of ordinary skill in the art, without having to pay creative labor, it can also obtain according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the schematic diagram of display base plate in the prior art；
Fig. 2 is a kind of schematic diagram of display base plate provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of another display base plate provided in an embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
Display base plate motherboard 100 in the prior art, as shown in Figure 1, to the cutting region of display base plate motherboard 100 into
Before row cutting, the film layer of the cutting region of display base plate motherboard 100 includes the layer structure on underlay substrate.Due in cutting region
The thickness of layer structure is thicker, and it is high to be cut by laser required ablation energy, thermal stress is generated in cutting process and in display base plate
Upper formation crackle, when crack propagation to viewing area, water oxygen enters viewing area by crackle, exists and shortens making for display base plate
The problem of with the service life.
The embodiment of the present invention is in view of the above-mentioned problems, provide a kind of display base plate motherboard and preparation method thereof and display dress
It sets, is cracked in display base plate after cutting can be prevented, and then water oxygen can be solved by crackle enters viewing area
The problem of shortening display base plate service life.
The embodiment of the present invention provides a kind of production method of display base plate motherboard, including：
After forming display element on underlay substrate, before forming the packaging film for covering the display element, it is thinned
The thickness of the cutting region of the display base plate motherboard.
In the present embodiment, by the way that the thickness of cutting region in display base plate motherboard is thinned, it is female to reduce cutting display base plate
Ablation energy needed for plate, and then the thermal stress generated in cutting process is reduced, it prevents from generating in display base plate after cutting and split
Line, so as to solve the problems, such as to shorten display base plate service life by water oxygen enters viewing area by crackle.Therefore, this hair
The technical solution of bright offer not only saves the ablation energy to display base plate motherboard, extends the service life of display base plate.
Above-mentioned display base plate motherboard can be flexible display substrates motherboard, can also be rigid display base plate motherboard.Aobvious
When showing that substrate motherboard is flexible display substrates motherboard, underlay substrate uses flexible substrate substrate, such as Kapton；Aobvious
When showing that substrate motherboard is rigid display base plate motherboard, underlay substrate uses rigid substrate substrate, such as quartz base plate or glass base
Plate.
Wherein, display base plate motherboard includes underlay substrate and the layer structure on the underlay substrate, this layer of structure can
To be at least one layer in barrier layer, buffer layer, gate insulating layer and interlayer insulating film.Cutting area in display base plate motherboard is thinned
The mode of the thickness in domain can be that the layer structure on underlay substrate is thinned, i.e., subtract at least one layer in layer structure
It is thin.
When being cut, laser cuts display base plate motherboard along laser cut line, laser cut line
In cutting region.
In an optional embodiment, as shown in Fig. 2, after forming the display element, the film of the cutting region
Layer includes barrier layer 220, buffer layer 230, gate insulating layer 240 and the layer insulation being located on the underlay substrate 210 successively
Layer 250, the thickness of the cutting region that the display base plate motherboard is thinned, including：
The gate insulating layer, the interlayer insulating film and the part institute in the cutting region are removed by etching technics
State buffer layer.
It is slow by removing the gate insulating layer 240 in cutting region, interlayer insulating film 250 and part in present embodiment
The mode for rushing layer 230, come be thinned display base plate motherboard cutting region film layer thickness.It should be noted that the present embodiment
In, it is not limited in a kind of this mode of thinned display base plate motherboard, in other embodiments, can also be cut by etching
The modes such as gate insulating layer and interlayer insulating film in the interlayer insulating film in region, or etching cutting region, it is aobvious to be thinned
Show substrate motherboard.
Dry carving technology may be used in the mode of etching, can also use wet-etching technique, but since dry carving technology compares wet etching
The precision of technique is high, and the control accuracy of the thickness of cutting region theca interna after etching can be improved using dry carving technology.
In present embodiment, the film layer of the cutting region after being thinned includes remaining buffer layer 230 and barrier layer 220, is cut
The thickness for cutting region greatly reduces, and reduces the ablation energy needed for cutting display base plate motherboard, and then reduce in cutting process
The thermal stress of generation, cracks after preventing cutting in display base plate, enters so as to solving water oxygen by crackle aobvious
The problem of showing area and shortening display base plate service life.
Based on the above embodiment, in another optional embodiment, it is described by etching technics remove described in cut
It cuts the gate insulating layer in region, after the interlayer insulating film and the part buffer layer, further comprise：
The remaining buffer layer and the part barrier layer are removed by etching technics.
As shown in figure 3, by removing gate insulating layer 340, interlayer insulating film 350,330 and of buffer layer in cutting region
The mode for partially obstructing layer 320, come be thinned display base plate motherboard cutting region film layer thickness.In the present embodiment, not
It is only limitted to a kind of this mode of thinned display base plate motherboard, it in other embodiments, can also be by etching in cutting region
Interlayer insulating film, or the gate insulating layer in etching cutting region and the modes such as interlayer insulating film, display base plate is thinned
Motherboard.
In present embodiment, for residual buffer layer 330 and partially obstruct layer 320 etching mode can with for grid
Insulating layer 340, interlayer insulating film 350 are identical with the etching mode of portion of buffer layer 330, can not also be identical, present embodiment
This is not construed as limiting.
In present embodiment, the film layer of the cutting region after being thinned includes the remaining barrier layer on underlay substrate 310
320, the thickness of cutting region greatly reduces, and reduces the ablation energy needed for cutting display base plate motherboard, and then reduce cutting
The thermal stress generated in the process, prevent cutting after cracked in display base plate, so as to solve water oxygen by crackle into
Enter the problem of shortening display base plate service life to viewing area.
The embodiment of the present invention also provides a kind of display base plate motherboard, include multiple display elements on underlay substrate and
The thicknesses of layers of cutting region between Adjacent display elements, the cutting region is less than predetermined threshold value.
In the present embodiment, by being thinned to the thickness of cutting region in display base plate motherboard less than predetermined threshold value, reduce
Ablation energy needed for cutting display base plate motherboard, and then reduce the thermal stress generated in cutting process, prevent after cutting
It is cracked in display base plate, so as to solve to shorten display base plate service life by water oxygen enters viewing area by crackle
The problem of.Therefore, technical solution provided by the invention not only saves the ablation energy to display base plate motherboard, also extends aobvious
Show the service life of substrate.
Above-mentioned display base plate motherboard can be flexible display substrates motherboard, can also be rigid display base plate motherboard.Aobvious
When showing that substrate motherboard is flexible display substrates motherboard, underlay substrate uses flexible substrate substrate, such as Kapton；Aobvious
When showing that substrate motherboard is rigid display base plate motherboard, underlay substrate uses rigid substrate substrate, such as quartz base plate or glass base
Plate.
Wherein, display base plate motherboard includes underlay substrate and the layer structure on the underlay substrate, this layer of structure can
To be at least one layer in barrier layer, buffer layer, gate insulating layer and interlayer insulating film.Cutting area in display base plate motherboard is thinned
The mode of the thickness in domain can be that the layer structure on underlay substrate is thinned, i.e., subtract at least one layer in layer structure
It is thin.
When being cut, laser cuts display base plate motherboard along laser cut line, laser cut line
In cutting region.
In present embodiment, predetermined threshold value can be different according to different display base plate motherboards, can also be identical, separately
Outside, the thickness of packaging film is additionally depended on, it is specific to can be selected in 30 microns, 25 microns, 21.25 microns, 20 microns and 18 microns
Either one or two of.
Further, display base plate motherboard further includes the rim area between the display element and the cutting region
Domain, the thickness of the film layer of the cutting region are less than the thickness of the film layer of the frame region.
Frame region is between display element and cutting region, the display base plate that is formed after the cutting of display base plate motherboard
It is middle to be used as frame.To ensure that the normal use of display base plate, the thickness of the film layer of frame region cannot be thinned.
Before the thickness of cutting region of the display base plate motherboard is thinned, the film of the frame region of display base plate motherboard
The thickness of layer is identical with the thickness of the film layer of cutting region.After the thickness of cutting region of the display base plate motherboard is thinned,
Part film layer in cutting region be etched technique removal, to achieve the purpose that the thickness of thinned cutting region, be thinned after
The thickness of cutting region is less than the thickness of the film layer of the frame region.
Such as：Before the thickness of cutting region of the display base plate motherboard is thinned, the rim area of display base plate motherboard
The film layer in domain and the film layer of cutting region include underlay substrate and barrier layer, buffer layer and grid on the underlay substrate
Pole insulating layer；During the thickness of cutting region of the display base plate motherboard is thinned, etching technics removes cutting region
Interior gate insulating layer；After the thickness of cutting region of the display base plate motherboard is thinned, the frame of display base plate motherboard
The film layer in region includes underlay substrate and barrier layer, buffer layer and gate insulating layer on the underlay substrate, shows base
The film layer of the cutting region of plate motherboard includes underlay substrate and the barrier layer on the underlay substrate and buffer layer, cutting area
The thickness of the film layer in domain is less than the thickness of the film layer of frame region.
In addition, after the thickness of cutting region of the display base plate motherboard is thinned, if desired again to display base plate mother
One layer of packaging film is covered on plate, then since the distance between cutting region and display element are more than frame region and display element
The distance between, therefore the thickness of the packaging film of cutting region is less than the thickness of the packaging film of frame region so that it is final
In covering after packaging film, the thickness of the film layer of cutting region remains unchanged less than the thickness of the film layer of frame region.
In the present embodiment, the thickness of the film layer of cutting region is less than the thickness of the film layer of frame region, and it is aobvious to reduce cutting
Show the ablation energy needed for substrate motherboard, and then reduce the thermal stress generated in cutting process, prevents after cutting in display base plate
In crack, so as to solve the problems, such as to shorten display base plate service life by water oxygen enters viewing area by crackle.
In an optional embodiment, as shown in figure 3, the film layer of the frame region includes being located at the substrate successively
Barrier layer 320, buffer layer 330, gate insulating layer 340, interlayer insulating film 350 on substrate 310 and packaging film 360, it is described
The film layer of cutting region includes the part barrier layer 320 being located on the underlay substrate 310 and the packaging film 360.
In present embodiment, due to cutting region film layer the number of plies less than frame region film layer the number of plies, and two
Thickness of the film layer that region has jointly in two regions is identical, and therefore, the thickness of the film layer of cutting region is less than frame
The thickness of the film layer in region.
Before the thickness of cutting region of the display base plate motherboard is thinned, the film of the frame region of display base plate motherboard
The film layer of layer and cutting region includes underlay substrate 310 and barrier layer 320, buffer layer on the underlay substrate 310
330, gate insulating layer 340 and interlayer insulating film 350；In the process of the thickness for the cutting region that the display base plate motherboard is thinned
In, gate insulating layer 340 in etching technics removal cutting region, buffer layer 330 and partially obstructs layer at interlayer insulating film 350
320；After the thickness of cutting region of the display base plate motherboard is thinned, the film layer packet of the frame region of display base plate motherboard
Include underlay substrate 310 and barrier layer 320, buffer layer 330, gate insulating layer 340 and interlayer on the underlay substrate 310
The film layer of insulating layer 350, the cutting region of display base plate motherboard includes underlay substrate 310 and is located on the underlay substrate 310
Remaining barrier layer 320, the thickness of the film layer of cutting region is less than the thickness of the film layer of frame region.
Again on display base plate motherboard cover one layer of packaging film 360 after, due between cutting region and display element
Distance is more than the distance between frame region and display element, therefore the thickness of the packaging film of cutting region is less than frame region
Packaging film thickness, on Landfill covering after packaging film, the film layer of the frame region includes being located at the substrate successively
Barrier layer 320, buffer layer 330, gate insulating layer 340, interlayer insulating film 350 on substrate 310 and packaging film 360, it is described
The film layer of cutting region includes the part barrier layer 320 being located on the underlay substrate 310 and the packaging film 360.
Further, the display base plate motherboard can also include between the frame region and the cutting region
Reserved area, the film layer of the reserved area includes the barrier layer 320 being located on the underlay substrate 310, buffer layer successively
330 and packaging film 360.
Ablation energy damages the layer structure of frame region when to avoid cutting, is equipped between frame region and cutting region
Reserved area influences to rest on the reserved area caused by ensureing the ablation energy in cutting process by the reserved area, no
Frame region can be damaged, to promote the yield of the display base plate obtained after cutting.
In present embodiment, the film layer of cutting region includes the part barrier layer being located on the underlay substrate 310
320 and the packaging film 360, the thickness of cutting region greatly reduce, reduce cutting display base plate motherboard needed for cutting
Energy, and then the thermal stress generated in cutting process is reduced, it is cracked in display base plate after preventing cutting, so as to solve
Certainly water oxygen is by the way that crackle enters viewing area by shortens display base plate service life the problem of.
Forming method for above-mentioned buffer layer and barrier layer include but not limited to chemical vapor deposition (such as：
PECVD) or physical vapour deposition (PVD), the material of buffer layer and barrier layer include but not limited to silica, silicon nitride, silicon oxynitride or
Various organic insulating materials, for example, polysiloxanes based material, acrylic based material or polyimides based material.In addition, for slow
The thickness and the number of plies embodiment of the present invention for rushing layer do not limit, and buffering includes but not limited to single layer structure or double-layer structure.It is carving
When erosion, buffer layer and barrier layer can be protected to being formed by element on underlay substrate.
In addition, in the embodiment of the present invention, the top in underlay substrate respective pixel region is equipped with active layer；Gate insulating layer position
Above active layer；It is equipped with grid layer above gate insulating layer and corresponding to active layer；Interlayer insulating film is located on grid layer
Side；Source-drain layer is equipped with above interlayer insulating film；Wherein, the source electrode in source-drain layer is by running through interlayer insulating film, gate insulating layer
The first via connect with active layer, the drain electrode in source-drain layer passes through the second via through interlayer insulating film, gate insulating layer
It is connect with active layer, the grid in grid layer is connect by the third via through gate insulating layer with active layer.
The material of gate insulating layer and interlayer insulating film can be silica, silicon nitride, silicon oxynitride etc., i.e. gate insulator
Layer and interlayer insulating film are inorganic material insulating layer.Pass through gate insulator between the active layer and grid layer of composition capacitance structure
Layer separates；It is separated by gate insulating layer and/or interlayer insulating film between the active layer and source-drain layer of composition capacitance structure.
The embodiment of the present invention also provides a kind of display base plate, for being formed after above-mentioned display base plate motherboard laser cutting.
The embodiment of the present invention additionally provides a kind of display device, including display base plate as described above.The display device
Can be：Any product or portion with display function such as TV, display, Digital Frame, mobile phone, tablet computer, navigator
Part, wherein the display device further includes flexible PCB, printed circuit board and backboard.
Unless otherwise defined, the technical term or scientific terminology that the disclosure uses should be tool in fields of the present invention
There is the ordinary meaning that the personage of general technical ability is understood." first ", " second " and the similar word used in the disclosure is simultaneously
It does not indicate that any sequence, quantity or importance, and is used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means to occur the element before the word, and either object covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, either directly or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative position relation, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited in above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form belongs within the protection of the present invention.
Claims (11)
1. a kind of production method of display base plate motherboard, which is characterized in that including：
After forming display element on underlay substrate, before forming the packaging film for covering the display element, it is thinned described
The thickness of the cutting region of display base plate motherboard.
2. the production method of display base plate motherboard according to claim 1, which is characterized in that forming the display element
Afterwards, the film layer of the cutting region includes barrier layer, buffer layer, gate insulating layer and the layer being located on the underlay substrate successively
Between insulating layer, it is described be thinned the display base plate motherboard cutting region thickness, including：
It is described slow that the gate insulating layer in the cutting region, the interlayer insulating film and part are removed by etching technics
Rush layer.
3. the production method of display base plate motherboard according to claim 2, which is characterized in that described that the display base is thinned
The thickness of the cutting region of plate further includes：
The remaining buffer layer and the part barrier layer are removed by etching technics.
4. the production method of display base plate motherboard according to claim 1, which is characterized in that the underlay substrate is flexibility
Underlay substrate.
5. a kind of display base plate motherboard, which is characterized in that include multiple display elements on underlay substrate and positioned at adjacent
The thicknesses of layers of cutting region between display element, the cutting region is less than predetermined threshold value.
6. display base plate motherboard according to claim 5, which is characterized in that the display base plate motherboard further includes being located at institute
The frame region between display element and the cutting region is stated, the thickness of the film layer of the cutting region is less than the rim area
The thickness of the film layer in domain.
7. display base plate motherboard according to claim 6, which is characterized in that the film layer of the frame region includes position successively
In barrier layer, buffer layer, gate insulating layer, interlayer insulating film and packaging film on the underlay substrate, the cutting region
Film layer include be located at the underlay substrate on the part barrier layer and the packaging film.
8. display base plate motherboard according to claim 7, which is characterized in that the display base plate motherboard further includes being located at institute
The reserved area between frame region and the cutting region is stated, the film layer of the reserved area includes being located at the substrate successively
Barrier layer, buffer layer on substrate and packaging film.
9. display base plate motherboard according to claim 5, which is characterized in that the underlay substrate is flexible substrate substrate.
10. a kind of display base plate, which is characterized in that the display base plate is the display as described in any one of claim 5-9
Substrate motherboard is cut.
11. a kind of display device, which is characterized in that including display base plate as claimed in claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810595868.9A CN108807480A (en) | 2018-06-11 | 2018-06-11 | Display base plate motherboard and preparation method thereof and display device |
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|---|---|---|---|
| CN201810595868.9A CN108807480A (en) | 2018-06-11 | 2018-06-11 | Display base plate motherboard and preparation method thereof and display device |
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| CN109755409A (en) * | 2019-01-10 | 2019-05-14 | 京东方科技集团股份有限公司 | A kind of display base plate and preparation method thereof, display device |
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| CN114843419A (en) * | 2022-04-20 | 2022-08-02 | 深圳市华星光电半导体显示技术有限公司 | Display panel manufacturing method and display device |
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Application publication date: 20181113 |