CN108710269A - A kind of semiconductor silicon wafer Rotatory lithography machine - Google Patents
A kind of semiconductor silicon wafer Rotatory lithography machine Download PDFInfo
- Publication number
- CN108710269A CN108710269A CN201810534801.4A CN201810534801A CN108710269A CN 108710269 A CN108710269 A CN 108710269A CN 201810534801 A CN201810534801 A CN 201810534801A CN 108710269 A CN108710269 A CN 108710269A
- Authority
- CN
- China
- Prior art keywords
- air
- turntable
- main frame
- boss
- balance weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 40
- 239000010703 silicon Substances 0.000 title claims abstract description 40
- 238000001459 lithography Methods 0.000 title claims abstract description 20
- 239000004065 semiconductor Substances 0.000 title claims abstract description 19
- 238000013016 damping Methods 0.000 claims abstract description 24
- 238000007664 blowing Methods 0.000 claims description 20
- 239000011796 hollow space material Substances 0.000 claims description 12
- 208000002925 dental caries Diseases 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 28
- 238000001259 photo etching Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000001352 electron-beam projection lithography Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention belongs to technical field of manufacturing semiconductors, specifically a kind of semiconductor silicon wafer Rotatory lithography machine, including main frame, mobile holder, exposure device, turntable, dynamic poise device, damping device, basic framework, the main frame is internally provided with turntable, and be slidably installed mobile holder above main frame；It is fixedly connected with exposure device below the mobile mid-stent；Turntable is equipped with below the exposure device；Dynamic poise device is equipped in turntable；The vibration that the dynamic poise device generates for reducing turntable in rotary course；Damping device is equipped between the main frame and basic framework；The vibration that the damping device generates for reducing main frame；For the present invention by the way that dynamic poise device is arranged in rotation cavity, realizing reduces the vibration that turntable generates in rotary course；By the way that damping device is arranged between main frame and basic framework, realizing reduces the vibration that main frame generates.
Description
Technical field
The invention belongs to technical field of manufacturing semiconductors, specifically a kind of semiconductor silicon wafer Rotatory lithography machine.
Background technology
Wafer refers to the silicon chip used in silicon semiconductor production of integrated circuits, and wafer is the load for producing used in integrated circuits
Body, general significance wafer refer to monocrystalline silicon wafer more, and wafer is most common semi-conducting material.In the production of IC chip
Cheng Zhong, the exposure transfer of the design configuration of chip on silicon chip surface photoresist is one of most important one process, the process
Equipment used is known as litho machine.Litho machine is the equipment of most critical in ic processing.Foreign countries are early in many years ago
Have proposed the concept of Next Generation Lithographies, and to the technologies such as extreme ultraviolet photoetching, electron beam projection lithography, ion beam projection lithography into
A large amount of research is gone, but due to technique, production efficiency, cost etc. are many, these technologies are still difficult to complete reality at present
With change.Currently, what the overwhelming majority came into operation is step and repeat lithography machine and advanced scanning projecting photoetching machine.Step and repeat lithography
Machine uses Polaroid technology, and the lens system in order to increase image field requirement larger diameter is used as support, but this requirement encounters
The dual restriction of technical factor and economic factor, to limit step and repeat lithography machine to higher precision, larger sized
Chip manufacture direction is developed.In this case, advanced scanning projecting photoetching machine is more favored.Step-scan projected light
In quarter machine, exposure process and step and repeat lithography machine are different.Light beam is projected to by a slit and transmission illumination device
In mask plane, mask to set at the uniform velocity by this Shu Guang, meanwhile, silicon chip moves in the opposite direction in the lower section of lens.It is this
Step-by-step scanning photo-etching device has lower deformation and greater area of image field compared with step and repeat lithography machine, meanwhile, carry silicon
The silicon wafer stage of piece and the mask platform of carrying mask can realize high-speed motion so that advanced scanning projecting photoetching machine has very high
Productivity, to preferably meeting the demand that market processes semiconductor chip.
Also occur in the prior art some semiconductor silicon wafers rotation photoetching technical solution, such as application No. is
201110036695.5 a Chinese patent disclose a kind of Rotatory lithography machine, including：Main frame；To carry the silicon of silicon chip
Piece platform, the silicon wafer stage are set in the main frame；Exposure figure is imaged in the exposure device on silicon chip, the exposure
Electro-optical device is connect with the main frame；The silicon wafer stage is rotated horizontally around its axis；The exposure device is along the silicon wafer stage
Make horizontal direction movement.The program, which realizes, reduces litho machine board size, further reduces the occupancy of production space, reduces
Production cost.But the elimination of the vibration of silicon wafer stage does not provide exact scheme solution in the program；And main frame and base
The damping effect of damper between plinth frame cannot reach desired effect.
Invention content
In order to make up for the deficiencies of the prior art, a kind of semiconductor silicon wafer Rotatory lithography machine proposed by the present invention, by
It rotates and dynamic poise device is set in cavity, realizing reduces the vibration that turntable generates in rotary course；By in main frame
Damping device is set between basic framework, and realizing reduces the vibration that main frame generates.
The technical solution adopted by the present invention to solve the technical problems is：A kind of semiconductor silicon wafer rotation of the present invention
Turn litho machine, including main frame, mobile holder, exposure device, turntable, dynamic poise device, damping device, basic framework, institute
Main frame is stated for carrying turntable；The main frame is internally provided with turntable, and be slidably installed mobile holder above main frame；Institute
It states and is fixedly connected with exposure device below mobile mid-stent；The exposure device is used to exposure figure imaging in Silicon Wafer,
Exposure device includes lens, lighting device；The lighting device upper end is fixedly connected on mobile frame bottom, lighting device lower end
It is fixedly connected with lens upper end；Turntable is equipped with below the lens；The turntable is mounted on main frame bottom plate by motor
On；Setting rotation cavity inside the turntable, rotation cavity is interior to be equipped with dynamic poise device；The dynamic poise device for reducing
The vibration that turntable generates in rotary course；Damping device is equipped between the main frame and basic framework；The damping dress
Set the vibration generated for reducing main frame；Wherein, the dynamic poise device includes live spindle, central turnplate, spring, balance
Block, the live spindle are rotatably installed in the rotary shaft of turntable, and live spindle is by motor-driven rotation；The live spindle
Upper end is fixedly connected with the lower face of central turnplate；One group of balance weight is connected by spring on the central turnplate cylindrical surface.Rotation
Platform drives Silicon Wafer rotation, while mobile holder drives exposure device to move horizontally, and turntable rotates a circle, and exposure device synchronizes
It is moved to edge from silicon wafer circle center, realizes and images in exposure figure on entire Silicon Wafer upper surface；Motor drives rotation
Main axis, live spindle drive central turnplate rotation, central turnplate to be rotated by spring band dynamic balance weight, motor speed one
Fixed, balance weight is under the influence of centrifugal force in a stable rotation in surface, the balance of shaking force of balance weight stable rotation
Turntable turns the vibration of fixed output quota life.
Preferably, it is equipped with upper air supporting plate above the balance weight, lower air supporting plate is equipped with below balance weight；The upper air supporting plate
Upper surface is fixedly connected with rotation cavity top surface, and one group of No.1 gas hole is arranged in upper air supporting plate lower surface；The No.1 gas hole
Blow windstream downwards；The lower air supporting plate lower surface is fixedly connected with rotation cavity floor, lower air supporting plate upper surface setting one
No. two gas holes of group；No. two gas holes blow windstream upwards；The balance weight can be in upper air supporting plate and lower air supporting plate
Between stable suspersion.Balance weight, only by the frictional force of very little, reduces itself generating for dynamic poise device during rotation
Vibration, further improve the processing quality of litho machine.
Preferably, No.1 spherical hollow space is set in the No.1 gas hole and No. two gas holes；The No.1 spherical hollow space
Close to central turnplate side, No.1 arc chute is set；Moving block is rotatablely installed in the No.1 spherical hollow space；The rotation
No. four gas holes are set inside block, and sliding boss are arranged close to central turnplate side in moving block；The sliding boss are justified in No.1
Sliding in arc chute；Outlet one circle embedded annular sphere magnet of No. four gas holes close to balance weight one end；It is described flat
The upper and lower surface insertion magnet of the block that weighs.Motor speed is higher, and balance weight is bigger by centrifugal force, and balance weight is with a distance from rotation center
Remoter, distance is remoter, and the air blowing hole number opened on upper and lower air supporting plate is more；Magnet on balance weight attracts on moving block
Annular sphere magnet, magnetic force drive moving block rotation, the sliding boss on moving block to be slided along No.1 arc chute, and sliding is convex
When platform moves to No.1 arc chute one end, moving block stops operating, and No. four gas holes are opened；Balance weight is from rotation center
When distance reduces, the magnet on balance weight attracts the annular sphere magnet on moving block, magnetic force to drive the rotation of moving block negative direction,
Sliding boss move to the No.1 arc chute other end, and moving block stops operating, No. four air blowing bore closures；Dynamic is realized to adjust
Whole gas hole area size, saves the usage amount of compressed air.
Preferably, the damping device includes ripple air cushion, spring, and No.1 cavity is arranged inside the ripple air cushion；Institute
It states No.1 cavity inside and is equipped with spring；One group of No. three gas hole is set on the upward corrugated surface of the ripple air cushion；Described No. three
Gas hole is vertically arranged.Compressed gas is passed through in ripple air cushion, No. three gas holes blow out upward air-flow, and air-flow is blown to
It on the downward corrugated surface of ripple air cushion, realizes that airflow supports ripple air cushion, and then realizes the vibration progress generated to main frame
It absorbs.
Preferably, the downward corrugated surface of the ripple air cushion and the intersection of upward corrugated surface are hinged the one of flow-stopping plate
End, hinged place are equipped with torsional spring；The flow-stopping plate is for stopping the air-flow reflected on the downward corrugated surface of ripple air cushion；The baffle
The other end of plate is hinged brush stroke one end, and hinged place is equipped with torsional spring；One group of bristle is set below the other end of the brush stroke.Three
The air-flow of number gas hole blowout is blown on the downward corrugated surface of ripple air cushion, the gas reflected on the corrugated surface downward from ripple air cushion
Stream stopped by flow-stopping plate, realize increase ripple air cushion vibration damping pressure, while flow-stopping plate can stop the dust in air into
Enter ripple air cushion, and then realizes the service life for improving ripple air cushion；Flow-stopping plate is blown by air-flow and is swung up, band electric brush
Bar moves, and realizes that No. three gas holes of bristle pair on brush stroke are cleared up.
Preferably, No. two spherical hollow spaces are set in No. three gas holes, and No. two spherical hollow space inner walls are equipped with No. two
Arc chute and No. three arc chutes, No. two arc chutes and No. three arc chutes are non-conterminous；No. three circular arcs
Shape sliding slot upper end is connected to by intercommunicating pore with No.1 cavity；No. three arc chute bottoms are equipped with arc-shaped air inlet duct；Institute
It states and is rotatablely installed air blowing block in No. two spherical hollow spaces；The air blowing block be equipped with outlet boss and air inlet boss, outlet boss and into
Gas boss is non-conterminous；No. two cavitys are set inside the air blowing block；Air inlet is set on the air inlet boss；The air inlet with
No. two cavity connections；Gas outlet is set on the outlet boss；The gas outlet is connected to No. two cavitys；The outlet boss exists
Sliding in No. two arc chutes；The air inlet boss slides in No. three arc chutes；In No. three arc chutes
Equipped with No.1 spring, the rotation of air blowing block outside No.1 cavity and ripple air cushion for being connected to.When work, when No.1 cavity compresses,
Compressed gas is injected into No. three arc chutes so that air inlet boss is compressed by the intercommunicating pore of No. three arc chute upper ends
No.1 spring, when outlet boss slides into No. two arc chutes close to the upward corrugated surface surface one end of ripple air cushion, into
Gas boss slides into No. three arc chutes close to ripple air cushion inner wall one end, and compressed air enters air inlet from arc-shaped air inlet duct
Mouthful, it ejects, is vertically ejected on the downward corrugated surface surface of ripple air cushion from gas outlet by No. two cavitys；Stop
When being passed through compressed air, No.1 spring pushes the rotation of air blowing block, air inlet boss to slide into No. two arc chutes close to ripple gas
Pad upward corrugated surface surface one end, inlet close.
Beneficial effects of the present invention are as follows：
1. the present invention, by the way that dynamic poise device is arranged in rotation cavity, realizing reduces turntable produces in rotary course
Raw vibration；By the way that damping device is arranged between main frame and basic framework, realizing reduces the vibration that main frame generates.
2. the present invention, by the way that upper air supporting plate is arranged above balance weight, air supporting plate under being arranged below balance weight realizes
Balance weight, only by the frictional force of very little, reduces the vibration of dynamic poise device itself generated, further during rotation
Improve the processing quality of litho machine.
3. the present invention is by the embedded annular sphere magnet of the circle of outlet one in No. four gas holes close to balance weight one end, flat
The upper and lower surface insertion magnet of the block that weighs, realizes and opens gas hole under magneticaction, and then realizes dynamic adjustment air blowing bore region
Size saves the usage amount of compressed air.
4. the present invention realizes the vibration damping pressure for increasing ripple air cushion, while flow-stopping plate can hinder by the way that flow-stopping plate is arranged
Dust in gear air enters ripple air cushion, and then realizes the service life for improving ripple air cushion；By in the another of flow-stopping plate
One end is hinged brush stroke, realizes that No. three gas holes of bristle pair on brush stroke are cleared up.
Description of the drawings
The invention will be further described below in conjunction with the accompanying drawings.
Fig. 1 is the front view of the present invention；
Fig. 2 is the enlarged view at A in Fig. 1；
Fig. 3 is the enlarged view at B in Fig. 1；
Fig. 4 is the enlarged view at C in Fig. 3；
In figure：Main frame 1, mobile holder 2, exposure device 3, lens 31, lighting device 32, turntable 4, rotation cavity
41, dynamic poise device 5, live spindle 51, central turnplate 52, balance weight 53, magnet 531, upper air supporting plate 54, No.1 gas hole
541, No.1 spherical hollow space 542, No.1 arc chute 543,55, No. two gas holes 551 of lower air supporting plate, moving block 56, four
Gas hole 561, sliding boss 562, annular sphere magnet 563, damping device 6, ripple air cushion 61, No.1 cavity 611, three are blown
614, No. three arc chutes 615 of the arc chute of spherical hollow space 613, two of stomata 612, two, arc-shaped air inlet duct 616,
Flow-stopping plate 62, brush stroke 63, bristle 631, air blowing block 64, outlet boss 641, air inlet boss 642, No. two cavitys 643, air inlets
644, gas outlet 645, No.1 spring 65, basic framework 7, Silicon Wafer 8.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below
Specific implementation mode is closed, the present invention is further explained.
As shown in Figures 1 to 4, a kind of semiconductor silicon wafer Rotatory lithography machine of the present invention, including main frame 1, shifting
Dynamic holder 2, exposure device 3, turntable 4, dynamic poise device 5, damping device 6, basic framework 7, the main frame 1 is for carrying
Turntable 4；The main frame 1 is internally provided with turntable 4, and be slidably installed mobile holder 2 above main frame 1；The mobile holder 2
It is fixedly connected with exposure device 3 below middle part；The exposure device 3 is used to exposure figure imaging in Silicon Wafer 8, exposure device
3 include lens 31, lighting device 32；32 upper end of the lighting device is fixedly connected on 2 bottom of mobile holder, under lighting device 32
End is fixedly connected with 31 upper end of lens；31 lower section of the lens is equipped with turntable 4；The turntable 4 is mounted on master by motor
On 1 bottom plate of frame；4 inside setting rotation cavity 41 of the turntable, rotation cavity 41 is interior to be equipped with dynamic poise device 5；It is described dynamic
The vibration that balancing device 5 generates for reducing turntable 4 in rotary course；It is equipped between the main frame 1 and basic framework 7
Damping device 6；The vibration that the damping device 6 generates for reducing main frame 1；Wherein, the dynamic poise device 5 includes rotation
Main shaft 51, central turnplate 52, spring, balance weight 53, the live spindle 51 are rotatably installed in the rotary shaft of turntable 4, rotation
Turn main shaft 51 by motor-driven rotation；51 upper end of the live spindle is fixedly connected with the lower face of central turnplate 52；The center
One group of balance weight 53 is connected by spring on 52 cylindrical surface of turntable.Turntable 4 drives Silicon Wafer 8 to rotate, while 2 band of mobile holder
Dynamic exposure device 3 moves horizontally, and turntable 4 rotates a circle, and exposure device 3 synchronizes from 8 center of Silicon Wafer and is moved to edge, realizes
Exposure figure imaged on 8 upper surface of entire Silicon Wafer；Motor drives live spindle 51 to rotate, during live spindle 51 drives
Heart turntable 52 rotates, and central turnplate 52 is rotated by spring band dynamic balance weight 53, and motor speed is certain, and balance weight 53 is in centrifugal force
Under the action of in a stable rotation in surface, the turntable 4 turns of fixed output quotas lifes of the balance of shaking force of 53 stable rotation of balance weight
Vibration.
As a kind of embodiment of the present invention, 53 top of the balance weight is equipped with upper air supporting plate 54,53 lower section of balance weight
Equipped with lower air supporting plate 55；Upper 54 upper surface of air supporting plate is fixedly connected with 41 top surface of rotation cavity, upper 54 lower surface of air supporting plate
One group of No.1 gas hole 541 is set；The No.1 gas hole 541 blows downwards windstream；Lower 55 lower surface of air supporting plate with
41 bottom surface of rotation cavity is fixedly connected, and one group of No. two gas hole 551 is arranged in lower 55 upper surface of air supporting plate；No. two gas holes
551 blow windstream upwards；The balance weight 53 can between upper air supporting plate 54 and lower air supporting plate 55 stable suspersion.Balance weight
53 during rotation only by very little frictional force, reduce dynamic poise device 5 itself generate vibration, further increase
The processing quality of litho machine.
As a kind of embodiment of the present invention, No.1 ball is set in the No.1 gas hole 541 and No. two gas holes 551
Shape cavity 542；The No.1 spherical hollow space 542 is close to 52 side of central turnplate setting No.1 arc chute 543；The No.1
Moving block 56 is rotatablely installed in spherical hollow space 542；No. four gas holes 561 are arranged in 56 inside of the moving block, and moving block 56 is close
Sliding boss 562 are arranged in 52 side of central turnplate；The sliding in No.1 arc chute 543 of the sliding boss 562；Described four
The embedded annular sphere magnet of the circle of outlet one of number gas hole 561 close to 53 one end of balance weight 563；53 upper and lower table of the balance weight
Face is embedded in magnet 531.Motor speed is higher, and balance weight 53 is bigger by centrifugal force, and balance weight 53 is remoter with a distance from rotation center,
Distance is remoter, and the air blowing hole number opened on upper and lower air supporting plate 55 is more；Magnet 531 on balance weight 53 attracts moving block 56
On annular sphere magnet 563, magnetic force drives moving block 56 to rotate, and the sliding boss 562 on moving block 56 are arc-shaped along No.1
Sliding slot 543 slides, and when sliding boss 562 move to No.1 543 one end of arc chute, moving block 56 stops operating, and No. four are blown
Stomata 561 is opened；When balance weight 53 reduces with a distance from rotation center, the magnet 531 on balance weight 53 attracts on moving block 56
Annular sphere magnet 563, magnetic force drives the rotation of 56 negative direction of moving block, and sliding boss 562 move to No.1 arc chute
543 other ends, moving block 56 stop operating, and No. four gas holes 561 are closed；Realize dynamic adjustment gas hole area size, section
The about usage amount of compressed air.
As a kind of embodiment of the present invention, the damping device 6 includes ripple air cushion 61, spring, the ripple gas
61 inside setting No.1 cavity 611 of pad；The No.1 cavity 611 is internally provided with spring；The upward ripple of the ripple air cushion 61
One group of No. three gas hole 612 is set on face；No. three gas holes 612 are vertically arranged.Pressure is passed through in ripple air cushion 61
Contracting gas, No. three gas holes 612 blow out upward air-flow, and air-flow is blown on the downward corrugated surface of ripple air cushion 61, realize air-flow
The air cushion 61 that ripples is supported, and then realizes that the vibration generated to main frame 1 absorbs.
As a kind of embodiment of the present invention, the friendship of the ripple air cushion 61 downward corrugated surface and upward corrugated surface
One end of hinged flow-stopping plate 62, hinged place are equipped with torsional spring at boundary；The flow-stopping plate 62 is for stopping the downward wave of ripple air cushion 61
The air-flow reflected on line face；The other end of the flow-stopping plate 62 is hinged 63 one end of brush stroke, and hinged place is equipped with torsional spring；The hairbrush
One group of bristle 631 is set below the other end of bar 63.The air-flow of No. three gas holes 612 blowout blows to the downward wave of ripple air cushion 61
On line face, the air-flow reflected on the corrugated surface downward from ripple air cushion 61 is stopped by flow-stopping plate 62, realizes and increases ripple air cushion
61 vibration damping pressure, while flow-stopping plate 62 can stop that the dust in air enters ripple air cushion 61, and then realize raising wave
The service life of line air cushion 61；Flow-stopping plate 62 is blown by air-flow to be swung up, and brush stroke 63 is driven to move, and is realized on brush stroke 63
Bristle 631 No. three gas holes 612 are cleared up.
As a kind of embodiment of the present invention, No. two spherical hollow spaces 613 are set in No. three gas holes 612, it is described
No. two 613 inner walls of spherical hollow space are equipped with No. two arc chutes 614 and No. three arc chutes 615, No. two arc chutes 614
It is non-conterminous with No. three arc chutes 615；615 upper end of No. three arc chutes is connected by intercommunicating pore and No.1 cavity 611
It is logical；615 bottom of No. three arc chutes is equipped with arc-shaped air inlet duct 616；Rotational installation in No. two spherical hollow spaces 613
Air blowing block 64；The air blowing block 64 is equipped with outlet boss 641 and air inlet boss 642, and outlet boss 641 and air inlet boss 642 are not
It is adjacent；No. two cavitys 643 are arranged in 64 inside of the air blowing block；Air inlet 644 is set on the air inlet boss 642；The air inlet
Mouth 644 is connected to No. two cavitys 643；Gas outlet 645 is set on the outlet boss 641；The gas outlet 645 and No. two cavitys
643 connections；The sliding in No. two arc chutes 614 of the outlet boss 641；The air inlet boss 642 is arc-shaped at No. three
Sliding in sliding slot 615；No.1 spring 65 is equipped in No. three arc chutes 615, the rotation of air blowing block 64 is used for No.1 cavity
611 are connected to 61 outside of ripple air cushion.When work, when No.1 cavity 611 compresses, pass through No. three 615 upper ends of arc chute
Intercommunicating pore injects compressed gas into No. three arc chutes 615 so that air inlet boss 642 compresses No.1 spring 65, works as outlet
When boss 641 slides into No. two arc chutes 614 close to the upward corrugated surface surface one end of ripple air cushion 61, air inlet boss
642 slide into No. three arc chutes 615 close to 61 inner wall one end of ripple air cushion, compressed air from arc-shaped air inlet duct 616 into
Enter air inlet 644, ejected from gas outlet 645 by No. two cavitys 643, it is downward to be vertically ejected into ripple air cushion 61
On corrugated surface surface；When stopping is passed through compressed air, No.1 spring 65 pushes air blowing block 64 to rotate, and air inlet boss 642 slides into
No. two arc chutes 614 are closed close to the upward corrugated surface surface one end of ripple air cushion 61, air inlet 644.
When work, turntable 4 drives Silicon Wafer 8 to rotate, while mobile holder 2 drives exposure device 3 to move horizontally, and rotates
Platform 4 rotates a circle, and exposure device 3 synchronizes from 8 center of Silicon Wafer and is moved to edge, realizes exposure figure imaging in entire silicon
On 8 upper surface of wafer；Motor drives live spindle 51 to rotate, and live spindle 51 drives central turnplate 52 to rotate, central turnplate 52
It is rotated by spring band dynamic balance weight 53, motor speed is certain, and balance weight 53 is stable flat at one under the influence of centrifugal force
Rotation in surface, the vibration of the balance of shaking force of 53 stable rotation of balance weight turntable 4 turns of fixed output quotas life.Motor speed is higher, puts down
Weighing, block 53 is bigger by centrifugal force, and balance weight 53 is remoter with a distance from rotation center, and distance is remoter, is opened on upper and lower air supporting plate 55
Air blowing hole number it is more；Magnet 531 on balance weight 53 attracts the annular sphere magnet 563 on moving block 56, magnetic force to drive
Moving block 56 rotates, and the sliding boss 562 on moving block 56 are slided along No.1 arc chute 543, and sliding boss 562 move to
When No.1 543 one end of arc chute, moving block 56 stops operating, and gas hole is opened；Balance weight 53 is with a distance from rotation center
When reduction, the magnet 531 on balance weight 53 attracts the annular sphere magnet 563 on moving block 56, magnetic force to drive moving block 56 anti-
Direction rotates, and sliding boss 562 move to 543 other end of No.1 arc chute, and moving block 56 stops operating, and gas hole closes
It closes；Dynamic adjustment gas hole area size is realized, the usage amount of compressed air is saved.Balance weight 53 during rotation only
By the frictional force of very little, the vibration of dynamic poise device 5 itself generated is reduced, the processing matter of litho machine is further improved
Amount.Be passed through compressed gas in ripple air cushion 61, No. three gas holes 612 blow out upward air-flow, air-flow blow to ripple air cushion 61 to
Under corrugated surface on, realize that airflow supports ripple air cushion 61, and then realize that the vibrations generated to main frame 1 absorb.Three
The air-flow that number gas hole 612 is blown out is blown on the downward corrugated surface of ripple air cushion 61, on the corrugated surface downward from ripple air cushion 61
The air-flow of reflection is stopped by flow-stopping plate 62, realizes the vibration damping pressure for increasing ripple air cushion 61, while flow-stopping plate 62 can stop
Dust in air enters ripple air cushion 61, and then realizes the service life for improving ripple air cushion 61；Flow-stopping plate 62 is by air-flow
It blows and is swung up, brush stroke 63 is driven to move, realize that the bristle 631 on brush stroke 63 clears up No. three gas holes 612.
When No.1 cavity 611 compresses, injected into No. three arc chutes 615 by the intercommunicating pore of No. three 615 upper ends of arc chute
Compressed gas so that air inlet boss 642 compresses No.1 spring 65, is leaned on when outlet boss 641 slides into No. two arc chutes 614
When the upward corrugated surface surface one end of nearly ripple air cushion 61, air inlet boss 642 slides into No. three arc chutes 615 close to ripple
61 inner wall one end of air cushion, compressed air enter air inlet 644 from arc-shaped air inlet duct 616, by No. two cavitys 643 from gas outlet
645 eject, and are vertically ejected on the downward corrugated surface surface of ripple air cushion 61；When stopping is passed through compressed air, one
Number spring 65 pushes air blowing block 64 to rotate, and it is upward close to ripple air cushion 61 that air inlet boss 642 slides into No. two arc chutes 614
Corrugated surface surface one end, air inlet 644 close.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (6)
1. a kind of semiconductor silicon wafer Rotatory lithography machine, including main frame (1), mobile holder (2), exposure device (3), turntable
(4), dynamic poise device (5), damping device (6), basic framework (7), the main frame (1) is for carrying turntable (4)；It is described
Main frame (1) is internally provided with turntable (4), and be slidably installed mobile holder (2) above main frame (1)；In the mobile holder (2)
It is fixedly connected with exposure device (3) below portion；The exposure device (3) is used to exposure figure imaging in Silicon Wafer (8), exposes
Device (3) includes lens (31), lighting device (32)；Lighting device (32) upper end is fixedly connected on mobile holder (2) bottom
Portion, lighting device (32) lower end are fixedly connected with lens (31) upper end；Turntable (4) is equipped with below the lens (31)；It is described
Turntable (4) is mounted on by motor on main frame (1) bottom plate；Setting rotation cavity (41) inside the turntable (4), rotation
Dynamic poise device (5) is equipped in cavity (41)；The dynamic poise device (5) is produced for reducing turntable (4) in rotary course
Raw vibration；Damping device (6) is equipped between the main frame (1) and basic framework (7)；The damping device (6) is for dropping
The vibration that low main frame (1) generates；It is characterized in that：The dynamic poise device (5) includes live spindle (51), central turnplate
(52), spring, balance weight (53), the live spindle (51) are rotatably installed in the rotary shaft of turntable (4), live spindle
(51) by motor-driven rotation；Live spindle (51) upper end is fixedly connected with the lower face of central turnplate (52)；The center
One group of balance weight (53) is connected by spring on turntable (52) cylindrical surface.
2. a kind of semiconductor silicon wafer Rotatory lithography machine according to claim 1, it is characterised in that：The balance weight (53)
Top is equipped with upper air supporting plate (54), and lower air supporting plate (55) is equipped with below balance weight (53)；Upper air supporting plate (54) upper surface with
Rotation cavity (41) top surface is fixedly connected, and one group of No.1 gas hole (541) is arranged in upper air supporting plate (54) lower surface；The No.1 is blown
Stomata (541) blows downwards windstream；Lower air supporting plate (55) lower surface is fixedly connected with rotation cavity (41) bottom surface, lower gas
One group of No. two gas hole (551) is arranged in kickboard (55) upper surface；No. two gas holes (551) blow windstream upwards；It is described
Balance weight (53) can between upper air supporting plate (54) and lower air supporting plate (55) stable suspersion.
3. a kind of semiconductor silicon wafer Rotatory lithography machine according to claim 2, it is characterised in that：The No.1 gas hole
(541) and in No. two gas holes (551) No.1 spherical hollow space (542) is set；The No.1 spherical hollow space (542) turns close to center
No.1 arc chute (543) is arranged in disk (52) side；Rotational installation moving block (56) in the No.1 spherical hollow space (542)；
No. four gas holes (561) are set inside the moving block (56), and moving block (56) is close to the setting sliding of central turnplate (52) side
Boss (562)；The sliding boss (562) sliding in No.1 arc chute (543)；No. four gas holes (561) are leaned on
The embedded annular sphere magnet (563) of the circle of outlet one of nearly balance weight (53) one end；The upper and lower surface of the balance weight (53) is embedded in magnetic
Iron (531).
4. a kind of semiconductor silicon wafer Rotatory lithography machine according to claim 1, it is characterised in that：The damping device
(6) include ripple air cushion (61), spring, No.1 cavity (611) is set inside the ripple air cushion (61)；The No.1 cavity
(611) it is internally provided with spring；One group of No. three gas hole (612) is set on the upward corrugated surface of the ripple air cushion (61)；It is described
No. three gas holes (612) are vertically arranged.
5. a kind of semiconductor silicon wafer Rotatory lithography machine according to claim 4, it is characterised in that：The ripple air cushion
(61) intersection of downward corrugated surface and upward corrugated surface is hinged one end of flow-stopping plate (62), and hinged place is equipped with torsional spring；Institute
Flow-stopping plate (62) is stated for stopping the air-flow reflected on the downward corrugated surface of ripple air cushion (61)；The flow-stopping plate (62) it is another
Hinged brush stroke (63) one end in end, hinged place is equipped with torsional spring；One group of bristle is set below the other end of the brush stroke (63)
(631)。
6. a kind of semiconductor silicon wafer Rotatory lithography machine according to claim 4, it is characterised in that：No. three gas holes
(612) No. two spherical hollow spaces (613) are set in, and No. two spherical hollow spaces (613) inner wall is equipped with No. two arc chutes (614)
With No. three arc chutes (615), No. two arc chutes (614) and No. three arc chutes (615) are non-conterminous；Described No. three
Arc chute (615) upper end is connected to by intercommunicating pore with No.1 cavity (611)；No. three arc chutes (615) bottom
Equipped with arc-shaped air inlet duct (616)；Rotational installation air blowing block (64) in No. two spherical hollow spaces (613)；The air blowing block
(64) it is equipped with outlet boss (641) and air inlet boss (642), outlet boss (641) and air inlet boss (642) are non-conterminous；It is described
No. two cavitys (643) are set inside air blowing block (64)；Air inlet (644) is set on the air inlet boss (642)；The air inlet
(644) it is connected to No. two cavitys (643)；Gas outlet (645) are set on the outlet boss (641)；The gas outlet (645) with
No. two cavity (643) connections；The outlet boss (641) sliding in No. two arc chutes (614)；The air inlet boss
(642) sliding in No. three arc chutes (615)；It is equipped with No.1 spring (65) in No. three arc chutes (615), blows
Air parcel (64) rotation outside No.1 cavity (611) and ripple air cushion (61) for being connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810534801.4A CN108710269B (en) | 2018-05-29 | 2018-05-29 | Semiconductor silicon wafer rotary photoetching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810534801.4A CN108710269B (en) | 2018-05-29 | 2018-05-29 | Semiconductor silicon wafer rotary photoetching machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108710269A true CN108710269A (en) | 2018-10-26 |
| CN108710269B CN108710269B (en) | 2020-08-04 |
Family
ID=63871027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810534801.4A Active CN108710269B (en) | 2018-05-29 | 2018-05-29 | Semiconductor silicon wafer rotary photoetching machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108710269B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111659540A (en) * | 2020-05-29 | 2020-09-15 | 尤尼柯（上海）仪器有限公司 | Desk-top low-speed centrifuge |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3172085B2 (en) * | 1996-03-18 | 2001-06-04 | キヤノン株式会社 | Peripheral exposure equipment |
| CN101398636A (en) * | 2008-09-17 | 2009-04-01 | 华中科技大学 | Precision vibration damping assembly and vibration damping platform composed of the assembly |
| CN102636961A (en) * | 2011-02-12 | 2012-08-15 | 上海微电子装备有限公司 | Rotatory lithography machine |
| CN207406704U (en) * | 2017-10-23 | 2018-05-25 | 苏州大学 | A kind of self-adapting type torsional vibration damper and diesel engine |
-
2018
- 2018-05-29 CN CN201810534801.4A patent/CN108710269B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3172085B2 (en) * | 1996-03-18 | 2001-06-04 | キヤノン株式会社 | Peripheral exposure equipment |
| CN101398636A (en) * | 2008-09-17 | 2009-04-01 | 华中科技大学 | Precision vibration damping assembly and vibration damping platform composed of the assembly |
| CN102636961A (en) * | 2011-02-12 | 2012-08-15 | 上海微电子装备有限公司 | Rotatory lithography machine |
| CN207406704U (en) * | 2017-10-23 | 2018-05-25 | 苏州大学 | A kind of self-adapting type torsional vibration damper and diesel engine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111659540A (en) * | 2020-05-29 | 2020-09-15 | 尤尼柯（上海）仪器有限公司 | Desk-top low-speed centrifuge |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108710269B (en) | 2020-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108735584A (en) | A kind of semiconductor chip production technology | |
| CN103662752B (en) | A kind of plastic bottle arranging machine | |
| CN108710269A (en) | A kind of semiconductor silicon wafer Rotatory lithography machine | |
| WO2019218961A1 (en) | Worktable and back side alignment device | |
| CN201136777Y (en) | Full-automatic filling machine for ointment | |
| CN109202588A (en) | A kind of pipe fitting outer wall chamfering grinding device | |
| CN108646517A (en) | A kind of litho machine wafer spin coating device | |
| CN110854015A (en) | Chip integrated manufacturing auxiliary equipment based on light pressure principle | |
| CN103901735A (en) | Silicon slice ejection mechanism | |
| CN115999423A (en) | Efficient coagulant preparation system and preparation method | |
| CN112558425B (en) | Multipurpose mask type smooth surface photoetching machine | |
| CN108766867A (en) | A kind of semiconductor chip production technology | |
| CN210675348U (en) | Special grinding machine for alumina ceramic material | |
| CN210435941U (en) | Jig for processing semiconductor chip | |
| CN108766868B (en) | Semiconductor silicon wafer glue homogenizing device | |
| CN104181778B (en) | A kind of litho machine balance mass system | |
| CN107050812A (en) | A kind of automatic ball-distributer of golf | |
| CN206325817U (en) | A kind of feed stripped screening machine with damping effect | |
| CN106269491A (en) | A kind of composite supersonic vibrosieve | |
| CN220635189U (en) | Multistage screening machine | |
| CN116511049B (en) | Mechanism sand pollen-removing mechanism and sand production line | |
| CN111396820A (en) | Adjustable L ED wall washer lamp | |
| KR100558547B1 (en) | Exposure apparatus | |
| CN213079920U (en) | Nail machine is with accuse material device | |
| CN204854103U (en) | Multi -functional cooler of fertilizer seed air current fine motion |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200615 Address after: Room 326, No.46, Guangji Road, Lizhu Town, Keqiao District, Shaoxing City, Zhejiang Province Applicant after: Shaoxing Yingshun Mechanical and Electrical Technology Co.,Ltd. Address before: 210008 Nanjing University, 22 Hankou Road, Jiangsu, Nanjing Applicant before: Hou Yuchuang |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231013 Address after: Industrial gathering point of Lizhu Town, Keqiao District, Shaoxing City, Zhejiang Province Patentee after: SHAOXING NIKER AUTOMOBILE ACCESSARY Co.,Ltd. Address before: Room 326, 46 Guangji Road, Lizhu Town, Keqiao District, Shaoxing City, Zhejiang Province Patentee before: Shaoxing Yingshun Mechanical and Electrical Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A semiconductor silicon wafer rotary lithography machine Effective date of registration: 20231226 Granted publication date: 20200804 Pledgee: Shaoxing China Light Textile City sub branch of Bank of Communications Co.,Ltd. Pledgor: SHAOXING NIKER AUTOMOBILE ACCESSARY Co.,Ltd. Registration number: Y2023980073362 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |