CN108705207A - The cutting method and cutter device of brittle material substrate with metal film - Google Patents
The cutting method and cutter device of brittle material substrate with metal film Download PDFInfo
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- CN108705207A CN108705207A CN201810209667.0A CN201810209667A CN108705207A CN 108705207 A CN108705207 A CN 108705207A CN 201810209667 A CN201810209667 A CN 201810209667A CN 108705207 A CN108705207 A CN 108705207A
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- laser beam
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- brittle material
- material substrate
- cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Abstract
A kind of cutting method and cutter device of the brittle material substrate with metal film are provided, the brittle material substrate of simple process ideally cutting belt metal film can be utilized.Make include the laser string of bursting of pulse laser beam laser beam (L1) through make its generate aberration aberration generate lens (4c) and generate aberration laser beam (L2), the most focus portion of the aberration laser beam (L2) is scanned from the surface edge cutting preset lines of the brittle material substrate (W1) of the parent as the brittle material substrate (W) with metal film, while brittle material substrate (W1) forms modified layer (K) of strength reduction, cutting groove (V) is formed in metal film (W2), then, predetermined wire cutting is cut on brittle material substrate (W) edge with metal film via fragmentation cell along modified layer (K).
Description
Technical field
The present invention relates to a kind of fragile material bases with metal film for being laminated with metal film on one side in brittle material substrate
The cutting method and cutter device of plate.In particular, the present invention relates to a kind of as speculum or mirror board in transparent glass etc.
One face of brittle material substrate, by the thin metal film etc. such as AM aluminum metallization and/or chromium make its adhere to the crisp of metal film
The cutting method and cutter device of property material substrate.
Background technology
It is known that there are as below methods：In general, in the case where cutting brittle material substrate as described above with metal film, such as
Shown in (a) of Fig. 8, using cutting wheel 15 (also referred to as stitch marker) etc., to the parent as the brittle material substrate W with metal film
The surface of brittle material substrate W1 delineated, to form the score line S of grooving shape, as shown in (b) of Fig. 8, from shape
At the face pressing fracture bar 14 of the metal film W2 for the opposite side for having the face of score line S opposite, to make the brittleness with metal film
Material substrate W bends and is cut (for example, referring to patent document 1, Figure 10 of patent document 2) along score line S.
In the processing of above-mentioned score line, instead of the mechanical gimmick using cutting wheel etc., to the surface of brittle material substrate
It irradiates laser beam and heat is utilized to generate crack along cutting preset lines, modified layer is formed, to which the method for forming score line is also
Usual way.
Citation
Patent document
Patent document 1：Japanese patent application discloses 2016-000533 bulletins
Patent document 2：Japanese patent application discloses 2015-039872 bulletins
Patent document 3：Japanese patent application discloses 2012-066479 bulletins.
Invention content
The subject that the invention solves
But using the brittle material substrate of above method cutting belt metal film, because as parent
Physical property between brittle material substrate and metal film is different, so leading to the problem of as follows：A part for metal film is not complete
It cuts and remains entirely, or generate tearing mark, the fragmentation irregularly ruptured, fragment etc. cut, without quilt
Ideally cut.
In addition, in order to be assuredly shut off metal film, it is also known that there are before cutting action, cutting wheel and/or laser are also utilized
Beam forms the method for the score line along cutting preset lines on the surface of metal film (for example, referring to patent document 3).But
In this method, after any surface of the brittle material substrate with metal film processes score line, need by substrate reversion and in phase
The face tossed about processes score line, and flow chart increases and becomes bothersome, and needs mechanism for inverting substrate etc. and fill
Setting becomes complicated, there are problems that cost is got higher.
Therefore, the object of the present invention is to provide a kind of solution the above subject and can utilize simple process high-precision
The cutting method and cutter device of the brittle material substrate with metal film of ground perfect cutting.
Means for solving the problems
The cutting method of the present invention made in order to achieve the above object is the unilateral one side in brittle material substrate
Be attached with the cutting method of the brittle material substrate with metal film of metal film, make include pulse laser beam laser string of bursting
Laser beam transparent makes it generate the aberration of aberration generation lens and generate aberration laser beam, from as the above-mentioned brittleness with metal film
The most focus portion of above-mentioned aberration laser beam is scanned on the surface of the brittle material substrate of the parent of material substrate along cutting preset lines,
While above-mentioned brittle material substrate forms the modified layer of strength reduction, cutting groove is formed in above-mentioned metal film, then, along upper
State modified layer via fragmentation cell by the above-mentioned brittle material substrate with metal film along the predetermined wire cutting of above-mentioned cutting.
In the cutting method of the present invention, it is preferred that make the most focus portion most focused of above-mentioned aberration laser beam with it is upper
The centre position for stating the thickness of brittle material substrate is matchingly scanned.
Here, the most focus portion of aberration laser beam refers to, beam profile (intensity point is measured along the direction of illumination of aberration laser beam
Cloth) when, the highest position of peak power of beam profile (along the position of the direction of illumination of aberration laser beam).
As the fragmentation cell for the modified layer for cutting above-mentioned brittle material substrate, 10.6 μm of illumination wavelength can be used
CO2Nd, YAG laser beam of 1.064 μm of laser beam and/or wavelength etc. has the wavelength of infrared spectral range (in general, 0.7 μm of wavelength
More than) laser beam (specifically, laser beam of 0.7 μm~20 μm of wavelength) and cut using heat optical unit,
Fracture bar is pressed from upper surface of base plate and substrate is made to bend the machine assembly to be cut.
In addition, from the cutter device of the present invention from the point of view of other viewpoints be the unilateral one side attachment in brittle material substrate
There is the cutter device of the brittle material substrate with metal film of metal film, including：Workbench loads above-mentioned with the crisp of metal film
Property material substrate；Aberration laser beam luminous component makes swashing for the laser string of bursting shot from the light source including pulse laser beam
Light beam generates aberration laser beam via making the aberration that above-mentioned laser beam generates aberration generate lens；Mobile mechanism, on making
Aberration laser beam luminous component is stated along the cutting preset lines relative movement of the above-mentioned brittle material substrate with metal film and in conduct
While the brittle material substrate of parent forms the modified layer of strength reduction, cutting groove is formed in metal film；Fragmentation cell,
The above-mentioned brittle material substrate with metal film is cut along above-mentioned modified layer.
The effect of invention
Because the present invention is constituted as described above, by scanning aberration laser beam, in the glass that can be used as parent
While the brittle material substrates such as substrate process the modified layer of strength reduction, it can be formed along cutting preset lines in metal film
Cutting groove.Therefore, it in next breaking step of breaking, is cut along modified layer to the brittle material substrate application external force with metal film
When brittle material substrate, in advance in the partial cut metal film of cutting groove, or the major part of its thickness is removed, therefore can be with
It is reliably cut the perfect end face for not generating tearing mark and/or fragmentation, fragment etc. in metal film.In addition, because in profit
Cutting groove is processed in metal film while brittle material substrate processes modified layer with aberration laser beam, so can omit
Substrate is set to invert and process process complicated as score line in metal film as previous, and it is possible to realize when processing
Between shortening and cost reduction.
In the present invention, the aberration generates lens and can be formed by planoconvex spotlight.In this case, by making laser beam
It is incident from the planar side of planoconvex spotlight, aberration laser beam can be projected from convex side.In this case, by planoconvex spotlight
Planar side configures diffraction optical element (DOE), can increase the focus number of the laser beam projected from the convex side of planoconvex spotlight, separately
Outside, spotlight diameter can be reduced.
Moreover, in the present invention, the light source of the aberration laser beam is 0.7~2.5 μm of wavelength (for example, Nd：YAG laser
Basic wave) near-infrared laser, and can use pulse width be 100 picoseconds of laser beams below laser string of bursting.
Description of the drawings
Fig. 1 is the definition graph of the summary of the cutter device of the present invention.
Fig. 2 is the block diagram for the optical system for showing the aberration laser beam luminous component of the present invention.
(a) of Fig. 3, (b) of Fig. 3 are the definition graphs for the focus state that amplification shows aberration laser beam.
Fig. 4 is the concept map of the profile for the laser string of bursting for showing pulse laser beam.
(a) of Fig. 5, (b) of Fig. 5 are the definition graphs for the first stage for showing the cutting processing process of the present invention.
Fig. 6 is the definition graph for the second stage for showing the cutting processing process of the present invention.
(a) of Fig. 7, (b) of Fig. 7 are another definition graphs for showing the fragmentation cell of the present invention.
(a) of Fig. 8, (b) of Fig. 8 are an examples of the cutting method for showing the existing brittle material substrate with metal film
The definition graph of son.
Reference sign
A, scoring device (cutter device) F, high energy distribution region
K, modified layer L1, laser beam
L2, aberration laser beam L3, cutting laser beam (CO2Laser beam)
V, cutting groove W, the brittle material substrate with metal film
W1, brittle material substrate W2, metal film
2, guiding piece 4, aberration laser beam luminous component
4a, light source 4b, optical modulator
4c, aberration generate lens 5, engraving head
6, cutting laser beam luminous component 7, engraving head
8, workbench 14, fracture bar.
Specific implementation mode
Hereinafter, the present invention is described in detail for the embodiment based on diagram.
Fig. 1 is the figure for showing scoring device (cutter device) A of the present invention.
The horizontal beam (crossbeam) for having guiding piece in X direction 2 is provided in pillars 1,1 of the scoring device A in left and right
3.Have the engraving head 5 of aberration laser beam luminous component 4 and has the engraving head 7 of cutting laser beam luminous component 6 with can
By motor M1 move in X direction in the way of be mounted on the beam 3 guiding piece 2.It loads processing object substrate W and it is inhaled
The workbench 8 of attached holding is maintained at via by the rotating mechanism 9 of fulcrum of the longitudinal axis on desk tray 10, and desk tray 10 is formed as, Neng Gouli
It is mobile along Y-direction (front-rear direction in Fig. 1) with the bolt 11 driven by motor M2.It should be noted that in the present embodiment, aberration
Laser beam luminous component 4 and cutting laser beam luminous component 6 are separately mounted at independent engraving head 5,7, but can also pacify
Mounted in common engraving head.
As shown in Fig. 2, the aberration laser beam luminous component 4 for being installed on engraving head 5 has：It is wide to project pulse by light source 4a
Degree (pulse duration) is 100 picoseconds or less, preferably 50 picoseconds or less (being usually 1 picosecond or more), is 10 picoseconds herein
Pulse laser beam；Optical modulator 4b will vibrate the pulse laser beam as the laser string of bursting of segmentation from light source 4a
The set of row and project；Aberration generates lens 4c, and aberration is generated in the laser beam L1 exported from optical modulator 4b.
It should be noted that the near-infrared laser of 0.7~2.5 μm of wavelength can be used in light source 4a, in the present embodiment, use
The near infrared ray laser of 1.064 μm of wavelength.
In addition, for the optical modulator 4b of the laser tandem of bursting of injection pulse laser beam, in such as Japan Patent
It is disclosed in the public table 2012-515450 bulletins of application, here, projecting pulse laser beam using well known optical modulator
Laser tandem of bursting, omit detailed description.
Although it is not special that the aberration for generating aberration in the laser beam L1 projected from optical modulator 4b generates lens 4c
Limit, but here, using make focus disperse along optical axis direction and make by laser beam L1 to bear in an axial direction fuzzy coke
The mode of point is focused and generates the planoconvex spotlight of aberration.Become the picture of focus dispersion by the laser beam L1 of the planoconvex spotlight
Poor laser beam L2.By keeping laser beam L1 incident from the planar side of planoconvex spotlight, aberration laser beam L2 can be projected from convex side.
As shown in (a) of Fig. 3, passed through by aberration by the aberration laser beam L2 of the laser tandem generation of bursting of pulse laser beam
It generates lens 4c to focus, and forms laser energy and put aside high energy distribution region (laser light long and narrow made of each focus portion f
Silk) F.Schematically amplify the figure of high energy distribution region F as shown in (b) of Fig. 3.Pass through high energy distribution area as formation
Domain F can be from the illuminated of soda glass substrate when being irradiated to processing object substrate, such as surface of soda glass substrate
Face to very deep inside processes the modified layer K of strength reduction (with reference to Fig. 5).
The cutting laser beam L3 (references projected from the cutting for being installed on another engraving head 7 with laser beam luminous component 6
Fig. 6) using the laser beam for the modified layer K that can cut strength reduction completely using above-mentioned aberration laser beam L2.In this implementation
In example, 10.6 μm of CO of wavelength is used2Laser beam is as cutting laser beam L3.It should be noted that instead of CO2Laser beam also can
Enough use the laser beam of 0.7~20 μm of Nd, the YAG laser beam equiwavelength of 1.064 μm of wavelength.
Then, hereinafter, to having used cutting for the brittle material substrate W with metal film of the present invention of above-mentioned scoring device A
Segmentation method illustrates.In the present embodiment, it is formed by the soda glass of thickness 1mm as the brittle material substrate W1 of parent,
The band metal obtained by its metal film W2 being made of aluminium for being laminated with 0.05~5 μm of thickness (specifically 0.1 μm) on one side
The brittle material substrate W of film is as processing object substrate.
First, as shown in (a) of Fig. 5, the brittle material substrate W with metal film is loaded on workbench 8, will be swashed from aberration
While the aberration laser beam L2 that light beam luminous component 4 projects is irradiated towards substrate W, using engraving head 5 and based on guiding piece 2
Mobile mechanism makes aberration laser beam L2 be moved along the cutting preset lines of substrate W.At this point, the height in the focus portion of aberration laser beam L2
Energy distribution region F reaches metal film W2 from the centre of the thickness of brittle material substrate W1.As a result, as shown in (b) of Fig. 5, energy
While enough processing the modified layer K of weakened from the plane of illumination of brittle material substrate W1 to lower surface, the thin gold of wall thickness
The high energy distribution region F for belonging to film W2 is removed by etching etc. to form cutting groove V.It is complete in the part of cutting groove V
Metal film W2 is cut off, or removes the major part of thickness.
It should be explained that, it is preferred that the workbench 8 for bearing substrate W is provided with space 8a, space 8a is in irradiation aberration
When laser beam L2, the laser beam that can will transmit through substrate W is discharged downwards.
Here, the preferred implementation of the aberration laser beam L2 (the laser tandem of bursting of pulse laser beam) including laser string of bursting
One example of condition is as follows.
Laser exports：9.7W
Repetition rate：32.5kHz
Pulse width：10 picoseconds
Pulse spacing (the irradiation interval of the point of irradiation on the substrate of laser pulse)：3μm
It bursts laser string：2 pulses
Pulse energy：149 μ J/1 burst
Sweep speed：97.5mm/s
It should be noted that can utilize above-mentioned laser output, repetition rate, pulse width, burst number and/or pulse spacing,
The adjustment of aberration etc. easily controls working depth and/or machining state.
Fig. 4 is the ideograph for the laser tandem of bursting for showing pulse laser beam.It is formed with the pulse being divided into one by one
Two subtle pulse P of laser beam, subtle pulse P is intermittently irradiated according to repetition rate.
As described above, by scanning aberration laser beam L2, process modified layer K's in the brittle material substrate W1 of substrate W
Simultaneously after metal film W2 processes cutting groove V, as shown in fig. 6, from cutting laser beam luminous component 6 towards processing modification
The cutting preset lines of layer K irradiate CO2While laser beam L3, make its edge using the mobile mechanism including engraving head 7 and guiding piece 2
Cut preset lines movement.CO at this time2The laser irradiation condition of laser beam L3 is because of the brittleness with metal film as processing object
Blank, the thickness of material substrate W and output is set as 120W by difference in the present embodiment, sweep speed is set as 180mm/s,
Repetition rate is set as 10kHz.
An edge processes the cutting preset lines irradiation CO of modified layer K as a result,2Laser beam L3 is moved it on one side, is utilized
The heat of laser beam, the modified layer K of the weakened of complete cutting brittle material substrate W1.In addition, passing through photograph before this
Image difference laser beam L2 and utilize cutting groove V to cut off metal film W2, or the major part of the thickness of removal metal film W2, therefore,
Utilize CO2Laser beam L3 applies external force, to will not the brittle material substrate W with metal film generate tearing mark and/or fragmentation,
Fragment etc., and can reliably be cut with perfect end face along cutting preset lines.
In the above-described embodiments, using aberration laser beam L2 after brittle material substrate W1 processes modified layer K, as
Apply external force from the fragmentation cell that modified layer K is cut to the brittle material substrate W with metal film, uses cutting laser beam
L3, but replace, mechanically can also apply external force using fracture bar and cut.
Fig. 7 indicates that the fragmentation cell using fracture bar is equipped on objective table 12 as described in (a) of Fig. 7 by rubber etc.
The elastic piece 13 of composition, will process the brittle material substrate W with metal film of modified layer K by the sides metal film W2 upward in a manner of
It is positioned on the elastic piece 13.Also, as shown in (b) of Fig. 7, fracture bar 14 is pressed from above towards modified layer K, so as to
Enough bend brittle material substrate W1 and from modified layer K cutting substrates W.
Present inventor is identical as previous embodiment with the material of brittle material substrate W1 or thickness, and by metal film W2's
In the case that material is changed to chromium by aluminium, the irradiation that aberration laser beam L2 is also carried out with laser irradiation condition below is tested.At this
In the case of, identically as first aluminium film, the modified layer K of strength reduction is processed in the brittle material substrate W1 as parent
While, slot segmentation V can be formed in metal film W2.
Laser exports：7.6W
Repetition rate：13kHz
Pulse width：10 picoseconds
Pulse spacing (the irradiation interval of the point of irradiation on the substrate of laser pulse)：4μm
It bursts laser string：4 pulses
Pulse energy：146 μ J/l burst
Sweep speed：52mm/s
More than, the embodiment of representative of the present invention is illustrated, but the present invention might not be only limitted to it is above-mentioned
Embodiment.For example, in the above-described embodiments, when using optical system as fragmentation cell, by irradiating aberration laser
Beam L2 and after entire cutting preset lines form modified layer K, cut with laser beam L3 along modified layer K irradiation cuttings, but
It is that can also irradiate cutting laser beam L3 along with the irradiation of aberration laser beam L2.In other present invention, reaching this
The purpose of invention and without departing from amendment and change appropriate can be carried out in the scope of the claims.
Industrial utilization possibility
The present invention can to the brittle material substrates such as glass substrate be laminated on one side metal film with metal film
It is utilized when brittle material substrate is cut.
Claims (6)
1. a kind of cutting method of the brittle material substrate with metal film is attached on one side in the unilateral of brittle material substrate
The cutting method of the brittle material substrate with metal film of metal film, the cutting method be characterized in that,
Make to include the aberration generation lens of the laser beam transparent generation aberration of the laser string of bursting of pulse laser beam and generate aberration
Laser beam,
It is swept from the surface of the brittle material substrate of the parent as the brittle material substrate with metal film along cutting preset lines
The most focus portion for retouching the aberration laser beam, while the brittle material substrate forms the modified layer of strength reduction,
The metal film forms cutting groove,
Then, along the modified layer via fragmentation cell the fragile material base with metal film described in predetermined wire cutting is cut along described
Plate.
2. the cutting method of the brittle material substrate according to claim 1 with metal film, which is characterized in that
The light source of the aberration laser beam is the near-infrared laser of 0.7~2.5 μm of wavelength, also, the use of pulse width is 100 skins
The laser string of bursting of second laser beam below.
3. the cutting method of the brittle material substrate according to claim 1 or 2 with metal film, which is characterized in that
The fragmentation cell is formed by the optical system including cutting laser beam, by along the cutting for foring the modified layer
Preset lines irradiate the cutting laser beam, to cut the brittle material substrate using heat.
4. the cutting method of the brittle material substrate according to claim 3 with metal film, which is characterized in that
The cutting is CO with laser beam2Laser beam.
5. the cutting method of the brittle material substrate according to any one of claim 1 to 3 with metal film, feature exist
In,
The fragmentation cell is formed by the mechanical system including being broken bar, by along the cutting preset lines for foring the modified layer
The fracture bar is pressed, is cut along the cutting preset lines to make the brittle material substrate bend.
6. a kind of cutter device of the brittle material substrate with metal film is attached on one side in the unilateral of brittle material substrate
The cutter device of the brittle material substrate with metal film of metal film, the cutter device are characterised by comprising：
Workbench loads the brittle material substrate with metal film；
Aberration laser beam luminous component, make the laser beam of the laser string of bursting shot from the light source including pulse laser beam via
The aberration that the laser beam generates aberration is set to generate lens and generate aberration laser beam；
Mobile mechanism keeps the aberration laser beam luminous component pre- along the cutting of the brittle material substrate with metal film
Alignment relatively move and while the brittle material substrate as parent processes the modified layer of strength reduction, in metal film
Form cutting groove；
Fragmentation cell cuts the brittle material substrate with metal film along the modified layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017068795A JP6888809B2 (en) | 2017-03-30 | 2017-03-30 | Brittle material substrate with metal film Dividing method and dividing device |
| JP2017-068795 | 2017-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108705207A true CN108705207A (en) | 2018-10-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810209667.0A Withdrawn CN108705207A (en) | 2017-03-30 | 2018-03-14 | The cutting method and cutter device of brittle material substrate with metal film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6888809B2 (en) |
| KR (1) | KR20180111497A (en) |
| CN (1) | CN108705207A (en) |
| TW (1) | TW201840381A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110435160A (en) * | 2019-09-09 | 2019-11-12 | 广东利元亨智能装备股份有限公司 | A kind of laser welding head and method for laser welding |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019204457B4 (en) | 2019-03-29 | 2024-01-25 | Disco Corporation | Substrate processing methods |
| WO2020247362A1 (en) * | 2019-06-03 | 2020-12-10 | Corning Incorporated | Methods of cutting glass-metal laminates using a laser |
| JP7326053B2 (en) * | 2019-07-11 | 2023-08-15 | 株式会社ディスコ | Workpiece processing method |
| JPWO2021009960A1 (en) * | 2019-07-16 | 2021-01-21 | ||
| JP7277030B2 (en) * | 2019-09-02 | 2023-05-18 | 株式会社ディスコ | Workpiece processing method |
| KR20220148197A (en) * | 2020-03-11 | 2022-11-04 | 닛토덴코 가부시키가이샤 | How to divide composites |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1577726A (en) * | 2003-06-26 | 2005-02-09 | 株式会社迪斯科 | Semiconductor wafer dividing method utilizing laser beam |
| JP2005340423A (en) * | 2004-05-26 | 2005-12-08 | Renesas Technology Corp | Method for manufacturing semiconductor device |
| JP2012199399A (en) * | 2011-03-22 | 2012-10-18 | Panasonic Corp | Laser processing method and laser processing apparatus |
| CN104308368A (en) * | 2014-09-03 | 2015-01-28 | 大连理工大学 | Quantitative removal method for multiple-pulse laser ablated metal coating |
| CN104690428A (en) * | 2013-11-19 | 2015-06-10 | 罗芬-新纳技术公司 | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| WO2016114934A1 (en) * | 2015-01-13 | 2016-07-21 | Rofin-Sinar Technologies Inc. | Method and system for scribing brittle material followed by chemical etching |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002110588A (en) * | 2000-09-27 | 2002-04-12 | Nec Kansai Ltd | Chip manufacturing apparatus |
| JP5232375B2 (en) * | 2006-10-13 | 2013-07-10 | アイシン精機株式会社 | Method for separating semiconductor light emitting device |
| JP2010201479A (en) * | 2009-03-05 | 2010-09-16 | Mitsuboshi Diamond Industrial Co Ltd | Apparatus and method of laser beam machining |
| JP5333399B2 (en) * | 2010-09-30 | 2013-11-06 | 三星ダイヤモンド工業株式会社 | Laser processing apparatus, workpiece processing method, and workpiece dividing method |
| JP2013136077A (en) * | 2011-12-28 | 2013-07-11 | Mitsuboshi Diamond Industrial Co Ltd | Splitting device |
| US10252507B2 (en) * | 2013-11-19 | 2019-04-09 | Rofin-Sinar Technologies Llc | Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy |
| US10144088B2 (en) * | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
| US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
| JP6428112B2 (en) * | 2014-09-30 | 2018-11-28 | 三星ダイヤモンド工業株式会社 | Patterning substrate breaker |
-
2017
- 2017-03-30 JP JP2017068795A patent/JP6888809B2/en active Active
-
2018
- 2018-01-31 KR KR1020180012337A patent/KR20180111497A/en active Search and Examination
- 2018-03-14 CN CN201810209667.0A patent/CN108705207A/en not_active Withdrawn
- 2018-03-15 TW TW107108805A patent/TW201840381A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1577726A (en) * | 2003-06-26 | 2005-02-09 | 株式会社迪斯科 | Semiconductor wafer dividing method utilizing laser beam |
| JP2005340423A (en) * | 2004-05-26 | 2005-12-08 | Renesas Technology Corp | Method for manufacturing semiconductor device |
| JP2012199399A (en) * | 2011-03-22 | 2012-10-18 | Panasonic Corp | Laser processing method and laser processing apparatus |
| CN104690428A (en) * | 2013-11-19 | 2015-06-10 | 罗芬-新纳技术公司 | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| CN104308368A (en) * | 2014-09-03 | 2015-01-28 | 大连理工大学 | Quantitative removal method for multiple-pulse laser ablated metal coating |
| WO2016114934A1 (en) * | 2015-01-13 | 2016-07-21 | Rofin-Sinar Technologies Inc. | Method and system for scribing brittle material followed by chemical etching |
| CN106132627A (en) * | 2015-01-13 | 2016-11-16 | 罗芬-新纳技术公司 | For fragile material being carried out scribing and carrying out the method and system of chemical etching subsequently |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110435160A (en) * | 2019-09-09 | 2019-11-12 | 广东利元亨智能装备股份有限公司 | A kind of laser welding head and method for laser welding |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018170475A (en) | 2018-11-01 |
| TW201840381A (en) | 2018-11-16 |
| KR20180111497A (en) | 2018-10-11 |
| JP6888809B2 (en) | 2021-06-16 |
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