CN108711513A - A kind of method and structure for preventing more pin capacitances anti-inserted - Google Patents
A kind of method and structure for preventing more pin capacitances anti-inserted Download PDFInfo
- Publication number
- CN108711513A CN108711513A CN201810477613.2A CN201810477613A CN108711513A CN 108711513 A CN108711513 A CN 108711513A CN 201810477613 A CN201810477613 A CN 201810477613A CN 108711513 A CN108711513 A CN 108711513A
- Authority
- CN
- China
- Prior art keywords
- pin
- surface mount
- pad
- pcb board
- capacitance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000003990 capacitor Substances 0.000 claims abstract description 18
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Multi-Conductor Connections (AREA)
Abstract
The present invention is more particularly directed to a kind of methods and structure for preventing more pin capacitances anti-inserted.The method for preventing more pin capacitances anti-inserted and structure, the capacitance has anode and two pins of cathode, pin one of in cathode after anode is changed to surface mount packages, corresponding pad is revised as Surface Mount pad on pcb board, another contact pin pin and its corresponding round pad are remained stationary；When insertion, first the pin of capacitance surface mount packages is aligned with the Surface Mount pad of pcb board, another contact pin pin is then inserted into corresponding round pad, finally two pins of capacitance are welded on pcb board.The method for preventing more pin capacitances anti-inserted and structure, form by changing a certain pin makes capacitor pin existence form not exclusively, and then has evaded the anti-inserted risk of polarity, while can meet the needs of PCB design again, it can arbitrarily put, be suitable for popularization and application.
Description
Technical field
The present invention relates to capacitor technology field, more particularly to a kind of method and structure for preventing more pin capacitances anti-inserted.
Background technology
Electrolytic capacitor is one kind of capacitance, and metal foil is anode（Aluminium or tantalum）, the oxidation film of metal is close to anode（Oxidation
Aluminium or tantalum pentoxide）It is dielectric, cathode is by conductive material, electrolyte（Electrolyte can be liquid or solid）With other materials
Material collectively constitutes, and because electrolyte is the major part of cathode, therefore electrolytic capacitor is gained the name.
The specified capacity of electrolytic capacitor can be accomplished very big, it might even be possible to accomplish tens of thousands of μ f even several f.Currently, electric
Electrolysis condenser is widely used in household electrical appliance and various electronic products, and range of capacity is larger, generally 1 ~ 1000 μ f, specified
Operating voltage range is 6.3 ~ 450V.
The positive and negative electrode of electrolytic capacitor is connected to PCB by positive and negative electrode pin respectively（Print Circuit Board, print
Printed circuit board）Plate, and it is positive and negative can not wrong.Pay attention to observing when use whether the side of electrolytic capacitor is labeled with "-", if having
Show to mark the negative pin that one end is electrolytic capacitor；It, can be according to pin if not indicating positive and negative anodes on electrolytic capacitor
Length judge that long foot is positive pin, short foot is negative pin.
Currently, in the power module of PCB design, as power is higher and higher, the capacitor's capacity needed is also higher and higher, often
The ceramic condenser of rule can no longer meet design requirement, thus the application of electrolytic capacitor application is more and more common.
Since existing electrolytic capacitor is real by the way that its positive and negative electrode pin to be plugged into the hole of two identical round pads
Now with the connection of pcb board, it is anti-inserted that producing line worker is easy to a positive and negative electrode pin in water operation, so as to cause short-circuit risks.
Under normal conditions, the positive and negative polar circle of all electrolytic capacitors is just strictly required in order to evade this risk in PCB design
One direction of pad is put, but cannot sometimes meet best electric property in this way.And during inserting, due to being
Manual operation still may be anti-inserted although polarized mark and silk-screen mark, needs to check repeatedly, time-consuming and laborious.
In view of the above-mentioned problems, the present invention proposes a kind of method and structure for preventing more pin capacitances anti-inserted.
Invention content
In order to compensate for the shortcomings of the prior art, the present invention provides it is a kind of be simple and efficient prevent more pin capacitances anti-inserted
Method and structure.
The present invention is achieved through the following technical solutions：
A method of prevent more pin capacitances anti-inserted, it is characterised in that：The capacitance has anode and two pins of cathode, will
Pin is changed to surface mount packages one of in cathode after anode, and corresponding pad is revised as Surface Mount pad on pcb board, another
Contact pin pin and its corresponding round pad are remained stationary；When insertion, first the Surface Mount of the pin of capacitance surface mount packages and pcb board is welded
Disk is aligned, and another contact pin pin is then inserted into corresponding round pad, is finally welded to two pins of capacitance on pcb board i.e.
It can.
After the capacitance is aligned and inserted into pcb board, first use Reflow Soldering by Surface Mount pad solder pcb board Surface Mount pad
On, then contact pin pin is welded on the circle pad of pcb board.
The capacitance structure that the present invention prevents more pin capacitances anti-inserted, including capacitor body, positive and negative the two poles of the earth are separately connected
Positive and negative electrode pin, one of pin use Surface Mount pin, another pin to be connected to the circle weldering of pcb board using contact pin form
Disk.
The Surface Mount pin is welded to the Surface Mount pad of rectangle on pcb board using Reflow Soldering.
The beneficial effects of the invention are as follows：The method for preventing more pin capacitances anti-inserted and structure, by changing a certain pin
Form make capacitor pin existence form not exclusively, and then evaded the anti-inserted risk of polarity, while PCB can be met again and set
The demand of meter can arbitrarily put, be suitable for popularization and application.
Specific implementation mode
In order to make technical problems, technical solutions and advantages to be solved be more clearly understood, tie below
Embodiment is closed, the present invention will be described in detail.It should be noted that specific embodiment described herein is only explaining
The present invention is not intended to limit the present invention.
Stating capacitance, there are anode and two pins of cathode, the method for preventing more pin capacitances anti-inserted, institute will be born after anode
Pin is changed to surface mount packages one of in extremely, and corresponding pad is revised as Surface Mount pad on pcb board, another contact pin pin
And its corresponding round pad is remained stationary；When insertion, first the pin of capacitance surface mount packages is aligned with the Surface Mount pad of pcb board,
Then another contact pin pin is inserted into corresponding round pad, finally two pins of capacitance is welded on pcb board.
After the capacitance is aligned and inserted into pcb board, first use Reflow Soldering by Surface Mount pad solder pcb board Surface Mount pad
On, then contact pin pin is welded on the circle pad of pcb board.
The capacitance structure for preventing more pin capacitances anti-inserted, including capacitor body, positive and negative the two poles of the earth be separately connected just,
Negative pin, one of pin use Surface Mount pin, another pin to be connected to PC using contact pin form.
The method for preventing more pin capacitances anti-inserted and structure, the form by changing a certain pin make capacitor pin exist
Form not exclusively, and then has evaded the anti-inserted risk of polarity, while can meet the needs of PCB design again, can arbitrarily put
It puts, is suitable for popularization and application.
Claims (4)
1. a kind of method for preventing more pin capacitances anti-inserted, it is characterised in that：The capacitance has anode and two pins of cathode,
Pin one of in cathode after anode is changed to surface mount packages, corresponding pad is revised as Surface Mount pad on pcb board, another
A contact pin pin and its corresponding round pad are remained stationary；When insertion, first by the Surface Mount of the pin of capacitance surface mount packages and pcb board
Pad is aligned, and another contact pin pin is then inserted into corresponding round pad, finally two pins of capacitance are welded on pcb board
.
2. the method according to claim 1 for preventing more pin capacitances anti-inserted, it is characterised in that：The capacitance is aligned and inserts
After entering pcb board, first use Reflow Soldering that contact pin pin on the Surface Mount pad of pcb board, is then welded to Surface Mount pad solder
On the circle pad of pcb board.
3. a kind of capacitance structure for preventing more pin capacitances anti-inserted, it is characterised in that：Including capacitor body, positive and negative the two poles of the earth
It is separately connected positive and negative electrode pin, one of pin uses Surface Mount pin, another pin to be connected to PCB using contact pin form
The circle pad of plate.
4. the capacitance structure according to claim 3 for preventing more pin capacitances anti-inserted, it is characterised in that：The Surface Mount pin
The Surface Mount pad of rectangle on pcb board is welded to using Reflow Soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810477613.2A CN108711513A (en) | 2018-05-18 | 2018-05-18 | A kind of method and structure for preventing more pin capacitances anti-inserted |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810477613.2A CN108711513A (en) | 2018-05-18 | 2018-05-18 | A kind of method and structure for preventing more pin capacitances anti-inserted |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108711513A true CN108711513A (en) | 2018-10-26 |
Family
ID=63868362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810477613.2A Pending CN108711513A (en) | 2018-05-18 | 2018-05-18 | A kind of method and structure for preventing more pin capacitances anti-inserted |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108711513A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390781A (en) * | 2022-01-07 | 2022-04-22 | 苏州浪潮智能科技有限公司 | Electrolytic capacitor bonding pad, electrolytic capacitor and electrolytic capacitor welding method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446623A (en) * | 1993-08-24 | 1995-08-29 | Rohm Co. Ltd. | Surface mounting type polar electronic component |
| CN1897182A (en) * | 2005-07-15 | 2007-01-17 | 鸿富锦精密工业（深圳）有限公司 | Anti-block electrolytic capacitance |
| CN201708184U (en) * | 2010-04-23 | 2011-01-12 | 吉爱华 | High-power LED package structure |
| CN204732295U (en) * | 2015-07-07 | 2015-10-28 | 国网山东蓬莱市供电公司 | A kind of capacitor |
| CN204991472U (en) * | 2015-10-14 | 2016-01-20 | 合肥联宝信息技术有限公司 | Condenser and be provided with circuit board of this condenser |
-
2018
- 2018-05-18 CN CN201810477613.2A patent/CN108711513A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446623A (en) * | 1993-08-24 | 1995-08-29 | Rohm Co. Ltd. | Surface mounting type polar electronic component |
| CN1897182A (en) * | 2005-07-15 | 2007-01-17 | 鸿富锦精密工业（深圳）有限公司 | Anti-block electrolytic capacitance |
| CN201708184U (en) * | 2010-04-23 | 2011-01-12 | 吉爱华 | High-power LED package structure |
| CN204732295U (en) * | 2015-07-07 | 2015-10-28 | 国网山东蓬莱市供电公司 | A kind of capacitor |
| CN204991472U (en) * | 2015-10-14 | 2016-01-20 | 合肥联宝信息技术有限公司 | Condenser and be provided with circuit board of this condenser |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390781A (en) * | 2022-01-07 | 2022-04-22 | 苏州浪潮智能科技有限公司 | Electrolytic capacitor bonding pad, electrolytic capacitor and electrolytic capacitor welding method |
| CN114390781B (en) * | 2022-01-07 | 2023-06-16 | 苏州浪潮智能科技有限公司 | Electrolytic capacitor bonding pad, electrolytic capacitor and electrolytic capacitor welding method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181026 |