CN108712852A - A kind of microchannel heat sink of gas-liquid two-phase mixing jetting - Google Patents
A kind of microchannel heat sink of gas-liquid two-phase mixing jetting Download PDFInfo
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- CN108712852A CN108712852A CN201810764994.2A CN201810764994A CN108712852A CN 108712852 A CN108712852 A CN 108712852A CN 201810764994 A CN201810764994 A CN 201810764994A CN 108712852 A CN108712852 A CN 108712852A
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- liquid
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- coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
Abstract
The present invention provides a kind of microchannel heat sinks of gas-liquid two-phase mixing jetting comprising upper cover plate, gas-liquid mixed injection structure, microchannel plate, heater, pedestal；The gas-liquid two-phase mixing jet structure includes that coolant inlet, crossing current liquid inlet, jet stream enter chamber, jet hole and the outlet of gas-liquid mixed flow.Coolant liquid is first flowed by coolant inlet, a part flows to microchannel plate formation crossing current liquid through liquid inlet of flowing over and exchanges heat, another part flows to jet stream and enters chamber, microchannel plate is ejected into after the gas mixing flowed into air inlet through jet hole to exchange heat, the coolant liquid flowed into microchannel with crossing current liquid inlet simultaneously mixes, so that coolant liquid is generated disorderly, finally by gas-liquid mixed outflux flow out.The present invention impacts the liquid that flows in microchannel using gas-liquid two-phase mixing jetting, realizes enhanced heat exchange, and inhibits microchannel boiling instability.In addition, also having the characteristics that compact-sized, small, manufacturing process is simple.
Description
Technical field
The present invention relates to a kind of novel microchannel heat sink, the microchannel of especially a kind of gas-liquid two-phase mixing jetting is radiated
Device.
Background technology
As electronic chip develops towards Highgrade integration, multifunction and micromation direction, the volume fever heat of chip
Flux constantly increases, and the heat of generation can not be taken away and will lead to the rapid raising of device and system temperature in time, seriously affect electricity
The reliable and stable work of sub- device.Therefore the microchannel heat sink with high efficient heat dissipation performance, compact package becomes ideal choosing
It selects.The entrance and exit of traditional microchannel heat sink is located at the both ends of radiating element, and microchannel is coupled envelope with cover board
The cooling microchannel of dress, connect to form coolant circuit, the coolant liquid flowed by microchannel is taken away electronic device and generated with the external world
Heat, to realize the purpose of dissipation from electronic devices.There are between radiator and coolant liquid in traditional microchannel cooling
The insufficient problem of heat exchange so that heat can not all be taken away, at the same coolant inlet speed increase when can lead to pressure drop
Increase.Boiling in addition, when but liquid boils micro-channel inner-cooling, in microchannel, to easily lead to boiling non-surely for the quick generation of bubble
Qualitative question brings serious problem to the stable operation of microchannel cooling system.
Invention content
It is an object of the invention to overcome the shortcomings of existing microchannel heat sink, provide a kind of using gas-liquid two-phase mixing spray
The microchannel heat sink penetrated disturbs in gas and liquid mixing jetting injection microchannel the liquid that flows in microchannel, makes crossing current
Turbulent flow occurs for liquid, while strengthening disturbance two-phase and boiling the bubble to be formed, and makes heat exchange between radiator and coolant liquid more
Fully, it realizes enhanced heat exchange, and effectively reduces pressure drop.
In order to achieve the above objectives, idea of the invention is that：
The present invention provides a kind of microchannel heat sinks of gas-liquid two-phase mixing jetting, including：It upper cover plate and stacks gradually
Gas-liquid mixed fluidic architecture, microchannel plate, heater and the pedestal being arranged below upper cover plate；
The center of the upper cover plate offers air inlet；The gas-liquid two-phase mixing jet structure includes that coolant liquid enters
Mouth, crossing current liquid inlet, jet stream enter chamber, jet hole and the outlet of gas-liquid mixed flow；The microchannel plate is alongst set
There is a plurality of microchannel being mutually parallel, the heater upper surface to be bonded with the bottom surface of the microchannel, the pedestal have with
The cavity of the heater devices；The crossing current liquid inlet connection coolant inlet and the microchannel；The jet stream into
Enter chamber connection coolant inlet and air inlet；The jet hole connecting morphism stream enters chamber and microchannel；
Coolant liquid is first flowed by coolant inlet, and a part flows to the microchannel plate through liquid inlet of flowing over and forms crossing current
Liquid exchanges heat, and another part flows to the jet stream and enters chamber, is penetrated through described after the gas mixing flowed into the air inlet
Discharge orifice is ejected into the microchannel plate and exchanges heat, while the coolant liquid flowed into microchannel with the crossing current liquid inlet is mixed
It closes, so that coolant liquid in microchannel is generated disorder, finally flowed out by the gas-liquid mixed outflux.
In a preferred embodiment：The micro- logical of 10 Dao Zhi, 15 equidistant parallel arrangements is provided on the microchannel plate
The center spacing in road, the adjacent microchannel is 1mm to 1.5mm.
In a preferred embodiment：The microchannel cross section is shaped to rectangle or triangle or trapezoidal, described micro- logical
The hydraulic diameter in road is 0.3mm to 1.0mm.
In a preferred embodiment：The material of the microchannel plate is copper or aluminium.
In a preferred embodiment：The jet hole array distribution enters the bottom of chamber in jet stream, and the jet hole is circle
The size of its diameter of shape d is 0.4-0.6 times of microchannel channel width, and the two neighboring jet hole circle center distance s is diameter d
2-5 times.
In a preferred embodiment：The entrance coolant liquid is deionized water or absolute ethyl alcohol, what the air inlet flowed into
Gas is air or nitrogen
The present invention compared with prior art, has following obvious prominent substantive distinguishing features and remarkable advantage：
1) present invention impacts the liquid that flows in microchannel by the way of gas-liquid two-phase mixing jetting, micro- logical
Road surface can form very thin thermal boundary layer, and dramatically increase the flow velocity of crossing current liquid, to significantly improve heat exchange efficiency.
2) present invention is by the way of gas-liquid two-phase mixing jetting, relative to single phase gas or liquid injection, mixing jetting
Bubble dispersion in a liquid, with bigger heat exchange area, while more can disturb crossing current liquid occur turbulent flow, to strengthen pass
Heat；
3) gas-liquid two-phase mixing jetting is used to be combined with microchannel crossing current liquid, when microchannel crossing current liquid boils
When, gas-liquid mixed injection stream generates significant disturbance to the boiling bubble that microchannel is flow over, and driving boiling bubble is quickly discharged, from
And inhibit boiling instability；
4) microchannel heat sink of the gas-liquid two-phase mixing jetting has compact-sized, small, manufacturing process is simple etc.
Feature is suitable for microelectronics cooling.
Description of the drawings
Fig. 1 is the configuration schematic diagram of the microchannel heat sink of gas-liquid two-phase mixing jetting；
Fig. 2 is the microchannel heat sink operating diagram of gas-liquid two-phase mixing jetting；
Fig. 3 is upper cover plate structure schematic diagram；
Fig. 4 is schematic diagram of the gas-liquid mixed fluidic architecture on the directions A-A；
Fig. 5 is the structural schematic diagram of the jet hole in gas-liquid mixed fluidic architecture；
Fig. 6 is the schematic diagram of microchannel plate；
Fig. 7 is the schematic diagram of heater, understructure.
Specific implementation mode
The preferred embodiment of the present invention is described with reference to the drawings as follows：
It is as shown in Figure 1, Figure 2 and Figure 7 a kind of injection microchannel heat sink of gas-liquid two-phase mixing of the present invention, including upper
Cover board 1, gas-liquid mixed fluidic architecture 2, microchannel plate 3, heater 4 and pedestal 5.The upper cover plate and gas-liquid mixing jet structure
It is preferred that using PC plate or PEEK materials, the submount material is preferably PEEK or asbestos board, and the heater is preferably polyamides Asia
Amine heater.Upper cover plate 1 connect through hole 8 with gas-liquid mixed fluidic architecture 2 and is connect with 14 screw of hole；Gas-liquid mixed injection structure
2, microchannel plate 3, the corresponding length of every layer of pedestal 5, width dimensions are identical, preferably 35mm × 17mm.Successively by upper cover plate 1
Gas-liquid mixed injection structure 2, microchannel plate 3, heater 4, pedestal 5 pass sequentially through stacked combination, and place sealing ring, then adopt
It is tightened by bolts, closed microchannel heat sink is formed under the action of its pretightning force.
As shown in figure 3,1 center of upper cover plate be provided with the air inlet of external connection 6, diameter is preferably 3mm；It is provided on plate pair
Claim 6 a diameter of 2.2mm through-holes 8 of distribution, and sealing ring conduit 7 is set, is linked by bolt and realize locking and sealing.Such as figure
Shown in 4, gas-liquid mixed fluidic architecture 2 includes coolant inlet 10, crossing current liquid inlet 11 and gas-liquid mixed flow outlet 12, jet stream
Into the Circular Jet hole 13 of chamber 9, array arrangement, Circular Jet hole 13 is as shown in Figure 5.Coolant inlet 10, crossing current liquid enter
Mouth 11 and gas-liquid mixed flow export 12 diameters and are preferably 3mm, and the height that jet stream enters chamber 9 is 4mm.Circular Jet hole 13
Diameter is preferably 0.1 to 0.6mm, pitch of holes 1mm, is directed at microchannel conduit 17；Distance of the jet hole 13 away from jet face be
2mm, consistent with 17 quantity of conduit, the lateral quantity of jet hole 13 is determined according to microchannel size and reality.
As shown in fig. 6, being provided with the microchannel of 10 Dao Zhi, 15 equidistant parallel arrangements, the phase on the microchannel plate
The center spacing of adjacent microchannel is 1mm to 1.5mm.The microchannel cross section is shaped to rectangle or triangle or trapezoidal, institute
The hydraulic diameter for stating microchannel is 0.3mm to 1.0mm.The microchannel plate material is copper or aluminium.The crossing current liquid inlet 11
It is connected to coolant inlet 10 and the microchannel；The jet stream enters chamber 9 and is connected to coolant inlet 10 and air inlet；The jet stream
13 connecting morphism stream of hole enters chamber 9 and microchannel；
The operation principle that gas-liquid mixed sprays microchannel heat sink is as shown in Figure 2.Heat is heated from heater 4, by phase
The microchannel plate bottom of contact is transferred to microchannel wall surface.Entrance coolant liquid is preferably deionized water or absolute ethyl alcohol, and entrance is cold
But gas preferably uses nitrogen or air.Coolant liquid separately flows into crossing current liquid inlet 11 and jet stream enters chamber 9, nitrogen or sky
Gas is entered by air inlet 6.The nitrogen or air that coolant liquid and air inlet are passed through enter chamber 9 in jet stream and mix, by Circular Jet
Hole 13 is injected in microchannel 3, while the coolant liquid for liquid inlet 11 of flowing over enters in microchannel, and Circular Jet hole 13 enters
Gas-liquid mixture disturbance crossing current liquid-liquid, and through outlet 12 outflow, be connected to external circuit.
The present invention impacts the liquid that flows in microchannel, by the way of gas-liquid two-phase mixing jetting in microchannel
Surface can form very thin thermal boundary layer, and dramatically increase the flow velocity of crossing current liquid, to significantly improve heat exchange efficiency；Relatively
There is the heat exchange area of bigger, while can more disturb in a liquid in the bubble dispersion of single phase gas or liquid injection, mixing jetting
Turbulent flow occurs for dynamic crossing current liquid, to augmentation of heat transfer；In addition, mutually being tied using gas-liquid two-phase mixing jetting and microchannel crossing current liquid
It closes, when liquid boils are flow in microchannel, gas-liquid mixed injection stream generates the boiling bubble that microchannel is flow over significant
Disturbance, driving boiling bubble is quickly discharged, to the instability that unanimously boils.
The foregoing is only a preferred embodiment of the present invention, but the present invention design concept be not limited thereto,
Any one skilled in the art in the technical scope disclosed by the present invention, using this design carries out the present invention non-
Substantive change belongs to the behavior for invading the scope of the present invention.
Claims (6)
1. a kind of microchannel heat sink of gas-liquid two-phase mixing jetting, it is characterised in that including：It upper cover plate and is cascading
Gas-liquid mixed fluidic architecture, microchannel plate, heater and pedestal below upper cover plate；
The center of the upper cover plate offers air inlet；The gas-liquid two-phase mixing jet structure include coolant inlet,
Crossing current liquid inlet, jet stream enter chamber, jet hole and the outlet of gas-liquid mixed flow；The microchannel plate is alongst equipped with phase
Mutually parallel a plurality of microchannel, the heater upper surface are bonded with the bottom surface of the microchannel, the pedestal with it is described
The cavity of heater devices；
The crossing current liquid inlet connection coolant inlet and the microchannel；The jet stream enter chamber connection coolant inlet with
Air inlet；The jet hole connecting morphism stream enters chamber and microchannel；
Coolant liquid is first flowed by coolant inlet, and a part flows to the microchannel plate through liquid inlet of flowing over and forms crossing current liquid
It exchanges heat, another part flows to the jet stream and enters chamber, through the jet hole after the gas mixing flowed into the air inlet
It is ejected into the microchannel plate to exchange heat, while the coolant liquid flowed into microchannel with the crossing current liquid inlet mixes, and makes
Coolant liquid generates disorderly in microchannel, is finally flowed out by the gas-liquid mixed outflux.
2. the microchannel heat sink of gas-liquid two-phase mixing jetting according to claim 1, it is characterised in that：The microchannel
Be provided with the microchannel of 10 Dao Zhi, 15 equidistant parallel arrangements on plate, the center spacing of the adjacent microchannel be 1mm extremely
1.5mm。
3. the microchannel heat sink of gas-liquid two-phase mixing jetting according to claim 1, it is characterised in that：The microchannel
Cross sectional shape is set as rectangle or triangle or trapezoidal, and the hydraulic diameter of the microchannel is 0.3mm to 1.0mm.
4. the injection microchannel heat sink of gas-liquid two-phase mixing according to claim 1, it is characterised in that：The microchannel
The material of plate is copper or aluminium.
5. the microchannel heat sink of gas-liquid two-phase mixing jetting according to claim 1, it is characterised in that：The jet hole
Array distribution enters the bottom of chamber in jet stream, and the jet hole is circle, and the size of diameter d is microchannel channel width
0.4-0.6 times, the two neighboring jet hole circle center distance s is 2-5 times of diameter d.
6. the microchannel heat sink of gas-liquid two-phase mixing jetting according to claim 1, it is characterised in that：The entrance is cold
But liquid is deionized water or absolute ethyl alcohol, and the gas that the air inlet flows into is air or nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810764994.2A CN108712852B (en) | 2018-07-12 | 2018-07-12 | A kind of microchannel heat sink of gas-liquid two-phase mixing jetting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810764994.2A CN108712852B (en) | 2018-07-12 | 2018-07-12 | A kind of microchannel heat sink of gas-liquid two-phase mixing jetting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108712852A true CN108712852A (en) | 2018-10-26 |
| CN108712852B CN108712852B (en) | 2019-07-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810764994.2A Active CN108712852B (en) | 2018-07-12 | 2018-07-12 | A kind of microchannel heat sink of gas-liquid two-phase mixing jetting |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109548364A (en) * | 2018-10-30 | 2019-03-29 | 中国运载火箭技术研究院 | A kind of radiator and its application |
| CN110567302A (en) * | 2019-09-17 | 2019-12-13 | 四川大学 | Double-layer cutoff type porous jet bubble micronization boiling cooling device |
| CN111900143A (en) * | 2020-07-31 | 2020-11-06 | 上海交通大学 | Manifold type high depth-width ratio micro-channel heat exchanger |
| CN112788918A (en) * | 2020-12-23 | 2021-05-11 | 中车大连机车研究所有限公司 | Turbulent flow jet cooling device for porous medium |
| CN113286497A (en) * | 2021-05-25 | 2021-08-20 | 电子科技大学 | Jet flow micro-channel radiator with surface micro-grooves |
| CN113543588A (en) * | 2021-06-24 | 2021-10-22 | 西安交通大学 | Jet flow-transverse flow combined immersed heat dissipation device and method |
| CN113840523A (en) * | 2021-10-09 | 2021-12-24 | 中国电子科技集团公司第二十六研究所 | Active heat exchange shell and manufacturing method thereof |
| CN113960103A (en) * | 2021-07-30 | 2022-01-21 | 西安交通大学 | Microchannel phase change heat transfer test device and microchannel heat exchanger |
| CN114295318A (en) * | 2021-12-10 | 2022-04-08 | 北京理工大学 | Multi-mode immersion gas jet refined measurement system |
| CN114599201A (en) * | 2022-01-26 | 2022-06-07 | 华南理工大学 | Micro-spray phase change liquid cooling vapor chamber for server, heat dissipation operation system and control method |
| CN115379718A (en) * | 2022-07-12 | 2022-11-22 | 电子科技大学 | Double-layer micro-channel heat dissipation structure facing non-uniform heat source |
| CN116469856A (en) * | 2023-06-20 | 2023-07-21 | 之江实验室 | Cooling chip with manifold micro-channel structure and cooling method |
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| CN110567302A (en) * | 2019-09-17 | 2019-12-13 | 四川大学 | Double-layer cutoff type porous jet bubble micronization boiling cooling device |
| CN110567302B (en) * | 2019-09-17 | 2020-08-21 | 四川大学 | Double-layer cutoff type porous jet bubble micronization boiling cooling device |
| CN111900143A (en) * | 2020-07-31 | 2020-11-06 | 上海交通大学 | Manifold type high depth-width ratio micro-channel heat exchanger |
| CN112788918B (en) * | 2020-12-23 | 2024-02-02 | 中车大连机车研究所有限公司 | Porous medium turbulent flow jet cooling device |
| CN112788918A (en) * | 2020-12-23 | 2021-05-11 | 中车大连机车研究所有限公司 | Turbulent flow jet cooling device for porous medium |
| CN113286497A (en) * | 2021-05-25 | 2021-08-20 | 电子科技大学 | Jet flow micro-channel radiator with surface micro-grooves |
| CN113543588A (en) * | 2021-06-24 | 2021-10-22 | 西安交通大学 | Jet flow-transverse flow combined immersed heat dissipation device and method |
| CN113960103A (en) * | 2021-07-30 | 2022-01-21 | 西安交通大学 | Microchannel phase change heat transfer test device and microchannel heat exchanger |
| CN113840523B (en) * | 2021-10-09 | 2022-07-29 | 中国电子科技集团公司第二十六研究所 | Active heat exchange shell and manufacturing method thereof |
| CN113840523A (en) * | 2021-10-09 | 2021-12-24 | 中国电子科技集团公司第二十六研究所 | Active heat exchange shell and manufacturing method thereof |
| CN114295318A (en) * | 2021-12-10 | 2022-04-08 | 北京理工大学 | Multi-mode immersion gas jet refined measurement system |
| CN114599201A (en) * | 2022-01-26 | 2022-06-07 | 华南理工大学 | Micro-spray phase change liquid cooling vapor chamber for server, heat dissipation operation system and control method |
| CN115379718A (en) * | 2022-07-12 | 2022-11-22 | 电子科技大学 | Double-layer micro-channel heat dissipation structure facing non-uniform heat source |
| CN116469856A (en) * | 2023-06-20 | 2023-07-21 | 之江实验室 | Cooling chip with manifold micro-channel structure and cooling method |
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