CN108738281B - 一种增强散热装置及控制方法 - Google Patents
一种增强散热装置及控制方法 Download PDFInfo
- Publication number
- CN108738281B CN108738281B CN201810549414.8A CN201810549414A CN108738281B CN 108738281 B CN108738281 B CN 108738281B CN 201810549414 A CN201810549414 A CN 201810549414A CN 108738281 B CN108738281 B CN 108738281B
- Authority
- CN
- China
- Prior art keywords
- heat
- heat dissipation
- liquid storage
- thermoelectric
- storage cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810549414.8A CN108738281B (zh) | 2018-05-31 | 2018-05-31 | 一种增强散热装置及控制方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810549414.8A CN108738281B (zh) | 2018-05-31 | 2018-05-31 | 一种增强散热装置及控制方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108738281A CN108738281A (zh) | 2018-11-02 |
CN108738281B true CN108738281B (zh) | 2020-12-22 |
Family
ID=63931572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810549414.8A Active CN108738281B (zh) | 2018-05-31 | 2018-05-31 | 一种增强散热装置及控制方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108738281B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023016206A1 (zh) * | 2021-08-11 | 2023-02-16 | 杭州大热若寒科技有限责任公司 | 散热及供暖系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100871457B1 (ko) * | 2006-10-11 | 2008-12-03 | 주식회사 아이티웰 | 발열소자의 방열 장치 |
JP5345832B2 (ja) * | 2008-12-18 | 2013-11-20 | 新日鐵住金株式会社 | 排熱利用発電装置 |
CN206962242U (zh) * | 2017-07-03 | 2018-02-02 | 沈阳雷卓激光医疗器械有限公司 | 一种半导体激光器散热结构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2658652Y (zh) * | 2003-07-18 | 2004-11-24 | 中科生命科技股份有限公司 | 半导体制冷器的蒸发散热装置 |
CN101610660A (zh) * | 2008-06-20 | 2009-12-23 | 沈国忠 | 压缩机制冷式全密封高效散热电子机箱 |
CN201297525Y (zh) * | 2008-10-30 | 2009-08-26 | 吴雅莉 | 一种具有良好散热结构的led灯具 |
CN102570289B (zh) * | 2011-05-25 | 2013-07-17 | 北京国科世纪激光技术有限公司 | 一种光纤耦合模块的温控散热系统 |
CN203588992U (zh) * | 2013-08-30 | 2014-05-07 | 广东新创意科技有限公司 | 一种tec芯片的热端及冷端集成散热结构 |
CN203704441U (zh) * | 2014-03-04 | 2014-07-09 | 四川省新成生物科技有限责任公司 | 一种半导体制冷加热装置 |
US9791184B2 (en) * | 2014-07-07 | 2017-10-17 | Santa Clara University | Mobile thermoelectric vaccine cooler with a planar heat pipe |
CN105737433B (zh) * | 2016-02-29 | 2018-01-23 | 上海交通大学 | 一种用于蜂窝芯材料加工的制冷夹持装置及方法 |
-
2018
- 2018-05-31 CN CN201810549414.8A patent/CN108738281B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100871457B1 (ko) * | 2006-10-11 | 2008-12-03 | 주식회사 아이티웰 | 발열소자의 방열 장치 |
JP5345832B2 (ja) * | 2008-12-18 | 2013-11-20 | 新日鐵住金株式会社 | 排熱利用発電装置 |
CN206962242U (zh) * | 2017-07-03 | 2018-02-02 | 沈阳雷卓激光医疗器械有限公司 | 一种半导体激光器散热结构 |
Also Published As
Publication number | Publication date |
---|---|
CN108738281A (zh) | 2018-11-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6798659B2 (en) | CPU cooling structure | |
US20070090737A1 (en) | Light-emitting diode assembly and method of fabrication | |
KR20080093284A (ko) | Led전구의 방열장치 | |
KR101152297B1 (ko) | 엘이디조명등 | |
WO2011150798A1 (zh) | 一种tec制冷装置及其应用的电器装置 | |
US5829515A (en) | Heat dissipator with multiple thermal cooling paths | |
US6666261B2 (en) | Liquid circulation cooler | |
CA2620479A1 (en) | Heat exchanger for thermoelectric applications | |
US20110056670A1 (en) | Heat sink | |
RU2002107437A (ru) | Электронное устройство с выделяющими тепло компонентами и поглощающими тепло элементами | |
KR101228757B1 (ko) | 이중 냉각 구조를 갖는 led 조명장치 | |
US7468885B2 (en) | Cooling device for interface card | |
CN108738281B (zh) | 一种增强散热装置及控制方法 | |
CN112286325A (zh) | 一种笔记本电脑外置散热器 | |
Ma et al. | Cooling of high power LEDs through ventilating ambient air to front surface of chip | |
GB2342152A (en) | Plate type heat pipe and its installation structure | |
JP4391351B2 (ja) | 冷却装置 | |
KR20110066577A (ko) | 펠티어 효과를 이용한 씨피유 칩의 냉각 장치 | |
KR20070051308A (ko) | 반도체 냉각 시스템 및 그 제조공정 | |
CN209857420U (zh) | 半导体制冷设备 | |
TWM617525U (zh) | 具主動式散熱之儲存裝置 | |
CN110582189B (zh) | 一种应用热管作为导热元件的热管式温度控制机柜 | |
KR101172679B1 (ko) | 공기조화기의 실외기 | |
TW200938766A (en) | An illumination block and suction cooling system therefor | |
JP5056036B2 (ja) | 電子部品装置の放熱構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190411 Address after: 201616 No. 3666 Sixian Road, Songjiang District, Shanghai Applicant after: PHICOMM (SHANGHAI) Co.,Ltd. Address before: 610100 125 Longquan Street Park Road, Longquanyi District, Chengdu, Sichuan. Applicant before: Sichuan fixun Information Technology Co.,Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201203 Address after: Room 703, building 3, Yangguang Chuncheng, Lubei street, Luqiao District, Taizhou City, Zhejiang Province Applicant after: Taizhou zhiao communication equipment Co.,Ltd. Address before: 201616 Shanghai city Songjiang District Sixian Road No. 3666 Applicant before: Phicomm (Shanghai) Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230105 Address after: 313000 room 1019, Xintiandi commercial office, Yishan street, Wuxing District, Huzhou, Zhejiang, China Patentee after: Huzhou YingLie Intellectual Property Operation Co.,Ltd. Address before: Room 703, building 3, Yangguang Chuncheng, Lubei street, Luqiao District, Taizhou City, Zhejiang Province Patentee before: Taizhou zhiao communication equipment Co.,Ltd. |