CN108746979A - A kind of aluminum bronze target and its welding method - Google Patents
A kind of aluminum bronze target and its welding method Download PDFInfo
- Publication number
- CN108746979A CN108746979A CN201810632976.9A CN201810632976A CN108746979A CN 108746979 A CN108746979 A CN 108746979A CN 201810632976 A CN201810632976 A CN 201810632976A CN 108746979 A CN108746979 A CN 108746979A
- Authority
- CN
- China
- Prior art keywords
- target
- welding
- copper alloy
- backing plate
- rafifinal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Abstract
A kind of welding method of aluminum bronze target, it is related to sputtering target material field, its elder generation plates titanium film or nickel film on copper alloy backing plate, pass through the good diffusion performance between titanium film or nickel film and rafifinal, increase the bond strength between copper alloy backing plate and rafifinal target, realizes rafifinal target and the welding of copper alloy backing plate at a lower temperature.The welding method is simple to operate, while avoiding the abnormal grain growth of rafifinal target, obtains the aluminum bronze target of high bond strength.A kind of aluminum bronze target, it uses the welding method of above-mentioned aluminum bronze target to weld to obtain, and compared with existing soldering target, the bond strength between the rafifinal target and copper alloy backing plate of the aluminum bronze target is high, and high temperature resistant, the sputtering operation that can be preferably applied under high temperature.
Description
Technical field
The present invention relates to sputtering target material fields, in particular to a kind of aluminum bronze target and its welding method.
Background technology
Sputtering target material is mainly used in electronics and information industry, such as integrated circuit, information storage, liquid crystal display, laser
Memory, electronic control device etc.;It is equally applicable for coating film on glass field;Can also be applied to wear-resistant material, high temperature is anti-corrosion, high
The industries such as shelves adornment.It is the indispensable consumable material of PVD (physical vapour deposition (PVD)) technique.
Vacuum coating uses fine aluminium target to generally require the Cu alloy material of high strength & high electric-conduction and high-termal conductivity as the back of the body
Plate is welded with it.In the prior art, frequently with the mode of soldering, rafifinal target and copper alloy backing plate are welded together, but
Since soldering solder melt point is low, such as when board sputters, temperature will lead to desoldering to target more than 200 DEG C because solder melts, institute
With for using the longer aluminum bronze target of sputter life that cannot use soldering, and Diffusion Welding is a kind of heat safe weldering well
Connect mode.
Diffusion Welding refers to the material surface to contact with each other, close to each other under the action of temperature and pressure, is locally occurred
It is plastically deformed, phase counterdiffusion is generated between atom, forms new diffusion layer in interface, be reliably connected to realize.For high-purity
For aluminium and Cu alloy material, to make the diffusion of the two at low temperature is highly difficult together, that is, allows to combine, in conjunction with
The requirement of sputtering target material is also not achieved in intensity.However, the recrystallization temperature of high-purity aluminum material is low, as heat treatment temperature increases,
The problem of crystal grain is drastically grown up, at high temperature Diffusion Welding, and there is abnormal grain growths.Therefore, also lack a kind of at present
The method that effectively rafifinal target and copper alloy backing plate can be welded.
Invention content
The purpose of the present invention is to provide a kind of welding methods of aluminum bronze target, can realize rafifinal target at low temperature
The welding of material and copper alloy backing plate avoids the abnormal grain growth of rafifinal target, obtains the aluminum bronze target of high intensity.
Another object of the present invention is to provide a kind of aluminum bronze targets, and the welding method of above-mentioned aluminum bronze target is used to weld
It obtains, the bond strength of rafifinal target and copper alloy backing plate is high, the sputtering that can be preferably applied under high temperature.
What the embodiment of the present invention was realized in:
A kind of welding method of aluminum bronze target comprising:
One layer of transition film is plated on the welding surface of copper alloy backing plate, transition film includes any one of titanium film and nickel film;
By the way of Diffusion Welding, at 300~400 DEG C, by fine aluminium target and the copper alloy backing plate for being coated with transition film
Weld together.
A kind of aluminum bronze target is welded by the welding method of above-mentioned aluminum bronze target.
The advantageous effect of the embodiment of the present invention is:
An embodiment of the present invention provides a kind of welding method of aluminum bronze target, elder generation plated on copper alloy backing plate titanium film or
Nickel film, by the good diffusion performance between titanium film or nickel film and rafifinal, come increase copper alloy backing plate and rafifinal target it
Between bond strength, realize rafifinal target and the welding of copper alloy backing plate at a lower temperature.Welding method operation letter
Folk prescription just, while avoiding the abnormal grain growth of rafifinal target, obtains the aluminum bronze target of high bond strength.
The embodiment of the present invention additionally provides a kind of aluminum bronze target, and the welding method of above-mentioned aluminum bronze target is used to weld
It arrives, compared with existing soldering target, the bond strength between the rafifinal target and copper alloy backing plate of the aluminum bronze target is high, and
And high temperature resistant, the sputtering operation that can be preferably applied under high temperature.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
The diagrammatic cross-section for the aluminum bronze target that Fig. 1 is provided by the embodiment of the present invention.
Specific implementation mode
It in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below will be in the embodiment of the present invention
Technical solution be clearly and completely described.The person that is not specified actual conditions in embodiment, builds according to normal condition or manufacturer
The condition of view carries out.Reagents or instruments used without specified manufacturer is the conventional production that can be obtained by commercially available purchase
Product.
A kind of aluminum bronze target of the embodiment of the present invention and its welding method are specifically described below.
An embodiment of the present invention provides a kind of welding methods of aluminum bronze target comprising:
One layer of transition film is plated on the welding surface of copper alloy backing plate, transition film includes any one of titanium film and nickel film;
By the way of Diffusion Welding, at 300~400 DEG C, by fine aluminium target and the copper alloy backing plate for being coated with transition film
Weld together.
Diffusion Welding refers to the material surface to contact with each other, close to each other under the action of temperature and pressure, is locally occurred
It is plastically deformed, phase counterdiffusion is generated between atom, forms new diffusion layer in interface, be reliably connected to realize.For high-purity
For aluminium and Cu alloy material, to make the diffusion of the two at low temperature is highly difficult together, that is, allows to combine, in conjunction with
The requirement of sputtering target material is also not achieved in intensity.However, the recrystallization temperature of high-purity aluminum material is low, as heat treatment temperature increases,
The problem of crystal grain is drastically grown up, at high temperature Diffusion Welding, and there is abnormal grain growths.
Inventor has found there is good diffusion between titanium film or nickel film and rafifinal by creative work.Cause
The invention people first plates titanium film or nickel film on copper alloy backing plate, and titanium film or nickel film is allowed to be located at copper alloy backing plate and rafifinal target
Between, as shown in Figure 1, by the diffusion between titanium film or nickel film and rafifinal, to increase copper alloy backing plate and rafifinal target
Between bond strength, realize rafifinal target and welding of the copper alloy backing plate under lower temperature (300~400 DEG C).
Further, the thickness of transition film is 4~10 μm, and preferably purity reaches 99.9% or more titanium or nickel.Transition film
In the case of too thin, titanium and nickel are difficult that enough diffusions are formed between rafifinal, and the strength demand of aluminum bronze target is not achieved;And
In the case that transition film is too thick, the strength reduction of transition film itself, to be impacted to the bond strength of entire aluminum bronze target.
It is found by inventor itself creative work, when the thickness of transition film is in the range of 4~10 μm, obtained aluminum bronze target
Bond strength it is higher.
Preferably, transition film is plated in in the embodiment of the present invention using vacuum magnetic control sputter the welding surface of copper alloy backing plate
On.Vacuum magnetic control sputter can accurately control sputter coating process, be easy to get high-precision homogeneous film thickness, conducive to perhaps expanding
Dissipate the progress of welding.Preferably, transition film and the bond strength of copper alloy backing plate are more than 100MPa, to meet the strong of aluminum bronze target
Degree demand.
Further, the mode of Diffusion Welding be hot isostatic press welding, pressure be 80~200MPa, soaking time be 2~
4h.Increasing welding pressure can be in favor of the atoms permeating of weld, to enhance the bond strength of weld.But excessively high pressure
Not only to equipment requirement height, but also it be easy to cause copper alloy backing plate and rafifinal target generates excessive plastic deformation.By hair
The discovery of person of good sense's creative work, in the case where pressure is 80~200MPa, welding, which obtains aluminum bronze target, can obtain preferably combining by force
Degree.Soaking time and temperature, pressure three when welding is closely related, and soaking time is too short, can cause to spread it is insufficient, up to not
To required bond strength;The long crystal grain that may lead to rafifinal of soaking time is grown up, and toughness is caused to reduce.Inventor passes through
Creative work is found, is 300~400 DEG C in temperature, under conditions of pressure is 80~200MPa, when soaking time is 2~4h,
The bond strength of obtained aluminum bronze target is preferable.
A kind of welding method for aluminum bronze target that the embodiment of the present invention is provided further includes:Before plating transition film, first exist
Turning forms flat thread on the welding surface of copper alloy backing plate.Flat thread can increase between transition film and copper alloy backing plate
Contact area, the bond strength both to increase.Preferably, flat thread is angular thread, flight pitch is 0.4~
0.6mm, the depth of thread are 0.15~0.25mm.
Further, before being diffused welding, pickling first is carried out to the welding surface of rafifinal target.Pickling is for going
Except the oxidation film of high-purity surface of aluminum target material, allowing between rafifinal and transition film to be preferably diffused.Preferably, pickling is adopted
Acid reagent is by concentrated nitric acid, the concentrated sulfuric acid and water according to 1:1:5~10 are mixed to get.
Rafifinal target after pickling is dried in vacuo 1~2h at 50~80 DEG C, then is diffused welding.Vacuum drying
Remaining acid reagent after rafifinal target pickling can be removed, allowing between rafifinal and transition film to be preferably diffused.
It is dried in vacuo in preferably after pickling 5h and carries out, and jacket welding need to be carried out in 2 days, to prevent the oxygen again of rafifinal target
Change.
The embodiment of the present invention additionally provides a kind of aluminum bronze target, is welded by the welding method of above-mentioned aluminum bronze target.
Compared with existing soldering target, the bond strength between the rafifinal target and copper alloy backing plate of the aluminum bronze target is high, and
High temperature resistant, the sputtering operation that can be preferably applied under high temperature.
The feature and performance of the present invention are described in further detail with reference to embodiments.
Embodiment 1
A kind of aluminum bronze target is present embodiments provided, preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.4mm, depth of thread 0.15mm.
S2. by vacuum magnetic-control sputtering, the titanium film of 10 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:5) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 2h at 50 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2h are carried out under conditions of 300 DEG C of temperature, pressure 200MPa.
Embodiment 2
A kind of aluminum bronze target is present embodiments provided, preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.6mm, depth of thread 0.25mm.
S2. by vacuum magnetic-control sputtering, the nickel film of 4 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:10) pickling is carried out to the welding surface of rafifinal target, gone
Except the oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 1h at 80 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 4h are carried out under conditions of 400 DEG C of temperature, pressure 50MPa.
Embodiment 3
A kind of aluminum bronze target is present embodiments provided, preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.5mm, depth of thread 0.20mm.
S2. by vacuum magnetic-control sputtering, the nickel film of 8 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:7) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 1h at 60 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 3h are carried out under conditions of 380 DEG C of temperature, pressure 150MPa.
Embodiment 4
A kind of aluminum bronze target is present embodiments provided, preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.45mm, depth of thread 0.18mm.
S2. by vacuum magnetic-control sputtering, the titanium film of 6 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:9) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 1.5h at 70 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2.5h are carried out under conditions of 330 DEG C of temperature, pressure 120MPa.
Comparative example 1
This comparative example provides a kind of aluminum bronze target, and preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.4mm, depth of thread 0.15mm.
S2. by vacuum magnetic-control sputtering, the titanium film of 2 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:5) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 2h at 50 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2h are carried out under conditions of 300 DEG C of temperature, pressure 200MPa.
Comparative example 2
This comparative example provides a kind of aluminum bronze target, and preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.4mm, depth of thread 0.15mm.
S2. by vacuum magnetic-control sputtering, the titanium film of 12 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:5) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 2h at 50 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2h are carried out under conditions of 300 DEG C of temperature, pressure 200MPa.
Comparative example 3
This comparative example provides a kind of aluminum bronze target, and preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.4mm, depth of thread 0.15mm.
S2. by vacuum magnetic-control sputtering, the zinc film of 10 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:5) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 2h at 50 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2h are carried out under conditions of 300 DEG C of temperature, pressure 200MPa.
Comparative example 4
This comparative example provides a kind of aluminum bronze target, and preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.4mm, depth of thread 0.15mm.
S2. by vacuum magnetic-control sputtering, the niobium film of 10 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:5) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 2h at 50 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2h are carried out under conditions of 300 DEG C of temperature, pressure 200MPa.
Comparative example 5
This comparative example provides a kind of aluminum bronze target, and preparation method is as follows:
S1. turning forms flat thread on the welding surface of copper alloy backing plate, which is angular thread, between screw thread
Away from for 0.4mm, depth of thread 0.15mm.
S2. by vacuum magnetic-control sputtering, the vanadium film of 10 μm of a layer thickness is plated on the welding surface of above-mentioned copper alloy backing plate.
S3. acid reagent (concentrated nitric acid is used:The concentrated sulfuric acid:Water=1:1:5) pickling, removal are carried out to the welding surface of rafifinal target
The oxidation film on its surface.
S4. the rafifinal target after pickling is dried in vacuo 2h at 50 DEG C.
S5. the rafifinal target after will be dry in the copper alloy backing plate and S4 after plated film in S2 steps carries out vacuum canning,
And hot isostatic press welding, soaking time 2h are carried out under conditions of 300 DEG C of temperature, pressure 200MPa.
Test example
The aluminum bronze target for taking Examples 1 to 4 and comparative example 1~5 to be provided carries out breaking test.Test method is:
Copper alloy backing plate side and rafifinal target side are fixed respectively, is stepped up pulling force, the two are separated until disconnecting, record
Break position.The results are shown in Table 1 for record.
1. breaking test result of table
Break position | |
Embodiment 1 | Rafifinal target |
Embodiment 2 | Rafifinal target |
Embodiment 3 | Rafifinal target |
Embodiment 4 | Rafifinal target |
Comparative example 1 | Copper alloy backing plate and rafifinal target interconnecting piece |
Comparative example 2 | Copper alloy backing plate and rafifinal target interconnecting piece |
Comparative example 3 | Copper alloy backing plate and rafifinal target interconnecting piece |
Comparative example 4 | Copper alloy backing plate and rafifinal target interconnecting piece |
Comparative example 5 | Copper alloy backing plate and rafifinal target interconnecting piece |
As can be seen from Table 1, in the aluminum bronze target that the embodiment of the present invention 1~4 is provided, copper alloy backing plate and rafifinal target
The bond strength of material is higher, and when carrying out breaking test, the plane of disruption is respectively positioned on rafifinal target, illustrates the knot of the aluminum bronze target
Close the fracture strength that intensity is more than rafifinal.The aluminum bronze target that comparative example 1 and comparative example 2 are provided is compared to embodiment 1, respectively
Thinner and thicker titanium film is used, the reduction of bond strength is resulted in, the plane of disruption is located at copper alloy backing plate and rafifinal target
Material interconnecting piece.The metal of transition zone is substituted on the basis of embodiment 1 in comparative example 3~5, equally causes weld strength not
Foot, the plane of disruption are located at copper alloy backing plate and rafifinal target interconnecting piece.
In conclusion an embodiment of the present invention provides a kind of welding method of aluminum bronze target, elder generation is on copper alloy backing plate
Titanium film or nickel film are plated, by the good diffusion performance between titanium film or nickel film and rafifinal, to increase copper alloy backing plate and height
Bond strength between fine aluminium target realizes rafifinal target and the welding of copper alloy backing plate at a lower temperature.The welding
Method is simple to operate, while avoiding the abnormal grain growth of rafifinal target, obtains the aluminum bronze target of high bond strength
Material.
The embodiment of the present invention additionally provides a kind of aluminum bronze target, and the welding method of above-mentioned aluminum bronze target is used to weld
It arrives, compared with existing soldering target, the bond strength between the rafifinal target and copper alloy backing plate of the aluminum bronze target is high, and
And high temperature resistant, the sputtering operation that can be preferably applied under high temperature.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of welding method of aluminum bronze target, which is characterized in that including:
One layer of transition film is plated on the welding surface of copper alloy backing plate, the transition film includes any one of titanium film and nickel film;
By the way of Diffusion Welding, at 300~400 DEG C, by fine aluminium target and the copper alloy for being coated with the transition film
Backboard welds together.
2. welding method according to claim 1, which is characterized in that the thickness of the transition film is 4~10 μm.
3. welding method according to claim 2, which is characterized in that be plated in the transition film using vacuum magnetic control sputter
On the welding surface of the copper alloy backing plate.
4. welding method according to claim 3, which is characterized in that the combination of the transition film and the copper alloy backing plate
Intensity is more than 100MPa.
5. welding method according to claim 1, which is characterized in that the mode of Diffusion Welding is hot isostatic press welding, pressure
Power is 80~200MPa, and soaking time is 2~4h.
6. welding method according to claim 1, which is characterized in that before plating the transition film, first closed in the copper
Turning forms flat thread on the welding surface of golden backboard.
7. welding method according to claim 6, which is characterized in that the flat thread is angular thread, flight pitch
For 0.4~0.6mm, the depth of thread is 0.15~0.25mm.
8. welding method according to claim 1, which is characterized in that before being diffused welding, first to described high-purity
The welding surface of aluminium target carries out pickling, it is preferable that the acid reagent that pickling uses is by concentrated nitric acid, the concentrated sulfuric acid and water according to 1:1:5~
10 are mixed to get.
9. welding method according to claim 8, which is characterized in that by the rafifinal target after pickling 50~80
It is dried in vacuo 1~2h at DEG C, then is diffused welding.
10. a kind of aluminum bronze target, which is characterized in that welded by the welding method of claim 1~9 any one of them aluminum bronze target
It connects.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810632976.9A CN108746979A (en) | 2018-06-19 | 2018-06-19 | A kind of aluminum bronze target and its welding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810632976.9A CN108746979A (en) | 2018-06-19 | 2018-06-19 | A kind of aluminum bronze target and its welding method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108746979A true CN108746979A (en) | 2018-11-06 |
Family
ID=63979090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810632976.9A Pending CN108746979A (en) | 2018-06-19 | 2018-06-19 | A kind of aluminum bronze target and its welding method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108746979A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110670030A (en) * | 2019-09-29 | 2020-01-10 | 洛阳丰联科绑定技术有限公司 | Bonding method of ITO spliced target material |
CN111304604A (en) * | 2020-03-03 | 2020-06-19 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for copper target and aluminum alloy back plate and prepared copper target assembly |
CN111889869A (en) * | 2020-07-21 | 2020-11-06 | 有研亿金新材料有限公司 | Welding method for high-purity rare earth and alloy target |
CN112067643A (en) * | 2020-09-08 | 2020-12-11 | 宁波江丰电子材料股份有限公司 | Sample preparation method for SEM detection of welding diffusion layer of high-purity aluminum target assembly |
CN112122763A (en) * | 2020-09-16 | 2020-12-25 | 宁波江丰电子材料股份有限公司 | Welding method for ultra-pure copper target and back plate |
CN112676782A (en) * | 2020-12-25 | 2021-04-20 | 宁波江丰电子材料股份有限公司 | Method for assembling titanium target and copper back plate |
CN112935511A (en) * | 2021-03-26 | 2021-06-11 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for cobalt target and copper-zinc alloy back plate |
CN113695730A (en) * | 2021-09-03 | 2021-11-26 | 宁波江丰电子材料股份有限公司 | Welding method of chromium target material assembly |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5282943A (en) * | 1992-06-10 | 1994-02-01 | Tosoh Smd, Inc. | Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies produced thereby |
CN101648316A (en) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | Welding structure and welding method of target materials and back plates |
CN103343321A (en) * | 2012-03-12 | 2013-10-09 | 有研亿金新材料股份有限公司 | Method of manufacturing sputtering target |
CN103521910A (en) * | 2012-07-05 | 2014-01-22 | 宁波江丰电子材料有限公司 | Method for target material component welding |
CN104551381A (en) * | 2013-10-25 | 2015-04-29 | 宁波江丰电子材料股份有限公司 | Welding method of tungsten target material component |
CN104588896A (en) * | 2013-10-30 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Welding method of aluminum target component |
-
2018
- 2018-06-19 CN CN201810632976.9A patent/CN108746979A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5282943A (en) * | 1992-06-10 | 1994-02-01 | Tosoh Smd, Inc. | Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies produced thereby |
CN101648316A (en) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | Welding structure and welding method of target materials and back plates |
CN103343321A (en) * | 2012-03-12 | 2013-10-09 | 有研亿金新材料股份有限公司 | Method of manufacturing sputtering target |
CN103521910A (en) * | 2012-07-05 | 2014-01-22 | 宁波江丰电子材料有限公司 | Method for target material component welding |
CN104551381A (en) * | 2013-10-25 | 2015-04-29 | 宁波江丰电子材料股份有限公司 | Welding method of tungsten target material component |
CN104588896A (en) * | 2013-10-30 | 2015-05-06 | 宁波江丰电子材料股份有限公司 | Welding method of aluminum target component |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110670030A (en) * | 2019-09-29 | 2020-01-10 | 洛阳丰联科绑定技术有限公司 | Bonding method of ITO spliced target material |
CN111304604A (en) * | 2020-03-03 | 2020-06-19 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for copper target and aluminum alloy back plate and prepared copper target assembly |
CN111889869A (en) * | 2020-07-21 | 2020-11-06 | 有研亿金新材料有限公司 | Welding method for high-purity rare earth and alloy target |
CN111889869B (en) * | 2020-07-21 | 2022-02-15 | 有研亿金新材料有限公司 | Welding method for high-purity rare earth and alloy target |
CN112067643A (en) * | 2020-09-08 | 2020-12-11 | 宁波江丰电子材料股份有限公司 | Sample preparation method for SEM detection of welding diffusion layer of high-purity aluminum target assembly |
CN112122763A (en) * | 2020-09-16 | 2020-12-25 | 宁波江丰电子材料股份有限公司 | Welding method for ultra-pure copper target and back plate |
CN112676782A (en) * | 2020-12-25 | 2021-04-20 | 宁波江丰电子材料股份有限公司 | Method for assembling titanium target and copper back plate |
CN112935511A (en) * | 2021-03-26 | 2021-06-11 | 宁波江丰电子材料股份有限公司 | Diffusion welding method for cobalt target and copper-zinc alloy back plate |
CN113695730A (en) * | 2021-09-03 | 2021-11-26 | 宁波江丰电子材料股份有限公司 | Welding method of chromium target material assembly |
CN113695730B (en) * | 2021-09-03 | 2023-01-13 | 宁波江丰电子材料股份有限公司 | Welding method of chromium target material assembly |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108746979A (en) | A kind of aluminum bronze target and its welding method | |
US20100143707A1 (en) | Surface-treated metal substrate and manufacturing method of the same | |
US20070015001A1 (en) | Copper alloy for electronic machinery and tools and method of producing the same | |
CN105378150B (en) | With carrier ultrathin copper foil and use the copper clad laminate, printed circuit board and the seedless substrate that are manufactured with carrier ultrathin copper foil | |
TWI353390B (en) | ||
JP2008127606A (en) | High-strength copper alloy sheet having oxide film superior in adhesiveness | |
TWI628407B (en) | Copper alloy plate and coil for heat dissipation parts | |
WO2016068046A1 (en) | Superconducting wire material substrate and method for manufacturing same, and superconducting wire material | |
JP2021035755A (en) | Carrier-layer-included metal laminate base material and method for manufacturing the same, metal laminate base material and method for manufacturing the same, and printed wiring board | |
JP2006257511A (en) | Solder alloy for manufacturing sputtering target, and sputtering target using the same | |
CN109790597A (en) | The manufacturing method of heat dissipation element copper alloy plate, heat dissipation element and heat dissipation element | |
TWI254747B (en) | Alloy target for conductive film or its protection layer and manufacturing method thereof | |
TW201139755A (en) | Electronic circuit, method for forming same, and copper clad laminate for electronic circuit formation | |
JP6093646B2 (en) | Manufacturing method of plating film | |
JP2006212659A (en) | Clad material and its manufacturing method | |
Takaku et al. | Interfacial reaction and morphology between molten Sn base solders and Cu substrate | |
Mohamed Anuar et al. | The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces | |
JP3911173B2 (en) | Rolled copper foil for copper clad laminate and method for producing the same (2) | |
JP4485570B2 (en) | Barrier film for flexible copper substrate and sputtering target for barrier film formation | |
CN107429322A (en) | Heat dissipation element copper alloy plate and heat dissipation element | |
JP6244142B2 (en) | Superconducting wire substrate, manufacturing method thereof, and superconducting wire | |
US20100288631A1 (en) | Ceramic sputtering target assembly and a method for producing the same | |
JPWO2014132947A1 (en) | Ultra-thin copper foil with carrier, copper-clad laminate and coreless substrate | |
CN107075667B (en) | Copper alloy target | |
TWI364337B (en) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181106 |
|
RJ01 | Rejection of invention patent application after publication |