CN108772565A - A kind of the metal injection filler and its application method of room temperature self-curing - Google Patents
A kind of the metal injection filler and its application method of room temperature self-curing Download PDFInfo
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- CN108772565A CN108772565A CN201810693972.1A CN201810693972A CN108772565A CN 108772565 A CN108772565 A CN 108772565A CN 201810693972 A CN201810693972 A CN 201810693972A CN 108772565 A CN108772565 A CN 108772565A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
- B22F3/225—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip by injection molding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/105—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing inorganic lubricating or binding agents, e.g. metal salts
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Abstract
The invention discloses a kind of metal injection filler of room temperature self-curing and its application method, the metal injection filler is metal mixture, is in thick at room temperature；Its composition includes：Fusing point 30 degrees Celsius of low-melting-point metals below, fusing point 500 degrees Celsius or more metal powder, fusing point is in 30 degrees Celsius or more of the low-melting-point metal and the alloy reactant of the metal powder；Wherein, mass fraction 20%-36% of the metallic element in the metal powder in the metal mixture.Metal injection filler in the present invention can be in liquid condition or lotion state under room temperature state, realize casting.And without the techniques such as heating, being sintered, passes through alloy reaction at room temperature and realize self-curing.Whole injection molding processs are convenient and safe without heating.And material is all made of metal, and electric conductivity, thermal conductivity are good, can be used for manufacturing complex-shaped and need conductive, heat conduction device.
Description
Technical field
The invention belongs to the metal injection fillers and its user of packing technique field more particularly to a kind of room temperature self-curing
Method.
Background technology
Casting refers to being injected into the die cavity of Guan Bi mould after plastics are plasticized in injection molding machine heating cylinder and forming system
The plastic working method of product.This method can process complex contour, accurate size or the product with inserts, and production efficiency is high.Using note
Most of material of mold forming is thermoplastic and certain thermosetting plasticses, therefore casting also tends to be referred to as being molded into
Type.
Traditional injection molding material is organic plastics, also has new research that metal material is used for casting, mainly
Method is metal dust slurry casting and molten metal casting.The former be by metal powder be mixed in organic solvent,
Mixing liquid or lotion are made in liquid glass or other bonding agents, is allowed to solid using curing process such as sintering again after casting
Chemical conversion type；The latter is by casting, cooled and solidified after metal molten, is substantially exactly improved metal casting.
No matter the materials such as plastics or metal, be required to heat in the process of casting, and plastics and add
Add the metal powder of bonding agent that cannot reach good conductive, heat-conducting effect.
Invention content
In view of this, it is an object of the invention to propose a kind of metal injection filler of room temperature self-curing, it is existing to solve
There is the problem of injection molding needs additional heating in technology.
In some illustrative embodiments, the metal injection filler of the room temperature self-curing, the metal injection filler are
Metal mixture is in thick at room temperature；Its composition includes：Fusing point is in 30 degrees Celsius of low-melting-point metals below, fusing point
In the low-melting-point metal at 30 degrees Celsius or more of 500 degrees Celsius or more of metal powders, fusing point and the metal powder
Alloy reactant；Wherein, mass fraction 20%- of the metallic element in the metal powder in the metal mixture
36%.
In some optionally embodiment, the fusing point 30 degrees Celsius of low-melting-point metals below include following one or
Arbitrary combination：Gallium simple substance and gallium-base alloy.
In some optionally embodiment, the fusing point 500 degrees Celsius or more of metal powder include following one or
Arbitrary combination：Iron powder and nickel powder.
In some optionally embodiment, the alloy reactant is using the fusing point in 30 degrees Celsius of low melting points below
Metal and the fusing point are generated in 500 degrees Celsius or more of metal powder in milling atmosphere.
In some optionally embodiment, the milling atmosphere includes following ball milling parameter：Rotational speed of ball-mill is 600-
1000 revs/min；Ball-milling Time is 20-90 minutes.
In some optionally embodiment, the powder size of the metal powder is 1 μm -75 μm.
In some optionally embodiment, the fusing point of selection is gallium-indium alloy in 30 degrees Celsius of low-melting-point metals below；
Wherein, the gallium for 75%-85%, the indium of 15%-25% are matched；The fusing point of selection is in 1000 degrees Celsius or more of metal powder
Nickel powder；Wherein, mass fraction of the nickel powder in its mixture with gallium-indium alloy is 25%-30%；The alloy generated is anti-
It includes following one or arbitrary combination to answer object：Ni2Ga3、NiGa5、Ni3Ga7And InNi3。
In some optionally embodiment, the fusing point of selection is gallium-indium alloy in 30 degrees Celsius of low-melting-point metals below；
Wherein, the gallium for 75%-85%, the indium of 15%-25% are matched；The fusing point of selection is in 1000 degrees Celsius or more of metal powder
Iron powder and nickel powder；Wherein, iron powder is 3%-5% in its mass fraction with nickel powder, in the mixture of gallium-indium alloy, and nickel powder is at it
With iron powder, gallium-indium alloy mixture in mass fraction be 22%-28%；Generate the alloy reactant include it is following it
One or arbitrary combination：FeGa3、NiGa4、NiGa5、Ni3Ga7And InNi3。
It is another object of the present invention to propose a kind of application method of the metal injection filler of room temperature self-curing.
In some illustrative embodiments, the application method of the metal injection filler of the room temperature self-curing, including：It determines
Injection molded container；The metal injection filler of room temperature self-curing as described in any one of the above embodiments is perfused in the way of pressure or machinery
Into in the injection molded container；It waits for completing solidification within 4-8 hours at room temperature.
In some optionally embodiment, by way of ultrasound, heating or logical DC current, accelerate self-curing.
In some optionally embodiment, it is described in the way of pressure or machinery by room temperature as described in any one of the above embodiments
Before the metal injection filler of self-curing is poured into the injection molded container, further include：By the metal injection filler from refrigeration
Solid state restores to room temperature viscous pasty state.
Compared with prior art, the present invention has following advantage：
Metal injection filler in the present invention can be injection molded as under room temperature state in liquid condition or lotion state, realization
Type.And without the techniques such as heating, being sintered, passes through alloy reaction at room temperature and realize self-curing.All it is injection molded as
Type process is convenient and safe without heating.And material is all made of metal, and electric conductivity, thermal conductivity are good, can be used for manufacturing shape
It is complicated and need conductive, heat conduction device.
Description of the drawings
Fig. 1 is the process for using figure of the metal injection filler in the embodiment of the present invention.
Specific implementation mode
The following description and drawings fully show specific embodiments of the present invention, to enable those skilled in the art to
Put into practice them.Other embodiments may include structure, logic, it is electrical, process and other change.Embodiment
Only represent possible variation.Unless explicitly requested, otherwise individual components and functionality is optional, and the sequence operated can be with
Variation.The part of some embodiments and feature can be included in or replace part and the feature of other embodiments.This hair
The range of bright embodiment includes equivalent obtained by the entire scope of claims and all of claims
Object.Herein, these embodiments of the invention can individually or generally be indicated that this is only with term " invention "
For convenience, it and if in fact disclosing the invention more than one, is not meant to automatically limit ranging from appointing for the application
What single invention or inventive concept.
Various embodiments of the present invention can be understood faster for the ease of those skilled in the art, at this to the main of the present invention
Thought is briefly described：
As what is illustrated in background technology, lacking one kind in the prior art can be converted by liquid at ambient temperature
Solid metal material.Based on this, present invention discover that using be in a liquid state at room temperature low-melting-point metal (also known as liquid metal or
Fusible metal) it carries out incomplete local alloy with refractory metal powder and reacts, it is anti-higher than the alloy of room temperature to generate fusing point
Object is answered, the metal mixture of low-melting-point metal, refractory metal and alloy reactant is formed it into while having, due to closing
Gold reaction is incomplete, and the low-melting-point metal in metal mixture obtained is still presented liquid condition, so the metal of liquid with it is solid
Thick metal mixture can be obtained in the metal powder mixing of state, while also having the alloy reaction of the two in the metal mixed
Object, the alloy reactant will be used as nucleation point, lure that the low-melting-point metal not reacted is not applying it with refractory metal into
Alloy reaction is voluntarily carried out under its external condition, until reaching complete reaction.Low-melting-point metal in metal mixture at this time
Content lowers, and the content of alloy reactant increases, and external imagery is that metal mixture is converted to solid gold by viscous liquid
Belong to.
In conclusion the invention discloses a kind of preparation method of the metal mixture of room temperature self-curing, the preparation method
For by fusing point 30 degrees Celsius of low-melting-point metals below and fusing point 500 degrees Celsius or more metal powder under certain condition
Uniformly mixing a period of time.Wherein, the certain condition meets the low-melting-point metal for making the part in mixing and partial
Alloy reaction occurs for the metal powder, generates alloy reactant of the fusing point at 30 degrees Celsius or more；After to be mixed, obtain
Simultaneously have the low-melting-point metal, metal powder and the two alloy reactant, in thick metal mixture.
In some embodiments, the certain condition includes：Mixing to the low-melting-point metal and the metal powder
Object provides the high energy for making it that alloy reaction locally occur；High energy in the embodiment of the present invention refers to promoting selected low melting point gold
Belong to the energy for reaching the condition that the two alloy reacts with refractory metal powder, which can be thermal energy (i.e. high temperature), also may be used
With the combination of thermal energy and mechanical energy (as squeezed, collision, deforming, energy caused by movement).
Specifically, the present invention provides following several mixture offers to the low-melting-point metal and the metal powder and makes
The mode of the high energy of alloy reaction locally occurs in it：
1. traditional heating；
Such as temperature is heated to the fusing point of metal powder, make its fusing, low-melting-point metal is in metal powder at this time
Liquid, mutual metal infiltration phenomenon is apparent between the two, and the two is easier to that alloy reaction, but environment temperature pole at this time occurs at this time
Height, alloy reaction speed is fast, need to control high-temperature time in the two complete reaction time hereinafter, to ensure that part only occurs for the two
Alloy reacts, to avoid leading to metal mixture premature cure due to reacting completely.The more difficult manipulation of this method reaction time.
2. high-voltage electric shock；
By the metal mixture (low-melting-point metal and metal powder) to two kinds of metals after evenly mixing, continue electricity
It hits, the temperature at electric shock drastically increases, and reaches the alloy reaction temperature condition of the two, and then generate alloy reactant, but the party
Method equipment requirement is high, needs additional safety guarantee equipment, manufacturing cost larger.
3. ball-milling treatment；
Ball-milling treatment is carried out to the metal mixture of the low-melting-point metal and the metal powder, in the ball of certain rotating speed
High energy, including thermal energy and mechanical energy can be generated in mill processing, transient temperature maximum can reach 1600 degrees Celsius or more,
The alloy reaction condition of various metals can be met, and its Energy distribution is uneven in ball-milling treatment, is more suitable for occurring incomplete
Alloy reacts, and prepares the metal mixture of the room temperature self-curing in the embodiment of the present invention.
Preferably, the metal mixture of the room temperature self-curing in the embodiment of the present invention is prepared using ball-milling treatment, at ball milling
Manage the ball milling method such as planetary ball mill, stirring ball-milling, wherein during the ball-milling treatment：Rotational speed of ball-mill is 600-
2000 revs/min；Ball-milling Time is 10-300 minutes.
Fusing point in the embodiment of the present invention can claim normal temperature liquid metal in 30 degrees Celsius of low-melting-point metals below, packet
It includes：Gallium simple substance, meet fusing point 30 degrees Celsius of gallium-base alloy and gallium simple substance and gallium-base alloy below mixture.Wherein,
Gallium-base alloy refers to the metal alloy that main component is gallium in the alloy, such as gallium-indium alloy, gallium tin alloy and or gallium indium base
Alloy, gallium kamash alloy etc., mainly using gallium indium/gallium tin as main component in the alloy.More specifically, gallium indium tin also can be selected
Alloy.
Fusing point in the embodiment of the present invention may include zinc powder, copper powder, iron powder, nickel in 500 degrees Celsius or more of metal powder
One or more of powder combines.Preferably, in order to form higher melting-point alloy reactant, after improving metal mixture solidification
Temperature tolerance, fusing point can be selected in the embodiment of the present invention and may include copper powder, iron powder, nickel in 1000 degrees Celsius or more of metal powder
One or more of powder combines.In some other embodiments, fusing point in the embodiment of the present invention 1000 degrees Celsius with
On metal powder fusing point can also be selected in 1000 degrees Celsius of one kind contained above having in copper powder, copper powder, iron powder, nickel powder or
Several metal alloys or metal mixture.Preferably, metal of the fusing point in the embodiment of the present invention at 1000 degrees Celsius or more
Powder selects pure (avoiding impurity as possible) copper powder, iron powder, nickel powder.
In some embodiments, the powder size of the metal powder is 0.1 μm -75 μm.Preferably, the choosing of powder size
Selecting can be selected according to the practical application scene of metal mixture, powder size it is smaller then made of metal mixture it is sticky
Degree is lower, and the viscosity of the more big then manufactured metal mixture of powder size is higher.At some for having three-dimensional plasticity requirements
Application in, can be selected powder size at 30 μm -75 μm, so that metal mixture is had preferable plasticity.At some for more
In the application that high fluid behaviour requires, 0.1 μm -30 μm are can be selected, metal mixture is made to have preferable coating and flowing
Property.
In some embodiments, before generating the alloy reaction, the metal powder is in itself and the low-melting-point metal
Mixture in mass fraction be 8%-50%.Preferably, the ratio between metal powder and low-melting-point metal can be according to tool
Body selection pairing, such as gallium simple substance carry out hybrid reaction with iron powder, generate FeGa3, therefore the ratio of gallium simple substance and iron powder can be such as
3：1.In some embodiments, the ratio of metal powder and low-melting-point metal also can be not in strict accordance with the ratio in reactant chemical formula
Example mixing, also can reach the effect of the present invention.
For how selecting to match between low-melting-point metal and metal powder, several assembled schemes are provided herein：
1. fusing point selects gallium simple substance, metal of the fusing point at 500 degrees Celsius or more in 30 degrees Celsius of low-melting-point metals below
It is FeGa that powder, which selects iron powder, alloy reactant,3。
2. fusing point selects gallium-indium alloy, gold of the fusing point at 500 degrees Celsius or more in 30 degrees Celsius of low-melting-point metals below
It is Ni to belong to powder to select nickel powder, alloy reactant2Ga3、NiGa4、NiGa5、Ni3Ga7And InNi3In it is one or more.
3. fusing point selects gallium-indium alloy, gold of the fusing point at 500 degrees Celsius or more in 30 degrees Celsius of low-melting-point metals below
It is FeGa to belong to powder to select nickel powder and iron powder, alloy reactant3、Ni2Ga3、NiGa4、NiGa5、Ni3Ga7And InNi3In one
Kind is a variety of.
4. fusing point selects gallium-indium-tin alloy in 30 degrees Celsius of low-melting-point metals below, fusing point is at 500 degrees Celsius or more
It is FeGa that metal powder, which selects nickel powder, iron powder and zinc powder, alloy reactant,3、Ni2Ga3、NiGa4、NiGa5、Ni3Ga7、InNi3、
It is one or more in Sn-Zn.
5. fusing point selects gallium-indium alloy, gold of the fusing point at 500 degrees Celsius or more in 30 degrees Celsius of low-melting-point metals below
It is FeGa to belong to powder to select iron powder and copper powder, alloy reactant3With it is one or more in Cu-In.
Here, the present invention provides the assembled scheme of a variety of low-melting-point metals and metal powder, art technology should manage
Solution in addition to the assembled scheme that the example above illustrates, other assembled schemes also can be used, details are not described herein.
It is another object of the present invention to propose a kind of metal mixture of room temperature self-curing, to propose one kind at room temperature
The metal material of solid can be voluntarily changed into from liquid, which can be made using above-mentioned preparation method, also can be used existing
There are other preparation methods in technology to realize its preparation.
A kind of metal mixture of room temperature self-curing, it is integrally in thick at room temperature；Its composition includes：Fusing point is 30
Degree Celsius below low-melting-point metal, fusing point 500 degrees Celsius or more metal powder, fusing point is described in 30 degrees Celsius or more
The alloy reactant of low-melting-point metal and the metal powder.2-24 hours are converted into admittedly by thick at ambient temperature for it
Body.
Metal mixture prepared by the present invention voluntarily can be converted into solid from liquid at room temperature, and solid state is steady
Fixed to exist, for this characteristic makes metal mixture with demand, being applied to various conductive, heat conduction and other metallic characters needs
The field asked, operatively for, the use state of fluid can be applied to the necks such as coating, perfusion, filling, printing, printing
Domain, operational suitability are strong.In addition, the metal mixture prepared by the present invention can voluntarily cure at room temperature, set without additional
Standby, equipment requirement is low, and operation requires low, safe.
The metal mixture of room temperature self-curing in the embodiment of the present invention can be applied due to its characteristic of fluid, metallic character
In conductive field, shielding field, heat conduction field, and fire-retardant neck can be applied to according to the selection of mixed metallic particles (such as nickel)
Domain and corrosion-resistant field, and according to the viscosity of metal mixture, it is applied to plastotype field, coating coating field, printing printing
Field.Specifically, it can be kept more suitable according to low-melting-point metal therein and the selection of metal powder and the mode of content is adjusted
In each application direction.
Based on above-mentioned preparation method and metal mixture, the present invention herein proposes a kind of metal injection of room temperature self-curing and fills out
Material, the metal injection filler are metal mixture, are in thick at room temperature；Its composition includes：Fusing point is at 30 degrees Celsius
The low melting point of low-melting-point metal below, fusing point in 500 degrees Celsius or more of metal powder, fusing point at 30 degrees Celsius or more
The alloy reactant of metal and the metal powder；Wherein, the metallic element in the metal powder is in the metal mixture
In mass fraction 20%-36%.
Metal injection filler in the present invention can be injection molded as under room temperature state in liquid condition or lotion state, realization
Type.And without the techniques such as heating, being sintered, passes through alloy reaction at room temperature and realize self-curing.All it is injection molded as
Type process is convenient and safe without heating.And material is all made of metal, and electric conductivity, thermal conductivity are good, can be used for manufacturing shape
It is complicated and need conductive, heat conduction device.
In some embodiments, the fusing point includes following one or arbitrary group in 30 degrees Celsius of low-melting-point metals below
It closes：Gallium simple substance and gallium-base alloy.In some embodiments, the fusing point includes following in 500 degrees Celsius or more of metal powder
One of or arbitrary combination：Iron powder and nickel powder.
In some embodiments, the alloy reactant using the fusing point in 30 degrees Celsius of low-melting-point metals below and
The fusing point is generated in 500 degrees Celsius or more of metal powder in milling atmosphere.Wherein, the milling atmosphere includes as follows
Ball milling parameter：Rotational speed of ball-mill is 600-1000 revs/min；Ball-milling Time is 20-90 minutes.
In some embodiments, the powder size of the metal powder is 1 μm -75 μm.Preferably, the powder of metal powder
Size is 10 μm -25 μm
In some optionally embodiment, the fusing point of selection is gallium-indium alloy in 30 degrees Celsius of low-melting-point metals below；
Wherein, the gallium for 75%-85%, the indium of 15%-25% are matched；The fusing point of selection is in 1000 degrees Celsius or more of metal powder
Nickel powder；Wherein, mass fraction of the nickel powder in its mixture with gallium-indium alloy is 25%-30%；The alloy generated is anti-
It includes following one or arbitrary combination to answer object：Ni2Ga3、NiGa4、NiGa5、Ni3Ga7And InNi3。
In some optionally embodiment, the fusing point of selection is gallium-indium alloy in 30 degrees Celsius of low-melting-point metals below；
Wherein, the gallium for 75%-85%, the indium of 15%-25% are matched；The fusing point of selection is in 1000 degrees Celsius or more of metal powder
Iron powder and nickel powder；Wherein, iron powder is 3%-5% in its mass fraction with nickel powder, in the mixture of gallium-indium alloy, and nickel powder is at it
With iron powder, gallium-indium alloy mixture in mass fraction be 22%-28%；Generate the alloy reactant include it is following it
One or arbitrary combination：FeGa3、Ni2Ga3、NiGa4、NiGa5、Ni3Ga7And InNi3。
It is another object of the present invention to propose a kind of application method of the metal injection filler of room temperature self-curing, packet
It includes：
Step S11, injection molded container is determined；
Step S12, by the metal injection of room temperature self-curing as described in any one of the above embodiments in the way of pressure or machinery
Filler is poured into the injection molded container；
Step S13, it waits for completing solidification within 4-8 hours at room temperature.Wherein, the side of ultrasound, heating or logical DC current can be passed through
Formula accelerates self-curing.
In some embodiments, being stored in for the metal injection filler of the room temperature self-curing in the embodiment of the present invention -20 is taken the photograph
In the low temperature environment of -0 degree Celsius of family name's degree, it is cured phenomenon during use non-to avoid metal injection filler.Therefore, make
When with the metal injection filler taken out from low temperature environment, it is necessary first to which the metal injection filler is extensive from refrigeration solid state
Again to room temperature viscous pasty state.
Its whole phenomenon shows as being converted into liquid by solid, is then converted to solid.Wherein, first time phase transition phenomena be by
Restore to room temperature in temperature, the low-melting-point metal in metal mixture is gradually converted into liquid, and it is in viscous to make metal mixture integrally
Thick liquid, second of phase transition phenomena are the solidification phenomenons by being illustrated in the embodiment of the present invention.
It should also be appreciated by one skilled in the art that various illustrative logical boxs, mould in conjunction with the embodiments herein description
Electronic hardware, computer software or combinations thereof may be implemented into block, circuit and algorithm steps.In order to clearly demonstrate hardware and
Interchangeability between software surrounds various illustrative components, frame, module, circuit and step its function above and carries out
It is generally described.It is implemented as hardware as this function and is also implemented as software, depends on specific application and to entire
The design constraint that system is applied.Those skilled in the art can be directed to each specific application, be realized in a manner of flexible
Described function, it is still, this to realize that decision should not be construed as the protection domain away from the disclosure.
Claims (10)
1. a kind of metal injection filler of room temperature self-curing, which is characterized in that the metal injection filler is metal mixture,
It is in thick at room temperature；
Its composition includes：Fusing point 30 degrees Celsius of low-melting-point metals below, fusing point 500 degrees Celsius or more metal powder,
Fusing point is in 30 degrees Celsius or more of the low-melting-point metal and the alloy reactant of the metal powder；
Wherein, mass fraction 20%-36% of the metallic element in the metal powder in the metal mixture.
2. metal injection filler according to claim 1, which is characterized in that the fusing point is in 30 degrees Celsius of eutectics below
Point metal includes following one or arbitrary combination：
Gallium simple substance and gallium-base alloy；
The fusing point includes following one or arbitrary combination in 500 degrees Celsius or more of metal powder：
Iron powder and nickel powder.
3. metal injection filler according to claim 2, which is characterized in that the alloy reactant is existed using the fusing point
30 degrees Celsius of low-melting-point metals below and the fusing point are generated in 500 degrees Celsius or more of metal powder in milling atmosphere.
4. metal injection filler according to claim 3, which is characterized in that the milling atmosphere includes following ball milling ginseng
Number：
Rotational speed of ball-mill is 600-1000 revs/min；
Ball-milling Time is 20-90 minutes.
5. metal injection filler according to claim 3, which is characterized in that the powder size of the metal powder be 1 μm-
75μm。
6. metal injection filler according to claim 3, which is characterized in that the fusing point of selection is below low at 30 degrees Celsius
Melting point metals are gallium-indium alloy；Wherein, the gallium for 75%-85%, the indium of 15%-25% are matched；
The fusing point of selection is nickel powder in 1000 degrees Celsius or more of metal powder；Wherein, mixing of the nickel powder in itself and gallium-indium alloy
Mass fraction in object is 25%-30%；
The alloy reactant generated includes following one or arbitrary combination：
Ni2Ga3、NiGa5、Ni3Ga7And InNi3。
7. metal injection filler according to claim 3, which is characterized in that the fusing point of selection is below low at 30 degrees Celsius
Melting point metals are gallium-indium alloy；Wherein, the gallium for 75%-85%, the indium of 15%-25% are matched；
The fusing point of selection is iron powder and nickel powder in 1000 degrees Celsius or more of metal powder；Wherein, iron powder is in itself and nickel powder, gallium indium
Mass fraction in the mixture of alloy is 3%-5%, and nickel powder is in its mass fraction with iron powder, in the mixture of gallium-indium alloy
For 22%-28%；
The alloy reactant generated includes following one or arbitrary combination：
FeGa3、Ni2Ga3、NiGa5、Ni3Ga7And InNi3。
8. a kind of application method of the metal injection filler of room temperature self-curing, which is characterized in that including：
Determine injection molded container；
By the filling of the metal injection filler of such as claim 1-7 any one of them room temperature self-curing in the way of pressure or machinery
It notes into the injection molded container；
It waits for completing solidification within 4-8 hours at room temperature.
9. application method according to claim 8, which is characterized in that by way of ultrasound, heating or logical DC current,
Accelerate self-curing.
10. application method according to claim 8, which is characterized in that it is described by pressure or machinery in the way of will as power
Before profit requires the metal injection filler of 1-7 any one of them room temperature self-curings to be poured into the injection molded container, further include：
The metal injection filler is restored from refrigeration solid state to room temperature viscous pasty state.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1069879A (en) * | 1992-07-18 | 1993-03-17 | 西安交通大学 | Dental body filled with gallium alloy material |
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| CN103184381A (en) * | 2013-02-20 | 2013-07-03 | 中国科学院电工研究所 | Liquid gallium alloy and preparation method thereof |
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| CN107274965A (en) * | 2017-07-03 | 2017-10-20 | 云南科威液态金属谷研发有限公司 | Electric slurry and its manufacture method based on low-melting-point metal micro-nano powder |
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| CN1069879A (en) * | 1992-07-18 | 1993-03-17 | 西安交通大学 | Dental body filled with gallium alloy material |
| JP2002008443A (en) * | 2000-06-26 | 2002-01-11 | Tokuriki Honten Co Ltd | Thermal hardening type low resistance conductive paste |
| CN103184381A (en) * | 2013-02-20 | 2013-07-03 | 中国科学院电工研究所 | Liquid gallium alloy and preparation method thereof |
| CN104140786A (en) * | 2013-05-09 | 2014-11-12 | 中国科学院理化技术研究所 | Composite phase-change thermal storage material |
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| CN105838333A (en) * | 2016-04-05 | 2016-08-10 | 中国科学院深圳先进技术研究院 | Phase change alloy thermal interface composite material and preparation method thereof |
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