CN208026850U - Electronic load - Google Patents

Electronic load Download PDF

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Publication number
CN208026850U
CN208026850U CN201820603092.6U CN201820603092U CN208026850U CN 208026850 U CN208026850 U CN 208026850U CN 201820603092 U CN201820603092 U CN 201820603092U CN 208026850 U CN208026850 U CN 208026850U
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CN
China
Prior art keywords
capacitance
pcb board
radiator
power tube
electrically connected
Prior art date
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Active
Application number
CN201820603092.6U
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Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITECH ELECTRONIC (NANJING) CO Ltd
Original Assignee
ITECH ELECTRONIC (NANJING) CO Ltd
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Priority to CN201820603092.6U priority Critical patent/CN208026850U/en
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Publication of CN208026850U publication Critical patent/CN208026850U/en
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Abstract

The utility model discloses a kind of electronic loads, including power amplifier board component, capacitance-resistance plate and radiator, and capacitance resistance ware is provided on the capacitance-resistance plate, and the power amplifier board component includes pcb board and power tube, it is characterised in that:The pcb board connects negative electrode, and the radiator connects positive electrode, and the cathode of the power tube and the cathode of capacitance resistance ware are electrically connected on the pcb board, and the anode of the power tube and the anode of capacitance resistance ware are electrically connected on the radiator.Compared with prior art, original existing positive circuit is also had the power amplifier board of anode circuit to be changed to only walk the pcb board of power tube negative loop by the utility model electronic load, and the pcb board sectional area of only rate of doing work pipe cathode in this way doubles, short-circuit impedance is reduced, pcb board allows the electric current by bigger.Meanwhile completely without high pressure on such pcb board, can be good at being applied on the higher electronic load of voltage class.

Description

Electronic load
Technical field
The utility model is related to a kind of electronic loads.
Background technology
Electronic load is generally used for absorbing the power of power supply when power supply product test, in addition to DC power supply, including DC-DC are suitable Orchestration, lithium battery, fuel cell, solar panels etc. can all use electronic load.Continuous with electronic product voltage is risen, The electronic load model that 400V, 600V even 1000V can meet such high voltage is very limited, it is difficult to meet high current Gao Gong The application of rate.
High-pressure electronic load high pressure maximum can reach how many, much power can be drawn, in addition to the characteristic with power tube itself is determined It is fixed outer, it is also related with the design of power modules and circuit board.Currently, the power amplifier board of electronic load existing positive circuit in wiring Also there is a negative loop, positive and negative on power amplifier board to have, voltage difference is very big, and when wiring will ensure that safe distance will sacrifice very big sky Between, it is difficult to the PCB for reserving enough width walks high current.
In the prior art, the Resistor-Capacitor Unit of electronic load is directly placed at one independent region of power postlaminar part, capacitance-resistance One end and the cathode of power amplifier board be directly connected to, other end is connected to by via pad on the metallic stud of radiator, is used Screw locking, metal column and aluminium radiator are conductive, and radiator also does positive electrode use, and the pressure difference between positive and negative anodes is up to 1200V, guides to anode on power amplifier board to make capacitance-resistance be connected to, and such power amplifier board is in order to ensure that enough safe spacings will Many spaces are sacrificed, power amplifier board high density layouts are unfavorable for.
Invention content
Technical problem to be solved in the utility model is in view of the deficiency of the prior art, by original power amplifier board On capacitance resistance ware region be separately configured to some small capacitance-resistance plates, these capacitance-resistance plates are arranged independently of power amplifier board-improve electronics Loaded work piece voltage, and then provide a kind of suitable for the powerful electronic load of high current.
In order to solve the above technical problems, the technical solution adopted in the utility model is:
A kind of electronic load, including power amplifier board component, capacitance-resistance plate and radiator, capacitance-resistance is provided on the capacitance-resistance plate Device, the power amplifier board component include pcb board and power tube, it is characterised in that:The pcb board connects negative electrode, described to dissipate Hot device connects positive electrode, and the cathode of the power tube and the cathode of capacitance resistance ware are electrically connected on the pcb board, the power The anode of pipe and the anode of capacitance resistance ware are electrically connected on the radiator.
The capacitance-resistance plate and pcb board are set to the not ipsilateral of the heat dissipation.
The power tube is located at below the capacitance-resistance plate.
The power tube is metal-oxide-semiconductor, and the source electrode of metal-oxide-semiconductor is electrically connected on the pcb board, and the drain electrode of metal-oxide-semiconductor electrically connects It is connected on the radiator.
The drain electrode of the metal-oxide-semiconductor is electrically connected at by capacitance-resistance plate or graphite flake on the radiator.
Compared with prior art, the utility model has an advantageous effect in that:
1, the utility model electronic load, the cathode of power tube and the cathode of capacitance resistance ware are electrically connected on pcb board, work( The anode of rate pipe and the anode of capacitance resistance ware are electrically connected on radiator, and pcb board connects negative electrode, and radiator connects positive electricity Original existing positive cabling is also had the power amplifier board of cathode cabling to be changed to only walk the pcb board of power tube negative loop, so only by pole The pcb board sectional area of rate of doing work pipe cathode doubles, and reduces short-circuit impedance, and pcb board allows the electric current by bigger.
2, capacitance resistance ware is now individually done to one block of fritter capacitance-resistance plate and fixed on a heat sink, is located above power tube, resistance Hold plate to be easier to ensure safe distance, completely without high pressure on such pcb board, can be good at being applied to voltage class higher Electronic load on.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is the explosive view of Fig. 1;
Fig. 3 is the portions the A enlarged diagram of Fig. 1.
Wherein:1, pcb board;2, radiator;3, capacitance-resistance plate;31, capacitance-resistance plate draws cathode;4, power tube;41, power tube D Foot;5, negative electrode;6, positive electrode.
Specific implementation mode
Below in conjunction with the accompanying drawings, it elaborates to the utility model:
As shown in Figure 1, the utility model electronic load includes power amplifier board component, radiator 2 and capacitance-resistance plate 3, wherein work( Rate board group part includes pcb board 1 and power tube 4, and capacitance resistance ware is connected on capacitance-resistance plate 3.Pcb board 1 connects negative electrode 5, heat dissipation Device 2 connects positive electrode 6, refers to Fig. 2.
The anode of power tube 4 and the anode of capacitance resistance ware are electrically connected with radiator 2, the cathode and resistance-capacitance device of power tube 4 The cathode of part is electrically connected with pcb board 1.
In the present embodiment, pcb board 1 is two pieces, is located at two sides of radiator 2, and capacitance-resistance plate 3 is located at radiator 2 Top surface is simultaneously electrically connected by cathode and pcb board 1, in conjunction with Fig. 3, in the present embodiment, capacitance-resistance plate draw cathode 31 pass through pcb board with Pad be electrically connected, power tube 4 is fixed on the lower section of capacitance-resistance plate 3.The size of each capacitance-resistance plate 3 is about to cover two power tubes Position, pass through hole to be thereon electrically connected on radiator 2 together with power tube by screw, constitute positive circuit.
In conjunction with Fig. 3, power tube 4 selects metal-oxide-semiconductor, the source electrode of metal-oxide-semiconductor to be electrically connected on pcb board 1, the drain electrode of metal-oxide-semiconductor I.e. power tube D feet 41 pass through capacitance-resistance plate after bending, and are electrically connected by screw on capacitance-resistance plate 3 and radiator;In other implementations In example, the drain electrode of metal-oxide-semiconductor can also be electrically connected on radiator 2 by graphite flake.

Claims (5)

1. a kind of electronic load, including power amplifier board component, capacitance-resistance plate and radiator, resistance-capacitance device is provided on the capacitance-resistance plate Part, the power amplifier board component include pcb board and power tube, it is characterised in that:The pcb board connects negative electrode, the heat dissipation Device connects positive electrode, and the cathode of the power tube and the cathode of capacitance resistance ware are electrically connected on the pcb board, the power tube Anode and the anode of capacitance resistance ware be electrically connected on the radiator.
2. electronic load according to claim 1, it is characterised in that:The capacitance-resistance plate and pcb board are set to the heat dissipation The not ipsilateral of device.
3. electronic load according to claim 2, it is characterised in that:The power tube is located at below the capacitance-resistance plate.
4. according to any electronic loads of claim 1-3, it is characterised in that:The power tube is metal-oxide-semiconductor, metal-oxide-semiconductor Source electrode is electrically connected on the pcb board, and the drain electrode of metal-oxide-semiconductor is electrically connected on the radiator.
5. electronic load according to claim 4, it is characterised in that:The drain electrode of the metal-oxide-semiconductor passes through capacitance-resistance plate or graphite Piece is electrically connected on the radiator.
CN201820603092.6U 2018-04-26 2018-04-26 Electronic load Active CN208026850U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820603092.6U CN208026850U (en) 2018-04-26 2018-04-26 Electronic load

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820603092.6U CN208026850U (en) 2018-04-26 2018-04-26 Electronic load

Publications (1)

Publication Number Publication Date
CN208026850U true CN208026850U (en) 2018-10-30

Family

ID=63911273

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820603092.6U Active CN208026850U (en) 2018-04-26 2018-04-26 Electronic load

Country Status (1)

Country Link
CN (1) CN208026850U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818976B (en) * 2019-04-12 2023-10-21 博計電子股份有限公司 Low voltage drop electronic load connections

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI818976B (en) * 2019-04-12 2023-10-21 博計電子股份有限公司 Low voltage drop electronic load connections

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