CN108731660A - A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode - Google Patents

A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode Download PDF

Info

Publication number
CN108731660A
CN108731660A CN201810263737.0A CN201810263737A CN108731660A CN 108731660 A CN108731660 A CN 108731660A CN 201810263737 A CN201810263737 A CN 201810263737A CN 108731660 A CN108731660 A CN 108731660A
Authority
CN
China
Prior art keywords
electrode
outer barrel
hole
harmonic oscillator
hemispherical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810263737.0A
Other languages
Chinese (zh)
Inventor
夏敦柱
颜冲
金伟明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Southeast University
Original Assignee
Southeast University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Southeast University filed Critical Southeast University
Priority to CN201810263737.0A priority Critical patent/CN108731660A/en
Publication of CN108731660A publication Critical patent/CN108731660A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/567Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
    • G01C19/5691Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass

Abstract

The present invention discloses a kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode, and gyroscope includes outer barrel, block and agent structure, and block is located at outer barrel top, and agent structure is located in outer barrel;Agent structure includes hemispherical Shell harmonic oscillator, PCB plane electrode plate, sector electrode, contact conductor, resonator fixed seat and fixed tray;Hemispherical Shell harmonic oscillator, resonator fixed seat and fixed tray sequentially assemble from top to bottom, fixed tray is ring-type, resonator fixed seat end face center is equipped with circular groove, PCB plane electrode plate is located in circular groove, PCB plane electrode plate top surface is equipped with sector electrode, bottom surface is equipped with contact conductor, and resonator fixed seat counter electrode wire locations are equipped with first electrode hole, and outer barrel bottom surface is equipped with second electrode corresponding with first electrode hole hole;Contact conductor passes through first electrode hole, fixed tray and second electrode hole to stretch out outer barrel bottom surface.The configuration of the present invention is simple, assembly are easy, and difficulty of processing is low, and circuit compatibility is good.

Description

A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode
Technical field
The present invention relates to micro electronmechanical and inertial navigation fields, and in particular to a kind of hemispherical resonator based on PCB plane electrode Gyroscope and its method for machining and assembling.
Background technology
Hemispherical resonant gyro be it is a kind of using the radial vibration standing wave precession effect of hemispherical Shell antelabium come sense pedestal revolve A kind of brother's formula oscillation gyro turned, high speed rotor and expansion bearing are not present in structure, has wider signal band for it, good Good stability, can still continue normally the features such as starting rapid and outstanding radioresistance in the case where power off the short time The features such as work has smaller drift noise, while it is small to be also equipped with quality, low-power consumption, and resolving power is high, long lifespan, is in succession Critical component in inertial navigation system possesses very vast potential for future development.
It is started from 1984 in the research and development of Britain, hemispherical resonant gyro, British Aerospace system is absorbed in equipment Co., Ltd In research and development cylinder shell-type resonant gyroscope, the existing trend for turning to HRG researchs.France has had developed the hemispherical resonator top of diameter 20mm Spiral shell instrument, Japan occurred as soon as early in 1986 delivers the article in relation to hemispherical resonant gyro.
The U.S. successfully applies HRG in spacecraft navigation, tactical missile navigation, communications satellite attitude control at present System, be accurately directed to and survey of deep space task in, reached 100% success rate.
Invention content
Goal of the invention:To overcome the shortcomings of the existing technology, the present invention is directed to provide a kind of hemisphere based on PCB plane electrode is humorous Shake gyroscope and its method for machining and assembling.
Technical solution:In order to solve the above technical problems, the present invention adopts the following technical scheme that:
A kind of hemispherical resonant gyro based on PCB plane electrode, it is characterised in that:Including outer barrel, block and main body knot Structure, the block are located at outer barrel top, and outer barrel is without top tubular structure, and agent structure is located in outer barrel;Agent structure includes half Spherical shell harmonic oscillator, PCB plane electrode plate, sector electrode, contact conductor, resonator fixed seat and fixed tray;Hemispherical Shell resonance Son, resonator fixed seat and fixed tray sequentially fit together from top to bottom, and fixed tray is cyclic structure, and resonator is fixed Seat end face center portion is equipped with circular groove, and PCB plane electrode plate is located in circular groove, and PCB plane electrode plate top surface is circumferentially uniformly provided with 16 sector electrodes, PCB plane electrode plate bottom surface correspond to each sector electrode position and are equipped with the electrode to connect with sector electrode Lead, resonator fixed seat counter electrode wire locations are uniformly provided with 16 first electrode holes, and outer barrel bottom surface is equipped with and the first electricity The corresponding 16 second electrode holes in pole hole site;16 contact conductors correspond among first electrode hole, fixed tray respectively Outer barrel bottom surface is stretched out in through-hole and second electrode hole;Gap between contact conductor and second electrode hole is equipped with insulator;PCB plane Electrode plate centers portion is equipped with 3 location holes, and resonator fixed seat and outer barrel bottom surface correspond to 3 position of positioning hole and be equipped with mutual The location hole matched.
Operation principle:The present invention is by by inside agent structure is placed on block and outer barrel surrounds wall, agent structure Again according to hemispherical Shell harmonic oscillator, plane PCB electrode plates, resonator fixed seat, bottom surface fixed tray fits together from top to bottom; Wherein plane electrode plate uniformly prints out the sector electrode of 16 deciles using PCB technology on pcb board, is welded below electrode Contact conductor passes through the first electrode hole in resonator fixed seat, and the alignment of accessory is completed across the second electrode hole of outer barrel.
It is preferred that hemispherical Shell harmonic oscillator upper end is fixed with block by soldering tech, harmonic oscillator lower end passes through resonator Fixed seat intermediate throughholes are simultaneously welded and fixed.
The block top sets that there are two what is communicated with outer barrel to vacuumize hole, can extract in cavity air out to complete Evacuation process.
It is preferred that the hemispherical Shell harmonic oscillator outer layer is gold-plated, spherical shell overall diameter is 20mm, shell thickness 1mm, and hemispherical Shell is humorous Oscillator cambered surface outer central sections are equipped with the first cylinder to connect with block, and hemispherical Shell harmonic oscillator cambered surface inner central section is equipped with second Cylinder, the second cylinder top connect with hemispherical Shell harmonic oscillator intrados central point, and hemispherical Shell harmonic oscillator bottom surface is stretched out in bottom end, stretch out Minister's degree is 1mm, and the second body bottom end is equipped with third cylinder, and the second cylinder radius is 1.65mm, and third cylinder radius is 1.5mm.
Above-mentioned hemispherical Shell harmonic oscillator bottom surface is face where hemispherical Shell harmonic oscillator diameter;Third cylinder column length is set as needed It is fixed.
It is preferred that the sector electrode is the plane electrode made on PCB plane electrode plate.
Compatibility between the electrode plate and circuit of above-mentioned electrode is preferably.
It is preferred that the resonator fixed seat circular groove periphery is uniformly provided with 6 the first fixed holes, resonator fixed seat is exhausted Edge material;Fixed tray ring body is equipped with 6 the second fixed holes that are corresponding with the first fixed hole position and being mutually matched, often The first fixed hole and the second fixed hole of group corresponding position are screwed.
A kind of method for machining and assembling of the hemispherical resonant gyro based on PCB plane electrode, includes the following steps:
1) glass dome shell harmonic oscillator is made:
According to prior art, the glass dome shell harmonic oscillator of dimension is made as requested, hemispherical Shell overall diameter 20mm, Hemisphere thickness of the shell 1mm, the second cylinder radius 1.65mm, third cylinder radius 1.5mm, the second cylinder stretch out hemisphere bottom surface 1mm;So Afterwards one layer of gold is plated in glass dome shell harmonic oscillator periphery;
2) block, outer barrel and fixed tray are processed:
Aluminum alloy materials casting or cutting forming as requested are selected, then precisely punching;
3) machined resonators fixed seat:
Insulating materials is selected to be made according to the size set by 3D printing technique;
6) PCB plane electrode plate is made:
16 fan-shaped two-sided planar electrodes divided equally are made using existing PCB technology, extraction wire is welded at the electrode back side, Pad is sector electrode center;
7) fixed and assembly:
Fixed tray is welded on outer barrel bottom, takes 3 root long sticks to pass through 3 location holes of outer barrel bottom surface, then puts successively Enter, resonator pedestal and PCB plane electrode plate, 3 root long sticks are each passed through the positioning on resonator pedestal and PCB plane electrode plate Hole assembles after alignment and fixes, then places harmonic oscillator and block.
It is preferred that in the step 5), hole is vacuumized by the hemispherical resonator based on PCB plane electrode by two in block Gyroscope is evacuated to vacuum state.
Advantageous effect:The present invention is based on the electrodes of the hemispherical resonant gyro of PCB plane electrode using plane electrode, and It stamps on pcb board electrode, assembly is easier to, and difficulty of processing is low, at low cost, and circuit compatibility is good, and structure is also simpler, is suitble to batch Amount production.
Description of the drawings
Fig. 1 is schematic structural view of the invention;
Fig. 2 is Fig. 1 exploded perspective views;
Fig. 3 is Fig. 1 cross section structure schematic diagrams
Fig. 4 is the capping structure schematic diagram of the present invention;
Fig. 5 is the outer tube structure schematic diagram of the present invention;
Fig. 6 is the hemispherical Shell harmonic oscillator structural schematic diagram of the present invention;
Fig. 7 is the PCB plane electrode plate structure schematic diagram of the present invention;
Fig. 8 is the resonator fixed seat structure schematic diagram of the present invention;
The bottom bottom surface fixed tray schematic diagram of the positions Fig. 9 present invention.
Specific implementation mode
Embodiment 1
As shown in figs 1-9, a kind of hemispherical resonant gyro based on PCB plane electrode, including outer barrel 6, block 1 and main body Structure, the block 1 are located at 6 top of outer barrel, and outer barrel 6 is without top tubular structure, and agent structure is located in outer barrel 6;Agent structure Including hemispherical Shell harmonic oscillator 2, PCB plane electrode plate 3, sector electrode 7, contact conductor 8, resonator fixed seat 4 and fixed tray 5;Hemispherical Shell harmonic oscillator 2, resonator fixed seat 4 and fixed tray 5 sequentially fit together from top to bottom, and fixed tray 5 is ring Shape structure, 4 end face center portion of resonator fixed seat are equipped with circular groove, and PCB plane electrode plate 3 is located in circular groove, PCB plane electrode plate 3 top surfaces are circumferentially uniformly provided with 16 sector electrodes 7, and 3 bottom surface of PCB plane electrode plate corresponds to 7 position of each sector electrode and is all provided with There are the contact conductor 8 to connect with sector electrode 7,4 counter electrode lead of resonator fixed seat, 8 position to be uniformly provided with 16 first electricity Pole hole 13,6 bottom surface of outer barrel are equipped with 16 second electrode holes 17 corresponding with 13 position of first electrode hole;16 contact conductors 8 divide 6 bottom surface of outer barrel Dui Ying not be stretched out across first electrode hole 13,5 intermediate throughholes of fixed tray and second electrode hole 17;Contact conductor 8 Gap between second electrode hole 17 is equipped with insulator;3 central part of PCB plane electrode plate is equipped with 3 location holes, and resonator is solid Reservation 4 and 6 bottom surface of outer barrel correspond to 3 position of positioning hole and are equipped with the location hole being mutually matched;2 upper end of hemispherical Shell harmonic oscillator and lid Cap 1 is fixed by soldering tech, and harmonic oscillator lower end passes through 4 intermediate throughholes of resonator fixed seat and is welded and fixed;1 top of block is set There are two vacuumize hole 9 with what is communicated inside outer barrel 6;2 outer layer of hemispherical Shell harmonic oscillator is gold-plated, and spherical shell overall diameter is 20mm, spherical shell Thickness is 1mm, and 2 cambered surface outer central sections of hemispherical Shell harmonic oscillator are equipped with the first cylinder 10 to connect with block 1, hemispherical Shell harmonic oscillator 2 cambered surface inner central sections are equipped with the second cylinder 11, and 11 top of the second cylinder connects with 2 intrados central point of hemispherical Shell harmonic oscillator, 2 bottom surface of hemispherical Shell harmonic oscillator is stretched out in bottom end, and extension length 1mm, the second body bottom end is equipped with third cylinder 12, the second cylinder 11 Radius is 1.65mm, and 12 radius of third cylinder is 1.5mm;The sector electrode 7 be made on PCB plane electrode plate 3 it is flat Face electrode;4 circular groove periphery of resonator fixed seat is uniformly provided with 6 the first fixed holes 15, and resonator fixed seat 4 is insulation material Material;5 ring body of fixed tray is equipped with 6 the second fixed holes 16 that are corresponding with 15 position of the first fixed hole and being mutually matched, The first fixed hole 15 and the second fixed hole 16 of every group of corresponding position are screwed.
The present invention is by the way that by inside agent structure is placed on block 1 and outer barrel 6 surrounds wall, agent structure is again according to half Spherical shell harmonic oscillator 2, plane PCB electrode plates, resonator fixed seat 4, bottom surface fixed tray 5 fit together from top to bottom;Wherein Plane electrode plate uniformly prints out the sector electrode 7 of 16 deciles using PCB technology on pcb board, and electricity is welded below electrode Pole lead 8 passes through the first electrode hole 13 in resonator fixed seat 4, and completes accessory across the second electrode hole 17 of outer barrel 6 Alignment;It finally can be by air in through-hole extraction cavity reserved in block 1 to complete evacuation process.
The method for machining and assembling of the above-mentioned hemispherical resonant gyro based on PCB plane electrode, includes the following steps:
1) glass dome shell harmonic oscillator 2 is made:
According to prior art, the glass dome shell harmonic oscillator 2 of dimension, hemispherical Shell overall diameter are made as requested 20mm, hemisphere thickness of the shell 1mm, 11 radius 1.65mm of the second cylinder, 12 radius 1.5mm of third cylinder, the second cylinder 11 stretch out half Ball bottom surface 1mm;Then one layer of gold is plated in 2 periphery of glass dome shell harmonic oscillator;
2) block 1, outer barrel 6 and fixed tray 5 are processed:
Aluminum alloy materials casting or cutting forming as requested are selected, then precisely punching;
3) machined resonators fixed seat 4:
Insulating materials is selected to be made according to the size set by 3D printing technique;
4) PCB plane electrode plate 3 is made:
16 fan-shaped two-sided planar electrodes divided equally are made using existing PCB technology, extraction wire is welded at the electrode back side, Pad is 7 center of sector electrode;
5) fixed and assembly:
Fixed tray 5 is welded on 6 bottom of outer barrel, takes 3 root long sticks to pass through 3 location holes of 6 bottom surface of outer barrel, then successively It is put into, resonator pedestal and 3,3 root long stick of PCB plane electrode plate are each passed through on resonator pedestal and PCB plane electrode plate 3 Location hole assembles after alignment and fixes, then places harmonic oscillator and block 1;Vacuumizing hole 9 by two in block 1 will be based on The hemispherical resonant gyro of PCB plane electrode is evacuated to vacuum state.
The present invention is based on the electrodes of the hemispherical resonant gyro of PCB plane electrode to use plane electrode, and is printed on pcb board Electrode is carved, assembly is easier to, and difficulty of processing is low, at low cost, and circuit compatibility is good, and structure is also simpler, suitable for mass production.
The unmentioned technology of the present invention is with reference to the prior art.

Claims (8)

1. a kind of hemispherical resonant gyro based on PCB plane electrode, it is characterised in that:Including outer barrel (6), block (1) and master Body structure, the block (1) are located at outer barrel (6) top, and outer barrel (6) is without top tubular structure, and agent structure is located at outer barrel (6) It is interior;Agent structure includes hemispherical Shell harmonic oscillator (2), PCB plane electrode plate (3), sector electrode (7), contact conductor (8), resonance Device fixed seat (4) and fixed tray (5);Hemispherical Shell harmonic oscillator (2), resonator fixed seat (4) and fixed tray (5) are from top to bottom Sequence fits together, and fixed tray (5) is cyclic structure, and resonator fixed seat (4) end face center portion is equipped with circular groove, and PCB is flat Face electrode plate (3) is located in circular groove, and PCB plane electrode plate (3) top surface is circumferentially uniformly provided with 16 sector electrodes (7), and PCB is flat Face electrode plate (3) bottom surface corresponds to each sector electrode (7) position and is equipped with the contact conductor (8) to connect with sector electrode (7), humorous Device fixed seat of shaking (4) counter electrode lead (8) position is uniformly provided with 16 first electrode holes (13), outer barrel (6) bottom surface be equipped with The corresponding 16 second electrode holes (17) in first electrode hole (13) position;16 contact conductors (8) are corresponded to respectively across the first electricity Outer barrel (6) bottom surface is stretched out in pole hole (13), fixed tray (5) intermediate throughholes and second electrode hole (17);Contact conductor (8) and second Gap between electrode hole (17) is equipped with insulator;PCB plane electrode plate (3) central part is equipped with 3 location holes (14), resonator Fixed seat (4) 3 location holes (14) position corresponding with outer barrel (6) bottom surface is equipped with the location hole (14) being mutually matched.
2. the hemispherical resonant gyro according to claim 1 based on PCB plane electrode, it is characterised in that:The hemisphere Shell harmonic oscillator (2) upper end is fixed with block (1) by soldering tech, and harmonic oscillator lower end passes through logical among resonator fixed seat (4) Hole is simultaneously welded and fixed.
3. the hemispherical resonant gyro according to claim 2 based on PCB plane electrode, it is characterised in that:The block (1) top set there are two with outer barrel (6) inside communicate vacuumize hole (9).
4. the hemispherical resonant gyro according to claim 1 based on PCB plane electrode, it is characterised in that:The hemisphere Shell harmonic oscillator (2) outer layer is gold-plated, and spherical shell overall diameter is 20mm, shell thickness 1mm, on the outside of hemispherical Shell harmonic oscillator (2) cambered surface in Center portion is equipped with the first cylinder (10) to connect with block (1), and hemispherical Shell harmonic oscillator (2) cambered surface inner central section is equipped with the second cylinder (11), the second cylinder (11) top connects with hemispherical Shell harmonic oscillator (2) intrados central point, and hemispherical Shell harmonic oscillator is stretched out in bottom end (2) bottom surface, extension length 1mm, the second body bottom end are equipped with third cylinder (12), and the second cylinder (11) radius is 1.65mm, Third cylinder (12) radius is 1.5mm.
5. the hemispherical resonant gyro according to any one of claims 1-4 based on PCB plane electrode, feature exist In:The sector electrode (7) is the plane electrode made on PCB plane electrode plate (3).
6. the hemispherical resonant gyro according to any one of claims 1-4 based on PCB plane electrode, feature exist In:Resonator fixed seat (4) the circular groove periphery is uniformly provided with 6 the first fixed holes (15), and resonator fixed seat (4) is exhausted Edge material;Fixed tray (5) ring body is equipped with 6 the second fixations that are corresponding with the first fixed hole (15) position and being mutually matched Through-hole (16), the first fixed hole (15) and the second fixed hole (16) of every group of corresponding position are screwed.
7. the method for machining and assembling of the hemispherical resonant gyro based on PCB plane electrode described in claim 1-6 any one, It is characterized in that:Include the following steps:
1) glass dome shell harmonic oscillator (2) is made:
According to prior art, the glass dome shell harmonic oscillator (2) of dimension is made as requested, hemispherical Shell overall diameter 20mm, Hemisphere thickness of the shell 1mm, the second cylinder (11) radius 1.65mm, third cylinder (12) radius 1.5mm, the second cylinder (11) stretch out half Ball bottom surface 1mm;Then one layer of gold is plated in glass dome shell harmonic oscillator (2) periphery;
2) processing block (1), outer barrel (6) and fixed tray (5):
Aluminum alloy materials casting or cutting forming as requested are selected, then precisely punching;
3) machined resonators fixed seat (4):
Insulating materials is selected to be made according to the size set by 3D printing technique;
4) PCB plane electrode plate (3) is made:
16 fan-shaped two-sided planar electrodes divided equally are made using existing PCB technology, extraction wire, welding are welded in the electrode back side Point is sector electrode (7) center;
5) fixed and assembly:
Fixed tray (5) is welded on outer barrel (6) bottom, takes 3 root long sticks to pass through 3 location holes (14) of outer barrel (6) bottom surface, so After be sequentially placed into, resonator pedestal and PCB plane electrode plate (3), 3 root long sticks be each passed through resonator pedestal and PCB plane electricity Location hole (14) on pole plate (3) assembles after alignment and fixes, then places harmonic oscillator and block (1).
8. the method for machining and assembling of the hemispherical resonant gyro according to claim 7 based on PCB plane electrode, feature It is:In the step 5), hole (9) is vacuumized by the hemispherical resonator top based on PCB plane electrode by two in block (1) Spiral shell instrument is evacuated to vacuum state.
CN201810263737.0A 2018-03-28 2018-03-28 A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode Pending CN108731660A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810263737.0A CN108731660A (en) 2018-03-28 2018-03-28 A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810263737.0A CN108731660A (en) 2018-03-28 2018-03-28 A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode

Publications (1)

Publication Number Publication Date
CN108731660A true CN108731660A (en) 2018-11-02

Family

ID=63941245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810263737.0A Pending CN108731660A (en) 2018-03-28 2018-03-28 A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode

Country Status (1)

Country Link
CN (1) CN108731660A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110303682A (en) * 2019-07-19 2019-10-08 中国科学院自动化研究所 The dedicated 3D printer of deep sea submarine
CN114505629A (en) * 2022-03-15 2022-05-17 哈尔滨工业大学 Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6474161B1 (en) * 1999-04-23 2002-11-05 Sagem Sa Gyroscopic sensor and rotation measurement apparatus constituting an application thereof
CA2409495A1 (en) * 2001-12-21 2003-06-21 Northrop Grumman Corporation Electrical connection to a coil spring through a local interference fit for connection to a vibratory rotation sensor and method of forming the same
US20090031832A1 (en) * 2007-08-03 2009-02-05 Choi Youngmin A Inner-forcer milli-hemispherical resonator gyro
KR101414391B1 (en) * 2013-06-11 2014-07-02 한국항공우주연구원 Hemispherical resonant gyro
CN205352405U (en) * 2016-03-03 2016-06-29 绍兴文理学院 Hemispherical resonance gyroscope
CN105737726A (en) * 2014-12-12 2016-07-06 深圳市联思精密机器有限公司 Multilayer electrode displacement sensor
US20160231113A1 (en) * 2015-02-10 2016-08-11 Northrop Grumman Systems Corporation Wide rim vibratory resonant sensors
CN106441254A (en) * 2016-08-31 2017-02-22 歌尔股份有限公司 MEMS three-axis inertial sensor based on thermal expansion airflow and processing method thereof
CN107014366A (en) * 2017-03-30 2017-08-04 中国人民解放军国防科学技术大学 A kind of cylindrical shell oscillation gyro based on static excitation with detection
CN107055457A (en) * 2016-12-12 2017-08-18 北京自动化控制设备研究所 A kind of micro- half spherical top sensitive structure of vitreous silica

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6474161B1 (en) * 1999-04-23 2002-11-05 Sagem Sa Gyroscopic sensor and rotation measurement apparatus constituting an application thereof
CA2409495A1 (en) * 2001-12-21 2003-06-21 Northrop Grumman Corporation Electrical connection to a coil spring through a local interference fit for connection to a vibratory rotation sensor and method of forming the same
US20090031832A1 (en) * 2007-08-03 2009-02-05 Choi Youngmin A Inner-forcer milli-hemispherical resonator gyro
KR101414391B1 (en) * 2013-06-11 2014-07-02 한국항공우주연구원 Hemispherical resonant gyro
CN105737726A (en) * 2014-12-12 2016-07-06 深圳市联思精密机器有限公司 Multilayer electrode displacement sensor
US20160231113A1 (en) * 2015-02-10 2016-08-11 Northrop Grumman Systems Corporation Wide rim vibratory resonant sensors
CN205352405U (en) * 2016-03-03 2016-06-29 绍兴文理学院 Hemispherical resonance gyroscope
CN106441254A (en) * 2016-08-31 2017-02-22 歌尔股份有限公司 MEMS three-axis inertial sensor based on thermal expansion airflow and processing method thereof
CN107055457A (en) * 2016-12-12 2017-08-18 北京自动化控制设备研究所 A kind of micro- half spherical top sensitive structure of vitreous silica
CN107014366A (en) * 2017-03-30 2017-08-04 中国人民解放军国防科学技术大学 A kind of cylindrical shell oscillation gyro based on static excitation with detection

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110303682A (en) * 2019-07-19 2019-10-08 中国科学院自动化研究所 The dedicated 3D printer of deep sea submarine
CN114505629A (en) * 2022-03-15 2022-05-17 哈尔滨工业大学 Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate
CN114505629B (en) * 2022-03-15 2022-12-06 哈尔滨工业大学 Electrode substrate fixing device for welding hemispherical harmonic oscillator and electrode substrate

Similar Documents

Publication Publication Date Title
US10527422B2 (en) Micro three-dimensional shell resonator gyroscope
CN107014366B (en) A kind of cylindrical shell oscillation gyro based on static excitation and detection
JP6248129B2 (en) Resonance sensor, gyroscope sensor, and method for forming gyroscope sensor
JP4316050B2 (en) Micromachine manufacturing method
CN108731660A (en) A kind of hemispherical resonant gyro and its method for machining and assembling based on PCB plane electrode
CN107313910B (en) A kind of hall thruster anode magnetic cup integral structure
CN102957396B (en) Resonating element, resonator, electronic device, electronic apparatus, and mobile object
CN104931031B (en) Polycyclic gyro of a kind of fixed electrostatic drive of outer rim and preparation method thereof
EP2438399B1 (en) Gyroscope packaging assembly
US20110240849A1 (en) Microengineered multipole rod assembly
JP2002543374A (en) Gyroscope sensor and rotation measuring device constituting its application
JP2018185188A (en) Physical quantity sensor, method for manufacturing physical quantity sensor, physical quantity sensor device, electronic apparatus, and mobile body
CN111633584A (en) Novel harmonic oscillator clamp holder and using method thereof
CN104197919B (en) The glass metal hemispherical resonator microthrust test of up/down perforation support
CN105509724B (en) Integrated metal vibration gyroscope
CN104197920A (en) Vertical-through-supported hemispherical resonant microgyroscope
JP2011176787A (en) Piezoelectric device and manufacturing method thereof
JP2022154534A (en) inertial sensor
CN103398707B (en) A kind of three silica-based super-thin micro-hemispherical resonator gyroscope of assembly type and preparation method thereof
CN115752410A (en) High-sensitivity and impact-resistant micro-hemispherical gyroscope electrode structure and manufacturing method thereof
CN106556386A (en) Micro- case resonant device of silicon substrate and preparation method thereof
CN116026297A (en) Hemispherical resonator gyroscope and packaging method thereof
RU2555201C2 (en) Gyroscope and method of its manufacturing
CN109186575A (en) The preparation method of bipolar electrode microtrabeculae shape resonator gyroscope based on SOI
CN100547718C (en) A kind of quartzy quadrupole rod device, assembly method and special-purpose assembling clearance gauge thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20181102

RJ01 Rejection of invention patent application after publication