CN108735600B - Semiconductor diode manufacturing process - Google Patents
Semiconductor diode manufacturing process Download PDFInfo
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- CN108735600B CN108735600B CN201810534122.7A CN201810534122A CN108735600B CN 108735600 B CN108735600 B CN 108735600B CN 201810534122 A CN201810534122 A CN 201810534122A CN 108735600 B CN108735600 B CN 108735600B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000005554 pickling Methods 0.000 claims abstract description 154
- 238000007789 sealing Methods 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 15
- 229910002804 graphite Inorganic materials 0.000 claims description 15
- 239000010439 graphite Substances 0.000 claims description 15
- 238000009792 diffusion process Methods 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 235000021110 pickles Nutrition 0.000 description 13
- 239000012634 fragment Substances 0.000 description 9
- 239000011435 rock Substances 0.000 description 4
- 239000000725 suspension Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode manufacturing process, which adopts a pickling system, wherein the pickling system comprises a cylinder, a first guide rod, a telescopic rod and a pickling box; the first guide rod collides with the first plate in the rotation process, so that the pickling tank is shaken up and down, and meanwhile, the first sliding telescopic rod is matched with the pickling tank to shrink and recover in the up-and-down shaking process of the pickling tank, so that the pickling tank is continuously stirred, the semiconductor diode in the pickling tank is fully contacted with a pickling solution, and the pickling efficiency and effect of the semiconductor diode are improved; meanwhile, the outer sealing ring and the sealing unit of the first sliding telescopic rod seal the first sliding telescopic rod, corrosion of pickling solution to the first sliding telescopic rod is slowed down, the service life of the first sliding telescopic rod is prolonged, and the service life of a semiconductor diode pickling system is prolonged.
Description
Technical Field
The invention belongs to the technical field of semiconductor diode production, and particularly relates to a semiconductor diode manufacturing process.
Background
A semiconductor diode refers to a two-terminal electronic device that utilizes semiconductor characteristics. The most common semiconductor diodes are PN junction diodes and metal semiconductor contact diodes. They have in common the asymmetry of the current-voltage characteristic, i.e. the current exhibits a good conductivity in one direction and a high resistance in the opposite direction. Can be used for rectification, wave detection, voltage stabilization, constant current, variable capacitance, switching, luminescence, photoelectric conversion and the like. The tunnel diode of ultrahigh frequency amplification or ultrahigh speed switch can be made by using the tunnel effect of carriers in the highly doped PN junction. The production of the diode generally comprises three parts, wherein the three parts comprise early diffusion, middle manufacturing and post printing packaging. The early diffusion mainly aims at the diffusion of phosphorus and boron of the silicon wafer. The middle-stage manufacture is mainly to manufacture the chip into a diode through a series of working procedures, and then the diode is electroplated by an electroplating factory so that the red capillary is changed into a white capillary. And finally, printing and packaging at the later stage. In the middle-stage manufacture, the diode is pickled to improve mechanical damage, remove impurities adsorbed on the surface and reduce the surface electric field, so that the diode obtains good quality. Therefore, the acid cleaning of the diode is important.
Also the technical scheme of diode pickling has appeared among the prior art, chinese patent as application number 201720074902.9 discloses a suspension type pickling installation for diode production, including overhead conveyor, stand, pickling bath and fixed sleeve, the connecting rod is installed to overhead conveyor below, the connecting rod below is provided with the primary suspension, primary suspension outside bolted connection has the dead lever, and the dead lever outside is fixed with the spring telescopic link, the stand intermediate junction has the locating wheel, the pickling bath interpolation has the pickle, pickling bath outside both ends are fixed with the wane, the orbit that removes has been laid to the race inslot, the leading wheel is installed in the support frame outside, the primary suspension below is provided with the stores pylon, the stores pylon below is fixed with the pickling dish, and is provided with the silk screen in the middle of the pickling dish. Although the technical scheme realizes the pipelining of the pickling, the batch waiting is not needed, and the pickling efficiency is improved, the technical scheme can not sufficiently stir the pickling solution to pickle the semiconductor diode and does not take any protection measures on the suspended mechanism, the pickling solution has strong corrosivity, and the suspended mechanism is soaked in the pickling solution for a long time and can corrode the suspended mechanism, so that the pickling effect of the pickling solution on the semiconductor diode is influenced; so that the use of the invention is limited.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a semiconductor diode manufacturing process, which adopts a pickling system, wherein the pickling system mainly utilizes a guide rod to collide with a plate in the rotation process, so that a pickling tank is rocked up and down, and simultaneously, a sliding telescopic rod is matched with the pickling tank to shrink and recover in the up-and-down rocking process, so that the pickling tank is continuously stirred, the semiconductor diode in the pickling tank is fully contacted with a pickling solution, and the pickling efficiency and effect of the semiconductor diode are improved; meanwhile, the outer sealing ring and the sealing unit of the first sliding telescopic rod seal the first sliding telescopic rod, corrosion of pickling solution to the first sliding telescopic rod is slowed down, the service life of the first sliding telescopic rod is prolonged, and the service life of a semiconductor diode pickling system is prolonged.
The technical scheme adopted by the invention for solving the technical problems is as follows: the invention provides a semiconductor diode manufacturing process, which comprises the following steps:
the method comprises the following steps: putting the silicon wafer in a tubular diffusion furnace for phosphorus diffusion and boron diffusion of the silicon wafer;
step two: placing the graphite boat on a wire arranging machine, and leading the lead wires into the graphite boat by the wire arranging machine;
step three: pouring the sucked soldering lug and the silicon wafer diffused in the step one into the graphite boat with the lead punched in the step two in sequence by using a sucking disc, and meanwhile, coating soldering flux on the graphite boat;
step four: reversing the graphite boat in the third step, vibrating the lead by using a supporting plate, and then lightly pressing the lead by using the supporting plate to complete die assembly;
step five: placing the diode subjected to die assembly in the fourth step into a welding furnace for welding;
step six: placing the diode welded in the step five into an acid pickling system for acid pickling;
step seven: sending the diode after acid washing in the sixth step to the next procedure;
the pickling system comprises a cylinder, a telescopic rod and a pickling box; a first motor is fixedly arranged in the middle of the bottom of the cylinder body; one end of the first motor is fixedly connected with the first rotating disc; one side of the first rotating disc is fixedly provided with a guide pillar; one end of the group of parallel telescopic rods is connected to the bottom of the pickling tank in a ball joint mode, and the other end of the group of parallel telescopic rods is connected to the bottom of the pickling tank in a ball joint mode; the bottom of the pickling tank is provided with a first through hole, and the bottom of the pickling tank is fixedly provided with a wedge-shaped block; the wedge-shaped blocks are circumferentially distributed at the bottom of the pickling tank, the number of the wedge-shaped blocks is six, and the cross section of each wedge-shaped block is triangular; the bottom of the cylinder body is provided with a bracket; when the pickling tank is in work, the pickling tank is supported by the group of parallel telescopic rods, a first motor switch is turned on, the first motor drives the first rotating disc to rotate, the guide pillar on one side of the first rotating disc rotates along with the first motor switch, the pickling tank is rocked by matching wedge blocks uniformly distributed at the bottom of the pickling tank with the guide pillar during rotation, and the pickling tank is rocked more uniformly by matching the parallel telescopic rods; the semiconductor diode is uniformly pickled in the pickling tank, so that the pickling effect of the semiconductor diode is improved; meanwhile, the pickling box continuously shakes, so that the pickling efficiency of the semiconductor diode is accelerated.
Preferably, a T-shaped channel is arranged in the guide pillar; a first guide rod is arranged in the T-shaped channel, and the T-shaped channel is matched with the first guide rod to slide; one end of the first guide rod is fixedly connected with the rolling ball, and the other end of the first guide rod is arranged in the T-shaped channel; the rolling ball is matched with a first plate in the wedge-shaped block to drive the pickling box to shake, a first sliding block is fixedly arranged on the surface of the first guide rod, and a first spring is sleeved on the outer side of the surface of the first guide rod; when the guide rod rotates, the rolling ball of the guide rod collides with a plate on the wedge block, the plate is stressed, the pickling box is rocked up and down, the semiconductor diode in the pickling box is rocked for pickling, the pickling box is used for extruding the guide rod in the rocking process of the pickling box, the corresponding sliding block extrudes the spring in the T-shaped channel, the spring relieves the force of the pickling box, the pickling box is prevented from being overturned due to overlarge stress, and meanwhile, the pickling liquid in the T-shaped channel can be extruded by the guide rod, so that the blockage is prevented, and the pickling efficiency of the semiconductor diode is improved.
Preferably, a first plate is rotatably mounted on the inclined surface of the wedge-shaped block; a torsion spring is arranged in the rotating shaft of the first plate; when the first guide rod rotates, the first guide rod collides with the first plate, so that the pickling tank shakes, and the pickling solution uniformly pickle the semiconductor diode, thereby improving the pickling effect of the semiconductor diode; and leave a board at a guide arm after, the torsional spring in the pivot restores a board to the normal position for the atress is the same in the collision next time, and the rocking of pickling case is more even, takes place to overturn in order to avoid the pickling case.
Preferably, the telescopic rod comprises a first sliding telescopic rod, a first protective sleeve, a first sealing ring, a sealing unit, a second spring and a second guide rod; a first groove is formed in the middle of the inner part of the second guide rod; the first groove is used for being matched with the second guide rod to stretch; the first sliding telescopic rod is fixedly connected with the second guide rod through a second spring; a second groove is formed in the second guide rod; a sealing unit is fixedly arranged in the second groove; the sealing unit is used for sealing the second guide rod; the top of the second guide rod is sleeved with a first protective sleeve, the first sealing ring is sleeved outside the first protective sleeve, and the first sealing ring is used for sealing an interface between the first protective sleeve and the second guide rod; semiconductor diode is when the pickling, the pickle has very strong corrosivity, establish a protective sheath through the top cover at a slip telescopic link, and seal the interface of a protective sheath and No. two guide arms with a sealing washer, at the in-process that a slip telescopic link cooperation was rocked, receive the corruption of pickle very easily, treat a protective sheath corroded back, demolish a protective sheath, utilize a slip telescopic link to continue to promote the pickling case and rock, along with the continuation corruption of a slip telescopic link, corresponding sealing washer produces the clearance with a slip telescopic link, carry out secondary seal to a slip telescopic link through sealed unit after that.
Preferably, the sealing unit comprises a second sliding telescopic rod, a second sliding block and an arc-shaped plate; the number of the sealing units is four, and the sealing units are all of the same structure; the arc-shaped plate is fixedly connected with the second groove through a second sliding telescopic rod; the surface of the second sliding telescopic rod is sleeved with a second sliding block; the second sealing ring is sleeved outside the first sliding telescopic rod; the arc-shaped plate is contacted with the second sealing ring; no. two slip telescopic links and No. two slider cooperations promote the arc to the one end motion of being close to No. two sealing washers, arc and No. two sealing washer in close contact with for No. two sealing washers push away to slip telescopic link department, and No. two sealing washers closely seal the slip telescopic link of a number, and No. two sealing washers carry out the secondary protection to a slip telescopic link.
Preferably, the bottom of the pickling tank is provided with a sliding block, and the sliding block can extend out of the bottom plate of the pickling tank; the end of the telescopic rod is connected to the bottom of the sliding block in a ball joint mode; arc-shaped elastic sheets are symmetrically arranged on two side surfaces of the sliding block; a first arc is arranged on one side of the end of the sliding groove for installing the sliding block; a second arc is arranged on the other side of the end of the sliding groove for installing the sliding block; the second arc radius is twice the first arc radius. The during operation, when the descaling box swings, the slider can produce the relative slip with the bottom plate of descaling box, through set up the arc shell fragment in slider both sides, the arc shell fragment kick-backs when the arc shell fragment breaks away from the spout, accelerate the flow of pickle, when the slider slides in the descaling box, through setting up first circular arc and the second circular arc of different radiuses, the arc shell fragment at first contacts first circular arc, this just makes the slider can be to second circular arc lopsidedness, the wobbling slider increases the flow of pickle, thereby improve the efficiency of pickling.
The invention has the beneficial effects that:
1. according to the manufacturing process of the semiconductor diode, the pickling system is adopted, and the pickling box is shaken up and down through the collision of the first guide rod and the first plate; during the vertical shaking of the pickling tank, the first sliding telescopic rod is matched with the extension and retraction, so that the semiconductor diode is in full contact with the pickling solution in the pickling tank, and the pickling efficiency and effect of the semiconductor diode are improved.
2. The invention relates to a semiconductor diode manufacturing process which adopts a pickling system, wherein a telescopic rod in the pickling system comprises a first sliding telescopic rod, a first protective sleeve, a first sealing ring, a sealing unit, a second spring and a second guide rod; the protection is sealed to the sliding telescopic rod through the cooperation of the protective sleeve, the sealing ring and the sealing unit, corrosion of a pickling solution to the sliding telescopic rod is slowed down, and therefore the service life of the sliding telescopic rod is prolonged.
3. The invention relates to a semiconductor diode manufacturing process, which adopts a pickling system, wherein the pickling system relieves the shaking force of a pickling tank through the mutual matching of a first guide rod, a first sliding block, a T-shaped channel and a first spring through the compression of the first spring so as to prevent the pickling tank from being tipped over due to overlarge pickling force; meanwhile, the pickling solution in the T-shaped channel is extruded by the first guide rod to prevent the pickling solution from blocking the T-shaped channel; thereby improving the pickling efficiency.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a process flow diagram of the present invention;
FIG. 2 is a front view of the pickling system;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a cross-sectional view of the telescoping rod of the acid wash system of the present invention;
FIG. 5 is a cross-sectional view B-B of FIG. 4;
in the figure: barrel 1, telescopic link 2, pickling case 4, first motor 11, rolling disc 13, guide pillar 14, T shape passageway 15, guide arm 3, wedge 42, a board 43, support 16, spin 17, slider 31, spring 32, slip telescopic link 211, protective sheath 212, sealing washer 213, sealed unit 5, spring 214 No. two, guide arm 215 No. two, groove 216 No. two, groove 217, slip telescopic link 51 No. two, slider 52, arc 53, No. two sealing washers 54, slider 6, arc shell fragment 7, first circular arc 8, second circular arc 9.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 5, a semiconductor diode manufacturing process according to the present invention includes the following steps:
the method comprises the following steps: putting the silicon wafer in a tubular diffusion furnace for phosphorus diffusion and boron diffusion of the silicon wafer;
step two: placing the graphite boat on a wire arranging machine, and leading the lead wires into the graphite boat by the wire arranging machine;
step three: pouring the sucked soldering lug and the silicon wafer diffused in the step one into the graphite boat with the lead punched in the step two in sequence by using a sucking disc, and meanwhile, coating soldering flux on the graphite boat;
step four: reversing the graphite boat in the third step, vibrating the lead by using a supporting plate, and then lightly pressing the lead by using the supporting plate to complete die assembly;
step five: placing the diode subjected to die assembly in the fourth step into a welding furnace for welding;
step six: placing the diode welded in the step five into an acid pickling system for acid pickling;
step seven: sending the diode after acid washing in the sixth step to the next procedure;
the pickling system comprises a cylinder body 1, a telescopic rod 2 and a pickling box 4; a first motor 11 is fixedly arranged in the middle of the bottom of the cylinder 1; one end of the first motor 11 is fixedly connected with the first rotating disc 13; a guide post 14 is fixedly arranged on one side of the first rotating disc 13; one end of the group of parallel telescopic rods 2 is connected to the bottom of the pickling tank 4 in a ball joint mode, and the other end of the group of parallel telescopic rods 2 is connected to the bottom of the pickling tank 4 in a ball joint mode; the bottom of the pickling tank 4 is provided with a first through hole, and the bottom of the pickling tank 4 is fixedly provided with a wedge-shaped block 42; the wedge-shaped blocks 42 are circumferentially distributed at the bottom of the pickling tank 4, the number of the wedge-shaped blocks 42 is six, and the cross section of each wedge-shaped block 42 is triangular; the bottom of the cylinder body 1 is provided with a bracket 16; when the pickling tank 4 works, the pickling tank 4 is supported by the group of parallel telescopic rods 2, a switch of the first motor 11 is turned on, the first motor 11 drives the first rotating disc 13 to rotate, the guide post 14 on one side of the first rotating disc 13 rotates along with the first rotating disc, in the rotation, the pickling tank 4 is shaken by the aid of the wedge blocks 42 uniformly distributed at the bottom of the pickling tank 4 and the guide post 14 in a matching mode, and meanwhile, the pickling tank 4 is shaken more uniformly by the aid of the parallel telescopic rods 2 in a matching mode; the semiconductor diode is evenly pickled in the pickling tank 4, so that the pickling effect of the semiconductor diode is improved; meanwhile, the pickling box 4 continuously shakes, so that the pickling efficiency of the semiconductor diode is accelerated.
In one embodiment of the present invention, a T-shaped channel 15 is provided in the guide post 14; the T-shaped channel 15 is internally provided with a first guide rod 3, and the T-shaped channel 15 is matched with the first guide rod 3 to slide; one end of the first guide rod 3 is fixedly connected with the rolling ball 17, and the other end of the first guide rod 3 is arranged in the T-shaped channel 15; the rolling ball 17 is matched with a first plate 43 in the wedge-shaped block 42 to drive the pickling tank 4 to swing, a first sliding block 31 is fixedly arranged on the surface of the first guide rod 3, and a first spring 32 is sleeved on the outer side of the surface of the first guide rod 3; guide arm 3 is when rotating, a board 43 on guide arm 3's spin 17 collision wedge 42, a board 43 is when the atress, make pickling tank 4 rock from top to bottom, semiconductor diode in pickling tank 4 rocks the pickling, in the shaking of pickling tank 4, pickling tank 4 extrudees guide arm 3, corresponding slider 31 extrudees the spring in T shape passageway 15, the power of pickling tank 4 has been alleviated to the spring, too big and take place to tumble in order to prevent pickling tank 4 atress, the pickle in T shape passageway 15 can be extruded by guide arm 3 simultaneously, prevent to block up, thereby semiconductor diode pickling's efficiency has been improved.
As an embodiment of the present invention, a first plate 43 is rotatably mounted on the inclined surface of the wedge block 42; a torsion spring is arranged in the rotating shaft of the first plate 43; when the first guide rod 3 rotates, the first guide rod 3 collides with the first plate 43, so that the pickling tank 4 shakes, and the pickling solution uniformly pickle the semiconductor diode, thereby improving the pickling effect of the semiconductor diode; after the guide rod 3 leaves the plate 43, the torsion spring in the rotating shaft restores the plate 43 to the original position, so that the next collision is the same in stress, and the pickling tank 4 is more uniformly shaken, so that the pickling tank 4 is prevented from being tilted.
As an embodiment of the present invention, the telescopic rod 2 includes a first sliding telescopic rod 211, a first protective sleeve 212, a first sealing ring 213, a sealing unit 5, a second spring 214, and a second guide rod 215; a first groove 216 is formed in the middle of the inner part of the second guide rod 215; the first groove 216 is used for matching with the extension and contraction of the second guide rod 215; the first sliding telescopic rod 211 is fixedly connected with a second guide rod 215 through a second spring 214; a second groove 217 is formed in the second guide rod 215; a sealing unit 5 is fixedly arranged in the second groove 217; the sealing unit 5 is used for sealing the second guide rod 215; the top of the second guide rod 215 is sleeved with a first protective sleeve 212, the first sealing ring 213 is sleeved outside the first protective sleeve 212, and the first sealing ring 213 is used for sealing an interface between the first protective sleeve 212 and the second guide rod 215; semiconductor diode is when the pickling, the pickle has very strong corrosivity, establish a protective sheath 212 through the top cover at a slip telescopic link 211, and the interface of protective sheath 212 and No. two guide arms 215 is sealed to a sealing washer 213, at the in-process that a slip telescopic link 211 cooperation was rocked, receive the corruption of pickle very easily, treat that a protective sheath 212 is corroded the back, demolish a protective sheath 212, utilize a slip telescopic link 211 to continue to promote pickling case 4 and rock, along with the continuation corruption of a slip telescopic link 211, corresponding sealing washer 213 produces the clearance with a slip telescopic link 211, it seals once more to a slip telescopic link 211 to follow through sealed unit 5.
As an embodiment of the present invention, the sealing unit 5 includes a second sliding telescopic rod 51, a second sliding block 52 and an arc-shaped plate 53; the number of the sealing units 5 is four, and the sealing units 5 are all of the same structure; the arc-shaped plate 53 is fixedly connected with the second groove 217 through a second sliding telescopic rod 51; a second sliding block 52 is sleeved on the surface of the second sliding telescopic rod 51; the second sealing ring 54 is sleeved on the outer side of the first sliding telescopic rod 211; the arc-shaped plate 53 is in contact with a second sealing ring 54; sliding telescopic rod 51 No. two and slider 52 cooperation promote the arc 53 to the one end motion that is close to No. two sealing washers 54, arc 53 and No. two sealing washers 54 in close contact with for No. two sealing washers 54 push away to sliding telescopic rod 211 department No. one, and No. two sealing washers 54 carry out closely sealed to sliding telescopic rod 211 No. one, and No. two sealing washers 54 carry out the secondary protection to sliding telescopic rod 211.
As an embodiment of the invention, a sliding block 6 is arranged at the bottom of the pickling tank 4, and the sliding block 6 can extend out of the bottom plate of the pickling tank 4; the end of the telescopic rod 2 is ball-jointed at the bottom of the sliding block 6; arc-shaped elastic sheets 7 are symmetrically arranged on two side surfaces of the sliding block 6; a first arc 8 is arranged on one side of the end of the sliding groove of the mounting sliding block 6; a second arc 9 is arranged on the other side of the end of the sliding groove of the mounting sliding block 6; the radius of the second circular arc 9 is twice the radius of the first circular arc 8. The during operation, when pickling case 4 swings, slider 6 can produce the relative slip with the bottom plate of pickling case 4, through set up arc shell fragment 7 in slider 6 both sides, arc shell fragment 7 kick-backs when arc shell fragment 7 breaks away from the spout, accelerate the flow of pickle, when slider 6 slides into pickling case 4, through setting up different radial first circular arc 8 and second circular arc 9, arc shell fragment 7 at first contacts first circular arc 8, this just makes slider 6 can be to 9 lopsidedness of second circular arc, the flow of pickle is increased to wobbling slider 6, thereby improve the efficiency of pickling.
When the pickling device is used, a semiconductor diode is placed into the pickling tank 4, pickling solution is poured into the barrel 1, the liquid level of the pickling solution is higher than that of the semiconductor diode, the switch of the first motor 11 is turned on, the first guide rod 3 positioned in the second rotating shaft 14 rotates, the first guide rod 3 collides with the first plate 43 in the wedge-shaped blocks 42 arranged on the circumference of the bottom of the pickling tank 4 in the rotating process, the pickling tank 4 shakes up and down, when the first guide rod 3 is far away from the first plate 43, the torsion spring in the rotating shaft restores the first plate 43, the first sliding telescopic rod 211 is continuously extruded in the up-and-down shaking process of the pickling tank 4, the first sliding telescopic rod 211 is continuously contracted and restored in the up-and-down shaking process, and the pickling solution is more uniform in the shaking process; in the pickling process, the first guide rod 3 relieves the force applied to the pickling tank 4 during shaking through compression of the first spring 32, and the first sliding telescopic rod 211 protects the first sliding telescopic rod 211 through sealing of the sealing ring and the sealing unit 5; after the semiconductor diode is pickled, a switch of a first motor 11 is closed, and the semiconductor diode after pickling is taken out from the upper part of the cylinder body 1 by a manipulator; when the semiconductor diode is subjected to acid washing, the acid washing solution has strong corrosivity, the first protective sleeve 212 is sleeved at the top of the first sliding telescopic rod 211, the first sealing ring 213 is used for sealing the interfaces of the first protective sleeve 212 and the second guide rod 215, the first sliding telescopic rod 211 is easily corroded by the acid washing solution in the process of matching and shaking, after the first protective sleeve 212 is corroded, the first protective sleeve 212 is detached, the first sliding telescopic rod 211 is used for continuously pushing the acid washing box 4 to shake, along with the continuous corrosion of the first sliding telescopic rod 211, a gap is generated between the corresponding sealing ring 213 and the first sliding telescopic rod 211, the first sliding telescopic rod 211 is sealed again through the sealing unit 5, the second sliding telescopic rod 51 and the second sliding block 52 are matched for pushing the arc-shaped plate 53 to move towards one end close to the second sealing ring 54, and the arc-shaped plate 53 is in close contact with the second sealing ring 54, make No. two sealing washer 54 push away to a slip telescopic link 211 department, No. two sealing washers 54 closely seal to a slip telescopic link 211, No. two sealing washers 54 carry out the secondary protection to a slip telescopic link 211 to the life of a slip telescopic link 211 has been improved.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (1)
1. A semiconductor diode manufacturing process is characterized in that: the process comprises the following steps:
the method comprises the following steps: putting the silicon wafer in a tubular diffusion furnace for phosphorus diffusion and boron diffusion of the silicon wafer;
step two: placing the graphite boat on a wire arranging machine, and leading the lead wires into the graphite boat by the wire arranging machine;
step three: pouring the sucked soldering lug and the silicon wafer diffused in the step one into the graphite boat with the lead punched in the step two in sequence by using a sucking disc, and meanwhile, coating soldering flux on the graphite boat;
step four: reversing the graphite boat in the third step, vibrating the lead by using a supporting plate, and then lightly pressing the lead by using the supporting plate to complete die assembly;
step five: placing the semiconductor diode subjected to die assembly in the fourth step into a welding furnace for welding;
step six: placing the semiconductor diode welded in the fifth step into an acid washing system for acid washing;
step seven: sending the semiconductor diode after the acid cleaning in the sixth step to the next procedure;
wherein, the pickling system comprises a cylinder body (1), a telescopic rod (2) and a pickling box (4); a first motor (11) is fixedly arranged in the middle of the bottom of the cylinder body (1); one end of the first motor (11) is fixedly connected with the first rotating disc (13); a guide post (14) is fixedly arranged on one side of the first rotating disc (13); one end of the telescopic rod (2) is connected to the bottom of the pickling tank (4) in a ball joint mode, and the other end of the telescopic rod (2) is connected to the bottom of the pickling tank (4) in a ball joint mode; the bottom of the pickling tank (4) is provided with a first through hole, and the bottom of the pickling tank (4) is fixedly provided with a wedge-shaped block (42); the wedge-shaped blocks (42) are circumferentially distributed at the bottom of the pickling tank (4), and the number of the wedge-shaped blocks (42) is six; the section of the wedge-shaped block (42) is triangular, and a support (16) is arranged at the bottom of the barrel (1);
a T-shaped channel (15) is arranged in the guide post (14); a first guide rod (3) is arranged in the T-shaped channel (15), and the T-shaped channel (15) is matched with the first guide rod (3) to slide; one end of the first guide rod (3) is fixedly connected with the rolling ball (17), and the other end of the first guide rod (3) is arranged in the T-shaped channel (15); the rolling ball (17) is matched with a first plate (43) in the wedge-shaped block (42) to drive the pickling box (4) to shake, a first sliding block (31) is fixedly arranged on the surface of the first guide rod (3), and a first spring (32) is sleeved on the outer side of the surface of the first guide rod (3);
a first plate (43) is rotatably arranged on the inclined surface of the wedge-shaped block (42); a torsion spring is arranged in the rotating shaft of the first plate (43);
the telescopic rod (2) comprises a first sliding telescopic rod (211), a first protective sleeve (212), a first sealing ring (213), a sealing unit (5), a second spring (214) and a second guide rod (215); a first groove (216) is formed in the middle of the inner part of the second guide rod (215); the first groove (216) is used for matching with the extension and retraction of the second guide rod (215); the first sliding telescopic rod (211) is fixedly connected with a second guide rod (215) through a second spring (214); a second groove (217) is formed in the second guide rod (215); a sealing unit (5) is fixedly arranged in the second groove (217); the sealing unit (5) is used for sealing a second guide rod (215); the top of the second guide rod (215) is sleeved with a first protective sleeve (212), the first sealing ring (213) is sleeved on the outer side of the first protective sleeve (212), and the first sealing ring (213) is used for sealing an interface between the first protective sleeve (212) and the second guide rod (215);
the sealing unit (5) comprises a second sliding telescopic rod (51), a second sliding block (52) and an arc-shaped plate (53); the number of the sealing units (5) is four, and the sealing units (5) are all of the same structure; the arc-shaped plate (53) is fixedly connected with the second groove (217) through a second sliding telescopic rod (51); a second sliding block (52) is sleeved on the surface of the second sliding telescopic rod (51); the second sealing ring (54) is sleeved on the outer side of the first sliding telescopic rod (211); the arc-shaped plate (53) is in contact with a second sealing ring (54);
the bottom of the pickling box (4) is provided with a sliding block (6), and the sliding block (6) can extend out of the bottom plate of the pickling box (4); the end of the telescopic rod (2) is in ball joint with the bottom of the sliding block (6); arc-shaped elastic sheets (7) are symmetrically arranged on two side surfaces of the sliding block (6); a first arc (8) is arranged on one side of the end of the sliding groove for installing the sliding block (6); a second arc (9) is arranged on the other side of the end of the sliding groove for installing the sliding block (6); the radius of the second circular arc (9) is twice that of the first circular arc (8).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810534122.7A CN108735600B (en) | 2018-05-29 | 2018-05-29 | Semiconductor diode manufacturing process |
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| CN201810534122.7A CN108735600B (en) | 2018-05-29 | 2018-05-29 | Semiconductor diode manufacturing process |
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| CN108735600B true CN108735600B (en) | 2021-06-08 |
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| CN109830577B (en) * | 2019-01-18 | 2021-06-15 | 深圳市广盛浩科技有限公司 | Manufacturing method of high-quality light-emitting diode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651404A (en) * | 2012-05-25 | 2012-08-29 | 常州银河电器有限公司 | Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer |
| CN103578979A (en) * | 2013-11-29 | 2014-02-12 | 如皋市大昌电子有限公司 | Technology for converting axial diode after welding |
| CN105390424A (en) * | 2015-12-10 | 2016-03-09 | 重庆凯西驿电子科技有限公司 | Diode pickling device |
| CN106449358A (en) * | 2016-07-07 | 2017-02-22 | 如皋市大昌电子有限公司 | Preparation technology of diode |
-
2018
- 2018-05-29 CN CN201810534122.7A patent/CN108735600B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651404A (en) * | 2012-05-25 | 2012-08-29 | 常州银河电器有限公司 | Axial diode and fabrication method of axial diode with polyimide glue as protection glue layer |
| CN103578979A (en) * | 2013-11-29 | 2014-02-12 | 如皋市大昌电子有限公司 | Technology for converting axial diode after welding |
| CN105390424A (en) * | 2015-12-10 | 2016-03-09 | 重庆凯西驿电子科技有限公司 | Diode pickling device |
| CN106449358A (en) * | 2016-07-07 | 2017-02-22 | 如皋市大昌电子有限公司 | Preparation technology of diode |
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