CN108754385B - A kind of printing process of low-melting-point metal - Google Patents
A kind of printing process of low-melting-point metal Download PDFInfo
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- CN108754385B CN108754385B CN201810651686.9A CN201810651686A CN108754385B CN 108754385 B CN108754385 B CN 108754385B CN 201810651686 A CN201810651686 A CN 201810651686A CN 108754385 B CN108754385 B CN 108754385B
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- melting
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- point metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
Abstract
The present invention provides a kind of printing process of low-melting-point metal, is related to printing technology.The printing process of the low-melting-point metal provided by the invention includes: step S1, provides a substrate, and the substrate surface does not adhere to low-melting-point metal；Step S2, the substrate surface can be adhered in selection, and the ink of the low-melting-point metal can be adhered；Step S3, target pattern is printed in the substrate surface ink；Step S4, make the ink solidification of the substrate surface；Step S5, the low-melting-point metal is printed in the substrate surface.Technical solution of the present invention can print low-melting-point metal on the substrate surface for not adhering to low-melting-point metal, expand the application range of low-melting-point metal.
Description
Technical field
The present invention relates to printing technology more particularly to a kind of printing processes of low-melting-point metal.
Background technique
Low-melting-point metal is quickly grown in recent years as a kind of unique emerging functional material of physicochemical properties.But by
It is very big in low-melting-point metal surface tension, it is not adhered between substrate used with most printings, so that can not be in substrate surface
On directly print low-melting-point metal, limit the application of low-melting-point metal.
Summary of the invention
The embodiment of the present invention provides a kind of printing process of low-melting-point metal, can be in the substrate for not adhering to low-melting-point metal
Low-melting-point metal is printed on surface, expands the application range of low-melting-point metal.
The embodiment of the present invention provides a kind of printing process of low-melting-point metal, adopts the following technical scheme that
The printing process of the low-melting-point metal includes:
Step S1, a substrate is provided, the substrate surface does not adhere to low-melting-point metal；
Step S2, the substrate surface can be adhered in selection, and the ink of the low-melting-point metal can be adhered；
Step S3, target pattern is printed in the substrate surface ink；
Step S4, make the ink solidification of the substrate surface；
Step S5, the low-melting-point metal is printed in the substrate surface.
Optionally, in step S1, the substrate be printing paper, paper jam, brown paper, art paper, aramid paper, copper foil, iron foil,
Polyethylene film, POLYCARBONATE SHEET, Kapton, teflon plate, cotton, burlap, silk fabric, woven dacron, polyamide fibre
One of cloth, Polypropylene, viscose rayon cloth, non-dust cloth, acetate fibre cloth.
Optionally, in step S2, the ink is water-based ink, oiliness from the ink that the volatilizees, ink that is heating and curing, ultraviolet solid
One of carburetion ink, electron beam curing ink, laser curing ink.
Optionally, in step S3, pass through steel mesh printing, silk-screen printing, ink jet printing, ultraviolet printing, intaglio printing, relief printing plate
One of printing, offset printing, thermal transfer printing, electrostatic printing mode print target pattern with the ink.
Optionally, in step S4, the mode of the ink solidification includes room temperature curing, be heating and curing, ultraviolet lighting solidification,
At least one of electron beam radiation curable, laser curing.
Optionally, it is described in the substrate table in step S5 when the fusing point of the low-melting-point metal is equal to or less than room temperature
It includes: to print the low-melting-point metal of liquid to the substrate surface that the low-melting-point metal is printed in face；The low melting point
When the fusing point of metal is higher than room temperature, in step S5, described to print the low-melting-point metal in the substrate surface include: to solid-state
The low-melting-point metal heated, make the low-melting-point metal be completely melt to be in a liquid state, by the low melting point of liquid gold
Belong to printing to the substrate surface.
Further, described print the low-melting-point metal of liquid to the substrate surface includes:
The low-melting-point metal of even spread liquid on roller, with the roller with the first preset pressure in the base
Material rolls on surface, prints low-melting-point metal in the substrate surface；Alternatively,
The low-melting-point metal of even spread liquid, the substrate is attached on the horizontal platform on horizontal platform,
Under the action of the second preset pressure, the substrate surface print low-melting-point metal, and after the printing by the substrate with
The horizontal platform separation；Alternatively,
The low-melting-point metal of liquid is packed into container, the substrate is immersed in the container and carries out impregnation
It is taken out after default dip time；Alternatively,
The low-melting-point metal of liquid is filling into watering can, it will under the action of third preset pressure with the watering can
The low-melting-point metal of liquid is sprayed onto the substrate surface.
Further, the target thickness of the low-melting-point metal printed according to the material of the substrate and needs, to described
One preset pressure, second preset pressure, the third preset pressure or the default dip time are selected.
Optionally, the roller is heatable roller, and the horizontal platform is heatable horizontal platform, and the container is can
The container of heating, the watering can are heatable watering can.
Optionally, the low-melting-point metal is fusing point in 300 DEG C of low-melting-point metal simple substance below, fusing point 300 DEG C with
Under low-melting alloy, alternatively, fusing point is in 300 DEG C of blends below, the blend include the low-melting-point metal simple substance,
At least two in the low-melting alloy and function powder.
A kind of printing process of low-melting-point metal provided in an embodiment of the present invention is not adhering to eutectic using the printing process
The process of the substrate surface printing low-melting-point metal of point metal is as follows: selecting adhesive substrate surface, and adhesive eutectic first
Then the ink of point metal prints target pattern in substrate surface ink, then makes the ink solidification of substrate surface, finally exist
Substrate surface prints low-melting-point metal, since low-melting-point metal does not adhere to substrate surface, but ink is adhered to, therefore, in substrate table
After low-melting-point metal is printed in face, low-melting-point metal is only covered on ink, substrate surface other positions are covered without low-melting-point metal
Lid, so that the figure of low-melting-point metal is identical as preset pattern, that is, realizes low-melting-point metal and is not adhering to low-melting-point metal
It is printed on substrate surface, expands the application range of low-melting-point metal.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the flow chart of the printing process of low-melting-point metal provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
It should be noted that each technical characteristic in the embodiment of the present invention can be tied mutually in the absence of conflict
It closes.
The embodiment of the present invention provides a kind of printing process of low-melting-point metal, and specifically, as shown in FIG. 1, FIG. 1 is the present invention
The flow chart of the printing process for the low-melting-point metal that embodiment provides, the printing process of the low-melting-point metal include:
Step S1, a substrate is provided, substrate surface does not adhere to low-melting-point metal；
The fusing point of low-melting-point metal in the embodiment of the present invention is at 300 DEG C or less.
Optionally, substrate is printing paper, paper jam, brown paper, art paper, aramid paper, copper foil, iron foil, polyethylene film, gathers
Polycarbonate sheet, Kapton, teflon plate, cotton, burlap, silk fabric, woven dacron, polyamide cloth, Polypropylene, viscose glue
One of fiber cloth, non-dust cloth (70% terylene, 30% nylon woven fabric), acetate fibre cloth etc..
Wherein it is possible to determine which kind of substrate be specifically chosen according to practical application.For example, being applied to fabric (such as clothes)
In, then it can choose cotton, burlap, silk fabric, woven dacron, polyamide cloth, Polypropylene, viscose rayon cloth, non-dust cloth, acetate fiber
One of cloth etc.；Applied in packaging, then it can choose brown paper, polyethylene film, Kapton, polytetrafluoroethylene (PTFE)
One of piece etc.；Applied in functional circuit, then it can choose art paper, polycarbonate, cotton fabric etc.；It is opened applied to film
The Central Shanxi Plain then can choose POLYCARBONATE SHEET etc..
It should be noted that whether substrate surface, which adheres to low-melting-point metal, can carry out printing determination by experiment, it can also
To be determined by following relatively simple mode: by substrate slant setting on testboard, the tilt angle of substrate is 20 °, is made
Low-melting-point metal drop (volume is the 80 μ L of μ L~120, by taking 80 μ L as an example) is dripped from certain altitude (2cm~5cm, by taking 2cm as an example)
It drops down on substrate surface, if substrate surface is remained without low-melting-point metal, then it represents that substrate surface does not adhere to low-melting-point metal, if base
There is low-melting-point metal residual on material surface, then it represents that substrate surface adheres to low-melting-point metal.
Step S2, adhesive substrate surface, and the ink of adhesive low-melting-point metal are selected；
Wherein it is possible to according to the adhesiveness of ink and substrate surface, and selected with the adhesiveness of low-melting-point metal etc.
It selects.Optionally, in step S2, ink is water-based ink, oiliness from volatilizing ink, the ink that is heating and curing, uv curing ink, electricity
One of beamlet cured printing ink, laser curing ink.
Similarly, ink whether adhere to low-melting-point metal and ink whether adhere to substrate surface can by test into
Row printing determines whether can also adhere to the similar mode of low-melting-point metal by the determination substrate surface with the foregoing description and carry out
It determines, is no longer repeated herein.
Step S3, target pattern is printed in substrate surface ink；
Wherein it is possible to according to the substrate of selection, and the ink of selection selects required mode.Optionally, it walks
In rapid S3, pass through steel mesh printing, silk-screen printing, ink jet printing, ultraviolet printing, intaglio printing, letterpress, offset printing, heat
One of hectographic printing, electrostatic printing mode print target pattern with ink.
Step S4, make the ink solidification of substrate surface；
Wherein it is possible to according to the ink of selection, and the substrate of selection selects the mode of ink solidification.It is optional
Ground, in step S4, the mode of ink solidification includes room temperature curing, be heating and curing, ultraviolet lighting solidification, electron beam radiation curable,
At least one of laser curing.
Step S5, low-melting-point metal is printed in substrate surface.
Optionally, when the fusing point of low-melting-point metal is equal to or less than room temperature, in step S5, low melting point is printed in substrate surface
Metal includes: to print the low-melting-point metal of liquid to substrate surface；When the fusing point of low-melting-point metal is higher than room temperature, step S5
In, include: to be heated to solid low-melting-point metal in substrate surface printing low-melting-point metal, keeps low-melting-point metal completely molten
Change is in a liquid state, and the low-melting-point metal of liquid is printed to substrate surface.
The too low solidification of low-melting-point metal temperature or viscosity can not print greatly very much in printing process in order to prevent, step S5
In substrate surface print low-melting-point metal when operating temperature can be higher than low-melting-point metal fusing point.Base can specifically be combined
Material can the fusing point of bearing temperature and low-melting-point metal reasonably selected.
The low-melting-point metal of liquid can be printed in several ways to substrate surface, below in the embodiment of the present invention
Carry out citing description:
In first example (corresponding subsequent embodiment 1,2,3,4), the low melting point gold of even spread liquid on roller
Belong to, rolled on substrate surface with roller with the first preset pressure, prints low-melting-point metal in substrate surface.
In actual use, the target thickness for the low-melting-point metal that can be printed according to the material and needs of substrate,
First preset pressure is selected, so that the first preset pressure does not exceed pressure limit when substrate does not adhere to, is made low
Melting point metals will not be printed onto the position other than ink, and can print the low melting point gold with target thickness in substrate surface
Belong to.
Optionally, roller is heatable roller, not only can be during printing low-melting-point metal to low melting point gold
Category is heated, and prevents that low-melting-point metal from solidifying or viscosity is excessive to print, can also be directly by solid low melting point
More than METAL HEATING PROCESS to its fusing point, liquid is become, and carry out subsequent printing.
In second example (corresponding subsequent embodiment 5), the low-melting-point metal of even spread liquid on horizontal platform will
Substrate is attached on horizontal platform, under the action of the second preset pressure, prints low-melting-point metal in substrate surface, and in printing
Substrate is separated with horizontal platform afterwards.
In actual use, the target thickness for the low-melting-point metal that can be printed according to the material and needs of substrate,
Second preset pressure is selected, so that the second preset pressure does not exceed pressure limit when substrate does not adhere to, is made low
Melting point metals will not be printed onto the position other than ink, and can print the low melting point gold with target thickness in substrate surface
Belong to.
Optionally, horizontal platform is heatable horizontal platform, not only can be during printing low-melting-point metal to eutectic
Point metal is heated, and prevents that low-melting-point metal from solidifying or viscosity is excessive to print, can also directly will be solid low
Melting point metals are heated to its fusing point or more, become liquid, and carry out subsequent printing.
In third example (corresponding subsequent embodiment 7,8), the low-melting-point metal of liquid is packed into container, by substrate
Progress impregnation in container is immersed to take out after default dip time (such as 10s).
In actual use, the target thickness for the low-melting-point metal that can be printed according to the material and needs of substrate,
Default dip time is selected, so that low-melting-point metal will not be printed onto the position other than ink, and can be in substrate
Surface printing has the low-melting-point metal of target thickness.
Optionally, container is heatable container, not only can be during printing low-melting-point metal to low melting point gold
Category is heated, and prevents that low-melting-point metal from solidifying or viscosity is excessive to print, can also be directly by solid low melting point
More than METAL HEATING PROCESS to its fusing point, liquid is become, and carry out subsequent printing.
It is in the 4th example (corresponding subsequent embodiment 6), the low-melting-point metal of liquid is filling into watering can, use watering can
The low-melting-point metal of liquid is sprayed onto substrate surface under the action of third preset pressure.
In actual use, the target thickness for the low-melting-point metal that can be printed according to the material and needs of substrate,
Third preset pressure is selected, so that third preset pressure does not exceed pressure limit when substrate does not adhere to, is made low
Melting point metals will not be printed onto the position other than ink, and can print the low melting point gold with target thickness in substrate surface
Belong to.
Optionally, watering can is heatable watering can, not only can be during printing low-melting-point metal to low melting point gold
Category is heated, and prevents that low-melting-point metal from solidifying or viscosity is excessive to print, can also be directly by solid low melting point
More than METAL HEATING PROCESS to its fusing point, liquid is become, and carry out subsequent printing.
Wherein, the thickness of the low-melting-point metal printed using the mode in first example and second example compared with
It is small, it is minimum up to 1~2 μm.Use the thickness for the low-melting-point metal that the mode in third example and the 4th example is printed
Spend it is larger, usually 10 μm or more.It can be adjusted into the 4th example by the number repeated print in first example
Print the thickness of obtained low-melting-point metal.
In addition, the printing process of the low-melting-point metal in the embodiment of the present invention can also include to step S5 resulting product into
The step of row post-processing is to obtain required product, above-mentioned post-processing may include component attachment, sealing, solidify, cuts out, pack
One or more of Deng.
Optionally, the low-melting-point metal in the embodiment of the present invention is fusing point in 300 DEG C of low-melting-point metal simple substance below, is melted
O'clock in 300 DEG C of low-melting alloys below, alternatively, fusing point, in 300 DEG C of blends below, blend includes low-melting-point metal list
At least two in matter, low-melting alloy and function powder, i.e. blend includes low-melting-point metal simple substance and low-melting alloy, or
Person, blend include low-melting alloy and function powder, alternatively, blend includes low-melting-point metal simple substance and function powder, or
Person, blend include low-melting-point metal simple substance, low-melting alloy and function powder.
Illustratively, low-melting-point metal simple substance can be mercury simple substance, gallium simple substance, indium simple substance or tin simple substance.
Illustratively, low-melting alloy can be gallium-indium alloy, gallium-indium-tin alloy, gallium tin alloy, gallium kirsite, gallium indium zinc
Alloy, gallium red brass, gallium indium red brass, gallium tin cadmium alloy, gallium Zn-Cd alloy, bismuth indium alloy, bismuth tin alloy, bismuth indium tin close
Gold, bismuth indium kirsite, bismuth red brass, bismuth indium red brass, bismuth indium leypewter, bismuth tin cadmium alloy, bismuth terne metal, bismuth tin
One of lead and cadmium alloy, leypewter, gun-metal, red brass, tin pltine and Tin Silver Copper Alloy.
Illustratively, function powder can be nickel simple substance, iron simple substance, titanium simple substance, zinc simple substance, silver-colored simple substance, copper simple substance, oxidation
Iron, copper oxide, zinc oxide, carbon dust, graphene, carbon nanotube, silica, boron nitride, bentonite, at least one in kaolin
Kind.
A kind of printing process of low-melting-point metal provided in an embodiment of the present invention is not adhering to eutectic using the printing process
The process of the substrate surface printing low-melting-point metal of point metal is as follows: selecting adhesive substrate surface, and adhesive eutectic first
Then the ink of point metal prints target pattern in substrate surface ink, then makes the ink solidification of substrate surface, finally exist
Substrate surface prints low-melting-point metal, since low-melting-point metal does not adhere to substrate surface, but ink is adhered to, therefore, in substrate table
After low-melting-point metal is printed in face, low-melting-point metal is only covered on ink, substrate surface other positions are covered without low-melting-point metal
Lid, so that the figure of low-melting-point metal is identical as preset pattern, that is, realizes low-melting-point metal and is not adhering to low-melting-point metal
It is printed on substrate surface, expands the application range of low-melting-point metal.
In order to facilitate understanding by those skilled in the art with implement the embodiment of the present invention in low-melting-point metal printing process,
The embodiment of the present invention carries out citing description with several specific embodiments below.
Embodiment 1, art paper surface printing low-melting-point metal functional circuit, detailed process is as follows:
(1) epoxies ink for screen printing is gone out into circuit diagram in art paper surface printing with silk screen print method；
(2) art paper that circuit diagram is printed in step (1) is placed into 30s at room temperature, it is completely solid to ink thereon
Change；
(3) the low melting point gold for being 11 DEG C (Ga67%In20.5%Sn12.5%, above to be weight percentage) by fusing point
Belong to preparatory roller coating on polyurethane roll, using the roller of above-mentioned even spread low-melting-point metal with the pressure of 0.5MPa in step
(2) it is rolled on resulting art paper surface, so that low-melting-point metal is adhered on ink.
(4) component attachment, sealing processing are carried out to step (3) resulting product, rear low melting point gold to obtain the final product is cut out in adhesive curing
Function of dominant circuit.
The printing process print resulting low-melting-point metal with a thickness of 2 microns, line width is 0.5 millimeter, and length is 100 millis
The resistance of the lines of rice is about 2.8 ohm, and electric conductivity is preferable.
Embodiment 2, brown paper surface printing low-melting-point metal packaging pattern, detailed process is as follows:
(1) water-based polyurethane ink for screen printing is gone out into pattern in brown paper surface printing with silk screen print method；
(2) brown paper for having printed pattern in step (1) is placed into 60s at room temperature, is fully cured to ink thereon；
(3) by be 11 DEG C comprising 4% nickel powder and fusing point low-melting alloy (Ga67%In20.5%Sn12.5%, it is above
It is weight percentage) the preparatory roller coating of low-melting-point metal on polyurethane roll, utilizes above-mentioned even spread low-melting-point metal
Roller is rolled on the resulting brown paper surface of step (2) with the pressure of 1.0MPa, so that low-melting-point metal is adhered on ink.
(4) sealing processing is carried out to step (3) resulting product, to get low-melting-point metal packaging pattern after adhesive curing.
The printing process prints the thickness of resulting low-melting-point metal packaging pattern up to 1 micron, and in low-melting-point metal
Nickel powder make the glossiness of low-melting-point metal packaging pattern fine, can match in excellence or beauty boiling hot silver process.
Embodiment 3, POLYCARBONATE SHEET surface printing low-melting-point metal circuit prepare thin film switch, and detailed process is as follows:
(1) uv curing ink is gone out into circuit diagram in POLYCARBONATE SHEET surface printing with ink-jet printing；
(2) POLYCARBONATE SHEET that circuit diagram is printed in step (1) is irradiated into 2s under ultraviolet light, it is complete to ink thereon
All solidstate；
(3) the low melting point gold for being 11 DEG C (Ga67%In20.5%Sn12.5%, above to be weight percentage) by fusing point
Belong to preparatory roller coating on polyurethane roll, using the roller of above-mentioned even spread low-melting-point metal with the pressure of 0.2MPa in step
(2) it is rolled on resulting POLYCARBONATE SHEET surface, so that low-melting-point metal is adhered on ink.
(4) step (3) resulting product is glued to get the thin film switch including low-melting-point metal circuit.
The thickness that resulting low-melting-point metal is printed in the printing process is only 5 microns, and can realize that film is opened by pressing
The function of pass.
Embodiment 4, cotton surface prints low-melting-point metal RFID, and (Radio Frequency Identification, is penetrated
Frequency identifies) label, detailed process is as follows:
(1) uv curing ink is printed out into RFID label tag figure in cotton surface with ink-jet printing；
(2) cotton that RFID label tag figure is printed in step (1) is irradiated into 5s under ultraviolet light, it is complete to ink thereon
Solidification；
(3) fusing point is pre- for the low-melting-point metal of 15.5 DEG C (Ga75.5%In24.5%, above to be weight percentage)
First roller coating is on polyurethane roll, using the roller of above-mentioned even spread low-melting-point metal with the pressure of 0.6MPa in step (2)
It is rolled on resulting face, so that low-melting-point metal is adhered on ink.
(4) chip attachment is carried out to get low-melting-point metal RFID label tag to step (3) resulting product.
The thickness that resulting low-melting-point metal is printed in the printing process is only 3.5 microns, and identification can be achieved after pasting chip
Function.
Embodiment 5, the stretchable flexible circuit of non-dust cloth surface printing low-melting-point metal, detailed process is as follows:
(1) polyureas ink for screen printing is gone out into circuit diagram in non-dust cloth surface printing with silk screen print method；
(2) non-dust cloth that circuit diagram is printed in step (1) is placed into 30min in 60 DEG C of baking ovens, to ink thereon
It is fully cured；
(3) fusing point is pre- for the low-melting-point metal of 15.5 DEG C (Ga75.5%In24.5%, above to be weight percentage)
First on horizontal platform even spread, non-dust cloth obtained in step (2) is attached on above-mentioned horizontal platform, with clean roller with
The pressure of 0.3MPa separates non-dust cloth with horizontal platform after so that non-dust cloth is fitted closely 10s with the low-melting-point metal on horizontal platform；
(4) elastic gum encapsulation process, adhesive curing, that it(?) can up to low-melting-point metal after cutting out are carried out to step (3) resulting product
Tensile elasticity circuit.
The printing process prints the thickness of resulting low-melting-point metal up to 30 microns.It is flowable due to low-melting-point metal
Property, it is ensured that circuit still keeps conduction state during stretching.2 millimeters wide, long 100 millimeters of conducting wire is extended in non-dust cloth
When rate is 20%, the resistance of conducting wire becomes 38 ohm from 18 ohm, and electric conductivity is still preferable.
Embodiment 6, Polypropylene surface printing low-melting-point metal RFID label tag, detailed process is as follows:
(1) water soluble acrylic acid ink is printed into out RFID label tag figure on Polypropylene surface with silk screen print method；
(2) Polypropylene that label figure is printed in step (1) is placed into 2min at room temperature, it is completely solid to ink thereon
Change；
(3) fusing point is pre- for the low-melting-point metal of 15.5 DEG C (Ga75.5%In24.5%, above to be weight percentage)
It is first filling in watering can, Polypropylene obtained in watering can nozzle and step (3) is kept into 15cm, is sprayed with the pressure of 3.0MPa
It penetrates, low-melting-point metal is sprayed onto Polypropylene surface；
(4) chip attachment, sealing processing are carried out to get low-melting-point metal RFID label tag to step (3) resulting product.
The thickness that resulting low-melting-point metal is printed in the printing process is only 4 microns, and identification function can be achieved after pasting chip
Energy.
Embodiment 7, polytetrafluoroethylene (PTFE) (PTFE) piece surface printing low-melting-point metal packaging pattern, detailed process is as follows:
(1) UV cure epoxy esters of acrylic acid ink is gone out to pack figure in sheet of PTFE surface printing with ink-jet printing
Case；
(2) sheet of PTFE that packaging pattern is printed in step (1) is irradiated into 5s under ultraviolet light, it is complete to ink thereon
Solidification；
(3) low-melting-point metal (Sn40%Bi56%In4%, above to be weight percentage) that fusing point is 130 DEG C is put
Enter in the container for being heated to 200 DEG C, after low-melting-point metal is molten into liquid, sheet of PTFE obtained in step (2) is immersed
It states and is taken out after impregnating 10s in the container equipped with low-melting-point metal；
(4) step (3) resulting product places 5min at room temperature up to low-melting-point metal packaging pattern.
The printing process print resulting low-melting-point metal packaging pattern with a thickness of 1.5 microns, and there is preferable gold
Belong to gloss, can match in excellence or beauty boiling hot silver process, can be directly used for commodity packaging.
Embodiment 8, printing paper (cellulose paper) surface printing low-melting-point metal circuit, detailed process is as follows:
It (1) will be by carbon and epoxy resin electrostatic printing ink on printing paper (cellulose paper) surface with videograph
Print out circuit diagram；
(2) printing paper that circuit diagram is printed in step (1) is stood into 1s at room temperature, it is completely solid to ink thereon
Change；
(3) eutectic containing 25% carbon dust and low-melting alloy (Ga67%In20.5%Sn12.5%) for being 11 DEG C by fusing point
Point metal pours into container, and printing paper obtained in step (2) is immersed in the above-mentioned container equipped with low-melting-point metal and impregnates 10s
After take out；
(4) step (3) resulting product carries out sealing processing, after drying, cutting out.
The resulting low-melting-point metal circuit of printing process printing is electrically conductive, with a thickness of 20 microns, wide 2mm, long 100mm's
The resistance of lines is 5.6 ohm.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of printing process of low-melting-point metal characterized by comprising
Step S1, a substrate is provided, the substrate surface does not adhere to low-melting-point metal；
Step S2, the substrate can be adhered in selection, and the ink of the low-melting-point metal can be adhered；
Step S3, target pattern is printed in the substrate surface ink；
Step S4, make the ink solidification of the substrate surface, only the cured ink is adhesive on the substrate surface
The low-melting-point metal；
Step S5, the low-melting-point metal of liquid is in substrate surface printing, the low-melting-point metal is only adhered to
On the ink, low-melting-point metal figure is obtained.
2. printing process according to claim 1, which is characterized in that in step S1, the substrate be printing paper, paper jam,
Brown paper, art paper, aramid paper, copper foil, iron foil, polyethylene film, POLYCARBONATE SHEET, Kapton, polytetrafluoroethylene (PTFE)
Piece, cotton, burlap, silk fabric, woven dacron, polyamide cloth, Polypropylene, viscose rayon cloth, non-dust cloth, one in acetate fibre cloth
Kind.
3. printing process according to claim 1, which is characterized in that in step S2, the ink is water-based ink, oiliness
From one of volatilization ink, the ink that is heating and curing, uv curing ink, electron beam curing ink, laser curing ink.
4. printing process according to claim 1, which is characterized in that in step S3, by steel mesh printing, silk-screen printing,
One of ink jet printing, ultraviolet printing, intaglio printing, letterpress, offset printing, thermal transfer printing, electrostatic printing mode,
Target pattern is printed with the ink.
5. printing process according to claim 1, which is characterized in that in step S4, the mode of the ink solidification includes
Room temperature curing is heating and curing, ultraviolet lighting solidification, electron beam radiation curable, at least one of laser curing.
6. printing process according to claim 1, which is characterized in that
It is described described in the substrate surface printing in step S5 when the fusing point of the low-melting-point metal is equal to or less than room temperature
Low-melting-point metal includes: to print the low-melting-point metal of liquid to the substrate surface；
It is described to print the low melting point in the substrate surface in step S5 when the fusing point of the low-melting-point metal is higher than room temperature
Metal includes: to heat to the solid low-melting-point metal, makes the low-melting-point metal be completely melt to be in a liquid state, by liquid
The low-melting-point metal print to the substrate surface.
7. printing process according to claim 6, which is characterized in that it is described by the low-melting-point metal of liquid print to
The substrate surface includes:
The low-melting-point metal of even spread liquid on roller, with the roller with the first preset pressure in the substrate table
It is rolled on face, prints low-melting-point metal in the substrate surface；Alternatively,
The low-melting-point metal of even spread liquid, the substrate is attached on the horizontal platform on horizontal platform,
Under the action of two preset pressures, the substrate surface print low-melting-point metal, and after the printing by the substrate with it is described
Horizontal platform separation；Alternatively,
The low-melting-point metal of liquid is packed into container, the substrate is immersed in the container and carries out impregnation through pre-
If being taken out after dip time；Alternatively,
The low-melting-point metal of liquid is filling into watering can, with the watering can by liquid under the action of third preset pressure
The low-melting-point metal be sprayed onto the substrate surface.
8. printing process according to claim 7, which is characterized in that printed according to the material of the substrate and needs low
The target thickness of melting point metals, to first preset pressure, second preset pressure, the third preset pressure or institute
Default dip time is stated to be selected.
9. printing process according to claim 7, which is characterized in that the roller is heatable roller, the level
Platform is heatable horizontal platform, and the container is heatable container, and the watering can is heatable watering can.
10. printing process according to claim 1, which is characterized in that the low-melting-point metal is fusing point at 300 DEG C or less
Low-melting-point metal simple substance, fusing point is in 300 DEG C of low-melting alloys below, alternatively, fusing point is in 300 DEG C of blends below, institute
Stating blend includes at least two in the low-melting-point metal simple substance, the low-melting alloy and function powder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651686.9A CN108754385B (en) | 2018-06-22 | 2018-06-22 | A kind of printing process of low-melting-point metal |
| PCT/CN2019/092313 WO2019242744A1 (en) | 2018-06-22 | 2019-06-21 | Method for printing low-melting-point metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651686.9A CN108754385B (en) | 2018-06-22 | 2018-06-22 | A kind of printing process of low-melting-point metal |
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| CN108754385A CN108754385A (en) | 2018-11-06 |
| CN108754385B true CN108754385B (en) | 2019-08-16 |
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| CN201810651686.9A Active CN108754385B (en) | 2018-06-22 | 2018-06-22 | A kind of printing process of low-melting-point metal |
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| Country | Link |
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| WO (1) | WO2019242744A1 (en) |
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| CN108754385B (en) * | 2018-06-22 | 2019-08-16 | 北京梦之墨科技有限公司 | A kind of printing process of low-melting-point metal |
| CN108770222B (en) * | 2018-06-22 | 2019-07-09 | 北京梦之墨科技有限公司 | A kind of printing process of low-melting-point metal |
| CN111318704B (en) * | 2018-12-14 | 2022-03-25 | 中国科学院理化技术研究所 | Device and method for 3D printing of porous metal material |
| CN111385978B (en) * | 2018-12-29 | 2021-06-01 | 北京梦之墨科技有限公司 | Double-layer circuit and manufacturing method thereof |
| WO2023122207A1 (en) * | 2021-12-22 | 2023-06-29 | Indium Corporation | Liquid metal paste containing metal particle additive |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005262702A (en) * | 2004-03-19 | 2005-09-29 | Konica Minolta Medical & Graphic Inc | Printing plate material and printing plate |
| CN103183979B (en) * | 2011-12-27 | 2014-11-05 | 比亚迪股份有限公司 | Ink composition and application for same, as well as product with selectively-metallized surface and preparation method for same |
| CN103657748B (en) * | 2012-09-25 | 2015-12-09 | 中国科学院理化技术研究所 | Printing-type papery micro-fluid chip and preparation method |
| CN103042849B (en) * | 2012-12-28 | 2015-09-02 | 深圳市柏星龙创意包装股份有限公司 | Embossment gilding technology |
| CN105873370A (en) * | 2016-04-26 | 2016-08-17 | 北京梦之墨科技有限公司 | Printing method and device for inkjet and liquid metal mixed printing and product |
| KR102597172B1 (en) * | 2016-11-08 | 2023-11-02 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
| CN107336551A (en) * | 2017-08-22 | 2017-11-10 | 郑晓波 | A kind of positioning and non-locating heat convex gold stamping transfer method and device |
| CN108754385B (en) * | 2018-06-22 | 2019-08-16 | 北京梦之墨科技有限公司 | A kind of printing process of low-melting-point metal |
| CN108770222B (en) * | 2018-06-22 | 2019-07-09 | 北京梦之墨科技有限公司 | A kind of printing process of low-melting-point metal |
-
2018
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| Publication number | Publication date |
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| WO2019242744A1 (en) | 2019-12-26 |
| CN108754385A (en) | 2018-11-06 |
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