CN108763602A - Pcb board intelligence plate-laying algorithm - Google Patents
Pcb board intelligence plate-laying algorithm Download PDFInfo
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- CN108763602A CN108763602A CN201711466384.6A CN201711466384A CN108763602A CN 108763602 A CN108763602 A CN 108763602A CN 201711466384 A CN201711466384 A CN 201711466384A CN 108763602 A CN108763602 A CN 108763602A
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- 239000000463 material Substances 0.000 claims abstract description 84
- 238000009825 accumulation Methods 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 35
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims description 15
- 238000004381 surface treatment Methods 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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Abstract
The invention discloses a kind of pcb board intelligence plate-laying algorithms.Under restrictive condition in pcb board production process, the plate-laying manufacturing process of different pcb boards is as follows：S1：The pcb board of identical number ID is fabricated to SET；S2：The different SET groupings of thickness, film number is more than or equal to SET group numbers；S3：The SET of same thickness is discharged to SET on PANEL using the intelligent plate-laying algorithm of left accumulation；S4：To each group of SET, previous step S3 is repeated, obtains PANEL set；S5：Using improved single solution for diverse problems algorithm, plate of material is cut into PANEL.For this algorithm on the basis of saving material, the film opened is minimum.
Description
Technical field
The invention belongs to printed circuit board typesetting system fields, and in particular to pcb board intelligence plate-laying algorithm.
Background technology
Printed circuit board (Printed circuit board) is the supplier of electronics member device electric appliance link.Its development
Has 100 years history, its design is mainly layout design, and the major advantage using circuit board is to greatly reduce wiring
With the mistake of assembly, the gentle productive labor rate of Automated water is improved.
Pcb board can be divided into, single sided board, dual platen, multi-layer board.The circuit of pcb board is worked it out simultaneously with drawing；PCB
Boundary's electric layer of plate is the insulating properties between protection circuit and each layer；The hole fixed screw of pcb board is used, and two layers or more of line is made
Road is connected each other, and larger via hole is used as the plug-in unit of part, and non-conduction hole is used as surface mount positioning；Pcb board
Anti-solder ink is divided into green oil, red oil, blue oil；The protected mode of pcb board has spray tin (HASL), changes golden (ENIG), changes silver
(Immersion Silver), change tin (Immersion Tin), organic guarantor's welding machine (OSP).
According to the thickness of the plate layer of pcb board, anti-solder ink, surface treatment and plate, factory in the actual production process, is
It saves material, working plate utilization rate is high, and the film opened is minimum, to the plate-layings of PCB plates at very intractable thing.Root
It is different with plate layer thickness since the plate layer of pcb board is different according in pcb board alignment processes, at the processing of ink and surface
Reason makes the arrangement of PCB increase many limitations, and in order to save material, in pcb board restrictive condition, the film opened is minimum,
Need intelligent plate-laying algorithm to pcb board plate-laying.
Invention content
The purpose of the present invention is providing pcb board intelligence plate-laying algorithm in view of the shortcomings of the prior art, different plates are solved
Layer, anti-solder ink, surface treatment and plate thickness pcb board plate-laying problem.
Technical solution of the invention is：Pcb board intelligence plate-laying algorithm, the restrictive condition in pcb board production process
Under, the plate-laying manufacturing process of different pcb boards is as follows：
S1：The pcb board of identical number ID is fabricated to SET；
S2：The different SET groupings of thickness, film number is more than or equal to SET group numbers；
S3：The SET of same thickness is discharged to SET on PANEL using the intelligent plate-laying algorithm of left accumulation；
S4：To each group of SET, previous step S3 is repeated, obtains PANEL set；
S5：Using improved single solution for diverse problems algorithm, plate of material is cut into PANEL.
According to embodiments of the present invention, step S3 is using the intelligent plate-laying algorithm of left accumulation, step SET being discharged on PANEL
It is.
S3.1：Definition, the definition include
(1)Pro_Process：Ink collecting,
Aft_Process：Ink collecting that treated；
(2) the wide width of PANEL, high length, PANEL lower-left angular coordinate be (0,0)；
(3) PANEL sets out in bottom y=0, that is, x-axis from point (0,0), it is assumed that gradually extends to y-axis, no longer than length
Length；
(4) sequence I={ π1, π2..., πnIndicate some loading sequence of n same thickness SET, πiIt is SET numbers, I (i)
After={ x, y, w, h, θ } indicates that the SET is packed into respectively, cross, ordinate, the width of rectangle, height and the rotation angle in the lower left corner
Degree；
(5) sequence E={ e1, e2..., emIndicate the contour line set generated in loading procedure, element ekIndicate horizontal line line
Section, it is made of three elements, i.e. ek={ x, y, w } indicates the left end point coordinates of k-th horizontal line section and the width of line segment respectively
Degree.
S3.2：The processing of every group of SET data, includes the following steps：
(1) each ink in cycle P ro_Process, or surface treatment,
Calculate ink in, set long with (Sum_Length),
It finds in ink, widest set (Max_Width),
And remember the number i of ink,
?：I, Sum_Length, Max_Width are stored in Aft_Process；(2) ink is divided into two classes
The length of PANEL：Length
The width of PANEL：Width
Ink of the Sum_Length more than or equal to Length exists：Pro_Process_1
Aft_Process_1
Others are placed on：Pro_Process_2
Aft_Process_2。
S3.3：Left accumulation plate-laying algorithm
N1：The number of Pro_Process_1 ink
N2：The number of Pro_Process_2 ink
While recycles (N1)
Left accumulation permutation algorithm arranges the first ink in Pro_Process_1
Highest level line：y
Level of subsistence：yi
The difference of highest, low-level line：Difference in height eh
The width of level of subsistence：ex
While recycles (N2)
If：Max_Width is less than eh
If：Sum_Length is less than ex
Ex=ex-Sum_Lengt
Record the value of N2
N2=N2+1；
Until：Pro_Process_1 is sky
If Pro_Process_2 non-emptys；
Finally the ink in remaining Pro_Process_2 is directly come on working plate.
According to embodiments of the present invention, step S3 is using the intelligent plate-laying algorithm of left accumulation, inspiration SET being discharged on PANEL
Rule is to exactly match preferentially：Minimum horizontal line e is chosen in the contour line that can be fitted intok, if there is multiple line segments, then excellent
First choose leftmost one section；According to loading sequence successively by rectangle and e from rectangle to be installedkIt is compared, if there is width
Degree or height and line segment ekWidth is equal and just left after being packed into fills and leads up or the right rectangle filled and led up then preferentially is packed into.
According to embodiments of the present invention, step S3 is using the intelligent plate-laying algorithm of left accumulation, inspiration SET being discharged on PANEL
Rule is that width matching is preferential：It is preferential to be packed into width or height and level of subsistence e in loading procedurekWide square
It is maximum to be then preferentially packed into area if there is multiple matching rectangles for shape.
According to embodiments of the present invention, step S3 is using the intelligent plate-laying algorithm of left accumulation, inspiration SET being discharged on PANEL
Rule is that matched is preferential：In rectangle to be installed, it is not more than level of subsistence e according to loading sequence queries width or heightk
It can realize that the left rectangle filled and led up may be in minimum water if being packed into the first rectangle inquired in the presence of if after width and loading
Generated on horizontal line it is new, smaller can feeding area, but increase contour line ek-1Width.
According to embodiments of the present invention, step S3 is using the intelligent plate-laying algorithm of left accumulation, inspiration SET being discharged on PANEL
Rule is can be packed into preferentially：In a certain range, width or height are searched successively not according to loading sequence from rectangular-shaped piece to be installed
More than level of subsistence ekThe rectangle of width, and if it exists, be then loaded into；If there are multiple, it is packed into the maximum square of area
Shape, may be generated on level of subsistence it is new, smaller can feeding area, while smaller rectangle delay is packed into.
According to embodiments of the present invention, step S3 is using the intelligent plate-laying algorithm of left accumulation, inspiration SET being discharged on PANEL
Rule：It can not arrange
For recycles plate number i
If the length of plate i and the wide width for being both greater than level of subsistence
The ordinate of level of subsistence is updated to the ordinate of time level of subsistence
If with left lower than right, the ordinate of level of subsistence is updated to left horizontal line ordinate
It is responsible for being updated to right horizontal line ordinate.
According to embodiments of the present invention, steps are as follows for the realization of the left accumulation plate-laying algorithms of step S3.3：
(1) input quantity is：PANEL (width length), plate I, output quantity are：Y,
(2) data initialization, E, I, y,
(3) for i=1:n
(5) are gone to step if exactly matched,
If width matching goes to step (5),
If matched goes to step (5),
If can be packed into matching goes to step (5),
If can not be packed into matching goes to step (5),
(4) merge the side in E,
(5) i-th of plate in set I is put into level of subsistence ekOn；
If not rotating y=max (y, I (j) .y+I (j) .h)
If rotation：Y=max (y, I (j) .y+I (j) .w)
(3) are gone to step until plate I is sky.
According to embodiments of the present invention, steps are as follows for the realization of the improved single solution for diverse problems algorithms of step S5：
(1) minimum value of broadside：min_wide；
(2) it calculates：The gross area of working plate divided by the area of plate of material round up：Number puts into of plate of material
Number：N=number+a
A=0,1,2,3,4, can be very much, a prodigious number can be given
Original material plate set M：The first plate of material of n blocks；
(3) while is recycled, until PNL is sky
If the number of PNL working plates is 1：
Directly working plate is come in plate of material, the length of working plate, is placed along the wide direction of plate of material
The width of working plate is placed along the direction of plate of material length
Lower-left angle alignment；
It is other：
Longth=working plates most greatly enhance+it secondary greatly enhances；
If in working plate, Longth>The width and Longth of=material<The length of=material (is cut according to the length of working plate
It takes)
MAX_ROOM long：The width of plate of material
MAX_ROOM wide：The length of the length of plate of material-longest working plate
MIN_ROOM long：The width of width-working plate of plate of material
MIN_ROOM wide：The length of working plate
The first bulk flitch in MAX_ROOM MIN_ROOM alternate material plate set；
Update collection of material M；
If：The minimum value of MAX_ROOM is less than min_wide
MAX_ROOM is then thrown plate of material set
If：The minimum value of MIN_ROOM is less than min_wide
MIN_ROOM is then thrown plate of material set
elseif：If the length for being wider than plate of material of working plate
First piece of working plate is removed, remaining working plate, cycle
If the width of working plate is less than the length of plate of material
This plate of material is taken out from collection of material
This working plate is taken out from working plate set
It is other：
MAX_ROOM long：The length of plate of material
MAX_ROOM wide：The length of the width of plate of material-longest working plate
MIN_ROOM long：The width of length-working plate of plate of material
MIN_ROOM wide：The length of working plate
If：The small min_wide of minimum value of MAX_ROOM
MAX_ROOM is then thrown plate of material set
If：The minimum value of MIN_ROOM is less than min_wide
MIN_ROOM is then thrown plate of material set
Until working plate collection is combined into sky, cycle is exited.
According to embodiments of the present invention, the restrictive condition in pcb board production process is as follows：
(1) pcb board of difference ID, constitutes different SET；
(2) pcb board of difference ID, can there is identical thickness；
(3) SET for differing thickness cannot centainly can come on the same PANEL；
(4) SET of identical number of plies same thickness, which can be considered, comes on the same PANEL；
(5) the different numbers of plies but the SET with same thickness, it may be considered that come on the same PANEL；
(6) SET of same thickness, different ink can come on PANEL, but gap is needed to separate；
(7) SET of same thickness, different surface treatment can come on PANEL, but gap is needed to separate；
(8) SET of same thickness, different ink when different surface treatment, first consider ink, consider further that surface treatment,
But it is necessarily required to gap to separate.
The method have the benefit that：Pcb board intelligence plate-laying algorithm software, after actual test and application,
For this algorithm on the basis of saving material, the film opened is minimum, this software and be applied to factory pcb board making.
Description of the drawings
Fig. 1 is left-justify arrangement accumulation algorithm flow chart.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
The software development process of pcb board
1, the restrictive condition in pcb board production process
(1) pcb board of difference ID, constitutes different SET；
(2) pcb board of difference ID, can there is identical thickness
(3) SET for differing thickness cannot centainly can come on the same PANEL；
(4) SET of identical number of plies same thickness, which can be considered, comes on the same PANEL；
(5) the different numbers of plies but the SET with same thickness, it may be considered that come on the same PANEL；
(6) SET of same thickness, different ink can come on PANEL, but gap is needed to separate；
(7) SET of same thickness, different surface treatment can come on PANEL, but gap is needed to separate；
(8) SET of same thickness, different ink when different surface treatment, first consider ink, consider further that surface treatment,
But it is necessarily required to gap to separate.
2, pcb board intelligence plate-laying algorithm designs
2.1, left accumulation plate-laying algorithm (SET comes on working plate)
2.1.1 definition
(1)Pro_Process：Ink collecting
Aft_Process：Ink collecting that treated
(2) the wide width of PANEL, high length, PANEL lower-left angular coordinate be (0,0)
(3) PANEL sets out in bottom y=0, that is, x-axis from point (0,0), it is assumed that gradually extends to y-axis, no longer than
The length of length.
(4) sequence I={ π1, π2..., πnIndicate some loading sequence of n same thickness SET, πiIt is SET numbers, I
(i) after={ x, y, w, h, θ } indicates that the SET is packed into respectively, cross, ordinate, the width of rectangle, height and the rotation in the lower left corner
Gyration.
((5) sequence E={ e1, e2..., emIndicate the contour line set generated in loading procedure, element ekIndicate horizontal
Line line segment, it is made of three elements, i.e. ek={ x, y, w } indicates the left end point coordinates and line segment of k-th of horizontal line section respectively
Width.
2.1.2SET the processing of data
(1) each ink (or surface treatment) (Pro_Process) is recycled
Calculate ink in, set long with (Sum_Length)
It finds in ink, widest set (Max_Width)
And remember the number i of ink
?：I, Sum_Length, Max_Width are stored in Aft_Process
(2) ink is divided into two classes
The length of PANEL：Length
The width of PANEL：Width
Ink of the Sum_Length more than or equal to Length exists：Pro_Process_1
Aft_Process_1
Others are placed on：Pro_Process_2
Aft_Process_2。
2.2, plate-laying algorithm
N1：The number of Pro_Process_1 ink
N2：The number of Pro_Process_2 ink
While recycles (N1)
Left accumulation permutation algorithm arranges the first ink in Pro_Process_1
Highest level line：y
Level of subsistence：yi
The difference of highest, low-level line：Difference in height eh
The width of level of subsistence：ex
While recycles (N2)
If：Max_Width is less than eh
If：Sum_Length is less than ex
Ex=ex-Sum_Lengt
Record the value of N2
N2=N2+1；
Until：Pro_Process_1 is sky
If Pro_Process_2 non-emptys；
Finally the ink in remaining Pro_Process_2 is directly come on working plate.
2.2.1 basic thought
(1) data preparations such as ink, surface treatment；
(2) cavity that the larger SET of area is generated after entering is larger, the cavity that the smaller rectangle of area generates after being packed into compared with
It is small；
(3) cavity that the larger SET of area is generated after being packed into can usually be packed into the smaller SET of area；
(4) contour line generated in loading procedure is more regular, that is, the horizontal line quantity for forming contour line is fewer, more has
Conducive to the loading of later stage SET.
2.2.2 heuristic rule designs
(1) it exactly matches preferential：Minimum horizontal line e is chosen in the contour line that can be fitted intok, if there is multiple line segments,
Leftmost one section is then preferentially chosen, according to loading sequence successively by rectangle and e from rectangle to be installedkIt is compared, if deposited
In width or height and line segment ekWidth is equal and just left after being packed into fills and leads up or the right rectangle filled and led up then preferentially fills
Enter；Exactly match the contour line quantity that can preferentially reduce and be generated after loading so that be packed into profile towards the concordant direction in top
Development.
(2) width matching is preferential：It is preferential to be packed into width or height and level of subsistence e in loading procedurekIt is wide
Rectangle, if there is multiple matching rectangles, then preferentially be packed into area it is maximum；From exactly match unlike priority rule,
Width matching is preferentially not required for realize that a left side is filled and led up or the right side is filled and led up after being packed into；Meanwhile the rule is so that smaller rectangle has
The trend being packed into is postponed, will not increase and be packed into contour line quantity.
(3) matched is preferential：In rectangle to be installed, it is not more than minimum water according to loading sequence queries width or height
Horizontal line ekWidth and the left rectangle filled and led up can be realized after being packed into, it, may be if being packed into the first rectangle inquired in the presence of if
Generated on level of subsistence it is new, smaller can feeding area, but increase contour line ek-1Width.
(4) it can be packed into preferential：In a certain range, from rectangular-shaped piece to be installed according to be packed into sequence search successively width or
Height is not more than the rectangle of floor level line width, and if it exists, is then loaded into；If there are multiple, it is maximum to be packed into area
Rectangle, may be generated on level of subsistence it is new, smaller can feeding area, while smaller rectangle delay is packed into.
(5) it can not arrange
For recycles plate number i
If the length of plate i and the wide width for being both greater than level of subsistence
The ordinate of level of subsistence is updated to the ordinate of time level of subsistence
If with left lower than right, the ordinate of level of subsistence is updated to left horizontal line ordinate
It is responsible for being updated to right horizontal line ordinate.
2.2.3 the realization of left accumulation plate-laying algorithm.
Step1：Input quantity is：PANEL (width length), plate I, output quantity are：y
Step2：Data initialization, E, I, y
Step3：For i=1:n
Turn step5 if exactly matched
If width matching turns step5
If matched turns step5
If can be packed into matching turns step5
If can not be packed into matching turns step5
Step4：Merge the side in E
Step5：I-th of plate in set I is put on level of subsistence；
If not rotating y=max (y, I (j) .y+I (j) .h)
If rotation：Y=max (y, I (j) .y+I (j) .w)
Turn Step3 until plate I is sky.
As shown in Figure 1, left-justify arrangement accumulation algorithm flow is as follows：
(1) SET process sets, technique 1, left-justify permutation algorithm；
(2) i, i-th piece of maximum plate SET are arranged；
(3) level of subsistence y, the wide w of input service plate；
(4) utilization rate ly, ly=SET (i) area divided by (i*w) are calculated, stores successively in ly set, whether judges ly
It is incremented by, is, then i=i+1 return to step (2)；It is no, then export the utilization rate ly of i-1；
(5) >=0.97 ly (i-1)？, it is no, then the i SET sequenced is taken out from work at present plate；
Arrangement unsuccessfully illustrates：Data update
Take out first piece of SET i.e.：Largest block SET puts Group_a23 into, updates current process, rear i-1 blocks SET, weight
It newly puts back to, in the SET not arranged, updates work at present plate：Working plate is constant, is then back to step (1) left-justify permutation algorithm；
(6) >=0.97 ly (i-1)？, it is that current i-1 SET is then arranged on working plate；
It arranges and successfully loses explanation：Data update
Output data：Level of subsistence：y
It has sequenced：I-1 SET
It has sequenced：I SET
It does not sequence：SET gathers；
(7) current process is updated, i-th of SET is put into the SET to sequence, return to step (1) left-justify permutation algorithm；
Update work at present plate
The width of working plate：The width of work at present plate
The length of working plate：Length-the y of work at present plate
Return to step (1) left-justify permutation algorithm；
(8) judge to determine whether technique 1 is empty？It is no, return to step (1) left-justify permutation algorithm；
It is then to update working plate
The width of working plate：The width of work at present plate
The length of working plate：Length-the y of work at present plate
(9) whether it is the last one technique？It is no, return to technique i+1；It is to terminate.
2.3, improved single solution for diverse problems algorithm (plate of material is cut into PANEL)
2.3.1 improved single solution for diverse problems algorithm design philosophy
(1) PANEL data sets are handled
All working plates：Length is greater than width
Working plate is according to length, sequence (first arrange longest ,) successively from top to bottom
(2) number of record single solution for diverse problems each plate of material used,
(3) it calculates and imposes uniformity without examining individual cases, the overall utilization of each plate of material
Overall utilization=(area of all working plate)/(number of each plate of material of the area * of each plate of material)
(4) the plate of material arrangement that utilization rate is high is used
With single solution for diverse problems algorithm, SET is come in three kinds of plate of material, and record each plate of material row SET number with
Type.
2.3.2 the realization of improved single solution for diverse problems algorithm
The minimum value of Setp1, broadside：min_wide
Setp2, calculating：The gross area of working plate divided by the area of plate of material round up： number
Put into the number of plate of material：N=number+a
A=0,1,2,3,4, can be very much, a prodigious number can be given
Original material plate set M：The first plate of material of n blocks
Setp3, while are recycled, until PNL is sky
If the number of PNL working plates is 1：
Directly working plate is come in plate of material, the length of working plate, is placed along the wide direction of plate of material
The width of working plate is placed along the direction of plate of material length
Lower-left angle alignment：
It is other：
Longth=working plates most greatly enhance+it secondary greatly enhances.
If in working plate, Longth>The width and Longth of=material<The length of=material (is cut according to the length of working plate
It takes)
MAX_ROOM long：The width of plate of material
MAX_ROOM wide：The length of the length of plate of material-longest working plate
MIN_ROOM long：The width of width-working plate of plate of material
MIN_ROOM wide：The length of working plate
The first bulk flitch in MAX_ROOM MIN_ROOM alternate material plate set.
Update collection of material M.
If：The minimum value of MAX_ROOM is less than min_wide
MAX_ROOM is then thrown plate of material set
If：The minimum value of MIN_ROOM is less than min_wide
MIN_ROOM is then thrown plate of material set
elseif：If the length for being wider than plate of material of working plate
First piece of working plate is removed, remaining working plate, cycle
If the width of working plate is less than the length of plate of material
This plate of material is taken out from collection of material
This working plate is taken out from working plate set
It is other：
MAX_ROOM long：The length of plate of material
MAX_ROOM wide：The length of the width of plate of material-longest working plate
MIN_ROOM long：The width of length-working plate of plate of material
MIN_ROOM wide：The length of working plate
If：The minimum value of MAX_ROOM is less than min_wide
MAX_ROOM is then thrown plate of material set
If：The minimum value of MIN_ROOM is less than min_wide
MIN_ROOM is then thrown plate of material set
Until working plate collection is combined into sky, cycle is exited.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (10)
1. a kind of pcb board intelligence plate-laying algorithm, it is characterized in that under restrictive condition in pcb board production process, different pcb boards
Plate-laying manufacturing process is as follows：
S1：The pcb board of identical number ID is fabricated to SET；
S2：The different SET groupings of thickness, film number is more than or equal to SET group numbers；
S3：The SET of same thickness is discharged to SET on PANEL using the intelligent plate-laying algorithm of left accumulation；
S4：To each group of SET, previous step S3 is repeated, obtains PANEL set；
S5：Using improved single solution for diverse problems algorithm, plate of material is cut into PANEL.
2. pcb board intelligence plate-laying algorithm according to claim 1, it is characterized in that step S3 is calculated using the intelligent plate-laying of left accumulation
Method, SET, which is discharged to the step on PANEL, is：
S3.1：Definition, the definition include
(1)Pro_Process：Ink collecting,
Aft_Process：Ink collecting that treated；
(2) the wide width of PANEL, high length, PANEL lower-left angular coordinate be (0,0)；
(3) PANEL sets out in bottom y=0, that is, x-axis from point (0,0), it is assumed that gradually extends to y-axis, no longer than length
Length；
(4) sequence I={ π1, π2..., πnIndicate some loading sequence of n same thickness SET, πiIt is that SET is numbered, I (i)=
After { x, y, w, h, θ } indicates that the SET is packed into respectively, cross, ordinate, the width of rectangle, height and the rotation angle in the lower left corner；
(5) sequence E={ e1, e2..., emIndicate the contour line set generated in loading procedure, element ekIndicate horizontal line line segment,
It is made of three elements, i.e. ek={ x, y, w } indicates the left end point coordinates of k-th horizontal line section and the width of line segment respectively；
S3.2：The processing of every group of SET data, includes the following steps：
(1) each ink in cycle P ro_Process, or surface treatment,
Calculate ink in, set long with (Sum_Length),
It finds in ink, widest set (Max_Width),
And remember the number i of ink,
?：I, Sum_Length, Max_Width are stored in Aft_Process；
(2) ink is divided into two classes
The length of PANEL：Length
The width of PANEL：Width
Ink of the Sum_Length more than or equal to Length exists：Pro_Process_1
Aft_Process_1
Others are placed on：Pro_Process_2
Aft_Process_2
S3.3：Left accumulation plate-laying algorithm
N1：The number of Pro_Process_1 ink
N2：The number of Pro_Process_2 ink
While recycles (N1)
Left accumulation permutation algorithm arranges the first ink in Pro_Process_1
Highest level line：y
Level of subsistence：yi
The difference of highest, low-level line：Difference in height eh
The width of level of subsistence：ex
While recycles (N2)
If：Max_Width is less than eh
If：Sum_Length is less than ex
Ex=ex-Sum_Lengt
Record the value of N2
N2=N2+1；
Until：Pro_Process_1 is sky
If Pro_Process_2 non-emptys；
Finally the ink in remaining Pro_Process_2 is directly come on working plate.
3. pcb board intelligence plate-laying algorithm according to claim 2, it is characterized in that step S3 is calculated using the intelligent plate-laying of left accumulation
Method, it is to exactly match preferentially that SET, which is discharged to the heuristic rule on PANEL,：Minimum level is chosen in the contour line that can be fitted into
Line ek, if there is multiple line segments, then preferentially choose leftmost one section；According to loading sequence successively by rectangle from rectangle to be installed
With ekIt is compared, if there is width or height and line segment ekWidth it is equal and be packed into after just a left side is filled and led up or the right side is filled out
Flat rectangle is then preferentially packed into.
4. pcb board intelligence plate-laying algorithm according to claim 2, it is characterized in that step S3 is calculated using the intelligent plate-laying of left accumulation
Method, it is that width matching is preferential that SET, which is discharged to the heuristic rule on PANEL,：It is preferential to be packed into width or height in loading procedure
With level of subsistence ekIt is maximum to be then preferentially packed into area if there is multiple matching rectangles for wide rectangle.
5. pcb board intelligence plate-laying algorithm according to claim 2, it is characterized in that step S3 is calculated using the intelligent plate-laying of left accumulation
Method, it is that matched is preferential that SET, which is discharged to the heuristic rule on PANEL,：In rectangle to be installed, according to loading sequence queries width
Or height is not more than level of subsistence ekWidth and the left rectangle filled and led up can be realized after being packed into, inquired if being packed into the presence of if
First rectangle, may be generated on level of subsistence it is new, smaller can feeding area, but increase contour line ek-1's
Width.
6. pcb board intelligence plate-laying algorithm according to claim 2, it is characterized in that step S3 is calculated using the intelligent plate-laying of left accumulation
Method, it is that can be packed into preferentially that SET, which is discharged to the heuristic rule on PANEL,：In a certain range, according to loading from rectangular-shaped piece to be installed
Sequence searches width successively or height is not more than level of subsistence ekThe rectangle of width, and if it exists, be then loaded into；If existing more
It is a, then be packed into the maximum rectangle of area, may be generated on level of subsistence it is new, smaller can feeding area, simultaneously so that
Smaller rectangle delay is packed into.
7. pcb board intelligence plate-laying algorithm according to claim 2, it is characterized in that step S3 is calculated using the intelligent plate-laying of left accumulation
Method, heuristic rule SET being discharged on PANEL：It can not arrange
For recycles plate number i
If the length of plate i and the wide width for being both greater than level of subsistence
The ordinate of level of subsistence is updated to the ordinate of time level of subsistence
If with left lower than right, the ordinate of level of subsistence is updated to left horizontal line ordinate
It is responsible for being updated to right horizontal line ordinate.
8. the pcb board intelligence plate-laying algorithm according to claim 2-7, it is characterized in that the left accumulation plate-laying algorithms of step S3.3
Realize that steps are as follows：
(1) input quantity is：PANEL (width length), plate I, output quantity are：Y,
(2) data initialization, E, I, y,
(3) for i=1:n
(5) are gone to step if exactly matched,
If width matching is gone to step (5)
If matched goes to step (5),
If can be packed into matching goes to step (5),
If can not be packed into matching goes to step (5),
(4) merge the side in E,
(5) i-th of plate in set I is put into level of subsistence ekOn；
If do not rotated：Y=max (y, I (j) .y+I (j) .h)
If rotation：Y=max (y, I (j) .y+I (j) .w)
(3) are gone to step until plate I is sky.
9. pcb board intelligence plate-laying algorithm according to claim 1, it is characterized in that the reality of the improved single solution for diverse problems algorithms of step S5
It is existing that steps are as follows：
(1) minimum value of broadside：min_wide；
(2) it calculates：The gross area of working plate divided by the area of plate of material round up：Number puts into the number of plate of material：N=
number+a
A=0,1,2,3,4, can be very much, a prodigious number can be given
Original material plate set M：The first plate of material of n blocks；
(3) while is recycled, until PNL is sky
If the number of PNL working plates is 1：
Directly working plate is come in plate of material, the length of working plate, the width of working plate is placed along the wide direction of plate of material, along
It places in the direction of plate of material length
Lower-left angle alignment；
It is other：
Longth=working plates most greatly enhance+it secondary greatly enhances；
If in working plate, Longth>The width and Longth of=material<The length of=material (long according to working plate intercepts)
MAX_ROOM long：The width of plate of material
MAX_ROOM wide：The length of the length of plate of material-longest working plate
MIN_ROOM long：The width of width-working plate of plate of material
MIN_ROOM wide：The length of working plate
The first bulk flitch in MAX_ROOM MIN_ROOM alternate material plate set；
Update collection of material M；
If：The minimum value of MAX_ROOM is less than min_wide
MAX_ROOM is then thrown plate of material set
If：The minimum value of MIN_ROOM is less than min_wide
MIN_ROOM is then thrown plate of material set
elseif：If the length for being wider than plate of material of working plate
First piece of working plate is removed, remaining working plate, cycle
If the width of working plate is less than the length of plate of material
This plate of material is taken out from collection of material
This working plate is taken out from working plate set
It is other：
MAX_ROOM long：The length of plate of material
MAX_ROOM wide：The length of the width of plate of material-longest working plate
MIN_ROOM long：The width of length-working plate of plate of material
MIN_ROOM wide：The length of working plate
If：The minimum value of MAX_ROOM is less than min_wide
MAX_ROOM is then thrown plate of material set
If：The minimum value of MIN_ROOM is less than min_wide
MIN_ROOM is then thrown plate of material set
Until working plate collection is combined into sky, cycle is exited.
10. pcb board intelligence plate-laying algorithm according to claim 1, it is characterized in that the restrictive condition in pcb board production process
It is as follows：
(1) pcb board of difference ID, constitutes different SET；
(2) pcb board of difference ID, can there is identical thickness；
(3) SET for differing thickness cannot centainly can come on the same PANEL；
(4) SET of identical number of plies same thickness, which can be considered, comes on the same PANEL；
(5) the different numbers of plies but the SET with same thickness, it may be considered that come on the same PANEL；
(6) SET of same thickness, different ink can come on PANEL, but gap is needed to separate；
(7) SET of same thickness, different surface treatment can come on PANEL, but gap is needed to separate；
(8) SET of same thickness, different ink when different surface treatment, first consider ink, consider further that surface treatment, but necessary
Gap is needed to separate.
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