CN108769498B - Combinable photosensitive chip, camera module and electronic equipment - Google Patents
Combinable photosensitive chip, camera module and electronic equipment Download PDFInfo
- Publication number
- CN108769498B CN108769498B CN201810966335.7A CN201810966335A CN108769498B CN 108769498 B CN108769498 B CN 108769498B CN 201810966335 A CN201810966335 A CN 201810966335A CN 108769498 B CN108769498 B CN 108769498B
- Authority
- CN
- China
- Prior art keywords
- photosensitive
- chip
- sub
- chips
- bondable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 42
- 238000003491 array Methods 0.000 claims abstract description 32
- 230000002950 deficient Effects 0.000 claims abstract description 11
- 238000012545 processing Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 230000006870 function Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 108091008695 photoreceptors Proteins 0.000 description 16
- 238000010586 diagram Methods 0.000 description 12
- 230000002093 peripheral effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000003705 background correction Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000004382 visual function Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Human Computer Interaction (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The embodiment of the application discloses a combinable photosensitive chip, a camera module and electronic equipment. The photosensitive chip comprises at least two pixel arrays, at least two mutually independent integrated circuits and a combination frame, wherein the at least two pixel arrays are positioned on a substrate, and the at least two mutually independent integrated circuits are correspondingly and electrically connected with the pixel arrays; a nonfunctional area is arranged between two adjacent pixel arrays, the nonfunctional area comprises a cutting route, and the cutting route divides the photosensitive chip into at least two photosensitive sub-chips; at least two mutually independent integrated circuits for respectively reading and processing the image signals output by the corresponding pixel arrays; and the combined frame is used for splicing the photosensitive sub-chip and the rest photosensitive sub-chips after the defective photosensitive sub-chip is replaced by the photosensitive sub-chip matched with the cutting route. By the technical scheme, the production and calibration precision of the camera module in the multi-camera system is improved, and when one photosensitive sub-chip is damaged or has poor functions, the damaged or functional photosensitive sub-chip can be replaced.
Description
Technical Field
The embodiment of the application relates to a semiconductor device technology, in particular to a combinable photosensitive chip, a camera module and electronic equipment.
Background
Electronic equipment with a plurality of camera modules can control different cameras respectively and carry out different functions to make the picture of catching through the camera have more content and more clear, the formation of image is more exquisite, the color is more bright-colored.
However, in the related art, a multi-camera system having a plurality of camera modules is generally assembled by a bracket. As shown in fig. 1, the first camera module 10 and the second camera module 20 are assembled into a multi-camera system by the bracket 130. Each camera module comprises a photosensitive chip (140, 150) and a lens assembly (110, 120), wherein the lens assembly (110, 120) comprises a lens, a lens seat and a motor. The photosensitive chips (140, 150) are soldered to the circuit board 160, and the imaging areas (141, 151) on the photosensitive chips (140, 150) are located in the vertical projection areas of the lens assemblies (110, 120). Because of the module level assembly mode, the production and calibration precision requirements of the positions among the modules may not be met. Such as binocular ranging, image fusion, etc., the small distance or angle deviation will cause larger deviation to the final result.
Disclosure of Invention
The embodiment of the application provides a combinable photosensitive chip, a camera module and electronic equipment, which can optimize the design scheme of a multi-camera system in the related technology.
In a first aspect, embodiments of the present application provide a bondable photosensitive chip, including at least two pixel arrays on a substrate, at least two mutually independent integrated circuits correspondingly electrically connected to the pixel arrays, and a bonding frame;
a nonfunctional area is arranged between two adjacent pixel arrays, the nonfunctional area comprises a cutting route, the cutting route divides the photosensitive chip into at least two photosensitive sub-chips, and the cutting route is used for indicating a track for cutting the photosensitive chip;
the at least two mutually independent integrated circuits are used for respectively reading and processing the image signals output by the corresponding pixel arrays;
and the combination frame is used for splicing the photosensitive sub-chip and the rest photosensitive sub-chips after the defective photosensitive sub-chip is replaced by the photosensitive sub-chip matched with the cutting route.
In a second aspect, an embodiment of the present application further provides a camera module, where the camera module includes the bondable photosensitive chip according to the first aspect.
In a third aspect, an embodiment of the present application further provides an electronic device, where the electronic device has the camera module set in the second aspect.
The embodiment of the application provides a combinable photosensitive chip scheme, which comprises at least two pixel arrays, at least two mutually independent integrated circuits and a combination frame, wherein the at least two pixel arrays are positioned on a substrate, and the at least two mutually independent integrated circuits are correspondingly and electrically connected with the pixel arrays; a nonfunctional area is arranged between two adjacent pixel arrays, the nonfunctional area comprises a cutting route which divides the photosensitive chip into at least two photosensitive sub-chips, wherein the cutting route is used for indicating a track for cutting the photosensitive chip; and the combination frame is used for splicing the photosensitive sub-chip and the rest photosensitive sub-chips after the defective photosensitive sub-chip is replaced by the photosensitive sub-chip matched with the cutting route, so that the defective photosensitive sub-chip is replaced by the qualified photosensitive sub-chip, and the problem that the whole photosensitive chip corresponding to double shooting or multiple shooting cannot be used due to damage or defective functions of the single photosensitive sub-chip is avoided. By adopting the technical scheme of the embodiment of the application, the photosensitive chips which are not separated can be designed and produced on the same wafer in the process of preparing the photosensitive chips of the multi-camera system, and the production and calibration precision of each camera module in the multi-camera system is improved, so that the image effect is improved. And when one photosensitive sub-chip in the multi-camera system is damaged or has poor functions, the damaged or functional photosensitive sub-chip can be replaced without influencing the normal use of the multi-camera system, so that the yield of the photosensitive chip and the camera module is improved.
Drawings
FIG. 1 is a schematic diagram of a conventional dual camera system;
fig. 2 is a schematic structural diagram of a combinable photosensitive chip according to an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a frame for combining a photosensitive chip capable of being combined;
FIG. 4 is a schematic structural view of a bonding frame of another bondable photosensitive chip provided in the present application;
FIG. 5 is a block diagram of another embodiment of a combinable photosensitive chip;
fig. 6 is a schematic structural diagram of a camera module according to an embodiment of the present application;
fig. 7 is a block diagram of a structure of a smart phone according to an embodiment of the present application.
Detailed Description
The present application is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings.
It should be noted that, due to the continuous improvement of the semiconductor technology and the technological level, the Image Sensor (Image Sensor), also called as a photosensitive chip or a photosensitive element, is used as a basic device for obtaining visual information, and has wider and wider application because it can realize the obtaining, conversion and expansion of visual functions of information, and gives visual, multi-level and content-rich visual Image information. The most widely used solid-state image sensors in the related art mainly include Charge Coupled Device (CCD) image sensors and Complementary Metal Oxide Semiconductor (CMOS) image sensors. The photosensitive chip of the embodiment of the present application may be the above-described two types of image sensors.
Fig. 2 is a schematic structural diagram of a combinable photosensitive chip according to an embodiment of the present application. The photosensitive chip can replace damaged or poorly functioning photosensitive sub-chips by using good-quality photosensitive sub-chips by means of the combined frame.
It should be noted that, a plurality of photosensitive chips may be formed on the same wafer by using the semiconductor device manufacturing process, and dicing may be performed. The photosensitive chip comprises at least two pixel arrays and corresponding integrated circuits. In the semiconductor manufacturing process, at least two pixel arrays and corresponding integrated circuits are formed on the same wafer, so that the problems of high module level assembly difficulty and difficult debugging in the related art can be avoided. In the related art, the camera module of the multi-camera system is a plurality of photosensitive chips corresponding to a plurality of lenses, each camera has independent functions, and has no function sharing part, and as the chips are respectively positioned on the circuit boards, the placement angle and the inclination of each chip are different, and the difficulty of subsequent equipment and debugging can be increased.
The pixel array includes a plurality of pixel units including photodiodes and readout circuits. The pixel structure is illustrated with a CMOS image sensor. Depending on the pixel structure, it can be classified into a passive pixel sensor (Passive Pixel Sensor, PPS), an active pixel sensor (Active Pixel Sensor, APS), and a digital pixel sensor (Digital Pixel Sensor, DPS). The photosensitive process of the active pixel cell is illustrated by way of example using APS as the example. The pixel cell includes a photodiode, a reset transistor T1, a source follower T2, and a row strobe transistor T3. Before the integration period starts, controlling the conduction of the T1 tube, resetting the photodiode to a reset level, and then starting the integration process of the photo-generated electrons; after a period of time, the T1 tube is controlled to be cut off, light irradiates the photodiode to generate electrons, and the electrons are amplified and output through the source follower T2; after the photoelectric integration process is completed, the row gate tube T3 is conducted, signals are sent to the column bus, and the signals are output through the column reading circuit.
The integrated circuit includes an interface circuit, a timing control circuit, an address decoder (a row address decoder or a column address decoder), a shift register (a row shift register or a column shift register), an analog signal amplifying circuit, and an analog-to-digital conversion circuit.
And the interface circuit is used for loading external control data to the memory register group of the chip.
And the time sequence control circuit is used for generating internal time sequence signals such as integral reading, resetting and the like of the pixel units according to the data set by the internal register and outputting the internal time sequence signals to the corresponding circuits in the form of pulse signals.
The row address decoder and the row shift register are mainly used for generating address control signals required by row selection of the pixel array. Firstly, the received row start address signal is decoded by a corresponding address decoder, then the obtained data is input into a shift register, and the shift of the address is realized under the control of a clock signal, so that a new address is generated.
The column address decoder and the column shift register are mainly used for generating address control signals required by the column selection of the pixel array. Firstly, the received column start address signal is decoded by a corresponding address decoder, then the obtained data is input into a shift register, and the shift of the address is realized under the control of a clock signal, so that a new address is generated.
And the analog signal amplifying circuit is used for amplifying the pixel signals read out by the column bus and outputting the amplified pixel signals to the analog-to-digital converter.
And the analog-to-digital converter is used for converting the pixel signals into corresponding digital signals and realizing the digital output of the pixel signals.
The image processor is integrated on the circuit board and is electrically connected with the photosensitive chip and is used for carrying out preset processing on the digital signal output by the analog-to-digital converter to obtain image data. The preset processing may include processing of AEC (automatic exposure control), AGC (automatic gain control), AWB (automatic White balance), color correction, lens Shading correction, gamma correction, dead pixel removal, auto Black Level, auto White Level, and the like.
The input/output interface circuit is integrated on the circuit board and is electrically connected with the image processor, and is used for receiving the image data output by the image processor, carrying out format adjustment on the image data according to a set format, and outputting the image data with the format adjusted for subsequent steps. For example, in an image fusion application scenario, each camera module in the multi-camera system outputs image data with adjusted format to the CPU for performing an image fusion operation.
As shown in fig. 2, the bondable photosensitive chip 200 includes at least two pixel arrays (210, 220) on a substrate and a bonding frame 240. Between two adjacent pixel arrays (210, 220) there is a nonfunctional area 230, the nonfunctional area 230 comprising a dicing line 270, the dicing line 270 dividing the photo-sensing chip 200 into at least two photo-sensing sub-chips (half-chips 280, 260), wherein the dicing line 270 is used to indicate a trajectory of dicing the photo-sensing chip 200. Each of the photo-sub-chips (280, 260) includes a pixel array (210, 220) and an integrated circuit. It should be noted that, the at least two integrated circuits are independent of each other, i.e. there is no circuit connection, and are used for respectively acquiring and processing the image signals detected by the at least two pixel arrays. For example, for a dual camera system, the photo-sensing chip has two pixel arrays, named first pixel array 210 and second pixel array 220, respectively. Accordingly, the integrated circuits connected to the pixel array may be named as a first integrated circuit and a second integrated circuit. The first integrated circuit reads the signals collected by the first pixel array 210, and obtains image signals through filtering, signal amplification, analog-to-digital conversion and other processes, and the image signals are set by the image processor. The second integrated circuit reads the signals collected by the second pixel array 220, and obtains the image signals through filtering, signal amplification, analog-to-digital conversion and other processes, and the image signals are set by the image processor. It should be noted that, for each good photo-sensing sub-chip, the functions of the pixel array and the integrated circuit are as described above, and will not be described here again.
It should be noted that, no integrated circuit is disposed on the nonfunctional area 230 between two adjacent pixel arrays (210, 220), so that it is ensured that the normal operation of the cut photosensitive sub-chip is not affected after the cut photosensitive chip 200 is cut. It will be appreciated that the nonfunctional area 230 may be provided in a regular shape or in an irregular shape. A cutting line 270 is provided on the nonfunctional area 230. The photosites 200 are separated into at least two photosites (280, 260) by the dicing lane 270. For example, the cutting line may be a line segment formed by fluorescent material located on the surface of the non-functional area 230, and a component for detecting the fluorescent material may be integrated on the cutting device to determine the cutting line by detecting the fluorescent material and cut the photosensitive chip by the cutting device based on the cutting line. For another example, the cutting path may be a groove etched to a predetermined depth and a predetermined shape on the surface of the nonfunctional area, and the cutting path is indicated by the groove. An ultrasonic sensor, an infrared sensor, or the like may be integrated on the cutting device, a cutting route may be detected by detecting the ultrasonic sensor or the infrared sensor, and the photosensitive chip may be cut by the cutting device based on the cutting route. It will be appreciated that the arrangement and detection of the cutting lines is not limited to the above-described embodiments. In addition, the cutting route may be provided at any position in the nonfunctional area, and the position of the provision of the cutting route is not particularly limited in this application. For example, the cutting path may coincide with a boundary line of the nonfunctional area.
When one of the photosensitive chips having at least two pixel arrays is damaged or has a defective function, the defective photosensitive sub-chip (a chip including a failure in the operation of the photosensitive chip due to the damage or the defective function or the like may be referred to as a defective photosensitive sub-chip) may be cut from the photosensitive chip along the above-described cutting route. And selecting good-quality photoreceptor chips matched with the cutting route, and splicing the good-quality photoreceptor chips and the rest photoreceptor chips through a combined frame. The remaining photoreceptor chips may be the remaining photoreceptor chips after the defective photoreceptor chips are cut off along the cutting line in the photoreceptor chips. The good photoreceptor chips matched with the dicing routes can be regarded as the photoreceptor chips not damaged and not having functional failure, and the dicing routes are matched with the dicing routes of the rest photoreceptor chips. For example, for a photosensitive chip with 2 pixel arrays, cutting the photosensitive chip along a cutting line may cut the nonfunctional area to obtain a photosensitive sub-chip with one pixel array. Therefore, the damaged or poorly functioning photoreceptor chips can be replaced by good photoreceptor chips.
The bonding frame includes at least two light-sensitive chip placement portions recessed inward from a surface of the bonding frame, and a partition portion having the same shape and size as the non-functional region is formed between adjacent two light-sensitive chip placement portions. Fig. 3 is a schematic structural diagram of a bonding frame of a bondable photosensitive chip provided in the present application. As shown in fig. 3, the combining frame 240 includes two photosensitive chip placement parts, named a first placement part 310 and a second placement part 320, respectively recessed downward from the surface of the combining frame for respectively placing the good photosensitive sub-chips and the remaining photosensitive sub-chips. The isolation part 250 is located between the first and second placement parts 310 and 320, and may be a solid cylinder extending from the surface to the bottom surface of the coupling frame 240 for isolating the first and second placement parts 310 and 320. The same side of the coupling frame 240 is divided into two sub-areas by the partition 250, and slits perpendicular to the partition 250 are respectively provided in the two sub-areas. Taking the combined frame shown in fig. 3 as an example, a side facing the user is defined as a front side, and a side opposite to the front side is defined as a back side, and the partition 250 divides the front side and the back side into two sub-areas, respectively. Slits for the photosensitive chips or the remaining sub-chips to enter the bonding frame 240 may be provided on the front and/or back sides. The first slit 330 corresponding to the first placing portion 310 and the second slit 340 corresponding to the second placing portion 320 provide an entrance for the photosensitive microchip and the remaining sub-chips to enter the photosensitive chip placing portion, respectively. Because the other side opposite to the side with the gap is not provided with the gap, the photosensitive sub-chip and the rest photosensitive sub-chip are placed in the first placing part and the second placing part and can prop against the other side opposite to the side with the gap, thereby playing a role in positioning. At this time, the hollowed portion 360 may be disposed at the bottom 350 of the combined frame, and the structure and position of the hollowed portion 360 are determined according to the positions of the welding spots of the photosensitive sub-chip or the remaining sub-chip.
Optionally, slits are respectively arranged on two sides of the combined frame parallel to the isolation part. Fig. 4 is a schematic structural diagram of a bonding frame of another bondable photosensitive chip provided in the present application. As shown in fig. 4, the two parallel ends of the combining frame 240 and the isolating part 250 are provided with a first slit 410 and a second slit 420 for the entrance of the photosensitive sub-chip and the residual sub-chip, so that the photosensitive sub-chip and the residual sub-chip are respectively inserted into the combining frame 240 from the two ends of the combining frame 240. And, since the spacer 250 is a solid cylinder extending from the surface of the coupling frame 240 to the bottom surface, it can play a role in positioning during the insertion of the photo-sensing sub-chip and the remaining sub-chips.
Optionally, the first placing portion 310 and the second placing portion 320 may be in interference fit with the photosensitive sub-chip and the remaining photosensitive sub-chip, so as to realize that the photosensitive sub-chip and the remaining photosensitive sub-chip are respectively fastened and connected with the first placing portion 310 and the second placing portion 320.
Alternatively, the first placing portion and the second placing portion may have steps 370, and the photoreceptor chips and the remaining photoreceptor chips are adhered to the upper surfaces of the steps 370, respectively, and the steps 370 are used for supporting the photoreceptor chips and the remaining photoreceptor chips, respectively.
The bonding frame is provided with a glue filling hole extending from the bottom surface of the step to the bottom surface of the gap, and the glue filling hole is filled with adhesive glue to bond the photosensitive sub-chip and the residual photosensitive sub-chip to the photosensitive chip placing part. It should be noted that, the surface of the step may coincide with the bottom surface of the above-mentioned gap, so as to realize smooth transition between the photosensitive sub-chip and the remaining photosensitive sub-chip to the first placement portion and the second placement portion.
Alternatively, the same side of the coupling frame 240 is divided into two sub-areas by the partition 250, corresponding to the first and second placement portions 310 and 320, respectively. The bottom of the first placement portion 310 is a hollowed-out design, so that after the photosensitive sub-chip or the remaining sub-chip is fixed on the first placement portion 310, the solder joint can be exposed by the first hollowed-out portion 430. Similarly, the bottom of the second placement portion 320 is also designed to be hollowed, so that after the photosensitive sub-chip or the remaining sub-chip is fixed on the second placement portion 320, the solder joint can be exposed by the second hollowed portion 440.
According to the technical scheme, at least two pixel arrays are formed on a substrate of a chip, a nonfunctional area is arranged between every two adjacent pixel arrays, the nonfunctional area comprises a cutting route, the cutting route divides a photosensitive chip into at least two photosensitive sub-chips, and when one photosensitive sub-chip is damaged or has poor functions, the damaged or poorly functional photosensitive sub-chip can be cut off from the photosensitive chip based on the cutting route; and then the poor photosensitive sub-chip is replaced by the photosensitive sub-chip matched with the cutting route, and the photosensitive sub-chip and the residual photosensitive sub-chip are spliced by adopting a combined frame, so that the poor photosensitive sub-chip is replaced by the qualified photosensitive sub-chip, and the problem that the whole photosensitive chip corresponding to double shooting or multiple shooting cannot be used due to the damage or poor functions of the single photosensitive sub-chip is avoided. By adopting the technical scheme of the embodiment of the application, the photosensitive chips which are not separated can be designed and produced on the same wafer in the process of preparing the photosensitive chips of the multi-camera system, and the production and calibration precision of each camera module in the multi-camera system is improved, so that the image effect is improved. And when one photosensitive sub-chip in the multi-camera system is damaged or has poor functions, the damaged or functional photosensitive sub-chip can be replaced without influencing the normal use of the multi-camera system, so that the yield of the photosensitive chip and the camera module is improved.
In some embodiments, the cut lines may share the nonfunctional area. Fig. 5 is a block diagram of another embodiment of a combined photosensitive chip. As shown in fig. 5, the dicing line 510 coincides with the central axis of the nonfunctional area, and two photosensitive sub-chips (520, 530) can be obtained by dicing the photosensitive chip along the dicing line 510. The areas of the non-functional sub-areas (550, 560) on the photo-sensing sub-chip are the same.
The bonding frame 240 includes a photosensitive chip placing portion for placing at least two photosensitive sub-chips (280,260). A slit 540 is provided on the side of the coupling frame 240 for providing an entrance for the photosensitive microchip and the remaining chiplets to enter the photosensitive chip placing section. For example, the slits 540 are disposed on at least two sides (to form a slit on each of two opposite long sides, or to form a slit on each of two opposite short sides, or to form a slit on each of two long sides and two short sides) of the bonding frame 240, so that the chip pins can pass through the slits to be bonded with the photosensitive sub-chip or the remaining photosensitive sub-chip.
It should be noted that, only one side of the two parallel sides of the combination frame may be provided with a slit, so as to facilitate positioning when the photosensitive sub-chip and the remaining sub-chip enter the photosensitive chip placing portion. The bottom of the combined frame can be provided with a hollow structure so that after the photosensitive sub-chip or the rest sub-chip is fixed on the photosensitive chip placing part, welding spots can be exposed by the combined frame. For example, a hollowed part is arranged at the bottom of the combined frame, and the structure and the position of the hollowed part are determined according to the positions of welding spots of the photosensitive sub-chip or the residual sub-chip.
Optionally, the photosensitive chip placing part has a step, and the photosensitive sub-chip and the remaining photosensitive sub-chip are respectively adhered to the upper surface of the step, and the photosensitive sub-chip and the remaining photosensitive sub-chip are supported by the step. It should be noted that, the surface of the step may coincide with the bottom surface of the above-mentioned gap, so as to realize smooth transition of the photosensitive sub-chip and the remaining photosensitive sub-chip to the photosensitive chip placement portion. The design has the advantage that the photosensitive chip is not assembled at the module end, but is designed to have a plurality of pixel arrays and corresponding integrated circuits according to the requirements of a multi-camera system in the semiconductor manufacturing process. Because the photosensitive chips of the multi-camera system are generated on the same wafer, the characteristic of high precision of semiconductor production is fully utilized, the precision of the multi-camera system is greatly improved, and the difficulty of module end production and calibration is reduced. And when bad photosensitive sub-chips appear in the photosensitive chip, the bad photosensitive sub-chips can be cut along the central axis of the nonfunctional area, and the rest half chips can be spliced with the photosensitive chips of good products to obtain the photosensitive chips which can work normally, so that the problem that the photosensitive chips of the whole double-shot or multi-shot system cannot be used due to the damage or the bad functions of the photosensitive sub-chips is avoided, and the yield of the chips and the modules is effectively improved.
The embodiment of the application also provides a camera module, which comprises the photosensitive chip provided by the embodiment, and a multi-camera system is formed by one photosensitive chip with a plurality of photosensitive areas. The camera module may include a plurality of rear camera modules and/or a plurality of front camera modules having the photosensitive chip provided in the above embodiments. The camera module comprises:
the bondable photosensitive chip with the structure described in the above embodiment is soldered on the circuit board. The precision of the semiconductor manufacturing process is far higher than that of the module manufacturing process, and two or more pixel arrays are prepared on the same substrate to form a plurality of photosensitive areas, so that the angles of the flatness of the chip, the relative deviation of at least two photosensitive areas, the relative inclination angle and the like can be improved from millimeter level to micrometer level.
And the number of the lenses is consistent with that of the pixel arrays of the combinable photosensitive chips. The lenses are fixed through the lens base to form a lens, the lens base and the voice coil motor form a lens assembly, and the lens assembly is fixed on the circuit board through the bracket to form a multi-camera system. It should be noted that the multi-camera system may be a camera system formed by a plurality of rear camera modules and/or a plurality of front camera modules.
Fig. 6 is a schematic structural diagram of a camera module according to an embodiment of the present application. As shown in fig. 6, the camera module includes: the first lens assembly 610, the second lens assembly 620, the bracket 630 and the combinable photosensitive chip 640. The first lens assembly 610 includes a first lens, a first lens base, and a first motor, so that the first lens slides in the first lens barrel under the driving of the first motor to adjust a focal length; the second lens assembly 620 includes a second lens, a second lens base and a second motor, so that the second lens slides in the second lens barrel under the driving of the second motor to adjust the focal length. The bondable photosensitive chip 640 includes the first pixel array 641 and the second pixel array 642, and the circuit structure thereof is shown in the above embodiments and will not be described herein. And the bondable photosensitive chip 640 is welded on the circuit board 650, the size of the circuit board 650 is larger than that of the bondable photosensitive chip 640, and the bracket 630 is fixedly connected with the circuit board 650 to form a packaging structure of the camera module.
Optionally, the first lens assembly 610 further includes a first infrared filter for filtering infrared light signals collected by the first lens. The second lens assembly 620 further includes a second infrared filter for filtering infrared light signals collected by the second lens.
Alternatively, the first infrared filter may be disposed separately from the first lens assembly 610, and the second infrared filter may be disposed separately from the second lens assembly 620.
The embodiment of the application provides electronic equipment, which is provided with a camera module. The electronic device may be a terminal with a camera, such as a smart phone, a PAD (tablet personal computer), a notebook computer, and an intelligent wearable device. Taking a smart phone as an example of a structure of an electronic device, fig. 7 is a block diagram of the structure of the smart phone according to an embodiment of the present application. As shown in fig. 7, the smart phone may include: memory 701, central processing unit (Central Processing Unit, CPU) 702 (also called a processor, hereinafter CPU), peripheral interface 703, RF (Radio Frequency) circuitry 705, audio circuitry 706, speaker 711, touch screen 712, multi-camera system 713, power management chip 708, input/output (I/O) subsystem 709, other input/control devices 710, and external ports 704, which communicate via one or more communication buses or signal lines 707.
It should be understood that the illustrated smartphone 700 is only one example of an electronic device, and that the smartphone 700 may have more or fewer components than shown in the figures, may combine two or more components, or may have a different configuration of components. The various components shown in the figures may be implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and/or application specific integrated circuits.
The following describes in detail a smart phone integrated with a file cleaning device provided in this embodiment.
The memory 701 may be accessed by the CPU702, the peripheral interface 703, etc., and the memory 701 may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic disk storage devices, flash memory devices, or other volatile solid state memory devices.
A peripheral interface 703, said peripheral interface 703 may connect input and output peripherals of the device to the CPU702 and the memory 701.
I/O subsystem 709, which I/O subsystem 709 may connect input and output peripherals on the device, such as touch screen 712 and other input/control devices 710, to peripheral interface 703. The I/O subsystem 709 may include a display controller 7091 and one or more input controllers 7092 for controlling other input/control devices 710. Among other things, one or more input controllers 7092 receives electrical signals from other input/control devices 710 or sends electrical signals to other input/control devices 710, which other input/control devices 710 may include physical buttons (push buttons, rocker buttons, etc.), dials, slider switches, joysticks, click wheels. It should be noted that the input controller 7092 may be connected to any of the following: a keyboard, an infrared port, a USB interface, and a pointing device such as a mouse.
A touch screen 712, the touch screen 712 being an input interface and an output interface between the user terminal and the user, displaying visual output to the user, which may include graphics, text, icons, video, and the like.
The display controller 7091 in the I/O subsystem 709 receives electrical signals from the touch screen 712 or transmits electrical signals to the touch screen 712. The touch screen 712 detects a contact on the touch screen, and the display controller 7091 converts the detected contact into an interaction with a user interface object displayed on the touch screen 712, i.e., implements a human-computer interaction, and the user interface object displayed on the touch screen 712 may be an icon running a game, an icon networked to a corresponding network, or the like. It is noted that the device may also include a light mouse, which is a touch sensitive surface that does not display a visual output, or an extension of a touch sensitive surface formed by a touch screen.
The RF circuit 705 is mainly used for establishing communication between the mobile phone and a wireless network (i.e. a network side), so as to realize data receiving and transmitting between the mobile phone and the wireless network. Such as sending and receiving short messages, emails, etc. Specifically, the RF circuit 705 receives and transmits RF signals, also referred to as electromagnetic signals, the RF circuit 705 converts electrical signals to electromagnetic signals or electromagnetic signals to electrical signals, and communicates with a communication network and other devices through the electromagnetic signals. RF circuitry 705 may include known circuitry for performing these functions including, but not limited to, an antenna system, an RF transceiver, one or more amplifiers, a tuner, one or more oscillators, a digital signal processor, a CODEC (COder-DECoder) chipset, a subscriber identity module (Subscriber Identity Module, SIM), and so forth.
An audio circuit 706 is mainly used to receive audio data from the peripheral interface 703, convert the audio data into an electrical signal, and send the electrical signal to the speaker 711.
A speaker 711 for reproducing a voice signal received from the wireless network by the mobile phone through the RF circuit 705 into sound and playing the sound to the user.
The power management chip 708 is used to power and power manage the hardware connected to the CPU702, I/O subsystem and peripheral interfaces.
The multi-camera system 713 includes a plurality of rear camera modules and/or a plurality of front camera modules, and is configured to obtain image data of a target object in different view angles, different depths of field, and the like, and transmit the image data to the memory 701 through the peripheral interface 703 for storage, so as to be called by the CPU 702.
The electronic equipment provided by the embodiment of the application is provided with the photosensitive chips which can be spliced, and the photosensitive chips which are not separated are designed and produced on the same wafer in the process of preparing the photosensitive chips, so that the production and calibration precision of each camera module in the multi-camera system is improved, and the image effect is improved. In addition, when one photosensitive sub-chip in the multi-camera system is damaged or has poor functions, the damaged or functional photosensitive sub-chip can be replaced without affecting the normal use of the multi-camera system, and the yield of the photosensitive chip and the camera module is improved.
Note that the above is only a preferred embodiment of the present application and the technical principle applied. Those skilled in the art will appreciate that the present application is not limited to the particular embodiments described herein, but is capable of numerous obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the present application. Therefore, while the present application has been described in connection with the above embodiments, the present application is not limited to the above embodiments, but may include many other equivalent embodiments without departing from the spirit of the present application, the scope of which is defined by the scope of the appended claims.
Claims (10)
1. The bondable photosensitive chip is characterized by comprising at least two pixel arrays, at least two mutually independent integrated circuits and a bonding frame, wherein the at least two pixel arrays are positioned on a substrate, and the at least two mutually independent integrated circuits are correspondingly and electrically connected with the pixel arrays;
a nonfunctional area is arranged between two adjacent pixel arrays, the nonfunctional area comprises a cutting route, the cutting route divides the photosensitive chip into at least two photosensitive sub-chips, and the cutting route is used for indicating a track for cutting the photosensitive chip;
the at least two mutually independent integrated circuits are used for respectively reading and processing the image signals output by the corresponding pixel arrays;
the combination frame is used for splicing the photosensitive sub-chip and the rest photosensitive sub-chips after the defective photosensitive sub-chip is replaced by the photosensitive sub-chip matched with the cutting route;
the combination frame is used for splicing the photosensitive sub-chip and the rest photosensitive sub-chip, and comprises:
a gap is formed in the side face of the combined frame;
and the gap is used for enabling the photosensitive sub-chip to be inserted and spliced with the residual photosensitive sub-chip.
2. The bondable photosensitive chip according to claim 1, wherein the dicing lanes bisect the nonfunctional area.
3. The bondable photosensitive chip according to claim 1, wherein the dicing lanes coincide with boundary lines of the nonfunctional areas.
4. The bondable photosensitive chip according to claim 1, wherein the bonding frame comprises at least two photosensitive chip placement portions, the photosensitive chip placement portions are recessed inward from a surface of the bonding frame, and a spacer portion is formed between adjacent two photosensitive chip placement portions, the spacer portion and the nonfunctional area having the same shape and size.
5. The bondable photosensitive chip according to claim 4, wherein one side of the bonding frame is divided into two sub-areas by the partition, and slits perpendicular to the partition are respectively provided on the sub-areas for providing an entrance of the photosensitive sub-chip and the remaining photosensitive sub-chip into the photosensitive chip placement portion.
6. The bondable photosensitive chip according to claim 4, wherein both sides of the bonding frame parallel to the partition are respectively provided with slits parallel to the partition for providing an entrance of the photosensitive sub-chip and the remaining photosensitive sub-chip into the photosensitive chip placing portion.
7. The bondable photosensitive chip according to claim 5 or 6, wherein the photosensitive chip placing portion has a step, and a surface of the step coincides with a bottom surface of the slit.
8. The bondable photosensitive chip according to claim 7, further comprising a glue filling hole extending from a bottom surface of the step to a bottom surface of the slit.
9. A camera module comprising a bondable photosensitive chip according to any one of claims 1 to 8.
10. An electronic device having the camera module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810966335.7A CN108769498B (en) | 2018-08-23 | 2018-08-23 | Combinable photosensitive chip, camera module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810966335.7A CN108769498B (en) | 2018-08-23 | 2018-08-23 | Combinable photosensitive chip, camera module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108769498A CN108769498A (en) | 2018-11-06 |
| CN108769498B true CN108769498B (en) | 2024-04-12 |
Family
ID=63966956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810966335.7A Active CN108769498B (en) | 2018-08-23 | 2018-08-23 | Combinable photosensitive chip, camera module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108769498B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114640932B (en) * | 2022-03-12 | 2023-04-11 | 山东大学 | Miniature acoustic sensor based on silicon-based photonic chip and MEMS (micro-electromechanical systems) diffraction grating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839956A (en) * | 2014-01-29 | 2014-06-04 | 苏州兰叶光电科技有限公司 | Cutting method used for image sensor chip wafers by adoption of wafer-level package mode |
| CN106331421A (en) * | 2016-08-22 | 2017-01-11 | 威海华菱光电股份有限公司 | Image sensor and image scanning equipment |
| CN107580167A (en) * | 2017-10-20 | 2018-01-12 | 维沃移动通信有限公司 | A kind of sensitive chip, mobile terminal and image pickup method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106659451B (en) * | 2014-06-10 | 2020-10-09 | 皇家飞利浦有限公司 | Modular imaging detector ASIC |
-
2018
- 2018-08-23 CN CN201810966335.7A patent/CN108769498B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839956A (en) * | 2014-01-29 | 2014-06-04 | 苏州兰叶光电科技有限公司 | Cutting method used for image sensor chip wafers by adoption of wafer-level package mode |
| CN106331421A (en) * | 2016-08-22 | 2017-01-11 | 威海华菱光电股份有限公司 | Image sensor and image scanning equipment |
| CN107580167A (en) * | 2017-10-20 | 2018-01-12 | 维沃移动通信有限公司 | A kind of sensitive chip, mobile terminal and image pickup method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108769498A (en) | 2018-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11889218B2 (en) | Stacked substrate solid state image sensor | |
| KR101804100B1 (en) | Solid-state imaging device, driving method of solid-state imaging device, and electronic apparatus | |
| EP3228077B1 (en) | Solid state image sensor with enhanced charge capacity and dynamic range | |
| KR102429308B1 (en) | Solid-state imaging element, electronic device, and imaging method | |
| CN110072069B (en) | Image sensor | |
| JP5820627B2 (en) | Solid-state imaging device, imaging device, and signal readout method | |
| CN108769499B (en) | Photosensitive chip, camera module and electronic equipment | |
| CN110753193B (en) | Image sensor | |
| JP2013051674A (en) | Imaging device in which peripheral circuit is arranged and increase in chip area is suppressed, and imaging apparatus | |
| US9070796B2 (en) | Solid-state imaging device and imaging apparatus | |
| US9426396B2 (en) | Image sensor, image capturing apparatus, and cellular phone for reduced power consumption when performing thinning readout | |
| CN108668068A (en) | A kind of camera module and electronic equipment | |
| KR101782334B1 (en) | Image sensor, image capturing apparatus, and cellular phone | |
| US9094626B2 (en) | Solid-state imaging device, method for controlling solid-state imaging device, and imaging device | |
| CN108769498B (en) | Combinable photosensitive chip, camera module and electronic equipment | |
| CN104935836A (en) | Solid-state imaging device | |
| JP6355773B2 (en) | Imaging device and imaging apparatus | |
| CN109167940A (en) | A kind of sensitive chip, camera module and electronic equipment | |
| KR20170090848A (en) | Image sensing device and method of driving the same | |
| CN108965674B (en) | Photosensitive chip, camera module and electronic equipment | |
| CN208509089U (en) | A kind of imaging sensor, camera module and electronic equipment | |
| CN208509086U (en) | A kind of camera module and electronic equipment | |
| CN108900789B (en) | Image sensor, camera module and electronic equipment | |
| CN108712600B (en) | Camera module and electronic equipment | |
| CN208509084U (en) | A kind of combinative sensitive chip, camera module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |