CN203574008U

CN203574008U - PN particle quick installation sieving mold of semiconductor cooler

Info

Publication number: CN203574008U
Application number: CN201320766912.0U
Authority: CN
Inventors: 郑美良; 李水祥; 杨红
Original assignee: ZHEJIANG MAITE ELECTRON Co Ltd
Current assignee: ZHEJIANG MAITE ELECTRON Co Ltd
Priority date: 2013-11-29
Filing date: 2013-11-29
Publication date: 2014-04-30
Anticipated expiration: 2023-11-29

Abstract

The utility model discloses a PN particle quick installation sieving mold of a semiconductor cooler. The PN particle quick installation sieving mold of the semiconductor cooler includes a semiconductor PN particle sieving mold; the PN semiconductor particle sieving mold is provided with particle sieving holes which are arranged in array; each row of the particle sieving hole and an adjacent row of the particle sieving hole are staggered; each column of the particle sieving hole and an adjacent column of the particle sieving hole are staggered; and an upper half of the particle sieving hole is a round frustum hole, and a lower half of the particle sieving hole is a square hole. When the PN particle quick installation sieving mold of a semiconductor cooler is used, a P-type or N-type semiconductor particle along the round frustum hole and the square hole of the particle sieving hole smoothly and easily fills a particle hole of a bottom mold, and falls on a corresponding deflector. Compared with the prior art, one piece of the sieving mold is saved and the cost is saved; the round frustum hole and the square hole of the particle sieving hole are combined to help the P or N particles quickly and accurately slip into the square hole; the rate for the PN particle falling into the hole is effectively improved; and the semiconductor particle installation is more efficient.

Description

A kind of semiconductor cooler PN particle Fast Installation sieve mould

Technical field

The utility model relates to semiconductor cooler and manufactures field, especially a kind of semiconductor cooler PN particle Fast Installation sieve mould.

Background technology

Semiconductor cooler claims again thermoelectric refrigerating unit or thermoelectric refrigerator, to utilize extraordinary semi-conductor thermoelectric material to form P-N knot, logical upper direct current, the object that can reach at two end faces of semiconductor cooler refrigeration and heat, the safety having due to semiconductor cooler, environmental protection, the features such as the life-span is long, utilize the use occasion of semiconductor cooler refrigeration a lot of both at home and abroad, for improving refrigeration work consumption, reach industrial applications, existing semiconductor cooler, all by tens, up to a hundred P-N knots form thermoelectric pile, tens, the thermoelectric pile of up to a hundred P-N knot compositions just respectively has tens, up to a hundred P types and N type semiconductor particle, when manufacturing refrigerator, these P types and N type semiconductor particle need to be put on the flow deflector in insulated ceramic plates, in traditional production technology, first the bed die in the P-N particle hole that is arrayed will be provided with, be arranged in the insulated ceramic plates that is welded with flow deflector, then adopt manual first by tens, up to a hundred P type semiconductor particles are put in bed die P type hole, afterwards P type semiconductor particle is welded in insulated ceramic plates, subsequent by tens, up to a hundred N type semiconductor particles are put in bed die N-type hole, weld again, waste time and energy very much, and easily misplace position, inefficiency not only, and affect conforming product rate, in March, 2011,30 State Intellectual Property Office disclosed a utility model patent " rapid installing tool of refrigerating slice " (publication number CN201780998 U), disclosed in this document " rapid installing tool of refrigerating slice " is comprised of two chip semiconductor sieve moulds, a slice is P type, a slice is N-type, but openly do not sieve the shape of nib, the shape that can only judge sieve nib from accompanying drawing should be square, this patent has defect in actual applications, be that semiconductor particle is difficult to decline down from sieve nib, cause particle installation effectiveness not high.

Summary of the invention

In order to address the deficiencies of the prior art, the utility model provides a kind of semiconductor cooler PN particle Fast Installation sieve mould, can improve semiconductor particle installation effectiveness, and only needs a slice sieve mould just can deal with problems.

The utility model solves the technical scheme that its technical problem adopts: a kind of semiconductor cooler PN particle Fast Installation sieve mould, it is characterized in that: a semiconductor PN particle sieve mould, described semiconductor PN particle sieve mould is provided with the particle sieve aperture that is arrayed, the setting of staggering of the particle sieve aperture of every a line particle sieve aperture and adjacent lines, the setting of staggering of the particle sieve aperture of each row particle sieve aperture and adjacent column; The described particle sieve aperture first half is conical bore, and Lower Half is square hole.

Adopt a kind of semiconductor cooler PN of the utility model particle Fast Installation sieve mould, with original technology comparison, saved a slice sieve mould, provide cost savings, particle sieve aperture adopts round platform hole in conjunction with square hole structure, be conducive to P type or N-type particle and slip into rapidly and accurately in square hole, effectively improved P type, the N-type particle porosity that falls, semiconductor particle is installed more efficient.

Accompanying drawing explanation

Fig. 1 is a kind of semiconductor cooler PN of the utility model particle Fast Installation sieve mode structure schematic diagram.

Fig. 2 is a kind of semiconductor cooler PN of the utility model particle Fast Installation sieve mould particle sieve aperture broken section enlarged drawing.

In Fig. 1, Fig. 2,1, semiconductor PN particle sieve mould, 2, particle sieve aperture.

Embodiment

Below in conjunction with accompanying drawing 1, Fig. 2, a kind of semiconductor cooler PN of the utility model particle Fast Installation sieve mould is described further.

Fig. 1, a kind of semiconductor cooler PN particle Fast Installation sieve mould shown in Fig. 2, semiconductor PN particle sieve mould 1 in the form of sheets, adopt aluminium or stainless steel to make, identical with the insulating ceramic film size on refrigerator to be prepared, semiconductor PN particle sieve mould 1 is provided with the particle sieve aperture 2 that is arrayed, the setting of staggering of the particle sieve aperture 2 of every a line particle sieve aperture 2 and adjacent lines, the distance staggering equals half of distance between particle sieve aperture 2, the setting of staggering of the particle sieve aperture 2 of each row particle sieve aperture 2 and adjacent column, the distance staggering equals half of distance between particle sieve aperture 2, described particle sieve aperture 2 first halves are up big and down small conical bore, and Lower Half is square hole, and square hole is slightly larger than semiconductor particle.

In practical application, first the bed die that is provided with the P-N particle hole that is arrayed is arranged in the insulated ceramic plates that is welded with flow deflector, on bed die, corresponding flow deflector is aimed in P-N particle hole, and fix, put again semiconductor PN particle sieve mould of the present utility model, make P type particle hole on the position alignment bed die of particle sieve aperture, and fix, then on semiconductor PN particle sieve mould, sprinkle a P type semiconductor particle, on, under, left, the right side vibrates semiconductor PN particle sieve mould gently, P type semiconductor particle will be along conical bore and the square hole of particle sieve aperture, be filled into like a cork in the P type particle hole of bed die smoothly, drop on corresponding flow deflector, unnecessary P type particle is swept back desktop, remove afterwards semiconductor PN particle sieve mould, carry out subsequent processing welding, after welding, after being turned to an an angle of 90 degrees, semiconductor PN particle sieve mould relays on bed die, just in time make N-type particle hole on the position alignment bed die of particle sieve aperture, and fix, then on semiconductor PN particle sieve mould, sprinkle a N type semiconductor particle, on, under, left, the right side vibrates semiconductor PN particle sieve mould gently, N type semiconductor particle will be along conical bore and the square hole of P type particle sieve aperture, be filled into like a cork in the N-type particle hole of bed die smoothly, drop on corresponding flow deflector, unnecessary N-type particle is swept back desktop, remove afterwards semiconductor PN particle sieve mould, an operation welding after carrying out, so far complete the installation of P type and N type semiconductor particle, remove after bed die, another sheet insulated ceramic plates in covering, welding has just completed the making of whole semiconductor cooler again.

Due to a kind of semiconductor cooler PN of the utility model particle Fast Installation sieve mould, with original technology comparison, saved a slice sieve mould, provide cost savings, particle sieve aperture adopts conical bore in conjunction with square hole structure, be conducive to P type or N-type particle and slip into rapidly and accurately in square hole, effectively improved P type, the N-type particle porosity that falls, semiconductor particle is installed more efficient.

It needs to be noted, the mode of above-described embodiment only limits to describe the present embodiment, but the utility model is confined to aforesaid way incessantly, therefore and those skilled in the art can modify easily accordingly within not departing from scope of the present utility model, scope of the present utility model should comprise principle that the utility model discloses and the maximum magnitude of new feature.

Claims

1. a semiconductor cooler PN particle Fast Installation is sieved mould, it is characterized in that: have a semiconductor PN particle sieve mould (1), described semiconductor PN particle sieve mould (1) is provided with the particle sieve aperture (2) that is arrayed, settings of staggering of the particle sieve aperture (2) of every a line particle sieve aperture (2) and adjacent lines, the setting of staggering of the particle sieve aperture (2) of each row particle sieve aperture (2) and adjacent column; Described particle sieve aperture (2) first half is conical bore, and Lower Half is square hole, and square hole is slightly larger than semiconductor particle.

2. a kind of semiconductor cooler PN particle Fast Installation according to claim 1 is sieved mould, it is characterized in that: the stagger distance that arranges of the particle sieve aperture (2) of every a line particle sieve aperture (2) and adjacent lines equals half of distance between particle sieve aperture (2), the stagger distance of setting of the particle sieve aperture (2) of each row particle sieve aperture (2) and adjacent column equals half of distance between particle sieve aperture (2).

3. a kind of semiconductor cooler PN particle Fast Installation according to claim 1 is sieved mould, it is characterized in that: described semiconductor PN particle sieve mould (1) in the form of sheets, adopt aluminium or stainless steel to make, identical with the insulating ceramic film size on refrigerator to be prepared.