CN108767413A - High-power medium microwave component micro discharge suppressing method based on laser ablation surface treatment - Google Patents

High-power medium microwave component micro discharge suppressing method based on laser ablation surface treatment Download PDF

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CN108767413A
CN108767413A CN201810352845.5A CN201810352845A CN108767413A CN 108767413 A CN108767413 A CN 108767413A CN 201810352845 A CN201810352845 A CN 201810352845A CN 108767413 A CN108767413 A CN 108767413A
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microwave component
micropore
laser ablation
medium microwave
pending area
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CN108767413B (en
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李韵
李斌
崔万照
贺永宁
王丹
胡少光
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Xian Institute of Space Radio Technology
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators

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  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

Based on the high-power medium microwave component micro discharge suppressing method of laser ablation surface treatment, (1) determines the three dimensional physical structure of pending cavity microwave component, input power P0, working frequency f0, operation wavelength λ0, input carrier signal x (t) and microwave component material property；(2) according to medium microwave component three dimensional physical structure and material characteristic, 3-D geometric model is established, determines the electromagnetic field amount and unit for electrical property parameters of any position in 3-D geometric model；Medium microwave component surface pending area is determined according to electromagnetic field magnitude；(3) laser ablation surface treatment technique is used to build micropore array in the surface pending area material surface, the micropore is that ingate is hole close-shaped and with certain depth, micropore ingate any two points spacing point maximum distance be W, depth H, andW≤H。

Description

High-power medium microwave component micro discharge based on laser ablation surface treatment inhibits Method
Technical field
The present invention relates to HIGH-POWERED MICROWAVES component micro discharge suppression technologies, belong to the high-power special effect of spacecraft microwave component Field is answered, the inhibition of spacecraft HIGH-POWERED MICROWAVES component micro discharge or the design of anti-micro discharge are mainly used for.
Background technology
Micro discharge is under vacuum or nearly vacuum environment, and free electron occurs under the effect of microwave component built-in field Multipactor.For spacecraft microwave device, the generation of micro discharge can cause bottom make an uproar increase, signal is disliked Change, even device failure, is the key basis for restricting high-power spacecraft microwave component and developing to high reliability, long-life Problem.For in-orbit spacecraft, the failure caused by Multipactor is that moment is paroxysmal, and often calamity The hard fault of difficulty.
Inhibit Multipactor, improve micro discharge breakdown threshold power, for ensureing the long-term steady of spacecraft payload Fixed operation is of great significance.Currently, having multi-satellite due to unavoidable micro- under the conditions of high-power or high-power operation Electric discharge problem results in development process and is obstructed.It is micro- to put meanwhile for follow-up higher power, smaller volume and more light weight demand Electric problem has become key technique bottleneck and challenge.
Traditional micro discharge suppressing method is broadly divided into two classes：Increase volume and Chemical Inhibition method.Wherein, increase volume Micro discharge suppressing method is mainly by increasing the spacing of parts surface at microwave component maximum field intensity, to reduce electric-field strength Degree, realizes the raising of micro-discharge threshold.For spacecraft microwave component and component, due to its volume and quality strictly by Control, by increasing the method for physical size raising micro-discharge threshold, there are significant limitations.Meanwhile by increasing physical size Being limited in scope for micro-discharge threshold can be improved, volume increases and the increase of corresponding quality will be brought high generation to space application Valence is impossible approach under many applicable cases.
Chemical Inhibition method is broadly divided into three classes：
I. the special material for having certain roughness, such as A Luoding (Alodine) are coated in metal surface；
Ii. the dielectric material of low secondary electron yield is coated in metal surface；
Iii. metallic microwave component is surface-treated using chemical method, generates chemical reaction to form porous knot Structure limits the generation of secondary electron.
I-th class and the i-th i class methods often lead to the generally increase of microwave component loss, are influenced on microwave component electrical property It is larger.I-th i classes method has comparable adhesive force requirement to dielectric material or porous material with base material, is technology to be solved Problem, while surface is modified the deterioration for often bringing electrical property and other performances, it would be highly desirable to it solves.
Apply for " (US4053855) Method and arrangement to eliminate multipacting in RF devices " propose a kind of method for eliminating micro discharge in radio-frequency devices, it is intended to by specific two chambers coaxial cavity It is filled up completely the dielectric material of certain dielectric constant, particular medium intensity in fluid filter, inhibits micro discharge；Similarly, Apply " (US4166256) Anti multipacting resonant cavity " by encapsulating polytetrafluoroethyl-ne in resonant cavity Alkene-vinyl fluoride inhibits micro discharge.A kind of domestic applications " parameterized part of wind generating set design side (CN101539959) Method ", " a kind of (CN102043876A) machine tool motion component implementation method meeting high acceleration requirement " exist with this method It is different.
Article " Multipactor Prediction in Novel High-Power Low-Pass Filters with Wide Rejection Band " devise high power capacity stop-band filter by the method for increasing maximum field strength spacing； “Sharp Reduction of the Secondary Electron Emission Yield from Grooved Surfaces " systems are discussed by carrying out the method that micro discharge inhibition is realized in surface treatment to microwave component metal material； “Experimental Study of Multipactor Suppression in a Dielectric-Loaded Accelerating Structure " pass through discussion load magnetic field, the coating of the surfaces TiN and using the methods of different medium material into The validity that row micro discharge inhibits, there are essential differences with the application.
Invention content
The technology of the present invention solves the problems, such as：Overcome the deficiencies in the prior art, ensure electrical property it is constant with do not increase additionally Under the premise of adding microwave component volume, weight, a kind of high-power medium microwave component being surface-treated based on laser ablation is provided Micro discharge suppressing method realizes increasing substantially for medium microwave component micro-discharge threshold.
Technical solution of the invention is：High-power medium microwave component micro discharge based on laser ablation surface treatment Suppressing method, steps are as follows：
(1) three-dimensional structure size, the input power P of pending cavity medium microwave component are determined0, working frequency f0, work Wavelength X0, input carrier signal x (t) and microwave component material property；
(2) according to cavity medium microwave component three-dimensional structure size and material property, 3-D geometric model is established, to establishing 3-D geometric model carry out electromagnetic-field simulation, the strongest region of electric field in 3-D geometric model is determined according to simulation result, so Surface pending area is determined according to the most strong region of electric field and cavity medium microwave component shape afterwards；
(3) laser ablation surface treatment technique is used to be prepared in the material surface of medium microwave component surface pending area Micropore array is formed, the micropore is that ingate is hole close-shaped and with certain depth, and micropore ingate is appointed Meaning distance between two points maximum distance be W, depth H, and W≤H；
Further, the pending area includes electric field strength maximum value EmaxPosition.
Further, the pending area includes at least with electric field strength 0.1EmaxPosition forms vertical for boundary Directly in the infinitely great close-shaped and pending cavity medium microwave component luminal border of the height on medium microwave component surface Intersection.
Further, the micropore in the surface pending area is meeting two-by-two under disjoint constraints, The more the better, the deeper depth the better.
Further, the shape of micropore ingate is round or rectangular.
Further, the micropore in the surface pending area is periodic arrangement, in two neighboring micropore In the heart away from for L0And L0>W。
Further, step (3) uses surface microscopic topographic analyzer to prepare the micropore array formed to step (3) afterwards It carries out Morphology analysis and adjusts laser ablation process if the structure size W and H of the micropore of ablation are unsatisfactory for requiring, into One step carries out laser ablation, until meeting the requirements.
The present invention has the beneficial effect that compared with prior art：
The present invention proposes a kind of micro discharge inhibition new method for the medium microwave component under the conditions of high power work, By the profound and subtle hole in microwave component surface construction micron dimension, remain unchanged in electrical property, do not introduce additional impurity and Under the premise of material, effectively inhibit secondary, to improve micro-discharge threshold, improving microwave component can transimission power. The present invention overcomes prior art defects, and micro discharge is realized under the premise of not influencing High-Power Microwave component electrical property Threshold value improves 900% or more, and promoting and applying will be for the design of spacecraft HIGH-POWERED MICROWAVES component anti-micro discharge and micro-discharge threshold It is significantly promoted and new design method and approach is provided, there are huge market prospects.
Description of the drawings
Fig. 1 micro hole structures prepare schematic diagram；
Fig. 2 ferrite medium circulator three dimensional physical structures；
The belt magnetic distribution figure having a high regard at meaning position of Fig. 3 ferrite media；
Fig. 4 ferrite medium circulators surface pending area；
Fig. 5 ferrite medium circulator surface periodic micro hole structure laser co-focusing micro images.
Specific implementation mode
Below in conjunction with the accompanying drawings and example elaborates to the present invention.
A kind of high-power medium microwave component micro discharge suppressing method based on laser ablation surface treatment, this method include Following steps：
(1) pending medium microwave component three-dimensional structure size, input power P are determined0, working frequency f0, operation wavelength λ0, input carrier signal x (t) and microwave component material property；, for metal material material property include conductivity, fusing point, Secondary electron emission characteristic, the material property for dielectric material include fusing point, dielectric constant, secondary electron emission characteristic；Its Maximum secondary electron emission coefficiency δ when middle secondary electron emission characteristic includes vertical incidencemax, vertical incidence when maximum two Secondary electron emission coefficiency δmaxCorresponding incident electron energy Emax, secondary electron yield be 1 when minimum correspond to incident electron energy Measure Emin；
(2) according to medium microwave component three-dimensional structure size and material property, medium microwave is established using CAD modeling softwares The 3-D geometric model of foundation is resolved into several small grid units by component 3-D geometric model, is drilled with description electromagnetic field Maxwell (Maxwell) equation group of change, numerical solution obtain out the electromagnetic field amount at each grid cell, determine three-dimensional geometry The strongest region of electric field in model；Determine that medium microwave component surface pending area is comprising electromagnetic field intensity maximum value Emax Position, at least with electric field strength 0.1EmaxPosition be boundary formed perpendicular to medium microwave component surface height without The intersection of poor big close-shaped and pending cavity medium microwave component luminal border；
(3) laser ablation is used to be surface-treated technique in medium microwave component surface pending area material surface construction schedule Property micropore, micropore be ingate be it is close-shaped and with certain depth hole, ingate is conveniently of circular shape or rectangular, Micropore ingate any two points spacing maximum distance be W, depth H, and W≤H；Micropore in the surface pending area is in the case where meeting disjoint constraints two-by-two, The more the better, depth More deeper, better；
(4) it is based on laser ablation process, pending area material surface carries out periodically micro- on medium microwave component surface Prepared by pore structure, process is as shown in Figure 1, include the following steps：
(i) structural parameters of the micropore determined according to step (3) determine lasing light input power, scanning times；
(ii) irradiation a is carried out to microwave component pending area material surface using laser；
(iii) lasting to carry out to material surface generation thawing b, layer liquid occur, particle sputters c outward, forms plasma Ablation finally occurs for body, forms micropore；
(5) step (3) uses surface microscopic topographic analyzer to prepare the micropore array progress formed to step (4) micro- afterwards See morphology analysis adjust laser ablation process if the structure size W and H of the micropore of ablation are unsatisfactory for requiring, further into Row ablation, until determining being optimal microcellular structure, medium microwave component electrical property and micro-discharge threshold after test processes are real Existing medium microwave component micro discharge inhibits.
Embodiment one：High micro-discharge threshold Y types knot wave-guide cavity wave ferrite circulator design method
A kind of high-power medium microwave component micro discharge suppressing method based on laser ablation surface treatment, this method include Following steps：
(1) ferrite medium circulator three-dimensional structure size, input power P are determined0For 1W, working frequency f0For 3.2GHz, Operation wavelength λ0=93.75mm, input carrier signal x (t)=sin (2 π f0T), the belt equipment material characteristic of ferrite medium is determined, It is silver for metal material, material property includes that conductivity is 6.3 × 107Ω m, fusing point are 961 degrees Celsius, secondary electron is sent out Penetrate maximum secondary electron emission coefficiency δ when characteristic includes vertical incidencemaxFor 2.2, vertical incidence when maximum secondary electronics hair Penetrate coefficient δmaxCorresponding incident electron energy EmaxMinimum corresponds to incident electron energy when for 165eV, secondary electron yield being 1 EminFor 30eV, the material property for ferrite medium includes 1200 degree of sintering temperature, dielectric constant 13, secondary electron hair Penetrate maximum secondary electron emission coefficiency δ when characteristic includes vertical incidencemaxFor 2.5, vertical incidence when maximum secondary electronics hair Penetrate coefficient δmaxCorresponding incident electron energy EmaxMinimum corresponds to incident electron energy when for 300eV, secondary electron yield being 1 EminFor 30eV；
(2) it as shown in Fig. 2, according to ferrite medium circulator three-dimensional structure size and material property, is modeled using CAD soft Part establishes the 3-D geometric model of ferrite medium circulator, and the 3-D geometric model of foundation is resolved into several small grid lists Member, Maxwell (Maxwell) equation group to develop with description electromagnetic field, numerical solution obtain out the electricity at each grid cell Magnetic field amount, as shown in Figure 3；Determine that ferrite medium circulator surface pending area is comprising electromagnetic field intensity maximum value Emax Position, with electric field strength 0.1EmaxPosition is that the height that boundary is formed perpendicular to medium microwave component surface is infinitely great The close-shaped intersection with pending cavity medium microwave component luminal border, as shown in Figure 4；
(3) use laser ablation surface treatment technique ferrite medium circulator surface pending area material surface into Prepared by row periodicity micro hole structure, micropore is that ingate is rectangular, micropore ingate any two points spacing maximum distance It it is W=150 μm, depth is H=300 μm, and two neighboring micropore center spacing is L0=400 μm；
(4) it is based on laser ablation process, pending area material surface carries out the period on ferrite medium circulator surface Property micro hole structure prepare, process is as shown in Figure 1, include the following steps：
(i) structural parameters of the micropore determined according to step (3) determine lasing light input power for 2W, scanning times about 200 times；
(ii) microwave component pending area material surface is irradiated using laser；
(iii) lasting to carry out that thawing, evaporation occurs to material surface, plasma is formed, ablation finally occurs, is formed micro- Hole；
(5) the periodical micro hole structure for using Analysis of Surface Topography instrument to prepare step (4) is analyzed, such as Fig. 5 institutes Show, determines that being optimal microcellular structure, micropore ingate any two points spacing maximum distance are W=180 μm, depth H =300 μm, two neighboring micropore center spacing is L0=400 μm, microwave component electrical property and micro discharge threshold after test processes Value realizes that microwave component micro discharge inhibits as shown in table 1.
Ferrite medium circulator micro-discharge threshold compares before and after 1 optimization design of table
Device Micro discharge experimental threshold values
Circulator (smooth surface) 380W, 400W
Circulator (surface micropore gap array structure) >=3400W, >=3400W
Ferrite medium circulator electrical property compares before and after 2 optimization design of table
Device Insertion Loss
Circulator (smooth surface) 0.15dB
Circulator (surface microporous structure) 0.15dB
Unspecified part of the present invention belongs to common sense well known to those skilled in the art.

Claims (7)

1. the high-power medium microwave component micro discharge suppressing method based on laser ablation surface treatment, it is characterised in that step is such as Under：
(1) three-dimensional structure size, the input power P of pending cavity medium microwave component are determined0, working frequency f0, operation wavelength λ0, input carrier signal x (t) and microwave component material property；
(2) according to cavity medium microwave component three-dimensional structure size and material property, 3-D geometric model is established, to the three of foundation It ties up geometrical model and carries out electromagnetic-field simulation, the strongest region of electric field in 3-D geometric model is determined according to simulation result, then root Surface pending area is determined according to the most strong region of electric field and cavity medium microwave component shape；
(3) laser ablation surface treatment technique is used to prepare to be formed in the material surface of medium microwave component surface pending area Micropore array, the micropore are that ingate is hole close-shaped and with certain depth, micropore ingate arbitrary two Spacing maximum distance is put as W, depth H, and W≤H。
2. according to the method described in claim 1, it is characterized in that：The pending area includes electric field strength maximum value EmaxPosition.
3. according to the method described in claim 1, it is characterized in that：The pending area includes at least with electric field strength 0.1EmaxPosition be boundary formed height perpendicular to medium microwave component surface it is infinitely great it is close-shaped with it is pending The intersection of cavity medium microwave component luminal border.
4. according to the method described in claim 1, it is characterized in that：Micropore in the surface pending area is meeting The more the better two-by-two under disjoint constraints, the deeper depth the better.
5. according to the method described in claim 1, it is characterized in that：The shape of micropore ingate is round or rectangular.
6. according to the method described in claim 1, it is characterized in that：Micropore in the surface pending area is the period Property arrangement, two neighboring micropore center spacing be L0And L0>W。
7. according to the method described in claim 1, it is characterized in that：Step (3) uses surface microscopic topographic analyzer to step afterwards Suddenly (3) prepare the micropore array formed and carry out Morphology analysis, if the structure size W and H of the micropore of ablation are unsatisfactory for It is required that then adjusting laser ablation process, laser ablation is further carried out, until meeting the requirements.
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EP3693497A1 (en) 2019-02-11 2020-08-12 Radiall Anti-multipactor coating deposited on rf or mw metal component, method for producing such a coating by laser texturing
CN113506968A (en) * 2021-06-15 2021-10-15 西安空间无线电技术研究所 Method for reducing secondary electron emission based on three-dimensional microstructure
CN116315546A (en) * 2022-12-12 2023-06-23 西安空间无线电技术研究所 Design method of surface microprotrusion high-power ferrite circulator

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CN107248605A (en) * 2017-06-19 2017-10-13 西安空间无线电技术研究所 A kind of high-power circulator and its anti-micro discharge design method

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EP2050116A1 (en) * 2006-08-07 2009-04-22 Quantum Filament Technologies Limited Field emission backplate
CN102795591A (en) * 2012-06-27 2012-11-28 西安交通大学 Method for reducing metal secondary electron yield by utilizing regular array structure
CN103882487A (en) * 2014-03-24 2014-06-25 陕西科技大学 Preparation method of silver membrane trap structure for inhibiting secondary electron emission on surface of microwave part
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3693497A1 (en) 2019-02-11 2020-08-12 Radiall Anti-multipactor coating deposited on rf or mw metal component, method for producing such a coating by laser texturing
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CN116315546B (en) * 2022-12-12 2024-05-14 西安空间无线电技术研究所 Design method of surface microprotrusion high-power ferrite circulator

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