CN108711589A - Arrange mould equipment - Google Patents
Arrange mould equipment Download PDFInfo
- Publication number
- CN108711589A CN108711589A CN201811035678.8A CN201811035678A CN108711589A CN 108711589 A CN108711589 A CN 108711589A CN 201811035678 A CN201811035678 A CN 201811035678A CN 108711589 A CN108711589 A CN 108711589A
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- Prior art keywords
- row
- locating rack
- sieve
- sieve plate
- hole
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Combined Means For Separation Of Solids (AREA)
Abstract
The present invention provides a kind of row's mould equipment, are related to semiconductor refrigerating technology field.Wherein, this row's mould equipment includes：Ontology is equipped with a container, and both sides are respectively equipped with through hole；Locating rack is fixedly arranged in container, and top is equipped with locating slot；Weldering mold, is positioned in locating slot, and its top is equipped with several row's die holes；Two sieve plates, several sieve pores are equipped at the top of each sieve plate, and when two sieve plates are stacked together, sieve pore on two sieve plates is arranged in alternate intervals successively, when any sieve plate is positioned on locating rack, it is located at the top of weldering mold, and external series gap is equipped between locating rack, external series gap is opposite with through hole, and each sieve pore is opposite with row's die hole；Isolation board, it is movable to be threaded through in through hole and external series gap；Vibration machine is connect with locating rack.Row's mould equipment in the present invention arranges mould using automatic mechanism to carry out crystal grain, efficient, reduces hand labor intensity.
Description
Technical field
The present invention relates to semiconductor refrigerating technology fields, in particular to a kind of row's mould equipment.
Background technology
Semiconductor refrigerating is also known as electronic cooling or thermoelectric cooling, is grow up from the fifties one between system
The subject of refrigeration technique and semiconductor technology edge, the P-N junction that it is constituted using extraordinary semi-conducting material form thermocouple pair, production
Raw Peltier effect, i.e., a kind of New Refrigerating method freezed by direct current and compression-type refrigeration and absorption refrigeration and claim
For three big refrigeration modes of the world.
The typical products of semiconductor refrigerating are semiconductor chilling plate, and semiconductor chilling plate generally includes ceramic wafer, lower pottery
Porcelain plate and the N-type crystal grain (i.e. N-type semiconductor) being connected between upper and lower ceramic wafer and p-type crystal grain (i.e. P-type semiconductor), N-type are brilliant
Alternate intervals are arranged successively for grain and p-type crystal grain.When the galvanic couple that direct current is connected by both different semi-conducting materials,
Upper and lower ceramic wafer absorbs heat and releases heat respectively, to realize the purpose of refrigeration.
In the generating process of semiconductor chilling plate, it usually needs crystal grain and upper and lower ceramic wafer are welded together, and
It needs one grain of crystal grain being accurately put into weld mold before welding, however, in the prior art, at present using artificial
Manually one grain of crystal grain is put into weldering and is shaken in mold in mold or by link mechanism horizontal jitter by crystal grain by mode,
Row's mould method row of the prior art imitates that rate is low, and hand labor intensity is big.
Invention content
The present invention provides a kind of row's mould equipment, it is intended to improve artificial row in the prior art and imitates the low technology of rate and ask
Topic.
The invention is realized in this way：
A kind of row's mould equipment according to embodiments of the present invention, including：
One ontology, top are equipped with a container, and the both sides of the ontology are respectively equipped with pass through aperture, the through hole with
The container connection, and two through holes are positioned opposite；
One locating rack is fixedly arranged on the inner wall of the container, and its top is equipped with a positioning groove；
One weldering mold, is positioned in the locating slot, and its top is equipped with several row's die holes being arranged in array；
Two sieve plates, several sieve pores that are being equipped with perforation at the top of each sieve plate and being arranged in array, and when two
When a sieve plate is stacked together, the sieve pore on two sieve plates is arranged in alternate intervals successively, when any sieve plate
When being positioned on the locating rack, it is located at the top of the weldering mold, and external series gap is equipped between the locating rack,
The external series gap is opposite with the through hole, and each sieve pore is opposite with row's die hole；
One isolation board, it is movable to be threaded through in the through hole and external series gap；And
One vibration machine is set in the container, and is connect with the locating rack.
In addition, in preferred embodiments of the present invention, above-mentioned row's mould equipment can also have following additional technical feature：
Further, the top of the locating rack also protrudes two positioning columns, and two positioning columns are symmetrically distributed in
The opposite sides of the locating slot, when the sieve plate is positioned on the locating rack, both sides respectively with the positioning column card
It connects.
Further, the both sides of the sieve plate are respectively equipped with semicircular clamping notch, the clamping notch with it is described fixed
Position column is clamped, and the arrangement of the sieve pore on the sieve plate is symmetrical above and below, and the radius of the clamping notch of the sieve plate both sides is equal.
Further, the both sides of the sieve plate are installed with a carrying handle respectively, when the sieve plate is positioned on the locating rack
When, the bottom of the carrying handle is resisted against the top of the locating rack.
Further, two carrying handles are distributed in diagonally opposing corner.
Further, when the sieve plate is positioned on the locating rack, the bottom of each carrying handle passes through one respectively
Magnetic assembly magnetic is fixed on the top of the locating rack.
Further, the magnetic assembly includes the first magnetic member being inlaid in respectively on the locating rack and the carrying handle
Part and the second magnetic attraction element.
Further, the locating rack includes a bottom plate and the posting that is fixedly arranged at the top of the bottom plate, the posting
And the bottom plate surrounds the container.
Further, the bottom plate is equipped with several tapped through holes, and the tapped through hole is connected to the locating slot, Mei Yisuo
It states and is each equipped with a height adjustment bolt on tapped through hole, the length of the height adjustment bolt is more than the depth of the tapped through hole
Degree.
Further, the bottom of the locating rack is equipped with a mounting bracket, and the vibration machine includes an electro-motor
And eccentricity balance-weight block, the electro-motor are fixedly arranged in the mounting bracket, the eccentricity balance-weight block eccentric setting is in the electricity
On the output shaft of dynamic motor.
The beneficial effects of the invention are as follows：Row's mould equipment that the present invention is obtained by above-mentioned design, in use, can will wherein one
Sieve plate is positioned on locating rack, keeps each sieve pore thereon opposite with row's die hole of lower section weldering mold, then from through
Isolation board is inserted into hole so that isolation board is isolated between sieve plate and weldering mold, then poured on sieve plate p-type crystal grain (
N-type crystal grain can first be poured into), and Vibration on Start-up generator makes p-type crystal grain be evenly distributed on sieve plate to drive sieve plate to vibrate
And fall into each sieve pore of sieve plate, when being fitted into p-type crystal grain in each sieve pore or most of sieve pores, close vibration
Device, and p-type crystal grain extra on sieve plate is removed, then horizontal extraction isolation board, then restarts vibration machine, with again
Sieve plate vibration is driven, the p-type crystal grain in each sieve pore is made to fall into row's die hole of respective lower section, is then shut off vibration hair
Raw device, when removing current sieve plate, and another sieve plate being positioned on locating rack, and pours into N-type crystal grain, then weighs again on it
It is multiple to execute primary above-mentioned row's mould action, N-type crystal grain is drained into each row's die hole of weldering mold, on two sieve plates
Sieve pore is arranged in alternate intervals successively, therefore with the p-type crystal grain and N-type crystal grain being discharged on mold also will be in finally successively to hand in weldering
For being intervally arranged, to complete the arrangement of semiconductor grain, weldering mold can be removed at this time, turns welding section after inspection, with
The both sides welding ceramics plate above and below crystal grain.Therefore this row mould equipment arranges mould using automatic mechanism to carry out crystal grain, efficient, drop
Low hand labor intensity.
Description of the drawings
It, below will be to required use in embodiment in order to illustrate more clearly of the technical solution of embodiment of the present invention
Attached drawing be briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not to be seen as
It is the restriction to range, it for those of ordinary skill in the art, without creative efforts, can be with root
Other relevant attached drawings are obtained according to these attached drawings.
Fig. 1 is the overlooking structure diagram of row's mould equipment in first embodiment of the invention；
Fig. 2 is the cross-sectional view of the line A-A in Fig. 1；
Fig. 3 is the cross-sectional view under another state of line A-A in Fig. 1；
Fig. 4 is the structural schematic diagram of the weldering mold in first embodiment of the invention；
Fig. 5 is the structural schematic diagram of row's mould equipment in second embodiment of the invention；
Fig. 6 is the structural schematic diagram of row's mould equipment in third embodiment of the invention.
Main element symbol description：
Following specific implementation mode will be further illustrated the present invention in conjunction with above-mentioned attached drawing.
Specific implementation mode
To keep the purpose, technical scheme and advantage of embodiment of the present invention clearer, implement below in conjunction with the present invention
The technical solution in embodiment of the present invention is clearly and completely described in attached drawing in mode, it is clear that described reality
The mode of applying is some embodiments of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ability
The every other embodiment that domain those of ordinary skill is obtained without creative efforts, belongs to the present invention
The range of protection.Therefore, the detailed description of the embodiments of the present invention to providing in the accompanying drawings is not intended to limit and wants below
The scope of the present invention of protection is sought, but is merely representative of the selected embodiment of the present invention.Based on the embodiment in the present invention,
The every other embodiment that those of ordinary skill in the art are obtained without creative efforts belongs to this
Invent the range of protection.
In the description of the present invention, it is to be understood that, term " length ", " radial direction ", " thickness ", "upper", "top",
"bottom", "inner", "outside", etc. instructions orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for the description present invention and simplify description, do not indicate or imply the indicated equipment or element must have a particular orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；Can be that machinery connects
It connects, can also be electrical connection；It can be directly connected, can also can be indirectly connected through an intermediary in two elements
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Embodiment 1
It please refers to Fig.1 to Fig.4, the row's mould equipment showing in first embodiment of the invention, including an ontology 10, certain
Position frame 20, one weldering 30, two sieve plates 40 of mold, an isolation board 50 and a vibration machine 60.
The top of the ontology 10 is equipped with a container 11, and the both sides of the ontology 10 are respectively equipped with pass through aperture, described
Through hole is connected to the container 11, and two through holes are positioned opposite.
Wherein, the ontology 10 is cup-shaped, and the container 11 is rounded, and bottom is disk construction, supporting & stablizing
Property it is good, 11 notch edges outward bending of container extends to form a turnup structure, with evade incised wound operator.
The locating rack 20 includes a bottom plate 21 and the posting 22 for being fixedly arranged on 21 top of the bottom plate, and the bottom plate 21 is solid
On the inner wall of the container 11, the posting 22 and the bottom plate 21 surround a positioning groove.
Wherein, the periphery of the bottom plate 21 and the posting 22 is rounded, and diameter and the container 11 is straight
Diameter is corresponding.The locating slot is a square structure, and size is corresponding with the size of mold 30 with weldering, with just
Place the subsequent weldering mold 30.
The weldering mold 30 is positioned in the locating slot, and its top is equipped with several row's die holes being arranged in array
31.Wherein, row's die hole 31 is rounded, and the diameter of row's die hole 31 can be arranged according to the size of N, p-type crystal grain.It is described
Weldering can directly use the mold of existing semiconductor grain and ceramic wafer welding with mold 30.
Several sieve pores 41 that are that the top of each sieve plate 40 is equipped with perforation and being arranged in array, and work as described in two
When sieve plate 40 is stacked together, the sieve pore 41 on two sieve plates 10 is arranged in alternate intervals successively, when any sieve plate
40 when being positioned on the top of the locating rack 20, is located at the top of the weldering mold 30, and between the posting 22
Equipped with external series gap A, the external series gap A is opposite with the through hole, each sieve pore 41 and 31 phase of row's die hole
It is right.Wherein, the sieve pore 41 is rounded, and the diameter of the sieve pore 41 can be arranged according to the size of N, p-type crystal grain.
It should be pointed out that two sieve plates 40 are respectively row's mould sieve plate of p-type crystal grain and row's mould sieve of N-type crystal grain
The sieve plate of p-type crystal grain need to be positioned on 20 top of the locating rack, that is, when arranging mould p-type crystal grain when row's mould N-type crystal grain by plate
When, the sieve plate of N-type crystal grain need to be positioned on 20 top of the locating rack.
Further, the top of the locating rack 20 also protrudes two positioning columns 23, and two positioning columns 23 are symmetrical
It is distributed in the opposite sides of the locating slot, the both sides of the sieve plate 40 are respectively equipped with semicircular clamping notch 42, when described
When sieve plate 40 is positioned on the locating rack 20, the clamping notch 42 of both sides is clamped with the positioning column 23 respectively, to real
Existing radial positioning, so that the sieve plate 40 can only up-down vibration.
Wherein, the weldering mold 30 is square structure, and to prevent pendulum wrong, rubber mold is equipped with a notch and positioning
A protrusion aligns on frame 22.
In addition to this, the both sides of the sieve plate 40 are installed with a carrying handle 43 respectively, and two carrying handles 43 are in diagonally opposing corner
Distribution.When the sieve plate 40 is positioned on the locating rack 20, the bottom of the carrying handle 41 is resisted against the posting 22
Top.The carrying handle 43 can also be conveniently operated personnel and press the sieve plate convenient for picking and placeing the sieve plate 40 when arranging mould
40。
The isolation board 50 is movable to be threaded through in the through hole and external series gap A, i.e. the one of the isolation board 50
End can be inserted into from the through hole of side, and can be pierced by from the through hole of the other side by the external series gap A,
The isolation board 50 can also be extracted out from side level simultaneously.
Wherein, the isolation board 50 is made by plastic material, and its role is to when arranging mould, first be isolated sieve plate 40
With weldering mold 30, crystal grain is avoided to fall directly into row's die hole 31, it is ensured that from arranging the order of mould, can ensure each row in this way
Only it can be put into a crystal grain in die hole 31.
The vibration machine 60 is set in the container 11, and is connect with the locating rack 20, is used to generate and be shaken
It is dynamic, it is vibrated with passing to the locating rack 20, and finally driving the sieve plate 40 being positioned on the locating rack 20.
Specifically, the bottom of the locating rack 20 is equipped with a mounting bracket 24, and the vibration machine 60 includes one electronic
Motor 61 and eccentricity balance-weight block 62, the electro-motor 61 are fixedly arranged in the mounting bracket 24, and the eccentricity balance-weight block 62 is inclined
The heart is set on the output shaft of the electro-motor 61, to constitute unbalanced block type vibrator.
This row mould equipment is described in detail below in conjunction with specific work process：
In use, wherein (as shown in Figure 2) can will be positioned on locating rack 20 by a sieve plate 40, the card of positioning column 23 in both sides
Connect under position-limiting action, keep each sieve pore 41 thereon opposite with row's die hole 31 of lower section weldering mold 30 always, then from
Isolation board 50 is inserted into through hole, so that isolation board 50 is isolated between sieve plate 40 and weldering mold 30；
Then p-type crystal grain (can also first pour into N-type crystal grain) is poured on sieve plate 40, and starts electro-motor 61, with band
Dynamic sieve plate 40 vibrates, and in vibration processes, ontology 10 can also be rocked, so that p-type crystal grain Quick uniform is distributed in sieve plate 40
It goes up and falls into each sieve pore 41 of sieve plate, when being fitted into p-type crystal grain in each sieve pore 41 or most of sieve pores 41, close electricity
Dynamic motor 61, and swing ontology 10 and tilted towards side, so that the extra p-type crystal grain for not entering sieve pore 41 leaves sieve plate 40；
Then horizontal extraction isolation board 50, and restart electro-motor 61, to drive sieve plate 40 to vibrate again, make each sieve
P-type crystal grain in hole 41 is fallen into row's die hole 31 of respective lower section, to row's mould of this completion p-type crystal grain；
It is then shut off electro-motor 61, removes current p-type sieve plate 40, and another N-type sieve plate 40 is positioned over locating rack 20
When upper (as shown in Figure 3), and N-type crystal grain was poured on it, primary above-mentioned row's mould action is then repeated again, by N
Type crystal grain is drained into each row's die hole 31 of weldering mold 30, and the sieve pore on two sieve plates 40 is arranged in alternate intervals successively,
Therefore it finally will also be arranged in alternate intervals successively with the p-type crystal grain and N-type crystal grain being discharged on mold 30 in weldering, to complete half
The arrangement of semiconductor die can remove weldering mold at this time, through turning welding section after the assay was approved, with above and below crystal grain both sides weld
Ceramic wafer.
To sum up, row's mould equipment in the present embodiment arranges mould using automatic mechanism to carry out crystal grain, efficient, reduces
Hand labor intensity.
Embodiment 2
Please refer to Fig. 5, show row's mould equipment that second embodiment of the invention is worked as, row's mould equipment in the present embodiment with
Row's mould equipment in first embodiment the difference is that, the present embodiment casts out positioning column limit, and magnetic is used to limit.
Specifically, when the sieve plate 40 is positioned on the locating rack 20, the bottom of each carrying handle 43 leads to respectively
Cross the top that 70 magnetic of a magnetic assembly is fixed on the posting 22.The magnetic assembly 70 is described fixed including being inlaid in respectively
Position frame 22 and the first magnetic attraction element 71 on the carrying handle 43 and the second magnetic attraction element 72.
Wherein, first magnetic attraction element 71 is active magnetic attraction element (such as magnet), is inlaid on the carrying handle 43,
Second magnetic attraction element 72 is passive magnetic attraction element (such as iron).First magnetic attraction element 71 and second magnetic attraction element
Mutual magnetic attraction between 72 is not easy excessive (small suction magnet can be used), is not shaken out as long as meeting sieve plate 40, this
Sample is convenient for picking and placeing sieve plate 40 and adjusts alignment hole position.In other embodiments, first magnetic attraction element 71 can also use
Electromagnet, and contraposition mark can also be set on the top surface of posting 22, to facilitate the placement positioning of sieve plate 40.
It should be pointed out that the technique effect and reality of the device that the embodiment of the present invention 2 is provided, realization principle and generation
It is identical to apply example 1, to briefly describe, the present embodiment 2 does not refer to place, can refer to corresponding contents in embodiment 1.
Embodiment 3
Please refer to Fig. 6, the row's mould equipment showing in third embodiment of the invention, row's mould equipment in the present embodiment with
Row's mould equipment in first embodiment the difference is that：
The bottom plate 21 is equipped with several tapped through holes, and the tapped through hole is connected to the locating slot, each screw thread
A height adjustment bolt 211 is each equipped on through-hole, the length of the height adjustment bolt 211 is more than the depth of the tapped through hole
Degree.
It should be understood that the length of locating slot can be goed deep by adjusting height adjustment bolt 212, weldering mould is jacked up to adjust
Tool 30 height, to meet different-thickness specification weldering mold 30 row's mould requirement.
It should be pointed out that the technique effect and reality of the device that the embodiment of the present invention 3 is provided, realization principle and generation
It is identical to apply example 1, to briefly describe, the present embodiment 3 does not refer to place, can refer to corresponding contents in embodiment 1.
The foregoing is merely the preferred embodiment of the present invention, are not intended to restrict the invention, for this field
For technical staff, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by
Modification, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of row's mould equipment, which is characterized in that including：
One ontology, top are equipped with a container, and the both sides of the ontology are respectively equipped with pass through aperture, the through hole with it is described
Container is connected to, and two through holes are positioned opposite；
One locating rack is fixedly arranged on the inner wall of the container, and its top is equipped with a positioning groove；
One weldering mold, is positioned in the locating slot, and its top is equipped with several row's die holes being arranged in array；
Two sieve plates, several sieve pores that are being equipped with perforation at the top of each sieve plate and being arranged in array, and when two institutes
State sieve plate it is stacked together when, the sieve pore on two sieve plates is arranged in alternate intervals successively, when any sieve plate is placed
When on the locating rack, it is located at the top of the weldering mold, and external series gap is equipped between the locating rack, it is described
External series gap is opposite with the through hole, and each sieve pore is opposite with row's die hole；
One isolation board, it is movable to be threaded through in the through hole and external series gap；And
One vibration machine is set in the container, and is connect with the locating rack；
Wherein, the locating rack includes a bottom plate and the posting that is fixedly arranged at the top of the bottom plate, the posting and the bottom
Plate surrounds the container.
2. row's mould equipment according to claim 1, which is characterized in that the top of the locating rack also protrudes two positioning
Column, two positioning columns are symmetrically distributed in the opposite sides of the locating slot, when the sieve plate is positioned on the locating rack
When, both sides are clamped with the positioning column respectively.
3. row's mould equipment according to claim 2, which is characterized in that the both sides of the sieve plate are respectively equipped with semicircular card
Notch is connect, the clamping notch is clamped with the positioning column, and the arrangement in the hole on the sieve plate is symmetrical above and below, the sieve plate both sides
Clamping notch radius it is equal.
4. row's mould equipment according to claim 1, which is characterized in that the both sides of the sieve plate are installed with a carrying handle respectively,
When the sieve plate is positioned on the locating rack, the bottom of the carrying handle is resisted against the top of the locating rack.
5. row's mould equipment according to claim 4, which is characterized in that two carrying handles are distributed in diagonally opposing corner.
6. row's mould equipment according to claim 4, which is characterized in that when the sieve plate is positioned on the locating rack,
The top of the locating rack is fixed in the bottom of each carrying handle by a magnetic assembly magnetic respectively.
7. row's mould equipment according to claim 6, which is characterized in that the magnetic assembly is described fixed including being inlaid in respectively
Position frame and the first magnetic attraction element on the carrying handle and the second magnetic attraction element.
8. row's mould equipment according to claim 1, which is characterized in that the bottom plate is equipped with several tapped through holes, described
Tapped through hole is connected to the locating slot, and each screw thread, which leads to, is each equipped with a height adjustment bolt, and the height adjusts spiral shell
The length of bolt is more than the depth of the tapped through hole.
9. row's mould equipment according to claim 1, which is characterized in that the bottom of the locating rack is equipped with a mounting bracket,
The vibration machine includes an electro-motor and eccentricity balance-weight block, and the electro-motor is fixedly arranged in the mounting bracket, institute
Eccentricity balance-weight block eccentric setting is stated on the output shaft of the electro-motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811035678.8A CN108711589A (en) | 2018-09-06 | 2018-09-06 | Arrange mould equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811035678.8A CN108711589A (en) | 2018-09-06 | 2018-09-06 | Arrange mould equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108711589A true CN108711589A (en) | 2018-10-26 |
Family
ID=63873554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811035678.8A Pending CN108711589A (en) | 2018-09-06 | 2018-09-06 | Arrange mould equipment |
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| Country | Link |
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| CN (1) | CN108711589A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265335A (en) * | 2019-06-28 | 2019-09-20 | 宜宾红星电子有限公司 | Semiconductor cooling device die package tooling |
| CN110416400A (en) * | 2019-07-03 | 2019-11-05 | 合肥圣达电子科技实业有限公司 | A kind of assembling equipment and assemble method for semiconductor cooler |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101976722A (en) * | 2010-08-19 | 2011-02-16 | 常山县米合电子有限公司 | Automatic grain discharging machine for semiconductor refrigerating sheet |
| CN201780998U (en) * | 2010-09-19 | 2011-03-30 | 常山县万谷电子科技有限公司 | Rapid installing tool of refrigerating slice |
| CN203574008U (en) * | 2013-11-29 | 2014-04-30 | 浙江迈特电子有限公司 | PN particle quick installation sieving mold of semiconductor cooler |
| CN208570663U (en) * | 2018-09-06 | 2019-03-01 | 泉州市依科达半导体致冷科技有限公司 | Arrange mould equipment |
-
2018
- 2018-09-06 CN CN201811035678.8A patent/CN108711589A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101976722A (en) * | 2010-08-19 | 2011-02-16 | 常山县米合电子有限公司 | Automatic grain discharging machine for semiconductor refrigerating sheet |
| CN201780998U (en) * | 2010-09-19 | 2011-03-30 | 常山县万谷电子科技有限公司 | Rapid installing tool of refrigerating slice |
| CN203574008U (en) * | 2013-11-29 | 2014-04-30 | 浙江迈特电子有限公司 | PN particle quick installation sieving mold of semiconductor cooler |
| CN208570663U (en) * | 2018-09-06 | 2019-03-01 | 泉州市依科达半导体致冷科技有限公司 | Arrange mould equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265335A (en) * | 2019-06-28 | 2019-09-20 | 宜宾红星电子有限公司 | Semiconductor cooling device die package tooling |
| CN110416400A (en) * | 2019-07-03 | 2019-11-05 | 合肥圣达电子科技实业有限公司 | A kind of assembling equipment and assemble method for semiconductor cooler |
| CN110416400B (en) * | 2019-07-03 | 2023-11-07 | 合肥圣达电子科技实业有限公司 | Assembling equipment and assembling method for semiconductor refrigerator |
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