CN108717215A - A kind of reflective DOE diffractive optical elements and preparation method thereof - Google Patents

A kind of reflective DOE diffractive optical elements and preparation method thereof Download PDF

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Publication number
CN108717215A
CN108717215A CN201810477579.9A CN201810477579A CN108717215A CN 108717215 A CN108717215 A CN 108717215A CN 201810477579 A CN201810477579 A CN 201810477579A CN 108717215 A CN108717215 A CN 108717215A
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CN
China
Prior art keywords
layer
preparation
optical elements
diffractive optical
polysilicon layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810477579.9A
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Chinese (zh)
Inventor
胡超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WUXI ZHONGWEI MASK ELECTRONICS Co Ltd
Original Assignee
WUXI ZHONGWEI MASK ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WUXI ZHONGWEI MASK ELECTRONICS Co Ltd filed Critical WUXI ZHONGWEI MASK ELECTRONICS Co Ltd
Priority to CN201810477579.9A priority Critical patent/CN108717215A/en
Publication of CN108717215A publication Critical patent/CN108717215A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • G02B5/1861Reflection gratings characterised by their structure, e.g. step profile, contours of substrate or grooves, pitch variations, materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/18Diffraction gratings
    • G02B5/1847Manufacturing methods
    • G02B5/1857Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams

Abstract

The present invention relates to the processing methods of the diffractive micro-optical device of microelectronic technique; specially a kind of reflective DOE diffractive optical elements and preparation method thereof; including monocrystalline silicon substrate (1), polysilicon layer (2) and photo mask board (3); the polysilicon layer (2) is located on monocrystalline silicon substrate (1); the photo mask board (3) is located on polysilicon layer (2); further include aluminium layer (4) and protective film (5); the aluminium layer (4) is located on polysilicon layer (2), and the protective film (5) is located on aluminium layer (4).

Description

A kind of reflective DOE diffractive optical elements and preparation method thereof
Technical field
The present invention relates to the processing method of the diffractive micro-optical device of microelectronic technique, specially a kind of reflective DOE spreads out Emitter part and preparation method thereof.
Background technology
Micro-processing technology based on silicon microelectronics achieves huge achievement in past over half a century, energetically The development for having pushed integrated circuit.Silicon is in nature first of constituent content, and people are to silicon and its derivative Characteristic has enough understandings.The huge industry ability for having benefited from silicon substrate processing technology needs retrofit technique to support micro- Optics of receiving also has obtained huge development.Micronano optical element have it is small, it is light-weight and the characteristics of be easily integrated.With The development of photoelectron technology, micronano optical element have wide answer in biomedicine, the fields such as fiber optic communication and information processing With.
Micronano optical element is made by the modern micro-nano technology technology of micron/submicron grade, including electricity Beamlet direct writing technology, laser writing technology, mask set lithography, technique of gray-scale mask and heat melt technology etc..With modernization Information apparatus requires optics fine structure, the micromation of device and integrated higher and higher, therefore using mutually treating as Ripe microelectronic processing technology processing micronano optical structure becomes an important research direction.
Invention content
The object of the present invention is to provide a kind of preparation method of reflective DOE diffractive optical elements, the reflective DOE diffraction Device can utilize the diffraction of transmitting light, illumination to be mapped on the device of micro-structure, will present on reflected light projects to other objects Diffraction pattern.
Technical solution is used by invention solves its technical problem:A kind of reflective DOE diffractive optical elements, including monocrystalline silicon Substrate, polysilicon layer and photo mask board, the polysilicon layer are located on monocrystalline silicon substrate, and the photo mask board is located at polycrystalline Further include aluminium layer and protective film on silicon layer, the aluminium layer is set on the polysilicon layer, and the protective film is located on aluminium layer.
Technical solution is used by invention solves its technical problem:A kind of preparation method of reflective DOE diffractive optical elements, Include the following steps:Step 1:It prepares the mask plate with optical microstructures and is used for photoetching;
Step 2:The polysilicon that growth thickness is a on monocrystalline silicon substrate is for etching;
Step 3:Photoetching and development are carried out to polysilicon layer using mask plate;
Step 4:Depth b is etched to polysilicon layer;
Step 5:Aluminium layer is plated on figure as reflecting layer;
Step 6:Transparent protective film is grown on figure.
Preferably, the growth thickness a of the polysilicon is 1 μm.
Preferably, the depth b is 250nm ± 40nm.
Preferably, the thickness of the aluminium layer is 50nm ± 20nm.
Advantageous effect of the invention is:The preparation method microelectronic processing technology of the reflective DOE diffractive optical elements of the present invention Preparing reflective DOE devices can effective control pattern precision and reduction cost;It can accurately be controlled using polysilicon as etch layer Etching depth processed is to reach the best diffraction efficiency of device.
Description of the drawings
Fig. 1 is the structural schematic diagram of the reflective DOE diffractive optical elements of the present invention.
Description of the drawings:1, monocrystalline silicon substrate, 2, polysilicon layer, 3, photo mask board, 4, aluminium layer, 5, protective film.
Specific implementation mode
Invention is described in further detail presently in connection with attached drawing.These attached drawings are simplified schematic diagram, only to show Meaning mode illustrates the basic structure of invention, therefore it only shows and invents related composition.
A kind of reflective DOE diffractive optical elements, including monocrystalline silicon substrate 1, polysilicon layer 2 and photo mask board 3, the polycrystalline Silicon layer 2 is located on monocrystalline silicon substrate 1, and the photo mask board 3 is located on polysilicon layer 2, further includes aluminium layer 4 and protective film 5, The aluminium layer 4 is located on polysilicon layer 2, and the protective film 5 is located on aluminium layer 4.
A kind of preparation method of reflective DOE diffractive optical elements, includes the following steps:Step 1:Preparing has the micro- knot of optics The mask plate of structure is used for photoetching;
Step 2:The polysilicon that growth thickness is a on monocrystalline silicon substrate is for etching;
Step 3:Photoetching and development are carried out to polysilicon layer using mask plate;
Step 4:Depth b is etched to polysilicon layer;
Step 5:Aluminium layer is plated on figure as reflecting layer;
Step 6:Transparent protective film is grown on figure.
The growth thickness a of the polysilicon is 1 μm.
The depth b is 250nm ± 40nm.
The thickness of the aluminium layer is 50nm ± 20nm.
The preparation method of the reflective DOE diffractive optical elements of the present invention prepares reflective DOE devices with microelectronic processing technology It can effective control pattern precision and reduction cost;Etching depth can be accurately controlled to reach using polysilicon as etch layer The best diffraction efficiency of device.
It is enlightenment with the above-mentioned desirable embodiment according to invention, through the above description, relevant staff is complete Can without departing from the scope of the technological thought of the present invention', carry out various changes and amendments, this invention it is technical Range is not limited to the contents of the specification, it is necessary to determine its technical scope according to right.

Claims (5)

1. a kind of reflective DOE diffractive optical elements, it is characterised in that:It is covered including monocrystalline silicon substrate (1), polysilicon layer (2) and photoetching Template (3), the polysilicon layer (2) are located on monocrystalline silicon substrate (1), and the photo mask board (3) is located at polysilicon layer (2) On, further include aluminium layer (4) and protective film (5), the aluminium layer (4) is located on polysilicon layer (2), and the protective film (5) is located at aluminium On layer (4).
2. a kind of preparation method of reflective DOE diffractive optical elements, it is characterised in that:Include the following steps:Step 1:Preparation has The mask plate of optical microstructures is used for photoetching;
Step 2:The polysilicon that growth thickness is a on monocrystalline silicon substrate is for etching;
Step 3:Photoetching and development are carried out to polysilicon layer using mask plate;
Step 4:Depth b is etched to polysilicon layer;
Step 5:Aluminium layer is plated on figure as reflecting layer;
Step 6:Transparent protective film is grown on figure.
3. the preparation method of reflective DOE diffractive optical elements according to claim 1, it is characterised in that:The polysilicon Growth thickness a is 1 μm.
4. the preparation method of reflective DOE diffractive optical elements according to claim 1, it is characterised in that:The depth b is 250nm±40nm。
5. the preparation method of reflective DOE diffractive optical elements according to claim 1, it is characterised in that:The thickness of the aluminium layer Degree is 50nm ± 20nm.
CN201810477579.9A 2018-05-18 2018-05-18 A kind of reflective DOE diffractive optical elements and preparation method thereof Pending CN108717215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810477579.9A CN108717215A (en) 2018-05-18 2018-05-18 A kind of reflective DOE diffractive optical elements and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810477579.9A CN108717215A (en) 2018-05-18 2018-05-18 A kind of reflective DOE diffractive optical elements and preparation method thereof

Publications (1)

Publication Number Publication Date
CN108717215A true CN108717215A (en) 2018-10-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810477579.9A Pending CN108717215A (en) 2018-05-18 2018-05-18 A kind of reflective DOE diffractive optical elements and preparation method thereof

Country Status (1)

Country Link
CN (1) CN108717215A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109975904A (en) * 2019-03-22 2019-07-05 无锡中微掩模电子有限公司 A kind of reflective DOE diffractive optical element of high-precision and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377044A (en) * 1990-03-19 1994-12-27 Canon Kabushiki Kaisha Reflecting diffraction grating and device, such as encoder or the like, using the same
CN1344945A (en) * 2000-09-21 2002-04-17 日本板硝子株式会社 Reflection-type diffraction grating
CN100542805C (en) * 2007-06-19 2009-09-23 浙江大学 The micro electronmechanical processing grating light valve array and the method thereof that are used for laser photo-typesetting
CN107942425A (en) * 2016-10-13 2018-04-20 上海矽越光电科技有限公司 Buried-metal type broadband reflection grating and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5377044A (en) * 1990-03-19 1994-12-27 Canon Kabushiki Kaisha Reflecting diffraction grating and device, such as encoder or the like, using the same
CN1344945A (en) * 2000-09-21 2002-04-17 日本板硝子株式会社 Reflection-type diffraction grating
CN100542805C (en) * 2007-06-19 2009-09-23 浙江大学 The micro electronmechanical processing grating light valve array and the method thereof that are used for laser photo-typesetting
CN107942425A (en) * 2016-10-13 2018-04-20 上海矽越光电科技有限公司 Buried-metal type broadband reflection grating and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109975904A (en) * 2019-03-22 2019-07-05 无锡中微掩模电子有限公司 A kind of reflective DOE diffractive optical element of high-precision and preparation method thereof

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Application publication date: 20181030