CN108728037A - A kind of adhesive and its manufacturing method increasing LED light module brightness - Google Patents
A kind of adhesive and its manufacturing method increasing LED light module brightness Download PDFInfo
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- CN108728037A CN108728037A CN201810449183.3A CN201810449183A CN108728037A CN 108728037 A CN108728037 A CN 108728037A CN 201810449183 A CN201810449183 A CN 201810449183A CN 108728037 A CN108728037 A CN 108728037A
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- Prior art keywords
- adhesive
- component
- led light
- dimethyl
- light module
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of adhesives and its manufacturing method increasing LED light module brightness, it includes the component A and 1 ~ 1.5 parts by weight B component of 1 parts by weight, wherein, component A includes 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% straight chain type Methyl Hydrogen Polysiloxane Fluid, 0 ~ 3% add-on type silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide, B component includes 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound, 0 ~ 5% acetylene radical siloxane platinum compounds, 0 ~ 5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide.The present invention passes through in α, each component ratio is adjusted on ω-dimethyl polydimethylsiloxane base, is promoted adhesives and insulating properties, is reduced hardening time and the solidification temperature of adhesive, it is effectively improved the heat dissipation effect of LED lamp, promotes the power of LED light in LED lamp.
Description
Technical field
The present invention relates to LED light manufacture technology fields, more particularly, to a kind of adhesive increasing LED light module brightness
And its manufacturing method.
Background technology
It is more prevalent as the headlamp of light source using LED light, and during this LED light use, not only to consider
Relatively high light efficiency, and to take into account good heat dissipation.
Existing LED lamp is made of substrate, radiator, lampshade, LED light mostly, wherein radiator and substrate connection with
Just the heat transfer that LED light generates is gone out, reaches heat dissipation effect；Lampshade covers the LED light on substrate, to by LED
The light conduction that lamp is sent out is gone out.However, existing adhesives substrate and radiator, effective between substrate and radiator
When contact surface only has 40~50%, especially substrate diameter to be more than 40mm, control that effective contact surface is more difficult, this also can
Heat dissipation is seriously affected, substrate temperature is excessively high, also limits the raising of LED light power.
Invention content
Based on this, it is necessary in view of the deficiencies of the prior art, provide a kind of increase increasing LED lamps cooling and brightness
The adhesive and its manufacturing method of LED light module brightness.
In order to solve the above technical problems, the technical solution adopted in the present invention is：It is a kind of to increase LED light module brightness
The manufacturing method of adhesive comprising the component A of 1 parts by weight and 1 ~ 1.5 parts by weight B component, wherein component A is by weight
Proportioning include 90 ~ 99% α, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% straight chain type Methyl Hydrogen Polysiloxane Fluid, 0 ~ 3% add
It is molded silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide, B component includes 90 by weight ratio ~
99% α, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound, 0 ~ 5% acetylene radical siloxane platinum compounds, 0 ~
5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide.
A kind of manufacturing method for the adhesive increasing LED light module brightness comprising following steps：
Weigh 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% straight chain type methyl hydrogen silicon
Oil, 0 ~ 3% add-on type silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide, fed successively to mixed
It closes and obtains A mixtures after being mixed 1 ~ 2 hour in blender, recycle vacuum degasing machine that above-mentioned A mixtures are carried out deaeration
Component A is made in processing；
90 ~ 99% α, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound, 0 ~ 5% second are weighed by weight ratio
Alkynyl siloxanes platinum compounds, 0 ~ 5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nanoscale gas phase two
Silica feeds to after being mixed 1 ~ 2 hour in mixing and blending machine and obtains B mixtures, recycles vacuum degasing machine will successively
Above-mentioned B mixtures carry out deaeration processing, and B component is made；
By component A obtained and B component according to weight ratio 1：（1~1.5）It is fed successively to mixing 1 ~ 2 in mixing and blending machine
Adhesive is obtained after hour；
Vacuum defoamation processing is carried out to adhesive using vacuum degasing machine；
By vacuum defoamation, treated that adhesive is put into dispenser, by dispenser by adhesive dispensing to substrate and heat dissipation
It is heating and curing between device, the bonding process of completing substrate and radiator.
In conclusion a kind of adhesive increasing LED light module brightness of the present invention and its manufacturing method provide a kind of glue
The adhesive between the substrate and radiator of LED lamp is tied, by α, ω-dimethyl polydimethylsiloxane base up-regulation
Straightening chain Methyl Hydrogen Polysiloxane Fluid, add-on type silica gel, silane coupling agent, nano grade gas phase silicon dioxide, platinum complex compound, acetylene
The component ratio of radical siloxane platinum compounds, ethynylcyclohexanol promotes adhesives and insulating properties, reduces adhesive
Hardening time and solidification temperature promote producing efficiency, are effectively improved the heat dissipation effect of LED lamp, promote LED light in LED lamp
Power.
Specific implementation mode
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the present invention, with reference to
Present invention is further described in detail for specific implementation mode.
A kind of adhesive increasing LED light module brightness of the present invention includes the component A and 1 ~ 1.5 weight of 1 parts by weight
Number B component, wherein component A includes 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% it is straight
Chain Methyl Hydrogen Polysiloxane Fluid, 0 ~ 3% add-on type silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nanoscale gas phase titanium dioxide
Silicon, B component include 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound, 0 ~ 5%
Acetylene radical siloxane platinum compounds, 0 ~ 5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nanoscale gas
Aerosil.
The degree of polymerization of the α, ω-dimethyl dimethyl silicone polymer raw material is 150 ~ 1200, and the straight chain type methyl contains
Hydrogen silicone oil acts on for crosslinking agent, and the add-on type silica gel acts on for tackifier, the platinum complex compound and acetylene radical siloxane platinum
Compound is catalyst action, and the ethynylcyclohexanol acts on for inhibitor.
Increase the adhesive of LED light module brightness according to aforementioned present invention, the present invention provides a kind of increase LED light module
The manufacturing method of the adhesive of brightness, the adhesive of the increase LED light module brightness involved in this method can with it is above-mentioned
The technical characteristic for increasing the adhesive embodiment elaboration of LED light module brightness is identical, and can generate identical technique effect.This
The manufacturing method that invention increases the adhesive of LED light module brightness passes through in α, ω-dimethyl polydimethylsiloxane base
Raise straightening chain Methyl Hydrogen Polysiloxane Fluid, add-on type silica gel, silane coupling agent, nano grade gas phase silicon dioxide, platinum complex compound,
The component ratio of acetylene radical siloxane platinum compounds, ethynylcyclohexanol is distinguished component A and B component using vacuum degasing machine
It is spare after deaeration processing, then component A and B component are subjected to mixing in proportion and are put into dispenser, it will be mixed finally by dispenser
The common dispensing of component A and B component after conjunction is heating and curing between substrate and radiator, the bonding work of completing substrate and radiator
Sequence, while effective contact area between substrate and radiator is promoted, to be effectively improved the heat dissipation effect of LED lamp, promoted
The LED light of LED lamp uses power, enhances the brightness of LED lamp.
The present invention increases the manufacturing method of the adhesive of LED light module brightness, includes the following steps：
Weigh 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% straight chain type methyl hydrogen silicon
Oil, 0 ~ 3% add-on type silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide, fed successively to mixed
It closes and obtains A mixtures after being mixed 1 ~ 2 hour in blender, recycle vacuum degasing machine that above-mentioned A mixtures are carried out deaeration
Component A is made in processing；
90 ~ 99% α, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound, 0 ~ 5% second are weighed by weight ratio
Alkynyl siloxanes platinum compounds, 0 ~ 5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nanoscale gas phase two
Silica feeds to after being mixed 1 ~ 2 hour in mixing and blending machine and obtains B mixtures, recycles vacuum degasing machine will successively
Above-mentioned B mixtures carry out deaeration processing, and B component is made；
By component A obtained and B component according to weight ratio 1：（1~1.5）It is fed successively to mixing 1 ~ 2 in mixing and blending machine
Adhesive is obtained after hour；
Vacuum defoamation processing is carried out to adhesive using vacuum degasing machine；
By vacuum defoamation, treated that adhesive is put into dispenser, by dispenser by adhesive dispensing to substrate and heat dissipation
It is heating and curing between device, the bonding process of completing substrate and radiator；Wherein, the temperature that adhesive is heating and curing is 20 ~ 45 DEG C.
The degree of polymerization of the α in one of the embodiments, ω-dimethyl dimethyl silicone polymer raw material be 150 ~
1200。
The straight chain type Methyl Hydrogen Polysiloxane Fluid acts on for crosslinking agent in one of the embodiments, the add-on type silica gel
It is acted on for tackifier, the platinum complex compound and acetylene radical siloxane platinum compounds are catalyst action, the acetenyl hexamethylene
Alcohol acts on for inhibitor
The add-on type silica gel, silane coupling agent are effectively promoted in the solidification process of adhesive in one of the embodiments,
Bonding force between the substrate and radiator of adhesives makes the two more closely attach, and effectively promotes substrate and radiator
Between effective contact area, and then improve LED lamp heat dissipation effect, promoted LED lamp in LED light use power, increase
The brightness of strong LED lamp.
In addition, component A includes the α of higher proportion in adhesive, ω-dimethyl dimethyl silicone polymer coordinates minor proportion
Nano grade gas phase silicon dioxide, with preferable caking property and insulating properties, apply LED lamp substrate and radiator it
Between play good fixed function and insulating effect, using the nano grade gas phase silicon dioxide after surface-active-treatment mix to
In α, ω-dimethyl dimethyl silicone polymer, package curing time and the solidification temperature of adhesive is greatly shortened, improves substrate
With the producing efficiency of the fixed LED lamp of radiator.
In conclusion a kind of adhesive increasing LED light module brightness of the present invention and its manufacturing method provide a kind of glue
The adhesive between the substrate and radiator of LED lamp is tied, by α, ω-dimethyl polydimethylsiloxane base up-regulation
Straightening chain Methyl Hydrogen Polysiloxane Fluid, add-on type silica gel, silane coupling agent, nano grade gas phase silicon dioxide, platinum complex compound, acetylene
The component ratio of radical siloxane platinum compounds, ethynylcyclohexanol promotes adhesives and insulating properties, reduces adhesive
Hardening time and solidification temperature promote producing efficiency, are effectively improved the heat dissipation effect of LED lamp, promote LED light in LED lamp
Power.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot limitation of the scope of the invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection model of the present invention
It encloses.Therefore, protection scope of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of adhesive increasing LED light module brightness, it is characterised in that：Component A including 1 parts by weight and 1 ~ 1.5
Parts by weight B component, wherein component A includes 90 ~ 99% α, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% by weight ratio
Straight chain type Methyl Hydrogen Polysiloxane Fluid, 0 ~ 3% add-on type silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nanoscale gas phase two
Silica, B component include 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound,
0 ~ 5% acetylene radical siloxane platinum compounds, 0 ~ 5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nanometer
Grade aerosil.
2. a kind of adhesive increasing LED light module brightness according to claim 1, it is characterised in that：The α, ω-
The degree of polymerization of dimethyl dimethyl silicone polymer raw material is 150 ~ 1200.
3. a kind of adhesive increasing LED light module brightness according to claim 1, it is characterised in that：The straight chain
Type Methyl Hydrogen Polysiloxane Fluid acts on for crosslinking agent, and the add-on type silica gel acts on for tackifier, the platinum complex compound and acetenyl
Siloxanes platinum compounds is catalyst action, and the ethynylcyclohexanol acts on for inhibitor.
4. a kind of manufacturing method for the adhesive increasing LED light module brightness, which is characterized in that include the following steps：
Weigh 90 ~ 99% α by weight ratio, ω-dimethyl dimethyl silicone polymer, 1 ~ 10% straight chain type methyl hydrogen silicon
Oil, 0 ~ 3% add-on type silica gel, 0 ~ 3% silane coupling agent and 0 ~ 3% nano grade gas phase silicon dioxide, fed successively to mixed
It closes and obtains A mixtures after being mixed 1 ~ 2 hour in blender, recycle vacuum degasing machine that above-mentioned A mixtures are carried out deaeration
Component A is made in processing；
90 ~ 99% α, ω-dimethyl dimethyl silicone polymer, 0 ~ 5% platinum complex compound, 0 ~ 5% second are weighed by weight ratio
Alkynyl siloxanes platinum compounds, 0 ~ 5% ethynylcyclohexanol, 0 ~ 3% silane coupling agent and 0 ~ 3% nanoscale gas phase two
Silica feeds to after being mixed 1 ~ 2 hour in mixing and blending machine and obtains B mixtures, recycles vacuum degasing machine will successively
Above-mentioned B mixtures carry out deaeration processing, and B component is made；
By component A obtained and B component according to weight ratio 1：（1~1.5）It is fed successively to mixing 1 ~ 2 in mixing and blending machine
Adhesive is obtained after hour；
Vacuum defoamation processing is carried out to adhesive using vacuum degasing machine；
By vacuum defoamation, treated that adhesive is put into dispenser, by dispenser by adhesive dispensing to substrate and heat dissipation
It is heating and curing between device, the bonding process of completing substrate and radiator.
5. a kind of manufacturing method of adhesive increasing LED light module brightness according to claim 4, feature exist
In：The degree of polymerization of the α, ω-dimethyl dimethyl silicone polymer raw material is 150 ~ 1200.
6. a kind of manufacturing method of adhesive increasing LED light module brightness according to claim 4, feature exist
In：The straight chain type Methyl Hydrogen Polysiloxane Fluid acts on for crosslinking agent, and the add-on type silica gel acts on for tackifier, the platinum complexing
Object and acetylene radical siloxane platinum compounds are catalyst action, and the ethynylcyclohexanol acts on for inhibitor.
7. a kind of manufacturing method of adhesive increasing LED light module brightness according to claim 4, feature exist
In：The temperature that described adhesive is heating and curing is 20 ~ 45 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810449183.3A CN108728037A (en) | 2018-05-11 | 2018-05-11 | A kind of adhesive and its manufacturing method increasing LED light module brightness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810449183.3A CN108728037A (en) | 2018-05-11 | 2018-05-11 | A kind of adhesive and its manufacturing method increasing LED light module brightness |
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| CN108728037A true CN108728037A (en) | 2018-11-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774802A (en) * | 2019-10-23 | 2020-02-11 | 广州市联中电子科技有限公司 | Large-size electronic blackboard device and manufacturing method thereof |
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|---|---|---|---|---|
| CN102559133A (en) * | 2011-12-23 | 2012-07-11 | 成都硅宝科技股份有限公司 | Addition type single component organosilicon sealant and processing method thereof |
| WO2015005221A1 (en) * | 2013-07-08 | 2015-01-15 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Silicone composition for optical semiconductor sealing and optical semiconductor device |
-
2018
- 2018-05-11 CN CN201810449183.3A patent/CN108728037A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102559133A (en) * | 2011-12-23 | 2012-07-11 | 成都硅宝科技股份有限公司 | Addition type single component organosilicon sealant and processing method thereof |
| WO2015005221A1 (en) * | 2013-07-08 | 2015-01-15 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Silicone composition for optical semiconductor sealing and optical semiconductor device |
Non-Patent Citations (2)
| Title |
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| 周志敏 等: "《漫步LED世界 灯具设计与工程应用篇》", 31 January 2013, 国防工业出版社 * |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774802A (en) * | 2019-10-23 | 2020-02-11 | 广州市联中电子科技有限公司 | Large-size electronic blackboard device and manufacturing method thereof |
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Application publication date: 20181102 |