CN108770242A - One kind being used for the corrosion inhibitor legal system on copper foil and makees the later half potting circuit method of fine-line - Google Patents
One kind being used for the corrosion inhibitor legal system on copper foil and makees the later half potting circuit method of fine-line Download PDFInfo
- Publication number
- CN108770242A CN108770242A CN201810703306.1A CN201810703306A CN108770242A CN 108770242 A CN108770242 A CN 108770242A CN 201810703306 A CN201810703306 A CN 201810703306A CN 108770242 A CN108770242 A CN 108770242A
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- Prior art keywords
- circuit
- copper
- foil
- prepreg
- line
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
It being used for the corrosion inhibitor legal system on copper foil the invention discloses one kind and making the later half potting circuit method of fine-line, includes the following steps：S01 makes foil carriers and controls deep etched circuit on copper foil；S02, etching copper-clad plate make core material；S03 rushes location hole to core material and foil carriers；S04, by the foil carriers after etching, core material carries out brown processing；S05 is sent into press and is pressed；S06, the hardness supporting layer dismantled on foil carriers；S07 drills to plank, drying-plate after drilling；S08 is sent into the heavy copper plating again of heavy copper plating line elder generation removing glue；S09 carries out patch photosensitive dry film → exposure → development → circuit etching successively；Whether S10 has out short circuit with automated optical inspection scanning outer-layer circuit；S11, print green oil are surface-treated again.One kind provided by the invention is used for the corrosion inhibitor legal system on copper foil and makees the later half potting circuit method of fine-line, and circuit is made to become more fine, it can be achieved that making the effect of more multi-line is with circuit crosstalk is reduced in equal area.
Description
Technical field
The present invention relates to one kind on copper foil corrosion inhibitor legal system make the later half potting circuit method of fine-line, belong to printing
Wiring board art.
Background technology
The type of PCB has a multi-layer board at present, and production process is " internal layer circuit → will be each to be made on CCL (copper-clad plate)
A internal layer CCL (copper-clad plate)+PP (prepreg)+copper foil is press-fitted together as one → drills on pressing body or laser drilling → heavy copper
Circuit is made again on the copper foil of plating → after the plating of pressing body ", according to the number of plies above-mentioned flow → print green oil → table repeatedly
Surface treatment.Copper foil is located at the outside of pressing body in production process, and the copper thickness that multi-layer board uses is mostly for 1oz (35um), H
oz(17um).But copper foil layers of copper after flow is electroplated by heavy copper thickens in this flow, and wherein multi-layer board is using 1oz copper foils as base copper
Plating after thickness increase to 50-60um, HDI or ELIC with H oz, T oz copper foils be base copper plating after thickness become 20-
35um.Since the increase of copper layer thickness causes this flow that can not make the fine-line that line width line-spacing L and line-spacing S is less than 30um.
Since thickness increases copper foil after plating, the lateral erosion exacerbation of circuit etching, line width (W in etching process2)
It is restricted, circuit spacing (S) becomes smaller.In addition some technologies use thinner copper foil, thick by controlling total copper after being electroplated
It spends to realize making fine rule road.But thin copper is not only expensive, and hardness is too small, thus needed in bonding processes carrier with
Pressing fold is prevented, while this technology can reduce the thermal conductivity of PCB since total copper thickness is excessively thin.
Invention content
To solve the deficiencies in the prior art, it is an object of the invention to the copper foils after overcoming tradition to be electroplated thicker to lead to line
The restricted defects of road L/S, provide a kind of copper thickness that can reduce plating on copper foil corrosion inhibitor method make it is fine
The later half potting circuit method of circuit.
In order to solve the above technical problems, the technical solution adopted by the present invention is：
One kind being used for the corrosion inhibitor legal system on copper foil and makees the later half potting circuit method of fine-line, includes the following steps：
S01 makes foil carriers and controls deep etched circuit on copper foil, specially：
1), prepare several prepregs, drag for and gone in prepreg after the made location hole in prepreg border direction
Between part, leave the prepreg frame side of closure；
2), prepare to be dragged for the identical hardness supporting layer of middle section size with prepreg；
3), first first prepreg frame is placed on copper foil, hardness supporting layer is then put into first semi-solid preparation
In piece frame side, one prepreg of covering is subsequently put on first prepreg frame side, then places on prepreg the
Two prepreg frame sides, then hardness supporting layer is placed in second prepreg frame side, copper foil is finally covered in second
On a prepreg frame side；
4) stacked body obtained in the previous step, is put into press pressing and makes foil carriers；
S02 carries out foil carriers to paste anti-photosensitive dry film, exposure, development, the deep etching making circuit of control successively；It covers simultaneously
Copper coin carries out patch photosensitive dry film, exposure, development, etching making circuit making core material successively；
S03 rushes location hole to core material and foil carriers, scans foil carriers and interior with automated optical inspection later
Layer core plate carries out open-short circuit, while being punched out to prepreg with perforating press；
S04, by the foil carriers after etching, core material carries out brown processing；
The prepreg of hole punch, core material and foil carriers core material are folded body after falling hot melt and put on rivet by S05
Or be sleeved on the steel disk with rivet, it is sent into press and is pressed；
S06, the plank that S05 has been pressed scan X-Ray, bore location hole, are milled according to the position fishing machine fishing of location hole
Fall prepreg frame side, the hardness supporting layer dismantled on foil carriers；
S07 drills to plank according to the position of positioning hole in S06, drying-plate after drilling；
Plank after drilling is carried out high-pressure washing, removes desmearing by S08, is sent into heavy copper plating line elder generation removing glue heavy copper electricity again
Plating；
S09 carries out patch photosensitive dry film → exposure → development → circuit etching successively；
Whether S10 has out short circuit with automated optical inspection scanning outer-layer circuit；
S11, print green oil are surface-treated again.
In S01, the thickness range for making foil carriers is 1.0~1.1mm.
The material of hardness supporting layer includes brown paper.
The mode to drill in S07 includes machine drilling or laser drilling.
Etching makes circuit in S01, and non-line section etches away 3/4 copper thickness.
In S01, the width on prepreg frame side is 3 inches.
Line levels are 3/4 copper thickness, retain 1/4 thickness of bottom copper.
Beneficial effects of the present invention：The present invention breaks traditional technological process, etched on copper foil after circuit again with
CCL, PP are press-fitted together as one, and control copper foil etch depth, and be embedded to PP by the circuit pack come is etched, it is thick only to retain native copper foil
The 1/4 of degree is on the surfaces dielectric layer PP, and total copper thickness still reduces 3/4 than the copper thickness of traditional technique, but at the same time not
The heat conductivility of PCB can be reduced.
Description of the drawings
Fig. 1 to Fig. 5 being used for the corrosion inhibitor legal system on copper foil for one kind of the present invention and making the later half potting circuit method of fine-line
Flow diagram of the middle step 1 to step 11；
Fig. 6 is the structure that traditional handicraft presses body in the prior art；
Fig. 7 is the structure for the pressing body that the present invention produces.
The invention will be further described below in conjunction with the accompanying drawings, and following embodiment is only used for clearly illustrating the present invention
Technical solution, and not intended to limit the protection scope of the present invention.
As shown in Fig. 1 to Fig. 5, flow is being electroplated by heavy copper in order to solve multiple-plate copper foil in the prior art in the present invention
Layers of copper thickens afterwards, and then causes this flow that can not make line width line-spacing L/S<The fine-line of 30um proposes a kind of in copper
Corrosion inhibitor legal system makees the later half potting circuit method of fine-line on foil, includes the following steps：
Step 1 makes foil carriers and makes circuit on copper foil, and copper thickness is widely used without limitation, especially may be used
Thick copper circuit density is increased to be applied to thick copper, the thickness range for making foil carriers is 1.0~1.1mm.
1), prepare several prepregs, drag for and gone in prepreg after the made location hole in prepreg border direction
Between part, leave the prepreg frame side of closure, the width on prepreg frame side is 3 inches；
2), prepare to be dragged for the identical hardness supporting layer of middle section size with prepreg；
3), first first prepreg frame is placed on copper foil, hardness supporting layer is then put into first semi-solid preparation
In piece frame side, one prepreg of covering is subsequently put on first prepreg frame side, then places on prepreg the
Two prepreg frame sides, then hardness supporting layer is placed in second prepreg frame side, copper foil is finally covered in second
On a prepreg frame side, the material of wherein hardness supporting layer includes brown paper；
4) stacked body obtained in the previous step, is put into press pressing and makes foil carriers；
Step 2 carries out copper foil load to paste anti-photosensitive dry film, exposure, development, etching making circuit, line levels 3/ successively
4 copper thicknesses retain bottom copper 1/4.Copper-clad plate simultaneously also carries out photosensitive dry film, exposure, development, etching making circuit making internal layer
Core plate.
Step 3 rushes location hole to core material and foil carriers, scans foil carriers with automated optical inspection later
And core material carries out open-short circuit, while prepreg is punched out with perforating press, position, size and core plate and copper foil
Carrier is consistent.
Step 4, by the foil carriers after etching, core material carries out brown processing；
The prepreg of hole punch, core material and foil carriers core material and copper foil load are folded and fall hot melt by step 5
Body puts on rivet or is sleeved on the steel disk with rivet afterwards, is sent into press and is pressed；
Step 6, the plank that step 5 has been pressed scan X-Ray, bore location hole, are dragged for according to the position fishing machine of location hole
Prepreg frame side is milled, the hardness supporting layer dismantled on foil carriers.
Step 7 drills to plank according to the position of positioning hole in step 6, the mode of drilling include machine drilling or
Person's laser drilling, drying-plate after drilling.
Plank after drilling is carried out high-pressure washing, removes desmearing by step 8, is sent into heavy copper plating line elder generation removing glue heavy copper again
Plating.
Step 9 carries out patch photosensitive dry film → exposure → development → circuit etching operation successively.It is etched according to customer requirement
Remove 1/4 face copper or the member-retaining portion circuit of selectivity；It then can the above flow repeatedly if it is HDI plates or ELIC plates is made.
Whether step 10 has out short circuit with automated optical inspection scanning outer-layer circuit.
Step 11, print green oil are surface-treated again.
As shown in fig. 6, the circuit of traditional PCB is in PP layers of outside, as shown in fig. 7, the present invention controls copper foil etching deeply
Degree, and will etch the circuit pack embedment PP come only retains the 1/4 of former copper thickness on the surfaces dielectric layer PP, so even if
Total copper thickness after heavy copper plating on the outside of PP still reduces 3/4 than the copper thickness of traditional technique, but at the same time will not drop
The heat conductivility of low PCB, (traditional handicraft presses body such as Fig. 6, and the present invention presses body such as Fig. 7).50- after former 1oz copper foils plating
60um outer-layer circuits are only capable of making L/S>The circuit of 100um/100um, but copper thickness 25-35um can after the plating of the invention 1oz copper foils
To make L/S<25um/25um circuits.30-50um is only capable of making L/S after former H oz copper foils plating>The circuit of 75um/75um, but
20-30um can make L/S after the plating of the method for the present invention H oz copper foils>The circuit of 10um/10um.H oz copper foils can be thus achieved
T oz copper foils with and micrometre grade thin copper foil circuit, it is not only significantly cost-effective, but also circuit is made to become more fine,
It may be implemented the effect of making more multi-line in equal area.
The above is only a preferred embodiment of the present invention, for those skilled in the art, exist
Without departing from the principles of the invention, several improvements and modifications can also be made, these improvements and modifications also should be regarded as this hair
Bright protection domain.
Claims (7)
1. one kind, which being used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line, it is characterised in that：Including following
Step：
S01 makes foil carriers and controls deep etched circuit on copper foil, specially：
1), prepare several prepregs, prepreg middle part is removed along fishing after the made location hole in prepreg border direction
Point, leave the prepreg frame side of closure；
2), prepare to be dragged for the identical hardness supporting layer of middle section size with prepreg；
3), first first prepreg frame is placed on copper foil, hardness supporting layer is then put into first prepreg frame
Bian Zhong subsequently puts one prepreg of covering on first prepreg frame side, then places second on prepreg
Prepreg frame side, then hardness supporting layer is placed in second prepreg frame side, copper foil is finally covered in second half
On cured sheets frame side；
4) stacked body obtained in the previous step, is put into press pressing and makes foil carriers；
S02 carries out foil carriers to paste anti-photosensitive dry film, exposure, development, the deep etching making circuit of control successively；Copper-clad plate simultaneously
Patch photosensitive dry film, exposure, development, etching making circuit making core material are carried out successively；
S03 rushes location hole to core material and foil carriers, scans foil carriers and internal layer core with automated optical inspection later
Plate carries out open-short circuit, while being punched out to prepreg with perforating press；
S04, by the foil carriers after etching, core material carries out brown processing；
Prepreg, core material and the copper foil load of hole punch are folded body after falling hot melt and put on rivet or be sleeved on rivet by S05
Steel disk on, be sent into press pressed；
S06, the plank that S05 has been pressed scan X-Ray, bore location hole, and half is milled according to the position fishing machine fishing of location hole
Cured sheets frame side, the hardness supporting layer dismantled on foil carriers；
S07 drills to plank according to the position of positioning hole in S06, drying-plate after drilling；
Plank after drilling is carried out high-pressure washing, removes desmearing by S08, is sent into the heavy copper plating again of heavy copper plating line elder generation removing glue；
S09 carries out patch photosensitive dry film → exposure → development → circuit etching successively；
Whether S10 has out short circuit with automated optical inspection scanning outer-layer circuit；
S11, print green oil are surface-treated again.
2. one kind according to claim 1, which is used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line,
It is characterized in that：In S01, the thickness range for making foil carriers is 1.0~1.1mm.
3. one kind according to claim 1, which is used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line,
It is characterized in that：The material of hardness supporting layer includes brown paper.
4. one kind according to claim 1, which is used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line,
It is characterized in that：The mode to drill in S07 includes machine drilling or laser drilling.
5. one kind according to claim 1, which is used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line,
It is characterized in that：Etching makes circuit in S01, and non-line section etches away 3/4 copper thickness.
6. one kind according to claim 1, which is used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line,
It is characterized in that：In S01, the width on prepreg frame side is 3 inches.
7. one kind according to claim 1, which is used for the corrosion inhibitor legal system on copper foil, makees the later half potting circuit method of fine-line,
It is characterized in that：In S02, line levels are 3/4 copper thickness, retain 1/4 thickness of bottom copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810703306.1A CN108770242B (en) | 2018-06-29 | 2018-06-29 | Method for manufacturing rear half-buried circuit of fine circuit on copper foil by corrosion reduction method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810703306.1A CN108770242B (en) | 2018-06-29 | 2018-06-29 | Method for manufacturing rear half-buried circuit of fine circuit on copper foil by corrosion reduction method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108770242A true CN108770242A (en) | 2018-11-06 |
| CN108770242B CN108770242B (en) | 2020-10-23 |
Family
ID=63975224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810703306.1A Active CN108770242B (en) | 2018-06-29 | 2018-06-29 | Method for manufacturing rear half-buried circuit of fine circuit on copper foil by corrosion reduction method |
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| Country | Link |
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| CN (1) | CN108770242B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114679849A (en) * | 2022-05-07 | 2022-06-28 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier and manufacturing method thereof |
| CN114885526A (en) * | 2022-03-31 | 2022-08-09 | 生益电子股份有限公司 | Method for manufacturing PCB with embedded circuit and PCB with embedded circuit |
| CN114940006A (en) * | 2022-05-07 | 2022-08-26 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier manufacturing method and copper foil carrier |
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| US20110114369A1 (en) * | 2009-11-16 | 2011-05-19 | Sang Youp Lee | Heat dissipating substrate and method of manufacturing the same |
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| CN107146781A (en) * | 2017-05-27 | 2017-09-08 | 华进半导体封装先导技术研发中心有限公司 | It is a kind of to have core plate structure and its manufacture method for the two-sided of BOT encapsulation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0955564A (en) * | 1995-08-11 | 1997-02-25 | Cmk Corp | Printed wiring board |
| US20110114369A1 (en) * | 2009-11-16 | 2011-05-19 | Sang Youp Lee | Heat dissipating substrate and method of manufacturing the same |
| CN102196668A (en) * | 2010-03-08 | 2011-09-21 | 宏恒胜电子科技（淮安）有限公司 | Method for manufacturing circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114885526A (en) * | 2022-03-31 | 2022-08-09 | 生益电子股份有限公司 | Method for manufacturing PCB with embedded circuit and PCB with embedded circuit |
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| CN114940006A (en) * | 2022-05-07 | 2022-08-26 | 湖南柳鑫电子新材料有限公司 | Copper foil carrier manufacturing method and copper foil carrier |
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|---|---|
| CN108770242B (en) | 2020-10-23 |
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