CN108788509A - A kind of preformed soldering - Google Patents
A kind of preformed soldering Download PDFInfo
- Publication number
- CN108788509A CN108788509A CN201810556267.7A CN201810556267A CN108788509A CN 108788509 A CN108788509 A CN 108788509A CN 201810556267 A CN201810556267 A CN 201810556267A CN 108788509 A CN108788509 A CN 108788509A
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- China
- Prior art keywords
- preformed soldering
- protrusion
- weld tabs
- preformed
- welding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to electronic device welding field of material technology, specifically provide a kind of preformed soldering.The preformed soldering of the present invention is provided with multiple protrusions being spaced in intervals and/or the recessed portion being spaced in intervals at least one surface of the weld tabs.The preformed soldering of the present invention, in welding, warm-up phase is conducive to reducibility gas or scaling powder and enters the position to be welded along the gap of protrusion and/or the ripple of recessed portion formation, to more effectively restore the oxidation film of weld tabs and soldered face, and be conducive to the gap effusion for the ripple that the gas generated after reduction is formed along protrusion and/or recessed portion.And at the wave crest of weld tabs or high spot, it due to being contacted with component, can preferentially melt, and gradually be promoted toward lower fusing until solder all melts, the gas that welding process generates further is promoted to be escaped, to achieve the purpose that reduce welding void fraction, improve welding quality.
Description
Technical field
The present invention relates to electronic device welding field of material technology, specifically provide a kind of preformed soldering.
Background technology
It is higher and higher to the heat dissipation and reliability requirement of encapsulation as electronic component is increasingly accurate and integrated, and drop
The void fraction of welding surface is to improve the most important thing of heat dissipation and reliability after low welding.If the void fraction after welding is high, weld
The thermal resistance of point just will increase, and the reliability of solder joint also can be bad, and cold-and-heat resistent cycle and impact resistance will be deteriorated, and solder joint easily goes out
Existing crackle is even broken, it is most likely that causes irretrievable loss to component.
The welding of preformed soldering restores welding or formic acid (or hydrogen) reduction weldering generally by scaling powder at present
Connect, when welding scaling powder either formic acid (or hydrogen) itself or the reduction of scaling powder or formic acid (or hydrogen) be soldered face and
Gas can be all generated when the oxidation film of solder surface, when the weld tabs welded encapsulation of plane, when welding generated gas due to
The channel not escaped is closed in welding surface inconvenient effusion, or even can not escape, to reduction welding void fraction, carry
High welding quality brings many puzzlements.
Invention content
In consideration of it, it is necessary to provide regarding to the issue above it is a kind of reduce welding void fraction, improve welding quality it is preforming
Weld tabs.
The present invention is achieved by the following technical solutions:
A kind of preformed soldering, be provided at least one surface of the weld tabs multiple intervals protrusion and/or
Every recessed portion.
Further, the distance at the interval is preferably:0.1-100mm.The protrusion at the interval and/or interval it is recessed
Concave portion makes weld tabs not completely enclose material surface to be welded in the same time, the gas for making warm-up phase and welding stage generate
Have enough time and channel discharge, therefore the interval of the protrusion and/or recessed portion be not limited to preferred distance values, all
The function of the present invention program can be realized away from value, only resultant effect is optimal within the scope of preferred value.
Further, the distance of the highs and lows on the preformed soldering surface is:0.005-5mm.Described
Every protrusion and/or the recessed portion at interval so that weld tabs is not completely enclosed material surface to be welded in the same time, make preheating
The gas that stage and welding stage generate has enough time and a channel discharge, therefore the peak on the preformed soldering surface and most
The distance of low spot is not limited to preferably be worth, and all distance values can realize the function of the present invention program, only in preferred value model
It is optimal to enclose interior resultant effect.
Further, the quantity of the protrusion or recessed portion is at least 2.
Further, the protrusion includes:(protrusion top is linear, or the way of contact with object to be welded for fin
Contacted for line), salient point (protrusion top accumulate it is dotted, or with the way of contact of object to be welded be point contact) or boss it is (prominent
It is face contact to play the way of contact that portion top is object planar or to be welded) etc..
Further, the recessed portion include groove (recessed portion is opened on weld tabs surface, to weld tabs body interior be recessed,
The bottommost of recess be it is planar or collect it is into a line, it is such as cylindrical or rectangular be recessed, be trapezoidal, V-shaped gully shape it is recessed
Fall into), (recessed portion is opened on weld tabs surface to pit, is recessed to weld tabs body interior, and the bottommost of recess is planar or collects
At a point, such as hemispherical, sector, rectangular, trapezoidal, conical recess) etc..
Further, the shape, size of the protrusion and/or recessed portion of the setting of the preformed soldering each surface,
Every, arrangement mode, protrusion height and/or recessed portion depth etc. can be identical, can not also be identical.
Further, when being respectively provided with protrusion and/or recessed portion on two surfaces of the preformed soldering, two tables
Shape, size, interval, arrangement mode, protrusion height and/or recessed portion depth of protrusion and/or recessed portion on face etc.
Can be identical, it can not also be identical.For example, all can be ripple (protrusion and recessed portion are combined and formed) respectively with two sides, concave-convex
Point or boss;It is ripple (protrusion and recessed portion are combined and formed) on one side that can also can also be, and is concave point, salient point or convex on one side
Platform;Can also be is concave point or salient point on one side, is boss on one side.Arbitrary group of the protrusion and/or recessed portion of other concrete forms
Conjunction can also.
Further, the protrusion on the preformed soldering surface or the section of recessed portion can be square, rectangle,
The polygons such as trapezoidal, triangle can also be that U-shaped, sector etc. are variously-shaped;The size of the protrusion or recessed portion is to this hair
The function of bright preformed soldering is unlimited without influence, i.e. size;Arrangement mode can be that regular uniform is continuous, can also be not advise
It is then uneven discontinuous.
Further, the protrusion and/or recessed portion on the preformed soldering surface can be punching press or roll forming,
Other machineries (such as weld tabs ontology is prepared respectively with protrusion, then by presetting card slot or hole etc., is assembled) or chemistry can be used
The method of (such as chemical etching, spraying plating) is molded.
Further, the alloy material of the preformed soldering can be tinbase, lead base, indium base, bismuthino, zinc-base, antimony base,
Any of which such as silver-based, copper-based, aluminium base solder are as preformed soldering made of alloy material, or arbitrary selection is wherein extremely
Few two kinds of alloy materials, preformed soldering made of MULTILAYER COMPOSITE;Can also be inside solder with metal or nonmetallic net or
The compound preformed soldering of silk, or the compound preformed soldering containing metal or non-metallic particle in solder matrix.
Further, the preformed soldering can be free from the preformed soldering of scaling powder, or be welded containing helping
The preformed soldering of agent;Existing way of the scaling powder on weld tabs can be surface coating, weld tabs intrinsic silicon comprising (i.e.
Scaling powder is added in basis material, weld tabs matrix is made together) etc. modes.
Further, the preformed soldering can make multilateral shape (such as rectangular, bar shaped), circle, arc, ring
The shapes such as shape, frame shape.
Advantageous effect of the present invention:
The preformed soldering of the present invention, in welding, warm-up phase is conducive to reducibility gas or scaling powder along protrusion
The gap for the ripple that portion and/or recessed portion are formed enters the position to be welded, to more effectively restore weld tabs and soldered face
Oxidation film, and the gap for being conducive to the ripple that the gas that generates is formed along protrusion and/or recessed portion after reduction escapes;
In the welding stage, at the wave crest of weld tabs or high spot can preferentially be melted due to being contacted with component, and gradually be melted toward lower
It promotes up to solder whole fusing, the gas that welding process generates further is promoted to be escaped, sky is welded to reach to reduce
Bubble rate, the purpose for improving welding quality.Warm-up phase and welding stage, as long as the effect of the emergent gas at least one stage is real
It is existing, then sufficiently achieve the effect for reducing welding void fraction, therefore the interval of the protrusion and/or recessed portion be not limited to it is preferred
Distance values, the distance of the highs and lows on the preformed soldering surface are also not necessarily limited to preferably be worth.
Description of the drawings
For convenience of to the clearer understanding of the present invention, accompanying schematic figure is please referred to.Accompanying schematic figure is not construed as pair
The limitation of the content of present invention, but be intended to illustratively illustrate.
Fig. 1 and 3 is ultrasound examination void fraction figure after existing flat sheet welded.Wherein white portion indicates welding vacuole,
Black portions indicate that welding is good.
Fig. 2 (single side contains the weld tabs of protrusion) and Fig. 4 (the two-sided weld tabs containing salient point) is the preforming weldering of the present invention
Ultrasound examination void fraction figure after piece welding.Wherein white portion indicates that welding vacuole, black portions indicate that welding is good.
Fig. 5 includes Fig. 5 a, Fig. 5 b and Fig. 5 c, and the signal of single side protrusion (raised rib) is contained for a kind of preformed soldering
Figure.Wherein 5a is regular uniform arrangement mode;5b is the uneven arrangement mode of rule;5c is irregular uneven arrangement mode.
Fig. 6 is the schematic diagram that a kind of preformed soldering contains single side protrusion (salient point).
Fig. 7 includes Fig. 7 a, Fig. 7 b and Fig. 7 c, and the schematic diagram of double corrugated is contained for a kind of preformed soldering.
Fig. 8 is the schematic diagram that a kind of preformed soldering contains two-sided protrusion (two-sided size is different).
Fig. 9 is the schematic diagram (two-sided shape is different) that a kind of preformed soldering contains two-sided protrusion, wherein being convex on one side
The rib risen, is boss on one side.
Specific implementation mode
In order to better illustrate technical solution of the present invention problem to be solved, the technical solution of use and reach beneficial
Effect is expanded on further in conjunction with specific implementation mode.It is worth noting that technical solution of the present invention is including but not limited to following
Embodiment.
Particular technique or condition are not specified in the embodiment of the present invention, according to technology described in document in the art or
Condition is carried out according to product description.Reagents or instruments used without specified manufacturer, being can be by purchased in market etc.
The conventional products that approach obtains.
Embodiment 1
Referring to Fig. 5, contain protrusion for a kind of preformed soldering single side, i.e. single side contains the schematic diagram of ripple (raised rib)
(left side) and its sectional view (right side).
The preforming weldering generally sheet of the present embodiment, the protrusion are fin, and the spacing between the fin is 1mm,
And by punching machine punch forming.
The fin section is sector, and the top margin of the fin is the peak on weld tabs surface, and bottom edge is weld tabs surface
Minimum point, the distance between the highest point and the lowest point are 0.09mm.It is mutually parallel between the fin, is continuously distributed in weld tabs table
Face.
The alloy material of the preformed soldering is lead-based solder.
The preformed soldering is the preformed soldering that surface coats fluxing agent.
In some other embodiment, it is described as bonvex prism in 5a is corrugated can also be by groove or pit formation;Also may be used
With by roll roll forming, or also can (such as weld tabs ontology is prepared respectively with protrusion, then passes through default card slot with other machineries
Or hole etc., assemble) or chemical (such as chemical etching, spraying plating) method molding.The global shape of weld tabs can the side of making
Shape, circle, arc, annular, frame shape, bar shaped etc..
In some other embodiment, the cross sectional shape of the fin or groove can also be square, rectangle, ladder
Shape, triangle, U-shaped etc..
In some other embodiment, the protrusion height and/or recessed portion depth, between fin, groove or pit
Spacing, a fixed value, regular uniform can be kept to be arranged on weld tabs, can also the different protrusion of simultaneous selection
Height and/or recessed portion depth, different distance values (as shown in Figure 5 c) or even intersection (as shown in Figure 5 b), it is irregular uneven
Be distributed in weld tabs surface.
In some other embodiment, the preformed soldering be also an option that tinbase, indium base, bismuthino, zinc-base, antimony base,
Any of which such as silver-based, copper-based, aluminium base solder can also be tinbase, lead as preformed soldering made of alloy material
Two or more arbitrary alloy material in the solders such as base, indium base, bismuthino, zinc-base, antimony base, silver-based, copper-based, aluminium base, to appoint
Preformed soldering made of meaning ratio MULTILAYER COMPOSITE.
In some other embodiment, the internal structure of the preformed soldering, can be inside solder with metal or
The compound preformed soldering of nonmetallic net or silk, or in solder matrix containing metal or non-metallic particle it is compound it is pre- at
Type weld tabs.
In some other embodiment, the weld tabs can also be the preformed soldering that surface is not coated with scaling powder, or
Person is the preformed soldering containing fluxing agent inside solder matrix.
Embodiment 2
Referring to Fig. 6, the schematic diagram (left side) and its sectional view of salient point (protrusion) are contained for a kind of preformed soldering single side
(right side).
The preformed soldering of the present embodiment generally sheet, the protrusion spacing be 1.5mm, weld tabs surface peak and
The distance between minimum point is 0.2mm, and roll roll forming is used in combination.
The salient point is hemispherical, and regular uniform is distributed in weld tabs surface.
The alloy material of the preformed soldering is tin solder.
The preformed soldering is the preformed soldering that surface coats fluxing agent.
In some other embodiment, the protrusion can also be that (top far from weld tabs ontology is one flat to boss
Face);The weld tabs can also by punching machine punch forming, or also can with other machinery (such as weld tabs ontology is made respectively with protrusion
It is standby, then by presetting card slot or hole etc., assemble) or chemical (such as chemical etching, spraying plating) method molding.Weld tabs it is whole
Shape can do squarely, circle, annular, frame shape, bar shaped etc..
In some other embodiment, the boss top surface shape can be square, rectangle, triangle, circle, ladder
Shape etc..
In some other embodiment, the height and/or spacing of the salient point or boss can keep a fixed value,
Regular uniform is arranged on weld tabs, can also simultaneous selection different height and/or distance values, irregular non-uniform distribution
On weld tabs surface.
In some other embodiment, the preformed soldering be also an option that lead base, indium base, bismuthino, zinc-base, antimony base,
Any of which such as silver-based, copper-based, aluminium base solder can also be tinbase, lead as preformed soldering made of alloy material
Two or more arbitrary alloy material in the solders such as base, indium base, bismuthino, zinc-base, antimony base, silver-based, copper-based, aluminium base, to appoint
Preformed soldering made of meaning ratio MULTILAYER COMPOSITE.
In some other embodiment, the internal structure of the preformed soldering, can be inside solder with metal or
The compound preformed soldering of nonmetallic net or silk, or in solder matrix containing metal or non-metallic particle it is compound it is pre- at
Type weld tabs.
In some other embodiment, the weld tabs can also be the preformed soldering that surface is not coated with scaling powder, or
Person is the preformed soldering containing fluxing agent inside solder matrix.
Embodiment 3
Referring to Fig. 7, wherein Fig. 7 a, Fig. 7 b and Fig. 7 c are a kind of two-sided schematic diagram containing protrusion of preformed soldering.
Fig. 7 a, Fig. 7 b and the modification that Fig. 7 c are embodiment 1 (Fig. 5 a, Fig. 5 b and Fig. 5 c) in the present embodiment.Difference lies in this
Embodiment is equipped with protrusion, and protrusion shape, size, arrangement mode phase on two surfaces on two surfaces of weld tabs
Together.
In some other embodiment, it is described as bonvex prism in 7a it is corrugated can also be by groove or pit formation;Institute
State weld tabs can also by roll roll forming, or also can with other machinery (such as weld tabs ontology is prepared respectively with protrusion, then is led to
Cross default card slot or hole etc., assemble) or chemical (such as chemical etching, spraying plating) method molding.The global shape of weld tabs
Squarely, circle, annular, frame shape, bar shaped etc. can be done.
In some other embodiment, the cross sectional shape of the fin or groove can also be square, rectangle, ladder
Shape, triangle, U-shaped etc..
In some other embodiment, the protrusion height and/or recessed portion depth, between fin, groove or pit
Spacing, a fixed value, regular uniform can be kept to be arranged on weld tabs, can also the different protrusion of simultaneous selection
Height and/or recessed portion depth, different distance values (as shown in Figure 7 c) or even intersection (as shown in Figure 7b), it is irregular uneven
Be distributed in weld tabs surface.
In some other embodiment, the preformed soldering be also an option that tinbase, indium base, bismuthino, zinc-base, antimony base,
Any of which such as silver-based, copper-based, aluminium base solder can also be tinbase, lead base, indium as weld tabs made of alloy material
Two or more arbitrary alloy material in the solders such as base, bismuthino, zinc-base, antimony base, silver-based, copper-based, aluminium base, with arbitrary proportion
Preformed soldering made of MULTILAYER COMPOSITE.
In some other embodiment, the internal structure of the preformed soldering, can be inside solder with metal or
The compound preformed soldering of nonmetallic net or silk, or in solder matrix containing metal or non-metallic particle it is compound it is pre- at
Type weld tabs.
In some other embodiment, the weld tabs can also be the preformed soldering that surface is not coated with scaling powder, or
Person is the preformed soldering containing fluxing agent inside solder matrix.
Embodiment 4
It is a kind of preformed soldering two-sided schematic diagram (left side) and its sectional view (right side) containing protrusion referring to Fig. 8.
Fig. 8 is the modification of Fig. 6 in embodiment 2 in the present embodiment.It is equal on two surfaces of weld tabs that difference lies in the present embodiment
Equipped with protrusion, and the protrusion shape on two surfaces, arrangement mode are identical, and size is different.
In some other embodiment, the protrusion can also be that (top far from weld tabs ontology is one flat to boss
Face);The weld tabs can also by punching machine punch forming, or also can with other machinery (such as weld tabs ontology is made respectively with protrusion
It is standby, then by presetting card slot or hole etc., assemble) or chemical (such as chemical etching, spraying plating) method molding.Weld tabs it is whole
Shape can do squarely, circle, annular, frame shape, bar shaped etc..
In some other embodiment, the boss top surface shape can be square, rectangle, triangle, circle, ladder
Shape etc..
In some other embodiment, the height and/or spacing of the salient point or boss can keep a fixed value,
Regular uniform is arranged on weld tabs, can also simultaneous selection different height and/or distance values, irregular non-uniform distribution
On weld tabs surface.
In some other embodiment, the preformed soldering be also an option that lead base, indium base, bismuthino, zinc-base, antimony base,
Any of which such as silver-based, copper-based, aluminium base solder can also be tinbase, lead base, indium as weld tabs made of alloy material
Two or more arbitrary alloy material in the solders such as base, bismuthino, zinc-base, antimony base, silver-based, copper-based, aluminium base, with arbitrary proportion
Preformed soldering made of MULTILAYER COMPOSITE.
In some other embodiment, the internal structure of the preformed soldering, can be inside solder with metal or
The compound preformed soldering of nonmetallic net or silk, or in solder matrix containing metal or non-metallic particle it is compound it is pre- at
Type weld tabs.
In some other embodiment, the weld tabs can also be the preformed soldering that surface is not coated with scaling powder, or
Person is the preformed soldering containing fluxing agent inside solder matrix.
Embodiment 5
Referring to Fig. 9, the schematic diagram (two-sided shape is different) of two-sided protrusion is contained for a kind of preformed soldering, wherein one side
It is the rib of protrusion, is salient point on one side.
Preformed soldering in the embodiment can be understood as in the weld tabs surface and embodiment 2 of (Fig. 5 a) in embodiment 1
The combination on the weld tabs surface of (Fig. 6).
The preformed soldering in the present embodiment is that tinbase and copper-based alloy material press 6:1 MULTILAYER COMPOSITE rolls or punching
It presses.
The preformed soldering is the preformed soldering that surface coats fluxing agent.
In some other embodiment, the preformed soldering be also an option that tinbase, lead base, indium base, bismuthino, zinc-base,
Any of which such as antimony base, silver-based, copper-based, aluminium base solder can also be tin as preformed soldering made of alloy material
Two or more arbitrary alloy material in the solders such as base, lead base, indium base, bismuthino, zinc-base, antimony base, silver-based, copper-based, aluminium base,
With preformed soldering made of arbitrary proportion MULTILAYER COMPOSITE.
In some other embodiment, the internal structure of the preformed soldering, can be inside solder with metal or
The compound preformed soldering of nonmetallic net or silk, or in solder matrix containing metal or non-metallic particle it is compound it is pre- at
Type weld tabs.
In some other embodiment, the weld tabs can also be the preformed soldering that surface is not coated with scaling powder, or
Person is the preformed soldering containing fluxing agent inside solder matrix.
In above-described embodiment 1-5, groove, pit and protrusion are all in contrast, to there is protrusion, and prominent place can not manage
Solution is groove or pit, such as Fig. 5 a, Fig. 7 a, Fig. 9 etc., both can be understood as the schematic diagram of protrusion, it is understood that is groove
Schematic diagram, therefore herein no longer individually increase attached drawing, that is, related text explanation.
The detection experiment of 1 preformed soldering void fraction of the present invention of experimental example
Detect sample:It is commercially available it is two-sided be plane weld tabs and the embodiment of the present invention 1 contain protrusion, another side on one side
For the weld tabs of plane.
Sample basic condition and experimentation:
Solder compositions:Sn63Pb37 (referred to as 6337)
Weld tabs size:(single side contains the weld tabs of protrusion, the weight of same size and plain film to 38.5*31.5*0.2mm
Unanimously, ensure that the consistency of thickness of weld seam after welding, protrusion height are 0.09mm).
Surface is coated with identical scaling powder, and (weld tabs that plain film and single side contain protrusion) scaling powder content is 1%.
It is soldered material:2mm thickness no-oxygen copper plates,
Welding manner:Preformed soldering is pressed from both sides among two pieces of 2mm thickness no-oxygen copper plates, carries out reflow soldering.
Detect void fraction equipment:Supersonic reflectoscope.
Commercially available two-sided planar weld tabs and the single side of the embodiment of the present invention 1 contain each 20 of the weld tabs of protrusion, are respectively adopted
Above-mentioned welding manner welds above-mentioned soldered material.Then each weld tabs is detected respectively using supersonic reflectoscope to be welded
Product void fraction, record, calculate each cell mean.It the results are shown in Table 1.
1 embodiment 1 of table and comparative example testing result
In order to more intuitively indicate welding void fraction Comparative result, Fig. 1 and Fig. 2 are respectively that plain film and single side contain protrusion
Weld tabs, ultrasound examination void fraction comparison diagram after welding, wherein Fig. 1 be existing flat sheet welded after ultrasound examination void fraction
Figure, Fig. 2 are ultrasound examination void fraction figure after the preformed soldering (single side contains protrusion) of the present invention welds.In Fig. 1 and Fig. 2
White portion indicates that welding vacuole, black portions indicate that welding is good.Comparison is it will be evident that the sky that the weld tabs of the present invention welds
Bubble is considerably less than the plain film of the prior art.
The detection experiment of 2 preformed soldering void fraction of the present invention of experimental example
Detect sample:Commercially available two-sided planar weld tabs and the two-sided of the embodiment of the present invention 4 are equipped with salient point (protrusion) weld tabs.
Sample basic condition and experimentation:
Solder compositions:Sn96.5Ag3Cu0.5 (referred to as SAC305)
Weld tabs size:38.5*31.5*0.25mm (the two-sided weld tabs equipped with salient point, the weight of same size and plain film
Unanimously, ensure the consistency of thickness of weld seam after welding, both sides bump height is 0.07mm).
Surface is coated with identical scaling powder, and (plain film and the two-sided weld tabs equipped with salient point) scaling powder content is 2%.
It is soldered material:2mm thickness no-oxygen copper plates,
Welding manner:Preformed soldering is pressed from both sides among two pieces of 2mm thickness no-oxygen copper plates, carries out reflow soldering.
Detect void fraction equipment:Supersonic reflectoscope.
Commercially available two-sided planar weld tabs and the two-sided weld tabs equipped with salient point of the embodiment of the present invention 4 20, are respectively adopted
Welding manner is stated to weld above-mentioned soldered material.Then detect what each weld tabs was welded respectively using supersonic reflectoscope
The void fraction of product, record, calculates each cell mean.It the results are shown in Table 2.
2 embodiment 4 of table and comparative example testing result
In order to more intuitively indicate welding void fraction Comparative result, Fig. 3 and Fig. 4 are respectively plain film and two-sided are equipped with salient point
Ultrasound examination void fraction comparison diagram after the preformed soldering welding of (protrusion), wherein Fig. 3 are ultrasound after existing flat sheet welded
Wave detects void fraction figure, and Fig. 4 is ultrasound examination vacuole after the preformed soldering (two-sided to be equipped with salient point weld tabs) of the present invention welds
Rate figure.White portion indicates that welding vacuole, black portions indicate that welding is good in Fig. 3 and Fig. 4.Comparison is it will be evident that this hair
The vacuole of bright weld tabs welding is considerably less than the plain film of the prior art.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of preformed soldering, which is characterized in that be provided with the protrusion at multiple intervals at least one surface of the weld tabs
The recessed portion in portion and/or interval.
2. preformed soldering according to claim 1, which is characterized in that a determining deviation is:0.1-100mm.
3. preformed soldering according to claim 1, which is characterized in that the peak on the preformed soldering surface and most
The distance of low spot is:0.005-5mm.
4. preformed soldering according to claim 1, which is characterized in that the quantity of the protrusion or recessed portion is at least
2.
5. preformed soldering according to claim 1, which is characterized in that the protrusion includes fin, salient point or boss.
6. preformed soldering according to claim 1, which is characterized in that the recessed portion includes groove, pit.
7. preformed soldering according to claim 1, which is characterized in that the preformed soldering is tinbase, lead base, indium
At least one of base, bismuthino, zinc-base, antimony base, silver-based, copper-based, acieral.
8. preformed soldering according to claim 1, which is characterized in that the protrusion or recessed on the preformed soldering surface
The cross sectional shape of concave portion is square, rectangle, trapezoidal, triangle, U-shaped or sector.
9. preformed soldering according to claim 1, which is characterized in that the preformed soldering is inside solder with gold
Belong to or the compound preformed soldering or solder matrix of nonmetallic net or silk in it is compound pre- containing metal or non-metallic particle
It is molded weld tabs.
10. according to preformed soldering described in any one of claim 1-9, which is characterized in that the preformed soldering is whole
Shape is rectangular, round, arc, annular, frame shape or bar shaped.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810556267.7A CN108788509A (en) | 2018-06-01 | 2018-06-01 | A kind of preformed soldering |
US16/978,197 US11207748B2 (en) | 2018-06-01 | 2018-09-06 | Solder preform |
EP18920829.1A EP3744470A4 (en) | 2018-06-01 | 2018-09-06 | Solder preform |
PCT/CN2018/104382 WO2019227756A1 (en) | 2018-06-01 | 2018-09-06 | Solder preform |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111451666A (en) * | 2020-05-01 | 2020-07-28 | 贤阳汇聚精密科技(苏州)有限公司 | Preforming soldering lug |
CN113118661A (en) * | 2021-03-05 | 2021-07-16 | 广州汉源新材料股份有限公司 | Preformed soldering lug and preparation method thereof |
CN114245763A (en) * | 2019-08-22 | 2022-03-25 | 恩德莱斯和豪瑟尔欧洲两合公司 | Component that can be soldered using SMD technology and method for producing a component that can be soldered using SMD technology |
CN116275681A (en) * | 2023-01-17 | 2023-06-23 | 广州汉源新材料股份有限公司 | Composite soldering lug and preparation method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090001138A1 (en) * | 2007-06-26 | 2009-01-01 | Advanced Micro Devices, Inc. | Method for preventing void formation in a solder joint |
CN202726328U (en) * | 2012-08-09 | 2013-02-13 | 四川飞龙电子材料有限公司 | Silver alloy sheet reshaped with embossing and used for welding |
CN202984929U (en) * | 2012-12-28 | 2013-06-12 | 汕尾市栢林电子封装材料有限公司 | Pre-forming soldering lug |
CN104625461A (en) * | 2014-12-30 | 2015-05-20 | 株洲南车时代电气股份有限公司 | High-performance preformed soldering lug and soldering method thereof |
CN107309571A (en) * | 2017-08-08 | 2017-11-03 | 深圳市亿铖达工业有限公司 | A kind of preformed soldering |
-
2018
- 2018-06-01 CN CN201810556267.7A patent/CN108788509A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090001138A1 (en) * | 2007-06-26 | 2009-01-01 | Advanced Micro Devices, Inc. | Method for preventing void formation in a solder joint |
CN202726328U (en) * | 2012-08-09 | 2013-02-13 | 四川飞龙电子材料有限公司 | Silver alloy sheet reshaped with embossing and used for welding |
CN202984929U (en) * | 2012-12-28 | 2013-06-12 | 汕尾市栢林电子封装材料有限公司 | Pre-forming soldering lug |
CN104625461A (en) * | 2014-12-30 | 2015-05-20 | 株洲南车时代电气股份有限公司 | High-performance preformed soldering lug and soldering method thereof |
CN107309571A (en) * | 2017-08-08 | 2017-11-03 | 深圳市亿铖达工业有限公司 | A kind of preformed soldering |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114245763A (en) * | 2019-08-22 | 2022-03-25 | 恩德莱斯和豪瑟尔欧洲两合公司 | Component that can be soldered using SMD technology and method for producing a component that can be soldered using SMD technology |
US11901149B2 (en) | 2019-08-22 | 2024-02-13 | Endress+Hauser SE+Co. KG | Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology |
CN111451666A (en) * | 2020-05-01 | 2020-07-28 | 贤阳汇聚精密科技(苏州)有限公司 | Preforming soldering lug |
CN113118661A (en) * | 2021-03-05 | 2021-07-16 | 广州汉源新材料股份有限公司 | Preformed soldering lug and preparation method thereof |
CN113118661B (en) * | 2021-03-05 | 2022-04-05 | 广州汉源新材料股份有限公司 | Preformed soldering lug and preparation method thereof |
CN116275681A (en) * | 2023-01-17 | 2023-06-23 | 广州汉源新材料股份有限公司 | Composite soldering lug and preparation method thereof |
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